Abstract: A method and structure for welding an air-sensitive metal, such as titanium, in an ambient environment containing air. The method (10) includes forming a weld (12) through a weld-through coating (14) applied to the weld face(s) (28) and heat-affected zone (30) of one or more workpiece(s) (16) to be welded. The weld-through coating may contain a reactive material that comprises one or more halogenides of alkali metal, e.g., fluorides of barium, calcium, and strontium. The weld-through coating may be applied to the workpiece using a thermal-spray process, such as a plasma-spray process (32), prior to forming the weld. The weld-through coating may be applied to the workpiece(s) generally contemporaneously with the formation of the weld just ahead of the weld or may be applied at any time prior to forming the weld.

Abstract: The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment.

Abstract: A coated nickel-base superalloy article, which is otherwise susceptible to the formation of a secondary reaction zone, is prepared by furnishing a nickel-base superalloy article substrate having thereon an initial aluminum-containing coating comprising an initial-coating additive zone and an initial-coating diffusion zone. The article is susceptible to the formation of the secondary reaction zone if heated to an elevated SRZ reaction temperature for an SRZ reaction period of time. The formation of the secondary reaction zone is avoided by first removing the initial-coating additive zone and the initial-coating diffusion zone, and thereafter depositing a subsequent aluminum-containing coating onto the article substrate. The subsequent aluminum-containing coating includes a subsequent-coating additive zone and a subsequent-coating diffusion zone.

Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: A barrier metal layer is provided on at least one electrodes, wherein one electrode is formed on a substrate and another is connected to an electronic component, so as to coat a base material of the electrode. The base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Zn, placing the solder material in contact with the barrier metal layer while the solder material is in a molten state, and solidifying the solder material. Thus, in the case where the electronic component is soldered to the substrate with the solder material such as an Sn—Zn-based material, the degradation of a soldering part is avoided, Consequently, a sufficient thermal fatigue strength of the soldering part is obtained.

Abstract: The aim of the present invention is a manufacturing process for assembly parts (101, 102, 111, 112) for the manufacture of elements of chemical devices (100), comprising the fixation of an anticorrosion metallic coating (31, 32) on an unprocessed assembly part (21, 22), by means of an operation comprising a brazing operation under a controlled atmosphere and, possibly, the shaping of the coated part (101, 102), by plastic deformation. The brazing temperature is preferentially less than approximately 750° C., and more preferentially between 600° C. and 720° C. The process according to the invention makes it possible to fix solidly on a steel plate an anticorrosion coating with a thickness less than 1 mm.

Abstract: A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.

Abstract: A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below the eutectic temperature of Ti and Cu. The above materials are heated and welded at temperature of (700 through 887° C.). The temperature selected is below the eutectic temperature of the Ti and Cu. The finished material forms a sputtering backing plate for a sputtering. A target member, bonded to the Cu material side of the backing plate, completes the sputtering target. In one embodiment, the proportion of the tertiary metal is achieved by controlling a thickness of the tertiary metal deposited on the Cu material. In another embodiment, the proportion of the tertiary metal is achieved by controlling the thickness of a layer of powder of the tertiary material deposited between the Cu and Ti materials.

Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.

Abstract: A highly reliable member for a semiconductor device, in which a high melting point metallizing layer, which consists mainly of a high melting point metal such as W and/or Mo, and an intervening metal layer, which has a melting point of not greater than 1,000° C. and consists mainly of at least one selected from among Ni, Cu and Fe, are provided on an AlN substrate material in this order on the AlN substrate material, and a conductor layer consisting mainly of copper is directly bonded to the intervening metal layer without intervention of a solder material layer. A semiconductor element or the like is mounted on the member for a semiconductor device, thereby fabricating a semiconductor device. The high melting point metallizing layer is formed on an aluminum nitride substrate by post-fire or co-fire metallization.

Abstract: The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.

Abstract: A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the waves are transferred to the stencil or printable material through air or a vibrational interface medium. The vibrational energy in turn assists with separating the printable material from the side walls of the apertures of the stencil. The vibrational energy can further assist in the process of cleaning the stencil. The acoustic pressure can also be used in the drying process by having the waves impinge on the water droplets to atomize the droplets on the surface of the stencil. The technology can be used for the assembly of Printed Circuit Assemblies, Ball Grid Array IC Packages, Flip Chip, etc.

Abstract: A method for securing a metallic substrate (24) to a metallic housing (26). The method may include: firing a first solderable coating (64) to an edge (60) of the metallic substrate (24); firing a second solderable coating (64) to a groove (62) of the metallic housing (26); joining the edge (60) of the metallic substrate (24) to the groove (62) of the metallic housing (26) to form a joint (66) at the first solderable coating and the second solderable coating; applying a solder (68) to the joint (66); and solder bonding the metallic substrate (24) to the metallic housing (26) to provide a hermetic seal at the joint (66). There is also an electronic control module that incorporates the method.

Abstract: A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 Å to 8200Å.

Abstract: An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.

Abstract: An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrodes formed using a flux comprises the steps of: applying a pretreatment process including coating of the solder bump electrode with the flux and applying a heat treatment thereto, and carrying out the flux cleaning to clean the heat-treated flux.

Abstract: A single-tube Coriolis mass flow sensor includes a stainless steel sleeve having an unplated interior surface and a titanium member having a cylindrical end inserted into the stainless steel sleeve. The exterior surface of the titanium cylindrical end forms a joint with the unplated interior surface of the stainless steel sleeve. The titanium cylindrical end is brazed to the unplated interior surface of the stainless steel sleeve at the joint, and the stainless steel sleeve exerts compressive stress on the titanium cylindrical end at the joint.

Abstract: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate. A filler metal secures the outer perimeter of the insert to the backing plate in order to eliminate leakage from the cooling channel during sputtering of the sputter target.

Abstract: Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected against re-oxidation by a non-corrosive, alkali metal fluoroaluminate layer (e.g. a potassium fluoroaluminate layer) which forms simultaneously.

Abstract: A method for securing an electrically conductive interconnect (30) through a metallic substrate (36) having a first surface (36) and a second surface (38). The method may include the steps of: forming a hole (34) in the metallic substrate (36), the hole (34) defined by an internal surface (46) of the metallic substrate (36) that extends from the first surface (36) to the second surface (38) of the metallic substrate (36); applying an electrically insulating layer (48) to the metallic substrate (36) including at least the first surface (36), the second surface (38), and the internal surface (46); applying a solderable coating (50) to at least a portion of the electrically insulating layer (48) on the second surface (38) of the metallic substrate (36) around the hole (34); applying a solder (52) to at least a portion of the solderable coating (50) at and above the hole (34); inserting the interconnect (30) through the hole (34); and solder bonding the interconnect (30) within the hole (34).

Abstract: A flexible plating method by continuously controlling the hydrogen concentration of the plating bath by adding controlled amounts of hydrogen gas. The control of the hydrogen concentration is provided by selected distribution and number of nozzles and size of orifices; and predetermined pressure and duration of hydrogen gas flowing through the nozzles, wherein pressure and duration may be variable with time. The control of the hydrogen concentration is selected to provide a ramp-up phase, needed for a rapid plating start, followed by a saturation phase, for consistent plating stability. With metal layer plating under control, a robust, reliable and low-cost metal structure enabling electrical wire connections to the interconnecting copper metallization of ICs is formed. The structure comprises a layer of barrier metal, preferably nickel, that resists copper diffusion, deposited on the non-oxidized copper surface.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

Abstract: A barrier metal layer is provided on at least one of electrodes, one formed on a substrate and other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Zn, contacting the solder material with the barrier metal layer while the solder material is in a molten state; and solidifying the solder material. Thereby, in the case where the electronic component is soldered to the substrate with the solder material such as an Sn—Zn based material, the degradation of a soldering part is avoided, and thus a sufficient thermal fatigue strength of the soldering part is obtained.

Abstract: A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.

Abstract: A method for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a first substrate having a plurality of pointed tips separated by valleys wherein the substrate is covered by a metallic layer, portions of the metallic layer is covered by an insulator, and other portions of the metallic layer are exposed is formed. The other portions of the metallic layer that are exposed are covered with a thermoelectric material overcoat. A second substrate of thermoelectric material is then fused to the pointed tip side of the first substrate by, for example, heating the back of the first substrate to melt the thermoelectric material overcoat or by passing current through the pointed tips to induce Joule heating and thereby melt the thermoelectric material overcoat.

Abstract: A method of brazing a metal work is disclosed, in which the work is heated to at least the softening temperature of resin and coated with a suspension constituted of a mixture of a flux and a binder, after which the work is brazed by being heated and dried. As a result, the binder (resin) attached to the surface of the work is softened and increases in stickiness. Even if foreign matter becomes attached to the work surface, therefore, the binder causes the flux to be firmly attached to (coupled with) the work surface together with the foreign matter. Thus, the flux can be securely coated (attached) on the work surface. The temperature of the work is not lower than the evaporation temperature of water. Even if oil becomes attached to the work surface, therefore, the water in the suspension is evaporated before it can be repelled by the oil, thus making it possible to prevent the flux from being repelled along with the water. In this way, the flux can be securely coated (attached) on the work surface.

Abstract: A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is pumped upwardly through a set of solder wave nozzles so as to clean and preheat the nozzles. The preselected conductor areas on the board are then aligned with the nozzles. At this time, the board is maintained at a height slightly above the nozzles to the extent that the molten solder is prevented from escaping from between the board and the nozzles. A relatively low wave of solder Is produced through the nozzles to cause the low wave of solder to contact and preheat the preselected conductor areas on the board. A relatively high wave of solder is then produced through the nozzles to locally solder the preselected conductor areas on the printed circuit board.

Abstract: A method of glass frit bonding wafers to form a package, in which the width of the glass bond line between the wafers is minimized to reduce package size. The method entails the use of a glass frit material containing a particulate filler material that establishes the stand-off distance between wafers, instead of relying on discrete structural features on one of the wafers dedicated to this function. In addition, the amount of glass frit material used to form the glass bond line between wafers is reduced to such levels as to reduce the width of the glass bond line, allowing the overall size of the package to be minimized. To accommodate the variability associated with screening processes when low volume lines of paste are printed, the invention further entails the use of storage regions defined by walls adjacent the glass bond line to accommodate excess glass frit material without significantly increasing the width of the bond line.

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: A new soldering flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards is disclosed. The new flux composition includes chemical reducing agents such as hydrazine, hydroxylamine, dimethylamine borane, and hydroquinone.

Abstract: The invention relates to a method for attaching a first body which is of one of a metal matrix composite (MMC)-material or copper to a second body which is a ceramic member for acting as a heat sink, wherein the surface of the ceramic member which is placed against the MMC- or copper body is coated with a first metal by heating the two bodies to above the eutectic temperature of a system comprised of the matrix metal of the MMC-body or the copper of the copper body and the first metal applied to the surface of the ceramic member; and subsequently cooling the system to room temperature.

Abstract: A bi-metal aluminum includes bearing an aluminum-based bearing layer, a steel backing, and an intermediate aluminum-based layer that has a thickness of from 60 to 120 micrometers positioned between the aluminum-based bearing layer and the steel backing. The intermediate layer has a yield strength that is less than that of the aluminum-based bearing layer. The aluminum-based bearing layer has a fine microstructure which imparts a very high fatigue strength. The aluminum bearing layer generally includes 4% to 15% by weight lead or tin, up to 26% by weight silicon and up to 2% by weight of any of the elements magnesium, manganese, nickel, zirconium, zinc, copper, or chromium with the remainder of the bearing layer being aluminum.

Abstract: A method of joining dissimilar metals includes the steps of applying a thin layer of pure aluminum to a surface of at least one of the dissimilar metals to be joined. The pure aluminum is applied by electroplating or by a PVD technique to prevent formation of oxides or intermetallic aluminum compounds in the pure aluminum layer. A barrier layer of chromium may also be applied between the substrate metal and the pure aluminum layer in high temperature applications such as where subsequent welding is anticipated to prevent the formation of harmful intermetallic compounds which may otherwise occur between the substrate and the pure aluminum layer. The sheets or slabs of dissimilar metals are then roll bonded by hot rolling with the aluminum layer forming an excellent diffusion bond therebetween. Difficult to bond metals such as copper, brass, carbon steel, titanium, certain aluminum alloys and zinc may be roll or press bonded in this way.

Abstract: The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.

Abstract: Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected against re-oxidation by a non-corrosive, alkali metal fluoroaluminate layer (e.g. a potassium fluoroaluminate layer) which forms simultaneously.

Abstract: A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.

Abstract: A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below the eutectic temperature of Ti and Cu. The above materials are heated and welded at temperature of (700 through 887° C.). The temperature selected is below the eutectic temperature of the Ti and Cu. The finished material forms a sputtering backing plate for a sputtering. A target member, bonded to the Cu material side of the backing plate, completes the sputtering target. In one embodiment, the proportion of the tertiary metal is achieved by controlling a thickness of the tertiary metal deposited on the Cu material. In another embodiment, the proportion of the tertiary metal is achieved by controlling the thickness of a layer of powder of the tertiary material deposited between the Cu and Ti materials.

Abstract: The present invention relates to a method for preparing the surface of a high purity alumina ceramic or sapphire specimen that enables direct brazing in a hydrogen atmosphere using an active braze alloy. The present invention also relates to a method for directly brazing a high purity alumina ceramic or sapphire specimen to a ceramic or metal member using this method of surface preparation, and to articles produced by this brazing method. The presence of silicon, in the form of a SiO2-containing surface layer, can more than double the tensile bond strength in alumina ceramic joints brazed in a hydrogen atmosphere using an active Au-16Ni-0.75 Mo-1.75V filler metal. A thin silicon coating applied by PVD processing can, after air firing, produce a semi-continuous coverage of the alumina surface with a SiO2 film. Room temperature tensile strength was found to be proportional to the fraction of air fired surface covered by silicon-containing films.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.

Abstract: A machine tool or die that is fabricated from thermally spray-formed steel is easily repaired by cleaning, roughing and covering the surface to be repaired by a cold-spray layer of metal and then forming a weldment by conventional electric welding processes. The repaired surface is then finished by conventional machining, grinding and polishing and then the tool is put back into service.

Abstract: A method which utilizes flip chip technology to provide interconnection between printed circuit boards and integrated circuits is disclosed. The method involves metallization of the bond pad and multiple, novel bump compositions and coating compositions to provide an interconnection which is reliable and which withstands differences in the coefficient of thermal expansion between the silicon device and the bump material.

Abstract: Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG. 1, which satisfies the formulas: 1≦x≦20, 3≦y≦13 and 3≦(x+y)/2≦13, or formulas: 0.1≦x≦25, 2≦y≦15 and 2≦(x+y)/2≦15.

Abstract: The present invention relates to a method of soldering a semiconductor chip to a substrate, such as to a capsule in an RF-power transistor, for instance. The semiconductor chip is provided with an adhesion layer consisting of a first material composition. A solderable layer consisting of a second material composition is disposed on this adhesion layer. An antioxidation layer consisting of a third material composition is disposed on said solderable layer. The antioxidation layer is coated with a layer of gold-tin solder. The chip is placed on a solderable capsule surface, via said gold-tin solder. The capsule and chip are exposed to an inert environment to which a reducing gas is delivered and the capsule and chip are subjected to a pressure substantially beneath atmospheric pressure whilst the gold-tin solder is heated to a temperature above its melting point.

Abstract: Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20° C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5° C./second.

Abstract: Surprisingly, silver-copper-palladium brazing alloys, which have hitherto been used only for the brazing of components of the same material, are also very well suited for brazing directly titanium to stainless steel if, the latter component clasps the titanium component tightly, so that the cold joint is under constant compressive stress. In a method for forming the titanium-steel compound the titanium component is provided with a cylindrical end which has a smaller out-side diameter than an adjacent main portion whose external surface is a first surface to be brazed. The cylindrical steel component is a sleeve whose inside diameter is equal to the outside diameter of the main portion and whose internal surface is a second surface to be brazed. A silver-copper-palladium brazing alloy is placed around the end of the titanium component. The steel sleeve is slipped thereover.

Abstract: A sheet metal layer of a layer-like configuration with rolled-on brazing material and a process for producing a honeycomb body by stacking and/or winding sheet metal layers made of a layered material. At least a part of sheet metal layers for honeycomb bodies have a structure forming channels through which a fluid can flow. At least part of the sheet metal layers is formed initially of a layered material with at least one layer of chromium-containing steel and at least one mainly aluminum-containing layer, that are homogenized to a large extent during a subsequent heat treatment. The layered material is provided with at least one additional layer made of brazing material when it is produced by rolling, so that during a subsequent heat treatment at least parts of contact locations between the sheet metal layers are joined by brazing.