Abstract: A process for encapsulating an apparatus to restrict environmental element permeation between the apparatus and an external environment includes applying multiple barrier layers to the apparatus and preceding each layer application with a separate cleaning of the presently-exposed apparatus surface, resulting in an apparatus which includes an encapsulation stack, where the encapsulation stack includes a multi-layer stack of barrier layers. Each separate cleaning removes particles from the presently-exposed apparatus surface, exposing gaps in the barrier layer formed by the particles, and the subsequently-applied barrier layer at least partially fills the gaps, so that a permeation pathway through the encapsulation stack via gap spaces is restricted. The quantity of barrier layers applied to form the stack can be based on a determined probability that a stack of the particular quantity of barrier layers is independent of at least a certain quantity of continuous permeation pathways through the stack.

Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

Abstract: To provide a light emitting device having high light extraction efficiency, and a method for manufacturing the light emitting device. A method for manufacturing a light emitting device (100) according to the present invention, includes: forming a sealing member (40) for sealing a light emitting element (10) on a base body (30) by dropping, the base body (30) including a conductive member (20) for connecting to the light emitting element (10), and a molding (25) integrally molded with the conductive member (20); the sealing member (10) being formed such that at least a part of a periphery of the sealing member (40) is located on an outward surface (38) of the conductive member (20) or the molding (25), the outward surface facing outward in a top view.

Abstract: An illumination device has a dual-emitting LED die structure in which a first p-n diode structure emits primary light having a peak at a first wavelength, and a second p-n diode structure emits primary light having a peak at a second wavelength that is longer than the first wavelength. A phosphor medium is positioned to be stimulated by the primary light of the dual-emitting LED die structure, and in response emits secondary, wavelength converted light, thereby contributing to a combined white illumination. Other embodiments are also described and claimed.

Abstract: In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

Abstract: An electronic device including a substrate and an optoelectronic device package is provided. The optoelectronic device package includes a light source, an image sensor and a plurality of connecting pins. The light source is configured to emit light toward a direction of a bottom surface of the optoelectronic device package. The image sensor is configured to receive reflected light from the direction of the bottom surface. The connecting pins are bended toward an opposite direction of the direction of the bottom surface and electrically connected to the substrate thereby increasing a discharge path of the electrostatic discharge.

Abstract: A method of manufacturing an embedded LED circuit board, including the step of: forming a through hole in a circuit substrate, the through hole communicating a first surface and a second surface of the circuit substrate; embedding a LED in the through hole of the circuit substrate; and electrically connecting two pins of the LED with a circuit disposed on the second surface of the circuit substrate. Because the LED is disposed in the through hole of the circuit substrate, not disposed on the surface on the circuit substrate, the LED is embedded in the circuit substrate. Therefore, the thickness of the embedded LED circuit board is reduced and it is advantageous to assembling the embedded LED circuit board in the electronic devices having limited volume.

Abstract: Embodiments of a light-emitting element and a light-emitting element array comprise: a light-emitting structure which includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; first and second electrodes which are disposed respectively on the first and second conductive type semiconductor layers; and an insulation layer which is disposed on the light-emitting structure exposed between the first electrode and the second electrode, wherein the second electrode comprises a light-emitting element including: a first part which overlaps with the second conductive type semiconductor layer in the thickness direction of the light-emitting structure; and a second part which extends from the first part and does not overlap with the second conductive type semiconductor layer in the thickness direction, thereby being capable of improving the productivity of a light-emitting element manufacturing process while minimizing the light leakage phenomenon between the

Abstract: Provided is a display apparatus which may reduce or minimize the occurrence of a defect due to an external shock while improving an expected lifespan thereof. The display apparatus includes a substrate having a first area, a second area, and a bending area between the first area and the second area, and being configured to be bent around a bending axis extending in a first direction, an inorganic insulating portion on the bending area, having a width along an edge of the substrate, and including a plurality of dams defining a plurality of grooves, and a first organic layer on the bending area, and partially overlapping the inorganic insulating portion to cover at least some of the dams.

Abstract: In various embodiments, a lighting device is provided. The lighting device includes a channel-shaped elongate profiled body having a central or web portion and two side portions sidewise of the web portion, a profiled body having mutually opposed undercuts opening inwardly of the channel shape of profiled body, and a light radiation source assembly including an elongate support board carrying one or more light radiation sources, e.g. LED sources, the support board having longitudinal sides extending into the said undercuts, wherein the light radiation source assembly is retained by the channel-shaped profiled body.

Abstract: A UV LED package disclosed herein includes a submount, a UV LED chip adapted to emit UV light at 200 nm to 400 nm, and a package body mounted with the submount. The submount includes a heat dissipating substrate, a first reflective electrode film and a second reflective electrode film separated from each other by an electrode separation gap on the heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film. The UV LED chip includes a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad.

Abstract: An organic light emitting diode array substrate, a method for manufacturing the same and a display device are provided. The organic light emitting diode array substrate includes a base substrate, a first electrode layer, a first light emitting layer, a second electrode layer, a thin film transistor, a third electrode layer, a second light emitting layer, and a fourth electrode layer. A drain electrode of the thin film transistor is connected to the third electrode layer, the third electrode layer is connected to the second electrode layer, a light emission of the first light emitting layer is controlled by the first electrode layer and a second electrode layer, and the light emission of the second light emitting layer is controlled by the third electrode layer and the fourth electrode layer.

Abstract: Disclosed is a substrate for mounting light emitting element with a high positional accuracy and a method of fixing the substrate. A substrate for mounting light emitting element defines a first recess and a second recess in first side in a plan view. The first recess is defined by two corner portions and a straight portion which connects the two corner portions, and the second recess further includes at least two straight portions each narrowing toward the inner end portion.

Abstract: Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode (LED) array apparatus includes a plurality of LEDs mounted to a substrate and an encapsulation covering the LEDs and having a surface texturing configured to extract light, wherein the surface texturing is includes at least one light extracting feature having a diameter larger than two or more of the LEDs.

Abstract: Disclosed are an optical member, a display device including the same, and a method of fabricating the same. The optical member includes a first substrate; a wavelength conversion layer on the first substrate; and a second substrate on the wavelength conversion layer, wherein the wavelength conversion layer includes an oxygen barrier.

Abstract: A light-emitting device having a curved light-emitting surface is provided. Further, a highly-reliable light-emitting device is provided. A substrate with plasticity is used. A light-emitting element is formed over the substrate in a flat state. The substrate provided with the light-emitting element is curved and put on a surface of a support having a curved surface. Then, a protective layer for protecting the light-emitting element is formed in the same state. Thus, a light-emitting device having a curved light-emitting surface, such as a lighting device or a display device can be manufactured.

Abstract: The present invention provides a micro light emitting diode display panel and a repair method thereof. The anode of the micro light emitting diode display panel is divided into a plurality of electrode plates which are spaced with one another. The respective electrode plates are electrically connected and integrated through the connection lines. Each electrode plate is correspondingly arranged with one micro light emitting diode. When one of the micro light emitting diodes is defective, the connection line electrically connected to electrode plate of the micro light emitting diode is cut to individually repair the defective micro light emitting diode to be a dark spot, and other micro light emitting diodes can normally emit light. The present invention can simplify a repair process of the micro light emitting diode display panel to promote the success rate of the repair of the micro light emitting diode display panel.

Abstract: The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

Abstract: The present disclosure provides an organic light-emitting display panel. The organic display panel comprises a substrate, an organic light-emitting structure disposed on the substrate, a package layer covering the organic light-emitting structure. The package layer comprises at least one non-organic block layer and at least one organic block layer, and a block pole. The block pole comprises a first block pole and a second block pole. The second block pole is disposed at the periphery of the first block pole. The at least one non-organic block layer comprises an outmost non-organic block layer. The first block pole is at least covered by the outmost non-organic block layer. The at least one organic block layer can partially cover the first block pole or not cover the first block pole at all. The at least one non-organic block layer can partially cover the second block pole or not cover the second block pole at all.

Abstract: A light-emitting device includes a support having a primary surface; a power supply connector located on the primary surface of the support and including one or more wire pads; a light-emitting element located on the primary surface of the support; one or more wires connecting the light-emitting element and the wire pads; and a cover member located on the primary surface of the support and covering the light-emitting element and the wire pads.

Abstract: Provided is a charging member that suppresses the occurrence of abnormal discharge under low temperature and low humidity. The charging member includes a support and a surface layer on the support, and the surface layer contains a compound represented by the following formula (a), (b), (c), or (d).

Abstract: A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.

Abstract: Provided is a light-emitting device that has excellent light extraction efficiency, inhibits deterioration of light-emission characteristics over time, and can be easily produced. The light-emitting device includes a substrate, a solid-state light-emitting element mounted on the substrate, a circular tube-shaped member positioned on the substrate such as to surround the solid-state light-emitting element, and a transparent resin portion including a cylindrical section that encapsulates the solid-state light-emitting element and that is in contact with an inner surface of the circular tube-shaped member, and a dome-shaped section that is positioned above the cylindrical section. The inner surface of the circular tube-shaped member is water repellent. The dome-shaped section contains a phosphor that is excited by light of a light-emission wavelength of the solid-state light-emitting element.

Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Abstract: Disclosed herein are an LED package module capable of lowering the price of manufacture by simply reducing the number of LED packages without decreasing the luminance, and a display device having the same. To this end, in an LED package module according to an exemplary embodiment of the present disclosure and a display device having the same, a plurality of LED packages is mounted on an LED module substrate in a matrix such that the LED packages are oriented in intersecting directions alternately in each of the longitudinal and lateral directions. Consequently, it is possible to increase price competitiveness by simply reducing the number of LED packages without degrading the display quality.

Abstract: A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

Abstract: A light source unit of one embodiment includes a socket housing, a light emitting module, a substrate, a sealing part, and a lens part. The sealing part seals the light emitting element and the conductive part to the substrate. A lens part is formed on the sealing part. Alastic modulus of the lens part is higher than that of the sealing part.

Abstract: A light emitting device includes light emitting elements. A substrate includes electrically conductive layers each having a first region in which the light emitting elements are arranged and a second region connected to the first region and provided at a position higher than the first region. An electrically conductive wire electrically connects the light emitting elements arranged on the electrically conductive layer and the second region of the adjacent electrically conductive layer. A resin molded portion is formed of a light-transmissive resin that seals the light emitting elements and the electrically conductive wire. The resin molded portion has a shape in which centrally projected cylindrical lens portions is aligned, and in each of the cylindrical lens portions, the light emitting elements is arranged in a line shape. The second region is arranged between the light emitting elements in the light emitting element array.

Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.

Abstract: A display panel includes a first substrate and a second substrate sealed by sealant, and an inorganic material thin film is also formed outside the sealant. The display panel possesses a better characteristic of water and oxygen isolation in a lateral direction. A manufacturing method of a display panel and a display device including the display panel are further disclosed.

Abstract: The invention provides a shell integrated light-emitting diode assembly, which includes: a plurality of light-emitting units, each of the light-emitting units including at least one light-emitting chip and an external wiring which is coupled to the light-emitting chip; and a shell structure, formed as a consolidation structure by a molding material for enclosing the light-emitting units to be inside the molding material; wherein the light-emitting units emit light through the molding material into an outside of the shell structure. The present invention also provides a shell integrated light-emitting diode lamp with the shell integrated light-emitting diode assembly, and a manufacturing method for the shell integrated light-emitting diode assembly.

Abstract: A light source module includes at least one light source emitting light, and a body supporting the light source, wherein the body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer contacted with the insulating layer, the conductive layer being at least provided in a path region in which electric current is applied to the light source, the conductive layer being contacted with the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

Abstract: A light-emitting device of the invention includes, a first substrate; a light-emitting element mounted on the first substrate and includes a second substrate and a semiconductor structure including a light-emitting layer; and a light-shielding body which is formed only on a surface of the light-emitting element opposite to the first substrate and includes a material including light-shielding particles.

Abstract: A light-emitting device package includes a supporting substrate, a light-emitting device on the supporting substrate, an adhesive layer on at least a portion of a side surface or lower surface of the light-emitting device, the adhesive layer connecting the light-emitting device to the supporting substrate, and an air layer in a space defined by the supporting substrate, the light-emitting device, and the adhesive layer.

Abstract: Disclosed is a method for manufacturing a flexible organic light-emitting diode (OLED) display component which includes steps of: forming a ferromagnetic material layer on a surface of a flexible substrate; and abutting the ferromagnetic material layer against a flat bearing surface, and applying a magnetic pull force directing to the bearing surface on the ferromagnetic material layer. Drawn by the magnetic pull force, the ferromagnetic material layer abuts closely against the flat bearing surface, smoothing out the flexible substrate, and meanwhile fixing the flexible substrate on the bearing surface.

Abstract: In a display device using a substrate having flexibility, a drop in reliability due to defects such as cracks in the case where a substrate is made to curve is controlled. A display device is provided including a first substrate having flexibility, the first substrate including a curved part, an organic film covering a first surface of the first substrate and a second surface opposing the first surface in the curved part; and a pixel part and a drive circuit part arranged on the first surface.

Abstract: Embodiments provide a light emitting device package including a substrate, a light emitting structure disposed under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, first and second electrodes connected to the first and second conductive semiconductor layers, a first pad connected to the first electrodes in first-first through-holes penetrating the second conductive semiconductor layer and the active layer, and a first insulation layer disposed between the first pad and the second conductive semiconductor layer and between the first pad and the active layer to cover the first electrodes in a first-second through-hole, and a second pad connected to the second electrode through a second through-hole penetrating the first insulation layer and electrically spaced apart from the first pad.

Abstract: A method for testing lifetime characteristics of a display panel in which a plurality of pixels each including a light-emitting element (an organic EL element) are arranged in a matrix, includes: setting a first light-emitting region including a plurality of pixels; setting a non-light-emitting region including all pixels adjacent to the first light-emitting region; setting a second light-emitting region including pixels which are not included in the first light-emitting region and the non-light-emitting region; and testing the lifetime characteristics of the display panel by causing the pixels in the first light-emitting region and the pixels in the second light-emitting region to emit light at different luminance levels without causing the pixels in the non-light-emitting region to emit light.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: A modular illuminating device comprises at least one frame (1) with the front elastic catches (2) for securing a transparent cover (4) to the frame (1), and the rear elastic catches (3) for fixing the frame (1) to a printed-circuit board (5) with at least one printed circuit module (6) and at least one light-emitting diode module (7) on its front side. The printed-circuit board (5) has multiple equally spaced assemblies comprised of the printed circuit modules (6) and LED modules (7), arranged in a row, or a rectangular matrix, or a honeycomb structure. The power line is printed along the printed-circuit board (5) with offtakes to individual printed circuit modules (6) and LEDs modules (7). Alternatively, the printed power line supplies the AC/DC converter placed at one end of the printed-circuit board (5), and the AC/DC converter supplies individual printed circuit modules (6) and LEDs modules (7) with constant voltage via another pair of leads printed along the printed-circuit board (5).

Abstract: A method can be used for producing an optoelectronic device. A first leadframe section with a component is provided. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.

Abstract: A carrier for an LED is disclosed. In an embodiment, the carrier includes a main body, wherein the carrier has an upper side on which a first contact area for attaching an LED is arranged, and wherein a protective device for protecting the LED from electrostatic discharges is integrated in the main body.

Abstract: A display device includes a first pixel and a second pixel. The first pixel and the second pixel are adjacent to each other. Each of the first pixel and the second pixel includes a first display region and a second display region. The first display region is configured to reflect incident light. The second display region is positioned inside the first display region and configured to emit light. The second display region has at least two pairs of parallel sides. A position of the second display region inside the first display region in the first pixel and a position of the second display region inside the first display region in the second pixel are different from each other.

Abstract: Disclosed is a light emitting device. The light emitting device comprises: a first lead and a second lead which are spaced apart from each other; a body part comprising a base, a reflector, and a cavity; and a light emitting diode which is disposed in the cavity, wherein the first lead includes a first bottom lead and a first top lead located on the first bottom lead, and the second lead includes a second bottom lead and a second top lead located on the second bottom lead, and wherein a separation region between the first top lead and the second top lead has a different shape than the separation region between the first bottom lead and the second bottom lead, the separation region between the first top lead and the second top lead having a shape bent at least once.

Abstract: An ultraviolet light emitting device having high quality and high reliability is provided by preventing deterioration of electrical characteristics which is associated with an ultraviolet light emission operation and caused by a sealing resin.

Abstract: Light emitting apparatus including: substrate; LED chips on substrate; sealing member sealing LED chips; buffer layer on substrate; and dam material on the top surface of buffer layer, for holding back sealing member, wherein the adhesive strength of buffer layer to substrate and the adhesive strength of dam material to buffer layer are higher than the adhesive strength of dam material to substrate.

Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.