Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.

Abstract: A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.

Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than the interior surfaces absent the coating. The stencil can also have one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board). Solder paste can be printed through the aperture(s) of the stencil onto contact pads on a printed wiring board.

Abstract: A ball mounting apparatus for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.

Abstract: A process and an apparatus for applying a brazing material to a metallic structure, especially a honeycomb body, include bringing the metallic structure into contact with a pulverulent brazing material in such a way that the brazing material at least partially adheres to the metallic structure. The metallic structure and/or the brazing material are made to vibrate, at least when they are in contact.

Abstract: Method for assembling a semiconductor device having fatigue-resistant interconnection fillet provides a semiconductor chip with at least one solder bump comprising an alloy of tin and lead with a melting temperature higher than the solder paste used. Further, a solder paste (preferably binary) is provided, which comprises tin and about 2.5 weight percent silver, and has a melting temperature of about 221° C. The solder bump is brought in contact with the solder paste, the bump is partially immersed in the paste, and thermal energy is supplied to reflow the solder paste at about 235° C. The amount of energy and time after the reflow of the paste is controlled so that the molten paste dissolves a pre-determined amount of the solder bump (lead and tin) to form a ternary alloy of about eutectic composition (about 1.62 weight % Ag, 36.95 weight % Pb, 61.43 weight % Sn) without melting the solder bump.

Abstract: The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the solder bumps is held in contact with a substrate and a compressible device. As the temperature is increased to melt the solder in the cavities, at an appropriate time and temperature, the compressible device is caused to decompress resulting in the mold separating from the substrate and leaving formed solder bumps on the contacts on the substrate. Various mechanisms are described to cause the force holding the mold and substrate together to decrease.

Abstract: A ball mounting method for mounting a plurality of balls held by a head onto a workpiece. The head is clamped such that a clamping surface mounted to the head is engaged with a rigid lower positioning stop, and then moved above a ball supply section. The balls are held on the head, and the head is moved above the workpiece. The clamping force is then released so that the clamping surface does not engage the lower stop, and the head is counterbalanced between the lower positioning stop and an upper positioning stop. While the head is unclamped and counterbalanced, the balls are mounted on the workpiece. The head is then clamped and moved above the ball supply section again.

Abstract: A brazing filler metal sheet is prepared. The brazing filler metal sheet includes a brazing filler metal layer, a sticking material layer, and a released paper. The brazing filler metal layer includes a brazing filler metal. A coating material layer is laminated on the brazing filler metal layer. The coating material layer includes a mixture of coating material particles and a binder. As the coating material particles, MCrAlY particles and abrasive particles are used. The coating material layer is then dried, and the brazing filler metal sheet is cut (step S4), and adhered to a rotor blade. The rotor blade is heated, to melt the brazing filler metal. The brazing filler metal diffuses due to the heat treatment holding process. A solidified layer is then formed by cooling. This solidified layer is subjected to blasting to allow the cubic boron nitride particles to protrude.

Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

Abstract: A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card. The impedance-controlled coupled noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern with one or more of the through openings receiving a differential signal pair of solder columns. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at opposite ends to a substrate and a circuit card. An electrical connection is provided between the impedance-controlled coupled noise suppressor structure and an image return current path of the circuit card.

Abstract: A method and structure are provided for implementing a column attach coupled noise suppressor for a solder column structure of the type used to join a substrate to a circuit card. The electrical noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at one end to either a substrate or a circuit card and are inserted through the elongated through openings of the electrical noise suppressor structure, spaced apart from the electrically conductive sidewalls. Then the solder columns are attached at the other end to the other one of the substrate or circuit card.

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.

Abstract: Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface.

Abstract: A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a compatible interlayer material such as titanium-nickel alloy placed between the two parts and heated at a temperature that is greater than the eutectic temperature of the interlayer material, where alloys, intermetallics or solid solution formed between the metal part and the metal interlayer material, but that is less than the melting point of either the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove unwanted materials, to assure a biocompatible component assembly for implantation in living tissue.

Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

Abstract: A method for protecting a semiconductor process wafer surface from contacting thermally degraded photoresist including providing a semiconductor process wafer having a process surface; forming a protective layer over selected areas of the process surface said protective layer including a resinous organic material having a glass transition temperature (Tg) that is about greater than a thermal treatment temperature; forming a photoresist layer over at least a portion of the protective layer to include a photolithographic patterning process; and subjecting the semiconductor process wafer to the thermal treatment temperature.

Abstract: An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent cover is secured on the alignment plate and shaped to cover part of the guide grooves. A parts feeder is operatively associated with the alignment plate to feed solder columns over the upstream end of the alignment plate. The solder columns are received in the guide grooves and fed toward the downstream end of the alignment plate while the alignment plate is vibrated by the vibrator. The solder columns are arranged in an array within the guide grooves so that a vacuum pickup tool may readily capture the cylindrical body of the solder columns.

Abstract: A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.

Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Abstract: A multi-chip stack structure and method of fabrication are provided utilizing self-aligning electrical contact arrays. Two or more arrays of interconnection contacts are provided, with one array being a rough aligned contact array, and a second array being a high bandwidth contact array. The rough aligned contact array has larger contacts and at least a portion thereof which melts at a substantially lower temperature than the melting temperature of the contacts of the high bandwidth contact array. By positioning two integrated circuit chips in opposing relation with the arrays mechanically aligned therebetween, and applying heat to melt the contacts of the rough aligned array, the two chips will rotate to align the respective contacts of the high bandwidth contact arrays, thereby achieving improved connection reliability between the structures.

Abstract: A method for forming a channel within a coated, metal-based substrate is described. In one technique, a channel-forming material is first deposited on the substrate, followed by the deposition of a bonding agent, such as a braze. One or more coatings can then be applied over the substrate. In one embodiment, the channel is formed when the channel-forming material is subsequently removed. In another embodiment, the channel is formed due to the lack of adhesion between particular channel-forming materials and the overlying bonding agent. Related articles are also described, e.g., gas turbine components which include protective coatings and a pattern of cooling channels.

Abstract: A family of low temperature brazing alloys wherein the alloy is utilized in the form of a filler metal or shim and consists of electroplated nickel on zinc shimstock, wherein the zinc shimstock includes zinc, aluminum and silicon, with or without a small amount of lead, tantalum or bismuth. The use of the brazing alloys for joining aluminum parts together or an aluminum part to a part of another metal, such as brass. Further, metallic coating could be thermally spray coated and powder metals could be utilized as the filler materials with equally acceptable brazing techniques. Using these techniques, the brazing could be accomplished at a temperature in the range of 750 to 1050° F.

Abstract: A method of providing turbulation on the inner surface of a passage hole (e.g., a turbine cooling hole) is described. The turbulation is first applied to a substrate which can eventually be inserted into the passage hole. The substrate is often a bar or tube, formed of a sacrificial material. After the turbulation is applied to the substrate, the substrate is inserted into the passage hole. The turbulation material is then fused to the inner surface, using a conventional heating technique. The sacrificial substrate can then be removed from the hole by various techniques. Related articles are also described.

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the substrate. The solder ball attachment system further includes a conveyor assembly to move the substrate between the flux station and the solder ball placement station.

Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.

Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.

Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Abstract: A new type of suspension circuit electrical bonding pad for electrically and mechanically connecting the magnetic recording head is described. The new type of bonding pad will serve as the joint material as well as the joint interface. Thus, there is no need to apply the conductive material in between the bonding pads and the magnetic recording head terminals, consequently reducing the process leading time and simplifying the magnetic recording head assembly process.

Abstract: A method of establishing a leak tight and structural connection between a core tube and an accommodating header plate in a tubular heat exchanger, including the steps of positioning the core tube into bores of the header plate and a braze foil, installing a ferrule inside the core tube end, radially expanding the ferrule in the core tube end, thus expanding the core tube end into intimate contact with the header plate in which it is received, deforming a ferrule into pinching contact with the braze foil plate, directing the flow of the braze material towards the contact surface area, and brazing the tubular heat exchanger in order to form a seal at the intimate contact area. A leak tight connection and a tubular heat exchanger having a leak tight connection produced via the noted method are also set forth.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: A method of interconnecting a pair of metal oilfield tubulars having complementary tapered edges with a common contact surface when the tubulars are interconnected, is provided. The method consist of having a melting temperature lower than the melting temperature of the tubulars, interconnecting the tubulars whereby the think layer of metal is in between the tubulars, applying heat to the thin layer of metal so as to melt the thin layer of metal, and cooling the tapered edges whereby a metallurgical bond is created between the tubulars.

Abstract: An electronic package having a solder interconnect liquidus temperature hierarchy to limit the extent of the melting of the C4 solder interconnect during subsequent second level join/assembly and rework operations. The solder hierarchy employs the use of off-eutectic solder alloys of Sn/Ag and Sn/Cu with a higher liquidus temperature for the C4 first level solder interconnections, and a lower liquidus temperature alloy for the second level interconnections. When the second level chip carrier to PCB join/assembly operations occur, the chip to chip carrier C4 interconnections do not melt completely. They continue to have a certain fraction of solids, and a lower fraction of liquids, than a fully molten alloy. This provides reduced expansion of the solder join and consequently lower stresses on the C4 interconnect.

Abstract: Improved fluxless soldering processes are disclosed. In accordance with one technique, a solder preform having a plurality of voids formed on its primary surfaces is disposed between metallized surfaces of a pair of members to be joined. Upon reaching the reflow temperature, fresh solder flows into the voids and wets portions of the metallized surfaces, thus overcoming the solder surface oxidation problem common to fluxless soldering processes. In accordance with another technique, a solder preform having primary surfaces coated with a thin layer of a noble metal is employed. The noble metal substantially prevents oxidation of the solder performs surfaces while the preform is heated to reach reflow temperature. As the solder temperature increases, portions of the noble metal are dissolved into the bulk solder material. Thus, during reflow, non-oxidized bulk solder material is enabled to wet the metallized surfaces of the pair of members.

Abstract: An object of the present invention is to provide a filler metal for an aluminum brazing sheet for heat exchangers capable of preventing or controlling occurrence of a melting hole during heating for brazing, and a method of manufacturing the same. In an Al—Si alloy filler metal which is clad on the aluminum brazing sheet and melted during heating for brazing, the maximum particle diameter of a coarse Si particle crystallized in the eutectic structure of the filler metal is 20 ?m or less. Provided that an average value and a standard deviation in a normal distribution of the particle diameter of the coarse Si particle in the filler metal are respectively ? and ?, (?+3?) is preferably 10 ?m or less. This brazing sheet is obtained by a method of adding a specific amount of Na, Sr, or Sb to the filler metal, a method of limiting the amount of impurities in the filler metal within a specific range, a method of specifying a cooling rate during the casting of the filler metal, or the like.

Abstract: A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.

Abstract: A flux is supplied from a flux transfer head having a flux transfer pin to a predetermined position on a substrate, and then a solder ball is mounted on the predetermined position by a solder ball mounting head having a suction nozzle. The solder ball mounting head and the flux transfer head are provided alternately on a head supporter. When the rotation of the head supporter is stopped, sucking a solder ball suction by the suction nozzle, depositing the flux on a free end of the flux transfer pin, transferring the flux to the substrate by the flux transfer pin, and mounting the solder ball on the predetermined position by the ball mounting head, and examining whether the solder ball exists on the suction nozzle by which the ball mounting operation has just carried out are executed.

Abstract: A solder ball dispenser (100) has feeder unit, head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are mobilized in the chambers by moving air. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The singulator ejects the balls one at a time to a target device such as a Ball Grid Array. The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum. The trajectory of each solder ball is stopped before moving to a next position in the pneumatic singulator. No solid object causes solder balls to move within the dispenser or to be ejected from the dispenser.

Abstract: A turbine engine component includes a substrate and a wear coating on the substrate. The wear coating includes wear-resistant particles in a matrix phase, the wear-resistant particles being formed of chrome carbide or a cobalt alloy. Methods for forming a turbine engine component are also disclosed.

Abstract: Systems and methods for forming a seal between members of an assembly are disclosed. In one embodiment, a seal is formed between a first member and a second member by establishing within the members a bounded volume and creating within the bounded volume a pressure differential with respect to the ambient pressure outside the bounded volume. The pressure differential results in a uniformly applied clamping force to the members thereby creating a reliable seal. A sealing member (such as solder, epoxy, or other sealant) is positioned between the first and second members and the resulting assembly is mechanically positioned such that heat can then be applied to melt the solder. Concurrently, the pressure differential is created which allows the externally applied mechanical positioning to be relaxed while the members are being sealed together. This system and method can be used to create hermetic seals.

Abstract: A method of forming a meltable material at a joint between telescopingly engaged male and female elements, with the female element having a joint surface that surrounds a joint surface of the male element. The method includes the steps of: placing a ring of the meltable material around one of the male and female elements at a first location spaced from the joint; heating the male and female elements at the joint to a temperature at which the meltable material melts; sliding the ring of meltable material from the first location to a second location; with the ring of meltable material at the second location and the male and female elements of the joint at a temperature at which the meltable material melts, causing the meltable material to flow between the male and female joint surfaces; and cooling the male and female elements at the joint to solidify the meltable material between the male and female joint surfaces.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4, SF4, and H2 and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component and formed with a plurality of through-holes for attracting the solder balls thereto, with the solder ball attracting mask having a principal face engageable with the solder balls and a rear face engageable with the suction apparatus such that the through-holes extend through the solder ball attracting mask from the principal face to the rear face, the through-holes each including a funnellike attraction area for attracting the solder ball thereto, which reduces its diameter gradually from the principal face towards the rear face up to a suction port and a suction hole which has a diameter larger than that of the suction port and extends from the suction port to the rear face to define a suction space.

Abstract: A backing plate of Ti for supporting a Ti sputtering target is formed of at least two components welded together. The backing plate is welded by interposing a Cu or Zr foil or powder between faces to be welded, and then heating the assembly to a reaction temperature high enough to melt one of the Ti and Cu or Zr to produce a liquid phase. The heating temperature is retained for a time long enough to permit diffusion of the Cu or Zr into the Ti to produce a liquid phase diffusion weld. By permitting diffusion to occur, a separate metallic compound is not produced at the welding face. In effect welding is accomplished without producing a welding face, whereby no interface exists in the finished weld. The resulting weld has a strength substantially equal to the strength of the Ti material, and very good welding qualities.

Abstract: A laser diode bar, solder preform and heat sink are assembled prior to reflowing the solder in a manner to prevent molten solder from being drawn by capillary action over the light emitting end of the diode bar. A recessed pin 30 locates the ends of the laser bar and solder preform with respect to an edge of the heat sink so that the laser bar and solder preform overhang the heat sink edge by respective amounts. When molten, the solder will not be drawn by capillary action to obscure the light emitting end of the laser diode bar.

Abstract: A highly heat-resistant laminated component for a fusion reactor has at least of a plasma-facing area made of tungsten or a tungsten alloy, a heat-dissipating area of copper or a copper alloy with a mean grain size of more than 100 &mgr;m, and an interlayer of a refractory metal-copper-composite. The refractory metal-copper-composite has a macroscopically uniform copper and refractory-metal concentration progression and a refractory metal concentration of between 10 vol. % and 40 vol. % over its entire thickness.