Abstract: A backlight unit which provides light to a liquid crystal display panel of a liquid crystal display. The backlight unit includes an optical lens module including an optical lens disposed above a point light source and configured to refract light output from the point light source, and a reflective polarization layer disposed directly on the optical lens and configured to separate polarization components of the light to transmit one polarization component and reflect another polarization component.

Abstract: The light-emitting device, according to one embodiment, comprises: a light-emitting structure including a first conductive semiconductor layer, an active layer formed beneath the first conductive semiconductor layer, and a second conductive semiconductor layer formed beneath the active layer; a reflective electrode arranged beneath the light-emitting structure and having a first region beneath the second conductive semiconductor layer and a second region extending from the first region and penetrating through the second conductive semiconductor layer and the active layer; and an electrode electrically connected to the first conductive semiconductor layer.

Abstract: A light emitting device includes a substrate, a light emitting element mounted on the substrate, a light transmissive member placed on an upper surface of the light emitting element, and a sealing member which seals the light emitting element and the light transmissive member. The light transmissive member is a plate-shaped member not containing a phosphor and is larger than the light emitting element when viewed from above. The sealing member includes a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element and covers side surfaces of the light emitting element, and a second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having wavelength different from wavelength of the light emitted from the light emitting element and covers at least an upper surface of the light transmissive member.

Abstract: Disclosed are a light emitting module and a light emitting device. The disclosed light emitting module includes a plurality of light emitting devices and a wire connecting the light emitting devices with each other and having at least a first end portion coupled with each light emitting device. The wire has a length longer than a distance between the light emitting devices, and is located higher than bottom surfaces of the light emitting devices. Each light emitting device includes a body including an insulating material, a first lead frame making contact with the body and having a first coupling part, a second lead frame making contact with the body and having a second coupling part, and a light emitting chip on at least one of the first and second lead frames. The first and second coupling parts are located higher than the bottom surfaces of the light emitting devices, and the wire is coupled with the first and second coupling parts of the light emitting devices.

Abstract: A backlight module and a display device comprise: a light guide plate; a LED light bar including a plurality of LED lamps arranged at intervals at a side of the light guide plate so as to emit the light to the light-entering surface of the light guide plate, and a gap provided between the LED light bar and the light guide plate; and a reflection member arranged outside the gap and reflecting the light from the LED light bar toward the light guide plate, wherein first regions and second regions are arranged on the reflection member at intervals, the first regions correspond to positions of the LED lamp, the second regions correspond to an interval between the plurality of LED lamps and/or a position outside the LED lamps at the end of the LED light bar, and the first region has a reflective index less than the second region.

Abstract: A semiconductor device includes a wiring substrate, a lower magnetic shield member, a semiconductor chip, and an upper magnetic shield member. The lower magnetic shield member is provided on the wiring substrate. The semiconductor chip is provided on the lower magnetic shield member. The semiconductor chip includes a magnetic memory element. The upper magnetic shield member is provided over the semiconductor chip. The semiconductor chip is disposed between the upper magnetic shield member and the lower magnetic shield member. The lower magnetic shield member and the upper magnetic shield member are in direct contact with each other.

Abstract: There is provided an optical element for use with a LED wherein a base face is arranged to receive incoming light from the LED. The optical element comprises a top face having a pattern of optical structures which refract light away from an optical axis (A) of the optical element. Further the optical element comprises a plurality of side faces extending between the top face and the base face and arranged to refract light from the light towards the optical axis (A). the top face extends such that it covers a first angular range relative to the optical axis (A). The first angular range is an angular range outside which light emitted by the LED would be subject to total internal reflection at an imaginary extension of the top face.

Abstract: An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.

Abstract: A light emitting device includes a substantially cuboid package and a light emitting element. The package is made up of a molded article, and first and second leads each embedded in the molded article. The first lead has a first terminal component exposed at the boundary between a first side face, a bottom face, and a rear face contiguous with the bottom face and opposite a light emission face. The second lead has a second terminal component exposed at the boundary between a second side face opposite the first side face, the bottom face, and the rear face. The first terminal component has a first terminal concavity whose opening is contiguous with the first side face, the bottom face, and the rear face. The second terminal component has a second terminal concavity whose opening is contiguous with the second side face, the bottom face, and the rear face.

Abstract: Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member.

Abstract: A manufacturing method of an LED package structure includes the steps of providing a base; disposing an LED chip on the base; electrically connecting the base and the LED chip by at least one metal wire, wherein the metal wire has an apex, and a height between the apex and a top surface of the LED chip is defined as a loop height; adhering a first phosphor sheet to the LED chip by a B-stage resin of the first phosphor sheet, wherein the first phosphor sheet covers the top surface, the side surface, and the electrode of the LED chip, the thickness of the first phosphor sheet is smaller than the loop height, and the apex of the metal wire is exposed from the first phosphor sheet; and disposing an encapsulation resin in the base to encapsulate the LED chip, the metal wire, and the first phosphor sheet.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.

Abstract: An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer.

Abstract: One electrical lead from an LED package is soldered to an inner electrically conductive member positioned and electrically isolated from an outer electrically conductive member by electrically insulating material while a second electrical lead and a neutral lead from the LED are soldered to the outer electrically conductive member so that heat is transferred from an LED die within the LED package to the outer electrically conductive member and then to a thermally conductive outer casing with a thermal path that minimizes thermal resistance and a tail cap is used to create a snug mechanical fit between a bottom surface of a metal can of a terminal battery held within the outer casing and the a surface of the tail cap.

Abstract: Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si—Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si—H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.

Abstract: A semiconductor nanocrystal including a core comprising a first semiconductor material comprising at least three chemical elements and a shell disposed over at least a portion of the core, the shell comprising a second semiconductor material, wherein the semiconductor nanocrystal is capable of emitting light with an improved photoluminescence quantum efficiency. Also disclosed are populations of semiconductor nanocrystals, compositions and devices including a semiconductor nanocrystal capable of emitting light with an improved photoluminescence quantum efficiency. In one embodiment, a semiconductor nanocrystal includes a core comprising a first semiconductor material comprising at least three chemical elements and a shell disposed over at least a portion of the core, the shell comprising a second semiconductor material, wherein the semiconductor nanocrystal is capable of emitting light upon excitation with a photoluminescence quantum efficiency greater than about 65%.

Abstract: The phosphor sheet of the present invention mainly includes a sheet material that is formed by mixing and solidifying of a phosphor powder and an adhesive material. The sheet material subsequently forms a first surface that receives a light source, and forms a second surface that is located on the opposite side to the first surface for scattering a light source. In addition, the distribution ratio of the phosphor powder as well as the adhesive material within the phosphor sheet is based mainly on the different positions and different distances towards the light source; the distribution ratio of the phosphor powder and the adhesive material increases gradually from the first surface towards the second surface. The phosphor of the present invention is designed to be a sheet material, so as to enable the overall volume of the light emitting device to be reduced.

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Abstract: A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract: A light emitting device includes a flip-chip mounted type light emitting element, a phosphor-containing member, and a first reflecting member. The flip-chip mounted type light emitting element has a pair of electrodes disposed on a bottom surface side. The phosphor-containing member is provided at least above the light emitting element and separated from the light emitting element. The first reflecting member is configured to cover the phosphor-containing member. An opening is in at least one of side faces of the light emitting device, the opening extracting light emitted from the light emitting element and light whose wavelength is converted by the phosphor-containing member.

Abstract: A display device including a wiring substrate having a first substrate layer and a second substrate layer, a conductive adhesive layer configured to cover the wiring substrate, a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer and electrically connected to a first electrode and a second electrode. Further, the first electrode is disposed on the first substrate layer, and the second substrate layer has one surface facing the conductive adhesive layer and the other surface covering the first electrode, and an auxiliary electrode electrically connected to the first electrode and the second electrode are disposed on one surface of the second substrate layer.

Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.

Abstract: A light-emitting device is disclosed and comprises: a semiconductor stack; a transparent substrate comprising a first material; a bonding layer which bonds the semiconductor stack and the transparent substrate; and a medium in the transparent substrate, the medium comprising a second material different from the first material.

Abstract: A semiconductor structure having a Group III-N buffer layer and a Group III-N barrier layer in direct contact to form a junction between the Group III-V buffer layer the Group III-N barrier layer producing a two dimensional electron gas (2DEG) channel, the Group III-N barrier layer having a varying dopant concentration. The lower region of the Group III-N barrier layer closest to the junction is void of intentionally introduced dopant and a region above the lower region having intentionally introduced, predetermined dopant with a predetermined doping concentration above 1×1017 atoms per cm3.

Abstract: Apparatus and associated methods relate to a diversion driver module that dynamically adds a diversion current to an LED current so that the summed current maintains a predetermined minimum holding current requirement of a phase-controlled dimmer supply. In an illustrative example, the diversion current may be a function of input AC line voltage and/or firing angle of the phase-controlled dimmer supply. The phase controlled device may include, for example, a triac. The triac may supply adjustable pulse-width current to dim the LED according to a phase control signal. The diversion driver module may include one or more heat dissipating components disposed in thermal communication with the lamp base. Some driver modules may be sufficiently compact and energy efficient to provide smooth dim-to-black performance while operating within acceptable temperature limits for reliable operation while contained in the base of a standard form factor lamp, such as an E12 full-glass lamp.

Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.

Abstract: A light source module includes a circuit board, board pads disposed on the circuit board, and a light emitting diode chip disposed on the board pads. The light emitting diode chip includes a substrate and a semiconductor stacking part disposed between the substrate and the circuit board, and the substrate includes an inclined part disposed at an upper portion thereof and a discharging part disposed at one side surface thereof.

Abstract: According to one embodiment, a luminaire includes a board provided in a main body part, a light-emitting element provided on a surface of the board, a surrounding wall member provided to surround the light-emitting element, and a joining part including a first portion which is provided between the board and the surrounding wall member and a second portion which is provided outside the surrounding wall member and covers at least a part of an outer wall of the surrounding wall member.

Abstract: The present disclosure provides various embodiments of light emitting chips and packages with improved current spreading structures, such as non-uniform via structures or varied via structures. In some embodiments, these structures may be used to regulate current flow and current crowding in order to improve emitter efficiency and uniformity. Some embodiments of this disclosure may also refer to contact pad placement to improve current flow. In some embodiments of non-uniform via structures, the size of the vias may vary, whereas in other embodiments, the shape or spacing between the vias may vary.

Abstract: A light source module, backlight assembly, and display device including the same are disclosed. In one aspect, the light source module includes a printed circuit board, a plurality of light sources arranged over the printed circuit board, and a plurality of optical lenses respectively arranged over the light sources. Each of the optical lenses has upper and lower surfaces opposing each other. The light source module further includes a plurality of reflection patterns respectively formed on the optical lenses. Each of the reflection patterns includes a first reflection pattern formed on the lower surface of the corresponding optical lens and a second reflection pattern formed on the upper surface of the corresponding optical lens.

Abstract: A light conversion assembly 100, a lamp and a luminaire is provided. The light conversion assembly 100 comprises a first layer 108 and a second layer 106. The first layer 108 comprises first luminescent material. The first luminescent material comprises particles showing quantum confinement and have at least in one dimension a size in the nanometer range. The first layer is arranged to receive light 110 from a light source emitting light of a first spectral distribution in a violet or blue spectral range. The first spectral distribution has a first peak wavelength. The first layer 108 is configured to convert substantially all the received light 110 towards light 104 of a second spectral distribution in the blue spectral range, independently of the position of first spectral distribution in the violet or blue spectral range. The second spectral distribution has a second peak wavelength which is a longer wavelength than the first peak wavelength. The second layer 106 comprises a second luminescent material.

Abstract: An organic light-emitting display apparatus includes a flexible substrate. The organic light-emitting display apparatus includes a first plastic layer. A first barrier layer is formed on the first plastic layer. A second plastic layer is formed on the first barrier layer. An organic light-emitting device layer is formed on the second plastic layer. A thin film encapsulating layer encapsulates the organic light-emitting device layer. The first barrier layer is patterned to correspond to an area where the organic light-emitting device layer is formed.

Abstract: Disclosed are a non-shrink varistor substrate and a method of manufacturing the same, wherein the non-shrink varistor substrate includes: a reinforcement layer formed of a ceramic material; a thin bonding layer formed on the surface of the reinforcement layer; a first varistor layer formed on the thin bonding layer and including a plurality of inner electrode layers therein; and an outer electrode layer formed on the first varistor layer and electrically connected to the inner electrode layers by a conductive material loaded in a via hole formed through the first varistor layer, the thin bonding layer and the reinforcement layer, and also wherein bondability and bonding reliability can be enhanced upon heterobonding of the reinforcement layer and the varistor layer.

Abstract: A light source may comprise a housing, a window mounted in a front plane of the housing, a window length spanning a front plane length, and a linear array of light-emitting elements within the housing. The linear array may be aligned with and emit light through the window, and the linear array may span the window length, wherein first and last light-emitting elements of the linear array are positioned adjacent to widthwise edges of the window, and wherein window sidewalls at the widthwise edges are aligned flush with housing sidewalls.

Abstract: An electro-optical device for performing time division gray scale display and which is capable of arbitrarily setting the amount of time during which light is emitted by EL elements is provided. From among n sustain periods Ts1, . . . , Tsn, the brightness of light emitted by the EL elements during at least one sustain period is set to be always lower than the brightness of light emitted by the EL elements during the other sustain periods, and the sustain periods are extended by the amount that the brightness has dropped. In accordance with the above structure, the sustain periods can be extended by lowering the setting of the brightness of light emitted by the EL elements.

Abstract: The present invention relates to a lighting device (1) comprising: a carrier (106, 206, 306), an electrode pattern comprising at least a first carrier electrode (214, 312) arranged on the carrier, and an opto-electronic module (102, 202, 302, 402). The opto-electronic module (102, 202, 302, 402) comprises: a first, a second, a third and a fourth electric contact point arranged to together define a tetrahedron; a first light source (208, 308, 408) arranged to emit light in response to an AC-voltage being applied between the first electric contact point (216, 316, 416) and the second electric contact point (218, 318, 418); and a second light source (210, 310, 410) arranged to emit light in response to an AC-voltage being applied between the third electric contact point (220, 320, 420) and the fourth electric contact point (222, 322, 422).

Abstract: A circular symmetric optical element for redirecting light which is emitted by a light source through a wavelength converting element, wherein the emitted light have an average color cA and a wavelength distribution depending on an emission angle from the wavelength converting element. Light having the average color cA have an emission angle tA.

Abstract: A light emitting device includes a substrate, a light emitting element mounted on the substrate, a light transmissive member placed on an upper surface of the light emitting element, and a sealing member which seals the light emitting element and the light transmissive member. The light transmissive member is a plate-shaped member not containing a phosphor and is larger than the light emitting element when viewed from above. The sealing member includes a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element and covers side surfaces of the light emitting element, and a second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having wavelength different from wavelength of the light emitted from the light emitting element and covers at least an upper surface of the light transmissive member.

Abstract: A fluorescent material according to an aspect of the present disclosure mainly comprises a compound represented by AB0.5-w-x-y-zCwEuxSmyLnzW0.5O3. A is one or more elements selected from the group consisting of alkaline earth metals and mainly contains Ca. B is one or more elements selected from the group consisting of divalent metals and mainly contains Mg. C is one or more elements selected from the group consisting of alkali metals and mainly contains Li, Na, or Li and Na. Ln is one or more elements selected from the group consisting of rare earth elements excluding Eu and Sm. w, x, y, and z meet the following conditions: 0.05?w?0.25, 0.05?x+y?0.25, 0.0?y?0.02, and w=x+y+z.

Abstract: There is herein described a patterned thin-film wavelength converter which comprises a substrate having a first patterned surface with a first pattern, and a thin film deposited on the first patterned surface. The thin film consists of a wavelength converting material and has a second patterned surface that is distal from the substrate. The second patterned surface has a second pattern that is substantially the same as the first pattern of the substrate. An advantage of the patterned thin-film wavelength converter is that post-deposition processing is not required to produce a textured surface on the wavelength converting material. A method of making the patterned thin-film wavelength converter is also described.

Abstract: An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode on the substrate; and a thin film encapsulation layer including a first inorganic layer having a first density on the substrate and a second inorganic layer having a second density on the first inorganic layer, the second density being different from the first density, and the organic light emitting diode being encapsulated between the thin film encapsulation layer and the substrate.

Abstract: The invention relates to a light-emitting semiconductor component, having: a light-emitting semiconductor chip (1) with an active region (11) which, in operation, emits light (31) having a first spectrum; a wavelength conversion element (2) which is positioned remote from the semiconductor chip (1), is downstream of the semiconductor chip (1) in the beam path of the light (31) having the first spectrum and converts the light (31) having the first spectrum at least partially into light (32) having a second spectrum; and a filter layer (3), which reflects at least a part (34) of a light (33) incident on the semiconductor component from the outside. The part (34) of the light (33) incident on the semiconductor component from the outside that is reflected by the filter layer (3) has a visible wavelength range and overlaps a color impression produced by the wavelength conversion element when the semiconductor component is in a switched-off state.

Abstract: LED light source having at least one light-emitting component. The light-emitting component is at least partly protected with a transparent protective material, which contains aliphatic thermoplastic polyurethane (TPU). A light-source band also includes at least one light-emitting component.

Abstract: A light emitting device includes a light emitting structure having a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer. A first electrode is electrically connected to the first conductive semiconductor layer and is provided under the light emitting structure, and a second electrode is electrically connected to the second conductive semiconductor layer and is provided under the light emitting structure. A first contact portion is provided through the light emitting structure and includes a first region electrically connected to the first electrode. A second region contacts a top surface of the first conductive semiconductor layer, and an insulating ion implantation layer is provided around the first contact portion to insulate the first contact portion from the second conductive semiconductor layer.

Abstract: A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting device further includes the translucent member having a translucent base and the wavelength conversion layer formed on the translucent base. The wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device.

Abstract: A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region and first and second metal contacts, wherein the first metal contact is in direct contact with the n-type region and the second metal contact is in direct contact with the p-type region. First and second metal layers are disposed on the first and second metal contacts, respectively. The first and second metal layers are sufficiently thick to mechanically support the semiconductor structure. A portion of a sidewall the device adjacent to one of the first and second metal layers is reflective.

Abstract: Disclosed is a light emitting device package including a package body having at least one cavity, at least one light emitting device mounted on the cavity, and a molding member disposed on the light emitting device to fill the cavity. The package body has at least one first recess formed at an upper portion than a bottom surface of the cavity, and the molding member is disposed to an inner edge of the at least one first recess.

Abstract: A photocoupler includes: a light emitting element; a light receiving element; an inner resin layer; and an outer resin layer. The light emitting element is driven by an input electrical signal. The light receiving element is configured to convert emission light of the light emitting element into an electrical signal. The inner resin layer includes a base resin and a curing agent. The base resin contains isocyanuric acid having an epoxy group. The curing agent contains an acid anhydride having an acid anhydride group. The inner resin layer covers the light emitting element and the light receiving element. Then outer resin layer encloses the inner resin layer and configured to block the emission light. Carbon atomic concentration increases and oxygen atomic concentration decreases with distance in depth direction of the inner resin layer from an interface.

Abstract: A semiconductor package according to some examples of the disclosure may include a base with a first redistribution layer on one side, first and second side by side die attached to the base on an opposite side from the first redistribution layer, an interposer attached to active sides of the first and second die to provide an interconnection between the first and second die, a plurality of die vias extending from the first and second die to a second redistribution layer on a surface of the package opposite the first redistribution layer, and a plurality of package vias extending through the package between the first and second redistribution layers.