Abstract: A charge transfer device has a charge transfer region under charge transfer electrodes for stepwise conveying charge packets through potential wells to a floating diffusion region, and the charge transfer region has a boundary sub-region contracting toward the floating diffusion region, wherein the final potential well is created at a certain portion in said boundary sub-region close to the floating diffusion region so that each charge packet travels over a short distance, thereby enhancing a charge transfer efficiency.

Abstract: A charge coupled device includes first and second pluralities of column registers and first and second register segments. The first plurality of column registers are splayed with respect to and on one side of a column direction line, and the second plurality of column registers are splayed with respect to and on another side of the column direction line. The first register segment is coupled to the first plurality of column registers, and the second register segment is coupled to the second plurality of column registers. The second register segment is spaced apart from the first register segment so as to define a layout area between the first and second register segments where at least one of an isolation register element and an output node is disposed. Each column register of the first plurality of column registers includes a plurality of column element wells.

Abstract: Low current leakage DRAM structures are achieved using a selective silicon epitaxial growth over an insulating layer on memory cell (device) areas. An insulating layer, that also serves as a stress-release layer, and a Si3N4 hard mask are patterned to leave portions over the memory cell areas. Shallow trenches are etched in the substrate and filled with a CVD oxide which is polished back to the hard mask to form shallow trench isolation (STI) around the memory cell areas. The hard mask is selectively removed to form recesses in the STI aligned over the memory cell areas exposing the underlying insulating layer. Openings are etched in the insulating layer to provide a silicon-seed surface from which is grown a selective epitaxial layer extending over the insulating layer within the recesses. After growing a gate oxide on the epitaxial layer, FETs and DRAM capacitors can be formed on the epitaxial layer.

Abstract: A charge transfer device is provided which is capable of reducing a reset field-through noise in a stable manner without being affected by characteristics of transistors and without occurrence of a mustache-shaped pulse-like noise.

Abstract: A test structure for insulation-film evaluation has a CCD structure comprising a semiconductor substrate (1), a gate insulating film (2) to be evaluated which is formed across the main surface of the semiconductor substrate (1), a plurality of gate electrodes (3a-3i) equally spaced in this order on the gate insulating film (2), a wire (20) connected to the gate electrodes (3a, 3d, 3g), a wire (21) connected to the gate electrodes (3b, 3e, 3h), and a wire (22) connected to the gate electrodes (3c, 3f, 3i). The test structure further comprises a read circuit (5) including an inverter (4) and other elements connected to the output stage of the CCD structure. This test structure allows simple failure location.

Abstract: To improve such a fact that a signal electric charge from a sensor unit in an MOS imaging device can not be completely read out by a low read-out voltage. To this end, in an arrangement in which a plurality of unit pixels each of which has a sensor unit (S) with a photoelectric conversion region (20) as well as an insulating gate transistor MOS for reading out a signal electric charge from the sensor unit (S) are disposed, a photoelectric conversion region of the sensor unit (S) is so constructed as to form a single potential dip for the signal electric charge and a gate electrode (18) of the insulating gate transistor (MOS) is formed into a pattern in which the middle portion in a channel width direction thereof is positioned above the central portion of the potential dip or its vicinity.

Abstract: A signal detecting apparatus in a charge coupled device (CCD) is disclosed. A CCD has a photodiode for converting an image signal into an electrical signal charge, a vertical CCD (VCCD) for transferring the signal charge in a vertical direction, a horizontal CCD (HCCD) for transferring the vertically transferred signal charge in a horizontal direction, and a sense amplifier for sensing the signal charge transferred from the HCCD. The disclosed signal detecting apparatus for a CCD includes a floating diffusion region for collecting the signal charges transferred from the HCCD and detecting a voltage formed by the signal charges. A reset gate is formed on one side of the floating diffusion region, and a reset drain is formed on one side of the reset gate opposite to the floating diffusion region. An output gate is formed on the other side of the floating diffusion region.

Abstract: In a floating diffusion output type or a floating gate output type charge-to-voltage converter, the floating diffusion or the floating gate is coupled to one or more diffusion regions by means of one or more switch elements, and such elements are selectively turned on or off in such a manner that the the charge-to-voltage conversion factor is raised to obtain a great voltage amplitude when a small quantity of signal charge is input, or the conversion factor is lowered to obtain a small voltage amplitude when a large quantity of signal charge is input.

Abstract: A charge transferring device includes a detection MOSFET for detecting a signal charge, a reset MOSFET for removing the signal charge after the signal charge is detected. The reset MOSFET includes a floating diffusion layer to which the signal charge is transferred, an impurity layer to which a reset voltage is applied, and a reset gate electrode to which a reset signal is supplied. The detection MOSFET includes a detection gate electrode connected with the floating diffusion layer. The floating diffusion layer includes a first semiconductor region and a second semiconductor region whose impurity concentration is lower than that of the first semiconductor region. The impurity concentration of the first semiconductor region is set to a concentration such that the first semiconductor region is not depleted in a voltage lower than the reset voltage when the reset signal is supplied to the reset gate electrode.

Abstract: A flash memory cell and a method for fabricating the same are provided. A first conductive film exposing a predetermined area of a semiconductor substrate is formed on the semiconductor substrate, and a tunnel oxide and a first interlevel dielectric film are formed on the surface of the semiconductor substrate exposed by the first conductive film and on the surface of the first conductive film, respectively. A floating gate covering the tunnel oxide and extending to the upper portion of the first conductive film in the vicinity of the tunnel oxide is formed as a second conductive film, and a second interlevel dielectric film is formed on the surface of the floating gate. A third conductive film electrically connected to the first conductive film in the vicinity of the floating gate is formed on a second interlevel dielectric film, thereby forming a control gate electrode comprised of the first conductive film and the third conductive film.

Abstract: The present invention provides a tunnel barrier structure comprising: a first semiconductor ridged portion having a first top surface, and said first semiconductor ridged portion being defined by a groove; an insulating layer burying the groove, and the insulating layer having a first upper surface which is higher in level than the first top surface of the first semiconductor ridged portion, and the insulating layer having side walls extending upwardly from edges of the first top surface of the first semiconductor ridged portion; side wall insulating films provided on the side walls; and a tunnel insulating film provided on the first top surface of the first semiconductor ridged portion, and the tunnel insulating film being defined by the side wall insulating films.

Abstract: The image sensor charge detection amplifier has a charge storage well 60, a charge sensor 32 for sensing charge levels in the charge storage well 60, a charge drain 28 adjacent to the charge storage well 60, and charge transfer structures for transferring charge from the charge storage well 60 to the charge drain 28.

Abstract: In a solid-state image pickup device adopting a progressive scanning system, a plurality of light-receiving sections are arranged in matrix, and signal charge transfer sections including a pair of horizontal transfer sections are provided so as to correspond to the light-receiving sections in each of rows. The signal charge transfer sections are selectively driven for each of the rows, and the signal charges of the odd-numbered light-receiving sections are transferred by one of the paired horizontal transfer sections, while those of the even-numbered light-receiving sections are transferred by the other horizontal transfer section. The device is thus constituted in such a manner that the signal charges of all the light-receiving sections are transferred in the horizontal direction using two horizontal transfer sections in each of the rows. Thus, smear characteristics can greatly be improved and low power consumption can easily be achieved.

Abstract: In a charge transfer device and a driving method therefor, electrons are injected through an insulating film into floating gate 108 or electrons are extracted through the insulating film from the floating gate 108, whereby the potential of the floating gate is converged to a fixed voltage.

Abstract: A charge-coupled device has a first P-type well layer which forms a charge transfer section and a second P-type well layer which forms a floating diffusion layer section and within which the first P-type well layer is formed. The second P-type well layer below the floating diffusion layer section has an impurity concentration lower than that of the first P-type well layer whereby a depletion layer formed therein by a PN-junction flares in the direction to the second P-type well layer. With this arrangement, it is made possible to reduce the floating diffusion capacitance and to maintain a large output voltage with respect to a signal electron charge.

Abstract: In a charge transfer device, a floating gate is provided in an insulating film which is provided on a charge transfer channel layer. A buffer amplifier is connected with the floating gate, and detects signal charges in the charge transfer channel layer to generate a signal indicative of an output voltage corresponding to the signal charges. A bias gate is provided in the insulating film apart from the floating gate to cover at least a part of the floating gate. A bias applying unit applies a bias voltage to the bias gate in response to the output voltage signal such that an alternate current (AC) component of a voltage of the floating gate is substantially equal to an AC component of a voltage of the bias gate.

Abstract: There is provided a solid-state image sensor including (a) a photoelectric converter which converts light into electric charges, (b) a transfer section which transfers the electric charges, (c) a floating diffusion layer which converts the transferred electric charges into a voltage, and (d) a multi-staged source follower circuit which amplifies and then outputs the voltage, a distance L2 between a wiring through which drain potential is supplied and a gate electrode in a first-stage MOSFET being longer than the same in second or later MOSFETs. In accordance with the solid-state image sensor, it is possible to reduce a capacity of a gate electrode in a first-stage MOSFET, which ensures high sensitivity even in a solid-state image sensor having small-sized pixels which deal with a small quantity of electric charges.

Abstract: A charged coupled device is disclosed including an asymmetrical split with independent control over the regions on opposite sides of the split. The charge coupled device is configurable for use in multiline or kinetic spectroscopy, and includes two separate horizontal registers with optional charge dump regions for improving efficiency.

Abstract: There is provided a charge transfer device including (a) a charge transfer channel for transferring signal charges therethrough, (b) a floating diffusion region for accumulating therein charges transferred from the charge transfer channel, (c) a field effect transistor for resetting the floating diffusion region so that the floating diffusion region is at a predetermined potential and (d) a bias charge input section through which a bias charge is supplied and which is connected to either the charge transfer channel or the floating diffusion region. The field effect transistor includes a reset gate electrode and a reset drain.

Abstract: A sensor element has a field effect transistor sensitive to a physical quity to be detected. The gate electrode of the transistor is implemented as a floating gate. The sensor element has therefore integrated therein a sensor cell and a non-volatile memory. The operating point of the transistor can be adjusted permanently by means of the floating gate on which charges can be stored in a non-volatile manner. In addition, charges corresponding to a detected physical quantity can be stored on the floating gate via a simple circuit in a non-volatile manner.

Abstract: A CMOS imaging device which includes a charge pump connected to one or more of a reset gate, transfer gate and row select gate of sensor cells and provides gate control signals which give the imaging device an increased dynamic range charge capacity while minimizing signal leakage. A charge pump may also supply control signals to photogates used in the cells.

Abstract: A charge transfer structure (30) includes a substrate comprised of semiconductor material and, coupled to a surface of the substrate, a plurality of serially coupled devices each having a gate terminal. The plurality of serially coupled devices include a first single port device (D1) defining a first primary charge storage well, a second single port device (D3) defining a second primary charge storage well, a first two port device (D2) defining a first transfer device, a second two port device (D4) defining a second transfer device, and two instances of a third two port device each defining a cascode device (CD). The ports of these devices are serially coupled together in an order given by D1, D2, CD, D3, D4, CD for transferring charge between the first and second primary charge storage wells. Charge is inserted into and withdrawn from each of the first and second primary charge storage wells through a single diffusion that functions as both an input port and an output port.

Abstract: A DRAM memory cell array includes a wiring layer formed at a storage-capacitor level of the cell for establishing a flipped connection of complementary bit lines, or for connecting support circuits in a DRAM cell array. The wiring layer includes a lower capacitor electrode and upper capacitor electrode which are formed simultaneously with respective plates of a storage capacitor. Both capacitor electrodes may be used to form distinct interconnections within a DRAM cell array.

Abstract: An improved split gate flash memory cell is disclosed whose floating gate is formed to have a reentrant angle such that its width increases with increased distance from the substrate so as to minimize the possibility of defects in the poly oxide layer overlaying the floating gate. The split gate flash memory is fabricated using a process comprising the steps of: (a) forming a floating gate with an overlaying poly oxide layer on a substrate, wherein the floating gate is etched to have a reentrant angle such that its width generally increases with a distance from the substrate; (b) forming a CVD nitride spacer on the floating gate using a CVD nitride deposition, then anisotropic etching the CVD nitride to form a nitride spacer adjacent to the floating gate; (c) forming a control gate on the floating gate wherein the control gate and the floating gate are separated by the poly oxide and the nitride spacer; and (d) forming a source and drain in the substrate using a source and drain implantation.

Abstract: An image sensor having a plurality of pixels arranged in a series of row and columns comprising: a semiconductor substrate having a plurality of pixels formed in rows and columns with at least two row adjacent pixels and at least two column adjacent pixels formed within the substrate; and at least one electrical function integrated within the adjacent pixels that is shared between the adjacent pixels. The electrical function can be either a contact region or an electrical circuit used in implementing either a photogate, a transfer gate, a reset gate, a row select gate, an amplifier drain, an output node, a floating diffusion contact, a reset drain, a lateral overflow gate, an overflow drain or an amplifier.

Abstract: A bi-directional multi-tapped CCD sensor readout structure includes a well formed in a substrate, a channel formed in the well defining a channel direction, and a clocking structure disposed over the channel and oriented transversely to the channel direction. The clocking structure includes a plurality of register element sets. A first register element set includes a first floating sensing conductor and a plurality of clock signal conductors. The plurality of clock signal conductors includes a first clock signal conductor under which is defined a first junction at the electrical semiconductor junction between the well and the substrate and a second junction at the electrical semiconductor junction between the channel and the well. The first and second junctions define an inter-junction separation. The well is formed in the substrate and the channel is formed in the well so that a length of the inter-junction separation is controllable by a first clock signal applied to the first clock signal electrode.

Abstract: An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

Abstract: A semiconductor well region has a groove into which a block-shaped floating gate is formed. The block-shaped floating gate has a bottom surface facing a bottom surface of the semiconductor well region served as a first channel region, a first side surface facing one of side surfaces of the semiconductor well region served as a second channel region, a second side surface facing the other of side surfaces of the semiconductor well region served as a third channel region, thereby a channel width is trebled.

Abstract: A charge coupled device is disclosed including: a well formed in a substrate, the well having a conductivity opposite to that of the substrate; a first conductivity type of BCCD region formed on the well; a first lightly doped impurity region formed in a predetermined portion of the first conductivity type of BCCD region; a heavily doped impurity region formed in a predetermined portion of the BCCD region, the heavily doped impurity region having a predetermined distance from the first lightly doped impurity region; a second lightly doped impurity region formed between the first lightly doped impurity region and heavily doped impurity region; a first polysilicon gate formed over a portion of the BCCD region, placed between the first lightly doped impurity region and heavily doped impurity region; and a second polysilicon gate formed over the first lightly doped impurity region. The realization of high speed CCD and simplification of the circuit configuration can be obtained by using one-phase clocking.

Abstract: An imaging device formed as a monolithic complementary metal oxide semiconductor Integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node and an analog-to-digital converter formed in the substrate connected to the output of the readout circuit.

Abstract: An active pixel sensor architecture comprising a semiconductor substrate having a plurality of pixels formed, thereon, incorporating microlens and lightshields into the pixel architecture. Each of the pixels further comprising: a photodetector region upon which incident light will form photoelectrons to be collected as a signal charge; a device for transferring the signal charge from the photodetector region to a charge storage region that is covered by a light shield; a sense node that is an input to an amplifier; the sense node being operatively connected to the signal storage region. The pixel architecture facilitates symmetrical design of pixels which allows for incorporation of light shield and microlens technology into the design.

Abstract: A charged coupled device is disclosed including an asymmetrical split with independent control over the regions on opposite sides of the split. The charge coupled device is configurable for use in multiline or kinetic spectroscopy, and includes two separate horizontal registers with optional charge dump regions for improving efficiency.

Abstract: In an image sensor 1 wherein an N.sup.+ -type impurity layer 13 to become a light-receiving part of a first conductive type is formed in a well layer 12 of a second conductive type (P-type) provided in a semiconductor substrate 11 of the first conductive type (N-type), an N.sup.- -type impurity layer 14 whose impurity concentration is lower than that of the N.sup.+ -type impurity layer 13 and connected to the lower side of the N.sup.+ -type impurity layer 13 is provided between the N.sup.+ -type impurity layer 13 and the P-type well layer 12. Alternatively, a P-type impurity layer (not shown) whose impurity concentration is lower than that of the P-type well layer 12 and joining with the lower side of the N.sup.+ -type impurity layer 13 may be provided.

Abstract: A signal processing circuit for a solid state image sensor, includes a charge detection circuit for outputting a signal output from the image sensor, a first inverting amplifier receiving the signal output, and a second inverting amplifier having a source-grounded MOS transistor having a gate connected to receive an output of the first inverting amplifier. A threshold of the MOS transistor is set to be the same as a black reference voltage in the input signal applied to the MOS transistor. Thus, a reset noise included in the signal output from the image sensor is suppressed or removed.

Abstract: In order to realize a multi-function sensor in which a reduction of a CMOS sensor and an addition of pixel signals are performed in a pixel portion and, further, an addition and a non-addition can be arbitrarily performed, there is provided a solid state image pickup apparatus in which charges generated by a photoelectric converting device are perfectly transferred to a floating diffusion portion through a transfer switch and a change in electric potential of the floating diffusion portion is outputted to the outside by a source-follower amplifier. A few photoelectric converting devices are connected to one floating diffusion portion through the transfer switch. One set of a few source-follower amplifiers are formed for a few pixels. The photoelectric converting device is constructed by an MOS transistor gate and a depletion layer under the gate.

Abstract: A MOS transistor comprising channel stoppers formed of a first polysilicon layer to determine a channel width, and a gate electrode formed of a second polysilicon layer, wherein a bias voltage is applied to the channel stoppers. In a charge detector having a source follower circuit with a drive MOS transistor and a load MOS transistor for converting a transferred signal charge into a signal voltage, the MOS transistor of the invention is used as the drive transistor, and its source output voltage is fed back as a bias voltage to the channel stoppers, thereby minimizing both the DC bias variation in the output voltage of the source follower circuit and the nonuniformity in the conversion efficiency.

Abstract: A depletion type transistor formed on a semiconductor substrate includes a drain region and a source region formed in distinct areas on the substrate. An inversion layer is formed in the surface area between the drain and the source regions. The transistor further includes two insulated gates: a floating gate located above the substrate and insulated from the inversion layer by an insulating layer in such a way as to cover the inversion layer, and a control gate provided above the floating gate and insulated from the floating gate by the insulating layer.

Abstract: A charge transferring apparatus comprising, e.g., a buried type charge coupled device in which a pair of transfer electrodes located at the most downstream point of a charge transfer direction is driven by a drive pulse other than that for any other pair of transfer electrodes and a potential well formed at the pair of the transfer electrodes located at the most downstream point is made shallower than that at any other pair of transfer electrodes allowing the output dynamic range of a charge transfer device to be increased for improving the output quality.

Abstract: In an active pixel sensor having a plurality of pixels, each of the pixels having a photodetector for accumulating charge from incident light, a transfer gate for removing charge from the photodetector, a floating diffusion that acts as a sense node to an amplifier input, and a drain the improvement comprising the provision of a reset mechanism for each pixel by application of a potential adjacent the floating diffusion such that the area between the floating diffusion and the drain becomes depleted.

Abstract: The accuracy of an active pixel sensor cell is increased by utilizing a reset diode in lieu of the reset transistor that is conventionally used to reset the voltage on the photodiode of the cell. The reset diode, which is largely unaffected by 1/f noise, consistently resets the photodiode to a substantially constant voltage as opposed to the reset transistor which varies the reset voltage on the photodiode across integration periods due to the effect of 1/f noise. In the present invention, the photodiode is formed by forming a well region of a second conductivity type in a substrate of a first conductivity type. The reset diode is then formed by forming a reset region of the first conductivity type in the well region.

Abstract: A charge transfer device comprising charge transfer means for transferring charges, a floating diffusion layer for accumulating the charges transferred from said charge transfer means, a floating gate electrode formed on said floating diffusion layer via an insulating layer, charge detection means connected to the floating gate electrode for outputting a voltage corresponding to an amount of charges accumulated in the floating diffusion layer, first precharge means connected to the floating gate electrode, the first precharge means starting precharging of the floating gate electrode responsive to transition of a first pulse voltage from a first state to a second state, the first precharge means terminating precharging of the floating gate electrode responsive to transition of the first pulse voltage from the second state to the first state, second precharge means connected to the floating diffusion layer, the second precharge means starting precharging of the floating diffusion layer responsive to transition

Abstract: In a charge coupled device including a semiconductor substrate having a semiconductor region, a plurality of nonactive barrier electrodes, a plurality of first electrodes and a plurality of second electrodes arranged between the nonactive barrier electrodes, an outermost one of the nonactive barrier electrodes is electrically isolated from the others of the nonactive barrier electrodes.

Abstract: A liquid crystal display device comprises a plurality of redundancy lines formed on a substrate, and a signal line covering the plurality of redundancy lines, whereby the aperture ratio is effectively increased.

Abstract: A general absolute value circuit for developing a true, symmetric or bipolar, absolute value output signal from an input charge signal, compact enough to be used on a sensor chip incorporated into (or used in combination with) a pixel processor of the type used in imaging and other systems that collect electromagnetic radiation as part of on-chip circuitry, includes a balanced differential amplifier combined with a merged dual shelf transistor structure. The balanced differential amplifier, in response to an input charge signal, drives the merged dual shelf transistor structure which in turn generates the desired true absolute value output signal. Such circuitry may be used in imaging systems to implement focal-plane processing algorithms or may be used for performing a single read true absolute value computation by a pixel processor located on a sensor chip. The merged dual shelf transistor structure enhances performance and speed of the processor in which it is incorporated.

Abstract: Channel coupled feedback- technology for implementing many analog and digital signal processing functions in a single-polysilicon digital IC fabrication process is described. Field effect transistors are constructed having a common channel and the substrate regions of the field effect transistors in the channel are electronically connected. Thus, a fixed amount of charge can freely move within the channel in response to the application of the signal to be processed. By sensing the charge transferred within the channel when the input signal is applied, many signal processing functions are possible. Fixed-gain amplifiers, offset compensated amplifiers, integrators, differentiators, analog-to-digital converters, digital-to-analog converters, switchable gain amplifiers, automatic gain control systems, and linear transform computation circuits are constructed entirely with field effect transistors, eliminating the need for passive components for most signal processing functions.

Abstract: A charge generation device configured within a semiconductor region of a substrate. The device includes a source for providing an input charge and an input diffusion which receives said input charge. A barrier gate associated with the input diffusion determines a selected potential of the input diffusion. A preset diffusion presets the input diffusion to the selected potential. An output element receives the input charge from the input diffusion. A first coupling means is provided for coupling the preset diffusion to the input diffusion subsequent to the output diffusion receiving the input charge during a first clock cycle, and for decoupling the preset diffusion from the input diffusion prior to the input diffusion receiving the input charge during a second clock cycle.

Abstract: In order to stabilize the reference level of an output signal from a solid-state image pick-up device, the solid-state image pick-up device includes an output circuit 12 for obtaining a picture signal Y1(t) from information charges outputted from a horizontal shift register 11, an impedance conversion circuit 13 for reducing the output impedance of the picture signal Y1(t) and a clamp circuit 14 for fixing the reference level in the picture signal Y1(t), all of which are integrated on the same semiconductor substrate.

Abstract: A fast-timing bi-directional charge coupled device ("CCD") is disclosed. The CCD operates at a much faster overall rate than conventional CCD's, while paradoxically slowing down the readout rate of the pixels. Lower power consumption is required, less heat is generated, thermal noise is lower, and digital noise is lower. The novel CCD is capable of 10-25 .mu.sec timing resolution (or even faster). The configuration entirely eliminates the (formerly) rate-determining step of transferring data "horizontally" from the "top" of the CCD columns. Instead, the charges on columns are transferred either "up" or "down" in an alternating manner. For example, the charges in odd-numbered columns might be transferred one row "up" with each clock cycle, and charges in even-numbered columns might be transferred "down." This alternating charge transfer architecture is termed "bi-directional.

Abstract: The invention relates to a charge coupled device with a buried channel in which charge is detected by a MOST (MOS transistor) incorporated in the channel and having a surface channel of the conductivity type opposed to that of the charge coupled device. The source zone is situated in the centre of the CCD channel and is formed simultaneously with the channel bounding zone. The gate electrode comprises two portions situated on either side of the source zone, which portions, seen at the surface, do not overlap the source and drain zones. Below the gate electrode, a zone is formed of the same conductivity type as but with a higher doping than the CCD channel, which zone forms a charge storage region for the charge packet to be read out during the reading-out process. The source and drain zones are connected to the MOST channel region by means of extensions. The detector can be manufactured in a self-aligned manner, has a high charge storage capacity, a good noise behaviour, and a high speed.

Abstract: A light receiving device includes, in addition to a photodiode and a reset element, a comparator formed by a first and a second MOS transistor and a counter. The comparator compares an output potential of the photodiode applied to a gate electrode of the first MOS transistor with a threshold potential externally applied to a gate electrode of the second MOS transistor. The counter counts a time duration from a point of time when the photodiode is reset by the switching element to a point of time at which the output potential of the photodiode exceeds the threshold potential, and outputs the time duration in a numeral value corresponding to the quantity of light incident on the photodiode. The required light sensitivity can be maintained even when the quantity of light is either large or small. Also, non-destructive reading can be carried out.