Abstract: An integrated circuit structure includes a first gate strip; a gate spacer on a sidewall of the first gate strip; and a contact etch stop layer (CESL) having a bottom portion lower than a top surface of the gate spacer, wherein a portion of a sidewall of the gate spacer has no CESL formed thereon.

Abstract: A TFT formed on an insulating substrate source, drain and channel regions, a gate insulating film formed on at least the channel region and a gate electrode formed on the gate insulating film. Between the channel region and the drain region, a region having a higher resistivity is provided in order to reduce an Ioff current. A method for forming this structure comprises the steps of anodizing the gate electrode to form a porous anodic oxide film on the side of the gate electrode; removing a portion of the gate insulating using the porous anodic oxide film as a mask so that the gate insulating film extends beyond the gate electrode but does not completely cover the source and drain regions. Thereafter, an ion doping of one conductivity element is performed. The high resistivity region is defined under the gate insulating film.

Abstract: A processing layer, such as silicon, is formed on a metal silicide contact followed by a metal layer. The silicon and metal layers are annealed to increase the thickness of the metal silicide contact. By selectively increasing the thickness of silicide contacts, Rs of transistors in iso and nested regions can be matched.

Abstract: A semiconductor device has a gate contact structure, including a semiconductor substrate, a polycrystalline silicon layer used as a gate electrode of a transistor, a middle conductive layer, a top metal layer having an opening exposing the polycrystalline silicon layer, and a contact plug directly contacting the polycrystalline silicon layer through the opening.

Abstract: An integrated circuit is provided. A gate dielectric is formed on a semiconductor substrate, and a gate is formed over the gate dielectric. A sidewall spacer is formed around the gate and a source/drain junction is formed in the semiconductor substrate using the sidewall spacer. A bottom silicide metal is deposited on the source/drain junction and then a top silicide metal is deposited on the bottom silicide metal. The bottom and top silicide metals are formed into their silicides. A dielectric layer is deposited above the semiconductor substrate and a contact is formed in the dielectric layer to the top silicide.

Abstract: A method of manufacturing a semiconductor device according to the present invention includes the steps of introducing first impurities of a first conductivity type into a main surface of a semiconductor substrate 1 to form a first impurity region, introducing second impurities of a second conductivity type to form a second impurity region, forming a first nickel silicide film on the first impurity region and forming a second nickel silicide film on the second impurity region, removing an oxide film formed on each of the first and second nickel silicide films by using a mixed gas having an NH3 gas and a gas containing a hydrogen element mixed therein, and forming a first conducting film on the first nickel silicide film and forming a second conducting film on the second nickel silicide film, with the oxide film removed.

Abstract: Non-planar transistors and methods of fabrication thereof are described. In an embodiment, a method of forming a non-planar transistor includes forming a channel region on a first portion of a semiconductor fin, the semiconductor fin having a top surface and sidewalls. A gate electrode is formed over the channel region of the semiconductor fin, and an in-situ doped semiconductor layer is grown on the top surface and the sidewalls of the semiconductor fin on opposing sides of the gate electrode using a selective epitaxial growth process. At least a part of the doped semiconductor layer is converted to form a dopant rich region.

Abstract: A semiconductor structure and method for forming the same. First, a semiconductor structure is provided, including (a) a semiconductor layer including (i) a channel region and (ii) first and second source/drain (S/D) extension regions, and (iii) first and second S/D regions, (b) a gate dielectric region in direction physical contact with the channel region via a first interfacing surface that defines a reference direction essentially perpendicular to the first interfacing surface, and (c) a gate region in direct physical contact with the gate dielectric region, wherein the gate dielectric region is sandwiched between and electrically insulates the gate region and the channel region. Then, (i) a first shallow contact region is formed in direct physical contact with the first S/D extension region, and (ii) a first deep contact region is formed in direct physical contact with the first S/D region and the first shallow contact region.

Abstract: A semiconductor structure and a related method for fabrication thereof include an isolation region located within an isolation trench within a semiconductor substrate. The isolation region comprises; (1) a lower lying dielectric plug layer recessed within the isolation trench; (2) a U shaped dielectric liner layer located upon the lower lying dielectric plug layer and partially filling the recess; and (3) an upper lying dielectric plug layer located upon the U shaped dielectric liner layer and completely filling the recess. The isolation region provides for sidewall coverage of the isolation trench, thus eliminating some types of leakage paths.

Abstract: A power supply clamp circuit includes a first transistor including a metal silicide layer that is formed in a substrate between a first electrode coupling part in a first drain region and a first gate electrode, and a second transistor including a first metal silicide layer and a second metal silicide layer each of which is formed in a substrate between a second electrode coupling part in a second drain region and a second gate electrode, wherein the first metal silicide layer and the second metal silicide layer are spaced apart from each other.

Abstract: By performing a silicidation process on the basis of a patterned dielectric layer, such as an interlayer dielectric material, the respective metal silicide portions may be provided in a highly localized manner at the respective contact regions, while the overall amount of metal silicide may be significantly reduced. In this way, a negative influence of the stress of metal silicide on the channel regions of field effect transistors may be significantly reduced, while nevertheless maintaining a low contact resistance.

Abstract: A method for forming a metal silicide region in a silicon region of a semiconductor substrate. The method comprises forming a metal layer over the silicon region, then in succession forming a titanium and a titanium nitride layer thereover. As the substrate is heated to form the silicide, the titanium getters silicon dioxide on the surface of the silicon region and the titanium nitride promotes the formation of a smooth surface at the interface between the silicide layer and the underlying silicon region.

Abstract: A process for manufacturing a semiconductor device includes: forming first contact holes in a dielectric film for a PMOS transistor; depositing germanium on the source/drain regions of the PMOS transistor exposed from the first contact holes; heat treating the germanium with silicon in the source/drain regions of the PMOS transistor to form a germanium silicide film; forming second contact holes in the dielectric film for the source/drain regions of the NMOS transistor; and forming contact plugs in the first and second contact holes.

Abstract: Provided are a semiconductor device and a method of fabricating the same. According to the semiconductor device, a silicide layer is formed on at least a part of both sidewalls of a gate pattern on a device isolation layer, thereby reducing resistance of the gate pattern. This makes an operation speed of the device rapid. According to the method of the semiconductor device, a sidewall spacer pattern is formed on at least a part of both sidewalls of the gate pattern in following salicide process by entirely or partially removing remaining portions of the sidewall spacer except for portions which are used as an ion implantation mask to form source/drain regions. This can reduce resistance of the gate pattern, thereby fabricating a semiconductor device with a rapid operation speed.

Abstract: A semiconductor device includes a MISFET. The semiconductor device also includes a silicon nitride film 12 and a silicon nitride film 10 arranged on the silicon nitride film 12. The silicon nitride film 12 covers at least a portion of an upper part of a source/drain 8 of the MISFET and has a film thickness thinner than a height of a gate electrode 4. The source/drain 8 includes nickel suicide 9 on its boundary to the silicon nitride film 10. The silicon nitride film 10 is a stressed film. A tight adhering property between the silicon nitride film 12 and the surface of the source/drain 8 and that between the silicon nitride film 12 and the silicon nitride film 10 are rendered higher than a tight adhering property which would prevail when the silicon nitride film 10 be made to adhere tightly to the source/drain 8.

Abstract: A semiconductor device includes a gate insulator and a gate electrode stacked on a substrate, a source/drain pattern which fills a recess region formed at opposite sides adjacent to the gate electrode, the source/drain pattern being made of silicon-germanium doped with dopants and a metal germanosilicide layer disposed on the source/drain pattern. The metal germanosilicide layer is electrically connected to the source/drain pattern. Moreover, a proportion of germanium amount to the sum of the germanium amount and silicon amount in the metal germanosilicide layer is lower than that of germanium amount to the sum of the germanium amount and silicon amount in the source/drain pattern.

Abstract: A method of forming an integrated circuit includes providing a semiconductor substrate and forming a gate over the semiconductor substrate. A gate sidewall spacer is formed around the gate and a resist is deposited on the gate sidewall spacer with the gate sidewall spacer and the gate exposed. A portion of the gate within the gate sidewall spacer is removed and a gate silicide is formed within the curved gate sidewall spacer. A dielectric layer is formed over the gate silicide and a contact is formed to the gate silicide.

Abstract: A field effect transistor of an embodiment of the present invention includes, a semiconductor substrate containing Si atoms; a protruding structure formed on the semiconductor substrate; a channel region formed in the protruding structure and containing Ge atoms; an under channel region formed under the channel region in the protruding structure and containing Si and Ge atoms, the Ge composition ratio among Si and Ge atoms contained in the under channel region continuously changing from the channel region side to the semiconductor substrate side; a gate insulating film formed on the channel region; and a gate electrode formed on the gate insulating film on the channel region.

Abstract: A semiconductor device includes: a first MOSFET including: first source and drain regions formed at a distance from each other in a first semiconductor region; a first insulating film formed on the first semiconductor region between the first source region and the first drain region; a first gate electrode formed on the first insulating film; a first sidewall insulating film formed at side portions of the first gate electrode; a first single-crystal silicon layer formed on each of the first source and drain regions, and having at least an upper-face made of a {111} plane; a first NiSi layer formed at least on the first single-crystal silicon layer, and having a portion whose interface with the first single-crystal silicon is on the {111} plane of the first single-crystal silicon layer and a part of the portion of the first NiSi layer being in contact with the first sidewall insulating film; and a first TiN film being in contact with the portion of the first NiSi layer on the {111} plane of the first single-cr

Abstract: In a semiconductor device, a first p-type MIS transistor includes: a first gate insulating film formed on a first active region; a first gate electrode formed on the first gate insulating film; a first side-wall insulating film; a first p-type source/drain region; a first contact liner film formed over the first active region; a first interlayer insulating film formed on the first contact liner film; and a first contact plug formed to reach the top surface of the first source/drain region. The first contact liner film has a slit extending, around a corner at which the side surface of the first side-wall insulating film intersects the top surface of the first active region, from the top surface of the first contact liner film toward the corner.

Abstract: A semiconductor device includes a silicon substrate; a P channel type field effect transistor including a first gate insulating film on the substrate, a first gate electrode on the first gate insulating film and a first source/drain region; and an N channel type field effect transistor including a second gate insulating film on the substrate, a second gate electrode on the second gate insulating film and a second source/drain region. The entire first gate electrode is made of a metal silicide, and at least in an upper portion including the upper surface of the second gate electrode, a silicide region of the same kind as the metal (M) is provided. The metal concentration in the silicide region is lower than that in the silicide of the first gate electrode. In an upper portion including the upper surface of the second gate electrode, there is a barrier layer region containing a metal diffusion suppressing element at a concentration higher than that in the lower portion.

Abstract: A semiconductor device includes an isolation layer pattern, an epitaxial layer pattern, a gate insulation layer pattern and a gate electrode. The isolation layer pattern is formed on a substrate, and defines an active region in the substrate. The isolation layer pattern extends in a second direction. The epitaxial layer pattern is formed on the active region and the isolation layer pattern, and has a width larger than that of the active region in a first direction perpendicular to the second direction. The gate insulation layer pattern is formed on the epitaxial layer pattern. The gate electrode is formed on the gate insulation layer pattern.

Abstract: A method for forming a thin film transistor on a substrate is disclosed. A gate electrode and a gate insulation layer are disposed on a surface of the substrate. A deposition process is performed by utilizing hydrogen diluted silane to form a silicon-contained thin film on the gate insulation layer first. A hydrogen plasma etching process is thereafter performed. The deposition process and the etching process are repeated for at least one time to form an interface layer. Finally, an amorphous silicon layer, n+ doped Si layers, a source electrode, and a drain electrode are formed on the interface layer.

Abstract: To provide a semiconductor device which can reduce an electrical resistance between a plug and a silicide region, and a manufacturing method thereof. At least one semiconductor element having a silicide region, is formed over a semiconductor substrate. An interlayer insulating film is formed over the silicide region. A through hole having an inner surface including a bottom surface comprised of the silicide regions is formed in the interlayer insulating film. A Ti(titanium) film covering the inner surface of the hole is formed by a chemical vapor deposition method. At least a surface of the Ti film is nitrided so as to form a barrier metal film covering the inner surface. A plug is formed to fill the through hole via the barrier metal film.

Abstract: A semiconductor integrated circuit memory device includes a gate line that extends in a first direction, an active region adjacent to a first end of the gate line and that extends in a second direction, a silicide layer formed on a top surface of the active region, on a top surface of the gate line, on both sidewalls of the first end of the gate line, and on a transverse endwall of the first end of the gate line. A spacer may be formed on sidewalls of the gate line, excluding the first end of the gate line, and a contact shared by the active region may be formed on the first end of the gate line.

Abstract: Methods and associated structures of forming a microelectronic device are described. Those methods may include forming an NMOS silicide on an NMOS source/drain contact area, forming a first contact metal on the NMOS silicide, polishing the first contact metal to expose a top surface of a PMOS source/drain region, and forming a PMOS silicide on the PMOS source/drain region.

Abstract: A metal oxide semiconductor (MOS) transistor is disclosed. The MOS transistor includes: a semiconductor substrate; a gate disposed on the semiconductor substrate, wherein the gate comprises two sidewalls; a spacer formed on the sidewalls of the gate; a source/drain region disposed in the semiconductor substrate; a silicide layer disposed on top of the gate and the surface of the source/drain region; and a retarded interface layer disposed in the junction between the silicide layer and the gate and source/drain region.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of forming a barrier layer. The method of forming the barrier layer includes providing a workpiece, forming a first material layer over the workpiece, the first material layer comprising a nitride-based metal compound. A second material layer is formed over the first material layer. The second material layer comprises Ta or Ti. The barrier layer comprises the first material layer and at least the second material layer.

Abstract: Embodiments herein present a structure, method, etc. for making high density MOSFET circuits with different height contact lines. The MOSFET circuits include a contact line, a first gate layer situated proximate the contact line, and at least one subsequent gate layer situated over the first gate layer. The contact line includes a height that is less than a combined height of the first gate layer and the subsequent gate layer(s). The MOSFET circuits further include gate spacers situated proximate the gate layers and a single contact line spacer situated proximate the contact line. The gate spacers are taller and thicker than the contact line spacer.

Abstract: A method for forming silicide contacts in integrated circuits (ICs) is described. A spacer pull-back etch is performed during the salicidation process to reduce the stress between the spacer and source/drain silicide contact at the spacer undercut. This prevents the propagation of surface defects into the substrate, thereby minimizing the occurrence of silicide pipe defects. The spacer pull-back etch can be performed after a first annealing step to form the silicide contacts.

Abstract: A semiconductor device and system for a hybrid metal fully silicided (FUSI) gate structure is disclosed. The semiconductor system comprises a PMOS gate structure, the PMOS gate structure including a first high-? dielectric layer, a P-metal layer, a mid-gap metal layer, wherein the mid-gap metal layer is formed between the high-? dielectric layer, the P-metal layer and a fully silicided layer formed on the P-metal layer. The semiconductor system further comprises an NMOS gate structure, the NMOS gate structure includes a second high-? dielectric layer, the fully silicided layer, and the mid-gap metal layer, wherein the mid-gap metal layer is formed between the high-? dielectric and the fully silicided layer.

Abstract: In a method of manufacturing a semiconductor device, an active channel pattern is formed on a substrate. The active channel pattern includes preliminary gate patterns and single crystalline silicon patterns that are alternately stacked with each other. A source/drain layer is formed on a sidewall of the active channel pattern. Mask pattern structures including a gate trench are formed on the active channel pattern and the source/drain layer. The patterns are selectively etched to form tunnels. The gate trench is then filled with a gate electrode. The gate electrode surrounds the active channel pattern. The gate electrode is protruded from the active channel pattern. The mask pattern structures are then removed. Impurities are implanted into the source/drain regions to form source/drain regions. A silicidation process is carried out on the source/drain regions to form a metal silicide layer, thereby completing a semiconductor device having a MOS transistor.

Abstract: A method of forming an integrated circuit includes providing a semiconductor substrate and forming a gate over the semiconductor substrate. A gate sidewall spacer is formed around the gate and a resist is deposited on the gate sidewall spacer with the gate sidewall spacer and the gate exposed. A portion of the gate within the gate sidewall spacer is removed and a gate silicide is formed within the curved gate sidewall spacer. A dielectric layer is formed over the gate silicide and a contact is formed to the gate silicide.

Abstract: Integrated circuit devices are provided including an integrated circuit substrate and a gate on the integrated circuit substrate. The gate has sidewalls. A barrier layer spacer is provided on the sidewalls of the gate. A portion of the barrier layer spacer protrudes from the sidewalls of the gate exposing a lower surface of the barrier layer spacer that faces the integrated circuit substrate. A silicide layer is provided on the portion of the barrier layer spacer protruding from the sidewalls of the gate.

Abstract: Disclosed herein are various embodiments of techniques for preventing silicide stringer or encroachment formation during metal salicide formation in semiconductor devices. The disclosed technique involves depositing a protective layer, such as a nitride or other dielectric layer, over areas of the semiconductor device where metal silicide formation is not desired because such formation detrimentally affects device performance. For example, silicon particles that may remain in device features that are formed through silicon oxidation, such as under the gate sidewall spacers and proximate to the perimeter of shallow trench isolation structures, are protected from reacting with metal deposited to form metal silicide in certain areas of the device. As a result, silicide stringers or encroachment in undesired areas is reduced or eliminated by the protective layer.

Abstract: A semiconductor device including a semiconductor substrate having source/drain regions, a gate electrode formed on and/or over the semiconductor substrate, spacers formed against sidewalls of the gate electrode, an interlayer insulating layer formed over the semiconductor substrate and the gate electrode and having a plurality of contact holes formed therein, and contact plugs formed within the contact holes. The contact plugs can include a first contact plug and a second contact plug electrically connected to the gate electrode, and a third contact plug and a fourth contact plug electrically connected to the source/drain regions.

Abstract: A static random access memory at least includes: pluralities of transistors disposed on a substrate, each transistor at least includes a gate, a gate dielectric layer, a source doped region and a drain doped region, in which some of the source doped regions are used for connecting with a Vss voltage or a Vdd voltage, and a salicide layer disposed on the gates, the source doped regions except those source doped regions used for connecting a Vss voltage and a Vdd voltage and the drain doped regions.

Abstract: Contacts having different characteristics may be created by forming a first silicide layer over a first device region of a substrate, and then forming a second silicide layer over a second device region while simultaneously further forming the first silicide layer. A first contact hole may be formed in a dielectric layer over a first device region of a substrate. A silicide layer may then be formed in the first contact hole. A second contact hole may be formed after the first contact hole and silicide layer is formed. A second silicidation may then be performed in the first and second contact holes.

Abstract: A semiconductor device includes a first MIS transistor of a non-salicide structure and a second MIS transistor of a salicide structure which are both formed on a substrate of silicon. The first MIS transistor includes a first gate electrode of silicon, first sidewalls, a first source and drain, and plasma reaction films grown in a plasma atmosphere to cover the top surfaces of the first gate electrode and first source and drain, wherein the plasma reaction film prevents silicide formation on the first MIS transistor.

Abstract: A semiconductor structure includes a semiconductor substrate; a gate dielectric over the semiconductor substrate; a gate electrode over the gate dielectric; a source/drain region adjacent the gate dielectric; a silicide region on the source/drain region; a metal layer on top of, and physical contacting, the silicide region; an inter-layer dielectric (ILD) over the metal layer; and a contact opening in the ILD. The metal layer is exposed through the contact opening. The metal layer further extends under the ILD. The semiconductor structure further includes a contact in the contact opening.

Abstract: In order that a top surface of a gate electrode does not have sharp portions, ends of the top surface of the gate electrode are rounded before refractory metal is deposited for silicidation. This reduces intensive application of film stresses which are generated in heat treatment, enabling formation of a silicide layer with a uniform, sufficient thickness.

Abstract: An advanced gate structure that includes a fully silicided metal gate and silicided source and drain regions in which the fully silicided metal gate has a thickness that is greater than the thickness of the silicided source/drain regions is provided. Methods of forming the advanced gate structure are also provided.

Abstract: It is an object to improve operation characteristics and reliability of a semiconductor device. A semiconductor device which includes an island-shaped semiconductor film having a channel-formation region, a first low-concentration impurity region, a second low-concentration impurity region, and a high-concentration impurity region including a silicide layer; a gate insulating film; a first gate electrode overlapping with the channel-formation region and the first low-concentration impurity region with the gate insulating film interposed therebetween; a second gate electrode overlapping with the channel-formation region with the gate insulating film and the first gate electrode interposed therebetween; and a sidewall formed on side surfaces of the first gate electrode and the second gate electrode. In the semiconductor device, a thickness of the gate insulating film is smaller in a region over the second low-concentration impurity region than in a region over the first low-concentration impurity region.

Abstract: A MOS semiconductor device includes a substrate having a first region with a Si(110) surface and a second region with a Si(100) surface, a p-channel MOSFET formed in the first region, and an n-channel MOSFET formed in the second region. The p-channel MOSFET including a first silicide layer formed on source/drain regions, and containing N atoms at an areal density of 8.5×1013 to 8.5×1014 cm?2, and F atoms at an areal density of less than 5.0×1012 cm?2. The n-channel MOSFET including a second silicide layer formed on a source/drain regions, and containing F atoms at an areal density of not less than 5.0×1013 cm?2.

Abstract: A semiconductor device is provided, which comprises a semiconductor film, a gate insulating film, a gate electrode, an insulating film, and a source and drain electrodes. The semiconductor film includes at least a channel forming region, a region, a source and drain regions disposed between the channel forming region and the region, a first silicide region over the region, and a second silicide region over a portion of the source and drain regions. The insulating film has a contact hole to expose at least the first silicide region. Each of the source and drain electrodes is electrically connected to the first silicide region via the contact hole. The region includes an element imparting one conductivity type at a lower concentration than the source and drain regions.

Abstract: The present disclosure provides a method for making a semiconductor device having metal gate stacks. The method includes forming a high k dielectric material layer on a semiconductor substrate; forming a first metal layer on the high k dielectric material layer; forming a silicon layer on the first metal layer; patterning the silicon layer, the first metal layer and the high k dielectric material layer to form a gate stack; and performing a silicidation process to fully change the silicon layer into a silicide electrode.

Abstract: A method (and system) of reducing contact resistance on a silicon-on-insulator device, including controlling a silicide depth in a source-drain region of the device.

Abstract: A semiconductor device includes a semiconductor layer formed partially on a semiconductor substrate by epitaxial growth, an embedded oxide film embedded between the semiconductor substrate and the semiconductor layer, first and second gate electrodes disposed on sidewalls of the semiconductor layer, a source layer formed in the semiconductor layer and disposed in the first gate electrode, and a drain layer formed in the semiconductor layer and disposed in the second gate electrode, wherein the sidewalls of the semiconductor layer are film-forming surfaces of the epitaxial growth.

Abstract: Methods for preventing cavitation in high aspect ratio dielectric regions in a semiconductor device, and the device so formed, are disclosed. The invention includes depositing a first dielectric in the high aspect ratio dielectric region between a pair of structures, and then removing the first dielectric to form a bearing surface adjacent each structure. The bearing surface prevents cavitation of the interlayer dielectric that subsequently fills the high aspect ratio region.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a method of manufacturing a semiconductor device includes providing a semiconductor wafer, forming at least one isolation structure within the semiconductor wafer, and forming at least one feature over the semiconductor wafer. A top portion of the at least one isolation structure is removed, and a liner is formed over the semiconductor wafer, the at least one feature, and the at least one isolation structure. A fill material is formed over the liner. The fill material and the liner are removed from over at least a portion of a top surface of the semiconductor wafer.