Abstract: A method for bonding two partially form-fitting surfaces of two metal bodies which contain the same metal is carried out by generating a first layer on the surface of a first one of the two bodies, the first layer containing a mixture of the metal and the oxide of the metal; generating a second layer on the first layer, the second layer containing the metal but less oxide of the metal than does the first layer; placing the partially form-fitting surfaces of the two metal bodies adjacent to each other; heating the bodies placed adjacent to each other to a temperature which lies in a target range below the melting point of the metal and above the eutectic temperature of the eutectic of the metal and the metal oxide; and holding the temperature within the target range over a predetermined or a controllable duration of time.

Abstract: Stacked semiconductor chip package system vertical interconnects and related methods are disclosed. A preferred embodiment of the invention includes a first semiconductor chip with a surface bearing a plurality of first fusible metallic coupling elements. A second semiconductor chip has a plurality of second fusible metallic coupling elements. The first and second fusible metallic coupling elements correspond at the adjoining surfaces of the first and second semiconductor chips when stacked, and are fused to form a gold-tin eutectic alloy fused metallic coupling vertically interconnecting the stacked chips.

Abstract: A process for producing a high temperature-resistant structure provides at least one at least partially structured metallic layer. A smooth metallic layer is deformed by a rolling process, in which oil at least partially wets the at least one layer. The oil is at least partially removed. Lubricant is fed onto at least one subsection of the at least one layer. A structure is at least partially shaped. Technical joining connections are produced for fixing the structure.

Abstract: A die attach process employs a temperature gradient lead free soft solder metal sheet or thin film as the die attach material. The sheet or thin film is formed to a uniform thickness and has a heat vaporizable polymer adhesive layer on one surface, by which the thin film is laminated onto the back metal of the silicon wafer. The thin film is lead-free and composed of acceptably non-toxic materials. The thin film remains semi-molten (that is, not flowable) in reflow temperatures in the range about 260° C. to 280° C. The polymer adhesive layer is effectively vaporized at the high reflow temperatures during the die mount.

Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.

Abstract: A process for brazing components formed of superalloys that contain elements prone to oxidation during brazing. At least one braze tape is applied to at least one faying surface of at least a first of the components being joined by brazing. The braze tape comprises a braze tape alloy containing the base metal of the superalloys and a melting point suppressant, and is applied so as to substantially cover the faying surface. The braze tape is then bonded to the faying surface by heating the first component to a temperature not exceeding the brazing temperature required to join the components. Thereafter, the components are assembled so that the bonded braze tape are between the respective faying surfaces of the components. The components are then brazed together by applying and heating a braze alloy to the braze temperature.

Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.

Abstract: A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs.

Abstract: An inertial measurement system having a triangular cupola shaped base structure with three mutually orthogonal sides and a bottom surface surrounding a hollow core. The bottom surface includes an aperture providing access to the hollow core. An inertial module is mounted on each of the sides and includes a gyroscopic rotational rate sensor and a linear accelerometer connected to a circuit board. The inertial measurement system also includes a motherboard and a plurality of metallization elements. The metallization elements extend from the bottom surface to the sides of the base structure and conductively connect the inertial module to the motherboard. The inertial measurement system may also include a non-conductive adhesive underfill positioned between the inertial module and the base structure.

Abstract: A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap (1, 30) includes a base member (2), a first plating layer (3, 31) that is formed on the surface of the base member, and a second plating layer (4, 32) that is formed on the surface of the first plating layer and is less oxidized than the first plating layer, wherein a part of the second plating layer in an area (S1, S5) inside an area (S2, S6) to which an electronic component accommodation member is joined is removed so that the surface of the first plating layer is exposed, and the surface of the first plating layer that is exposed in the area from which the second plating layer is removed is oxidized.

Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

Abstract: A joint compound for electrical connections is disclosed which includes an antioxidant base material and a quantity of stainless steel grit mixed with the antioxidant base material to provide improved mechanical pullout strength. The joint compound has a weight ratio of antioxidant to stainless steel grit in the range of from about 30:70 to about 90:10, preferably, from about 40:60 to about 70:30, and more preferably about 50:50. The stainless steel grit is cut wire having a diameter within the range of from about 0.012 inches to about 0.125 inches, with a preferred diameter within the range of from about 0.012 inches to about 0.030 inches, and 0.017 inches being a more preferred stainless steel grit diameter. In a method for forming an electrical connection between electrical components, a joint compound as described is applied to mating surfaces of either a suitable connector, the components to be coupled together, or both.

Abstract: A laminate aluminum block for forming an article includes a series of aluminum laminate plates to collectively form a tool body for forming an article in a forming operation. A series of aluminum brazing layers are formed for brazing together adjacent aluminum laminate plates. The series of aluminum laminate plates and the series of aluminum brazing layers are deoxidized. Draining apertures are formed through a plurality of the series of aluminum laminate plates. The series of aluminum laminate plates are stacked alternating with the aluminum brazing layers between adjacent aluminum laminate plates without a flux. The stacked series of alternating aluminum plates and aluminum brazing layers are pressed. The stacked series of alternating aluminum plates and aluminum brazing layers are heated in a vacuum furnace to a temperature wherein the aluminum brazing layers braze the aluminum laminate plates together and excess braze material drains from the draining apertures.

Abstract: The present invention discloses a lead frame fabrication method, wherein a metallic plate is locally fabricated in double sides to form accurately aligned and closely spaced circuits; the metallic plate is also locally fabricated in single side to form patterned trenches; a filling material is filled into the trenches to provide extra mechanical support and separate the metallic plate into a plurality of conductive regions or regions with special electric properties. The present invention can overcome the conventional problems in lead frame fabrication and has the advantages of a superior heat-dissipating ability, multi-leads and diversified applications.

Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.

Abstract: A method for gluing and brazing a honeycomb structure includes at least one partially structured foil with a pitch and a wave height. The method includes the steps of choosing a mean brazing material diameter of a powder brazing material, said diameter being 15% smaller than the height of the wave; determining a minimum thickness of the glue strip according to equation; gluing at least partially structured foil within the width of the glue strip on at least part of the wave crests formed by the undulation; brazing the honeycomb structure. The invention also relates to a corresponding honeycomb structure that ensures satisfactory joint connections even when said structure is used in the exhaust systems of automobiles.

Abstract: A braze formulation for superalloys including nickel, chromium, optionally, cobalt, optionally, aluminum, optionally, boron, hafnium and tantalum, said braze formulation having a solidus temperature of no greater than about 1180° C. and a liquidus temperature of no greater than about 1250° C. Methods for brazing are also provided. The brazing formulations are robust with good ductility and have minimal embrittled phases or otherwise decreased braze integrity.

Abstract: A connector and method for making wherein the connector has a connector body, connector leads extending from the connector body for solder connection to an electronic circuit wherein the connector leads do not extend a uniform distance from the body connector body. A solder paste is formed on each connector lead by stenciling it onto a flat plate that is non-wettable to the solder paste. The solder paste is composed of first solder particles having a first lower melting point and second solder particles having a second higher melting point. The solder paste is heated to the first melting point for adhering the solder paste to the connector leads while planarizing the solder covered electrical leads with the flat plate. The connector leads are soldered to an electrical circuit by removing the flat plate and heating the solder paste to the second higher melting point.

Abstract: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate (2) consists of a plurality of layers (5a) of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer (5) can be applied to a device joining substrate (1) comprising an electrode layer (4) formed on the base substrate (2) and the solder layer (5) formed on the electrode layer.

Abstract: Anti-ice valve components are provided that include a servo housing, a valve body, and a transfer tube. The servo housing includes a surface having a cavity formed therein. The valve body is spaced apart from the servo housing and includes a surface having a cavity formed therein. The transfer tube has a first end, a second end, and a length, where the first end is disposed in the servo housing cavity, the second end is disposed in the valve body cavity, and the length extends between the first end and the second end and has a portion forming a bend of at least 180 degrees.

Abstract: Target/backing plate constructions and methods of forming target/backing plate constructions are disclosed herein. The targets and backing plates can be bonded to one another through an appropriate interlayer. The targets can comprise one or more of titanium, tantalum, titanium zirconium, hafnium, niobium, vanadium, tungsten, copper or a combination thereof. The interlayer can comprise one or more of silver, copper, nickel, tin, titanium and indium. Target/backing plate constructions of the present invention can have bond strengths of at least 20 ksi and an average grain size within the target of less than 80 microns.

Abstract: The invention relates to a component made from aluminium material with a partial or complete coating of the surfaces for brazing and method for production of the coating. According to the method, fine-grain particulate brazing material is at least partly fused by means of a low temperature plasma beam and spayed onto the surfaces of the component in fused form, whereby the brazing agent forms a uniform good adhesion to the surfaces of the component. The application of the brazing agent can occur at any region of the surfaces of the component, for example, even on the edges. The particular advantage of said method is that a precisely dosed, uniform and well adhering coating of brazing agent can be achieved, whereby the use of solvents and binders can be avoided in the production process which is environmentally-friendly.

Abstract: A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it is also achievable for providing a recognizable lead-free device so as to prevent the process confusion.

Abstract: Plumbing valves, fittings, and other water handling devices are manufactured of a metal, such as silicon bronze, having a lead content below 0.2%. Such devices are subsequently electroplated with a galvanizing solution including saline or alkaline solutions containing nickel and tin. The resultant plated products can be soldered to the remaining copper components of a plumbing system using conventional lead-free solder.

Abstract: The invention comprises a process for joining a first surface and a second surface where the first surface comprises an initially non-solderable surface which comprises coating the first surface with a solder-adhesion layer to produce a solder-adhesion layer on the first surface and providing a Thermal Interface Material (“TIM”) composition comprising solderable heat-conducting particles in a bondable resin matrix where at least some of the solderable heat-conducting particles comprise a solder surface. The TIM composition is placed between the first surface and the second surface to extend between and be contiguous with both the second surface and the solder-adhesion layer on the first surface. Sufficiently heating the TIM composition results in (a) soldering at least some of the solderable heat-conducting particles to one another; and (b) soldering at least some of the solderable heat-conducting particles to the solder-adhesion layer on the first surface.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A processing apparatus that is formed from a plurality of metal layers that are stacked and aligned together and then connected together to form one or more portions of the processing apparatus.

Abstract: An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.

Abstract: [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device. [Means for Solving Problem] A flat plate 10 or 30 having a plurality of projections 12 or recesses 32 thereon is prepared; the flat plate is aligned to oppose an electronic component 14 or 34 and a resin composition 18 or 19 including a solder powder 22 or 23 is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals 16 or 36, so as to form solder bumps 24 or 38 on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps.

Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract: A golf club head joining method is provided, which utilizes a soldering joining process to assemble the golf club head. The joining method includes the steps of providing a first component and a second component, wherein the first and second components are made of metal materials; subsequently, the step of applying a coating of active metal or compounds suitable to be affixed with a soldering metal material on the first component and the second component; and the last step of finally joining the first component to the second component, enabling the two to become one. Therefore, the joining method enables the joining of the golf club head not to be restricted to the use of certain materials and enhances the joint strength without incurring additional costs or complicating the manufacturing process.

Abstract: Disclosed are methodologies for producing lead type electrical components. Components are placed in a lead frame with termination paste applied to selected portions of the component. Upon firing of the assembled lead frame and electrical components, the electrical components are concurrently terminated, and provided with strongly secured leads.

Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.

Abstract: The heat resistance of a joint between a terminal electrode and a metal terminal as well as the bonding strength of the joint are increased in a ceramic electronic component. The surface of the metal terminal in contact with a binder is formed of a coating layer which is a Ag-based metal plated film. The binder contains a metal powder composed of a Cu-based metal and having an average particle diameter of 2.0 ?m or less and a glass component. The step of joining the metal terminal to a terminal electrode via the binder includes bringing the terminal electrode into intimate contact with the metal terminal via the binder and heat-treating them at a temperature in the range of 550° C. to 750° C. to form a Ag—Cu alloy layer between the metal terminal and a metal bonding layer, thus joining the terminal electrode to the metal terminal by Ag—Cu alloy bonding.

Abstract: A CTE modified braze composition that can be utilized to manufacture a strong, gastight joint where at least one of the joining members comprises a ceramic (e.g., a ceramic or a cermet). The braze composition is formulated so as to reduce the thermal stress that results from the mismatch of thermal expansion coefficients between a ceramic joining member and the braze or other joining members. The braze composition comprises a braze alloy in powder, paste or bulk form mixed with one or more particulate or fibrous fillers that exhibit a low (i.e., no more than 6 ppm/K) or negative coefficient of thermal expansion. The braze composition can be used to join members, at least one of which comprises ceramic, and to a composite member produced by joining the two or more members.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract: A process for repairing a component includes the steps of placing a piece of refractory metal material over an area of component to be repaired; depositing a repair filler metal material proximate to the piece of refractory metal material in an amount sufficient to repair the component; subjecting the repair filler material to a welding treatment without directly heating the piece of refractory metal material; flowing the repair filler material within the area; and casting the repair filler material.

Abstract: The invention relates to a process for the multi-stage production of diffusion-soldered joints for power components with semiconductor chips, the melting points of diffusion-soldering alloys and diffusion-soldered joints being staggered in such a manner that a first melting point of the first diffusion-soldering alloy is lower than a second melting point of the second diffusion-soldering alloy, and the second melting point being lower than a third melting point of a first diffusion-soldered joint of the first diffusion-soldering alloy.

Abstract: The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining is from 20.65 to 23.5 wt %. The invention has been completed on the basis of the discovery that the true eutectic point of this alloy system corresponds to 20.65 wt % Sn. In the invention, as means for adjusting the composition of a resulting joint, it is necessary to appropriately adjust the composition and thickness of a brazing material according to the thickness of a gold plating. In the invention, the relationship between the brazing material thickness and the gold plating thickness is shown when the brazing material to be used has an Sn content of 21 wt % to 25 wt %.

Abstract: A method for gluing and brazing a honeycomb structure includes at least one partially structured foil with a pitch and a wave height. The method includes the steps of choosing a mean brazing material diameter of a powder brazing material, said diameter being 15% smaller than the height of the wave; determining a minimum thickness of the glue strip according to equation; gluing at least partially structured foil within the width of the glue strip on at least part of the wave crests formed by the undulation; brazing the honeycomb structure. The invention also relates to a corresponding honeycomb structure that ensures satisfactory joint connections even when said structure is used in the exhaust systems of automobiles.

Abstract: A method for making a braze joint across a discontinuity in a work piece using alternating current. A filler metal is pre-placed at a location sufficiently close to the discontinuity such that, when an alternating current is applied across a work piece to heat the work piece and melt the filler metal, the filler metal is drawn into the discontinuity. The alternating current is maintained for a set residence time, generally less than 10 seconds and more particularly less than 3 seconds. The alternating current is then altered, generally by reducing the current and/or voltage such that the filler metal can solidify to form a braze joint of desired quality and thickness.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: A compound arrangement comprising a first component of metal being brazed to a second component of metal. The first component has an external cylindrical surface touching an cylindrical internal surface of the second component. The second component clasps the first component tightly, so that the second component exerts compressive stress on said external surface of the first component.

Abstract: A low-temperature flux is described which dissolves the refractory oxide layer from a shape memory alloy containing both nickel and titanium, such as Nitinol, and from other metals like stainless steel. The flux is particularly useful for preparing shape memory alloy members for soldering and permits joining of such members to other members, comprising, for example, stainless steel, used in structures like medical devices. The flux is a non-aqueous molten salt formulated on eutectic mixtures of KOH (potassium hydroxide), NaOH (sodium hydroxide) and LiOH (lithium hydroxide), with melting temperatures in a range from about 170° C. to about 226° C.

Abstract: A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 ? to 8200 ?. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality.

Abstract: Fluxing agents comprising potassium fluorostannate and/or cesium fluorostannate which can be used for brazing or soldering components of aluminum or of an aluminum alloy, even by solderless brazing or soldering. Conventional fluxing agents or other fluorometallates, such as alkali metal fluorozincates and/or alkali metal fluorosilicates, can also be added to the fluorostannate-containing fluxing agent. The fluxing agents of the invention can be applied by either dry or wet fluxing methods.

Abstract: A method and structure for welding an air-sensitive metal, such as titanium, in an ambient environment containing air. The method (10) includes forming a weld (12) through a weld-through coating (14) applied to the weld face(s) (28) and heat-affected zone (30) of one or more workpiece(s) (16) to be welded. The weld-through coating may contain a reactive material that comprises one or more halogenides of alkali metal, e.g., fluorides of barium, calcium, and strontium. The weld-through coating may be applied to the workpiece using a thermal-spray process, such as a plasma-spray process (32), prior to forming the weld. The weld-through coating may be applied to the workpiece(s) generally contemporaneously with the formation of the weld just ahead of the weld or may be applied at any time prior to forming the weld.