Abstract: A bi-layer photovoltaic cell, and method (100) of making same, with an electric field applied at the p-n heterojunction interface. The cell includes a first semiconductor layer including a binder, nanocrystals of an n-type semiconductor, and spatially bound cations and a second semiconductor layer contacting the first semiconductor layer that includes a binder, nanocrystals of a p-type semiconductor, and spatially bound anions. The cell further includes a p-n heterojunction at the contacting interface between the first and second semiconductor layers. An electric field is created by the spatially bound cations and anions that are located in the layers proximal to the p-n heterojunction. The nanocrystals are single crystals of organic semiconductors that are less than 50 nanometers in size and that comprise a majority of the volume of their respective layers. The binder is a polymer matrix, such as an epoxy. The cell includes electrical contacts abutting the semiconductor layers.

Abstract: A radiation sensing structure includes red, green and blue photodiodes stacked Above an infrared radiation sensing photodiode.

Abstract: In a photoelectric conversion device including a first-conductivity type first semiconductor region located in a pixel region, a second-conductivity type second semiconductor region provided in the first semiconductor region, and a wiring for electrically connecting the second semiconductor region to a circuit element located outside the pixel region, a shield is provided on the light-incident side of the wiring, via an insulator in such a way that it covers at least part of the wiring and also the shield includes a conductor whose potential stands fixed. This photoelectric conversion device may hardly be affected with low-frequency radiated noises as typified by power-source noise.

Abstract: A semiconductor energy detector includes a semiconductor substrate comprised of a semiconductor of a first conductivity type, into which an energy ray of a predetermined wavelength range is incident from an incident surface thereof. A semiconductor energy detector includes a plurality of diffusion regions of a second conductivity type comprised of a semiconductor of a second conductivity type and a diffusion region of the first conductivity type comprised of a semiconductor of the first conductivity type higher in impurity concentration than the semiconductor substrate. The diffusion regions of a second conductivity type and the diffusion region of the first conductivity type are provided on a surface opposite to the incident surface of said semiconductor substrate. Each first conductivity type semiconductor substrate side of pn junctions, formed at the area of interface between the semiconductor substrate and each of the diffusion regions of the second conductivity type, is commonly connected.

Abstract: An electronic power device of improved structure is fabricated with MOS technology to have a gate finger region and corresponding source regions on either sides of the gate region. This device has a first-level metal layer arranged to independently contact the gate region and source regions, and has a protective passivation layer arranged to cover the gate region. Advantageously, a wettable metal layer, deposited onto the passivation layer and the first-level metal layer, overlies said source regions. In this way, the additional wettable metal layer is made to act as a second-level metal.

Abstract: A single junction interdigitated photodiode utilizes a stack of alternating highly doped first regions of a first conductivity type and highly doped second regions of a second conductivity type, which are formed below and contact the first regions, to collect photons. In addition, a highly doped sinker of a first conductivity type contacts each first region, and a highly doped sinker of a second conductivity type contacts each second region.

Abstract: A system and method for providing power to a light-powered transponder. In order to create a sufficient voltage differential, two different photovoltaic elements are used. The photovoltaic elements generate voltages of different polarities. Because the photovoltaic elements are used independently to generate voltages with different polarities, the present system can achieve a desired voltage differential despite the inherent difficulties presented by the use of a standard CMOS process.

Abstract: An improved finger structure applied to a packaging stack structure. The packaging stack structure is composed of several layers of chips, each chip is formed several leading wires and several finger sets are connected to the leading wire. Several finger units are formed on a finger set. The shape of these finger units is a strip structure with a bending angle, and the shape of these finger units is along an obverse direction of these leading wires to the finger unit and is changed corresponding to the obverse direction of the finger unit. The present invention can simplify the process and improve the reliability by changing the finger structure and continuously using the obverse bonding process to avoid the striking strength of the reverse bonding process.

Abstract: Nanocomposite photovoltaic devices are provided that generally include semiconductor nanocrystals as at least a portion of a photoactive layer. Photovoltaic devices and other layered devices that comprise core-shell nanostructures and/or two populations of nanostructures, where the nanostructures are not necessarily part of a nanocomposite, are also features of the invention. Varied architectures for such devices are also provided including flexible and rigid architectures, planar and non-planar architectures and the like, as are systems incorporating such devices, and methods and systems for fabricating such devices. Compositions comprising two populations of nanostructures of different materials are also a feature of the invention.

Abstract: Nanocomposite photovoltaic devices are provided that generally include semiconductor nanocrystals as at least a portion of a photoactive layer. Photovoltaic devices and other layered devices that comprise core-shell nanostructures and/or two populations of nanostructures, where the nanostructures are not necessarily part of a nanocomposite, are also features of the invention. Varied architectures for such devices are also provided including flexible and rigid architectures, planar and non-planar architectures and the like, as are systems incorporating such devices, and methods and systems for fabricating such devices. Compositions comprising two populations of nanostructures of different materials are also a feature of the invention.

Abstract: A solid-state image pickup device includes, in a substrate, a plurality of photoelectric conversion regions for subjecting incoming light to photoelectric conversion, a reading gate for reading a signal charge from the photoelectric conversion regions, and a transfer register (vertical register) for transferring the signal charge read by the reading gate. Therein, a groove is formed on the surface side of the substrate, and the transfer register and the reading gate are formed at the bottom part of the groove. With such a structure, in the solid-state image pickup device, reduction can be achieved for the smear characteristics, a reading voltage, noise, and others.

Abstract: Method and system for converting solar energy into electrical energy utilizing serially coupled multijunction-type photovoltaic cells in conjunction with a form of spectral cooling. The latter cooling is carried out by removing ineffective solar energy components from impinging concentrated light, inter alia, through the utilization of dichroics or the conversion of ineffective solar energy components to effective energy components by means of luminescence, phosphorescence, or fluorescence. Ineffective solar energy components are described as those exhibiting wavelengths outside the bandgap energy defined wavelength and an associated wavelength defined band of useful photon energy.

Abstract: An imaging cell and a method of forming the imaging cell are disclosed. The imaging cell includes a first transistor that has source, a drain, and a gate, and a second transistor that has a source, a drain, and a gate connected to the source of the first transistor. In addition, the cell has a photodiode that is partially formed over the source of the second transistor.

Abstract: A nanostructured apparatus may include a mesoporous template having an array of regularly-spaced pores. One or more layers of material may conformally coat the walls to a substantially uniform thickness. Such an apparatus can be used in a variety of devices including optoelectronic devices, e.g., light emitting devices (such as LEDs, and lasers) and photovoltaic devices (such as solar cells) optical devices (luminescent, electro-optic, and magnetooptic waveguides, optical filters, optical switches, amplifies, laser diodes, multiplexers, optical couplers, and the like), sensors, chemical devices (such as catalysts) and mechanical devices (such as filters for filtering gases or liquids).

Abstract: In one aspect, the invention provides photovoltaic cells that utilize a mesh electrode on at least one exposure side of the photovoltaic cell. Preferably, the mesh electrode is a metallic mesh. In one embodiment, the invention provides dye-sensitized solar cells (DSSC) having a wire mesh exposure side electrode and a photovoltaic material comprising a photosensitized interconnected nanoparticle layer. In one embodiment, the wire mesh electrode functions as the cathode of the DSSC. In another embodiment, the wire mesh electrode functions as the anode of the DSSC. In addition, embodiments are provided where wire mesh electrodes are used for the anode and the cathode of a DSSC.

Abstract: A solid-state imaging device is provided, which comprising at least one unit pixel portion. Each of the at least one unit pixel portion comprises a light receiving portion for subjecting incident light to photoelectric conversion to output electric charges, and an optical signal detecting portion comprising a first conductivity type buried region for accumulating the output electric charges. The light receiving portion comprises at least a portion of a second conductivity type impurity diffusion region, and at least a portion of a first conductivity type well region provided between a second conductivity type well region and the second conductivity type impurity diffusion region. The second conductivity type well region and the second conductivity type impurity diffusion region are separated from each other.

Abstract: A PIN diode includes a first p-area, an n-area, and in between an intermediate area on a first surface of a substrate, wherein a doping concentration of the intermediate area is lower than a doping concentration of the p-area and lower than a doping concentration of the n-area. Further, the PIN diode includes a first electrically conductive member, which is arranged on a side of the p-area, which faces away from the intermediate area, and a second electrically conductive member, which is arranged on a side of the n-area, which faces away from the intermediate area. The PIN diode is preferably separated from the substrate by an insulating layer, covered by a further insulating layer on the surface, which faces away from the substrate, and laterally surrounded by a trench filled with an insulating material, such that it is essentially fully insulated and encapsulated.

Abstract: There is described an integrating circuit for converting light energy produced by a photodetector into a voltage signal, this integrating circuit comprising an amplifier having an input coupled to a terminal of the photodetector and an output for outputting the voltage signal, and an integration capacitor having a first electrode connected to the amplifier input and a second electrode connected to the amplifier output. The first electrode of the capacitor is formed by the terminal of the photodetector connected to the amplifier input and the second electrode is formed by a layer of conductive material deposited on top of the photodetector and separated from this photodetector by a layer of insulating material, these layers of conductive material and of insulating material being transparent or nearly transparent at least for a given range of wavelengths of light. There is also described a method of forming the integration capacitor as well as a photodetector including the integration capacitor.

Abstract: A solar cell module 60 has a plurality of solar cells 14 having a plurality of parallel grooves 8 on the individual light-receiving surfaces thereof, each of the grooves having an electrode 5 for extracting output on the inner side face (electrode-forming inner side face) on one side in the width-wise direction thereof; and a support 10, 50 for supporting the solar cells 14 in an integrated manner so as to direct the light-receiving surfaces upward. The annual power output can be increased by adjusting the direction of arrangement of the electrode-forming inner side faces of the grooves 8 while taking the angle of inclination ? of the light-receiving surface of the individual as-installed solar cells 14 relative to the horizontal plane and the latitude ? of the installation site of the solar cell module into consideration.

Abstract: A novel solid-state imaging device is provided which has a first color picture cell array containing picture cells having a photo-electric converting element for converting incident light to electric signals arranged two-dimensionally, and a second color picture cell array containing picture cells having a photo-electric converting element for converting incident light to electric signals arranged two-dimensionally, placed in juxtaposition, on a substrate. The solid-state imaging device is characterized in that a common well is provided to be common to the first color picture cell array and the second color picture cell array. A well-wiring and a well-contact may be provided as necessary between the first color picture cell array and the second color picture cell array.

Abstract: Photovoltaic devices, such as solar cells, and methods for their manufacture are disclosed. A device may be characterized by an architecture where two more materials having different electron affinities are regularly arrayed such that their presence alternates within distances of between about 1 nm and about 100 nm. The materials are present in a matrix based on a porous template with an array of template pores. The porous template is formed by anodizing a layer of metal. A photovoltaic device may include such a porous template disposed between a base electrode and a transparent conducting electrode. A first charge-transfer material fills the template pores, A second (complementary) charge-transfer material fills additional space not occupied by the first charge-transfer material.

Abstract: Nanocomposite photovoltaic devices are provided that generally include semiconductor nanocrystals as at least a portion of a photoactive layer. Photovoltaic devices and other layered devices that comprise core-shell nanostructures and/or two populations of nanostructures, where the nanostructures are not necessarily part of a nanocomposite, are also features of the invention. Varied architectures for such devices are also provided including flexible and rigid architectures, planar and non-planar architectures and the like, as are systems incorporating such devices, and methods and systems for fabricating such devices. Compositions comprising two populations of nanostructures of different materials are also a feature of the invention.

Abstract: Nano-architected/assembled solar cells and methods for their manufacture are disclosed. The solar cells comprise oriented arrays of nanostructures wherein two or more different materials are regularly arrayed and wherein the presence of two different materials alternates. The two or more materials have different electron affinities. The two materials may be in the form of matrixed arrays of nanostructures. The presence of the two different materials may alternate within distances of between about 1 nm and about 100 nm. An orientation can be imposed on the array, e.g. through solution deposition surfactant templation or other methods.

Abstract: This invention relates an optoelectronic material comprising a uniform medium with a controllable electric characteristic; and semiconductor ultrafine particles dispersed in the medium and having a mean particle size of 100 nm or less, and an application device using the same.

Abstract: A photodiode comprises an optical detection portion for detecting an optical signal and outputting a photoelectric conversion signal. The optical detection portion has a semiconductor substrate of a first conductive type and semiconductor layers of a second conductive type formed in spaced-apart relation in a surface of the semiconductor subtrate. A depletion layer is formed in the semiconductor subtrate by application of a reverse bias to the photodiode so as to surround the semiconductor layers. An etched surface portion of the depletion layer is disposed between the semiconductor layers so that an interface level region of the surface of the semiconductor substrate does not exist between the semiconductor layers.

Abstract: Reducing a dark current in a semiconductor photodetector provided with a second mesa including an regrown layer around a first mesa. An n-type buffer layer, a n-type multiplication layer, a p-type field control layer, a p-type absorption layer, a cap layer made of p-type InAlAs crystal, and a p-type contact layer 107 are made to grow on a main surface of a n-type substrate. Thereafter the p-type contact layer, the p-type cap layer, the p-type absorption layer and the p-type field control layer are patterned to form a first mesa. Next, after making a p-type regrown layer selectively grow around the first mesa or by forming a groove in the regrow layer located in a vicinity of the p-type cap type during a step of the selective growth, the p-type cap layer containing Al and the regrow layer are separated owing to the groove such that no current path is formed between both layers.

Abstract: A semiconductor light receiving device is provided, which comprises a semiconductor substrate, a collector region, a base region, and an emitter region, an insulating film covering the surface of the collector region, the base region, and the emitter region, a first metal line on the insulating film at a position corresponding to the base region and being electrically connected to the emitter region, and a second metal line on the insulating film at a position corresponding to a junction portion of the base region and the collector region and being electrically connected to the emitter region. The first metal line has a sloped surface such that incident light falling on the first metal line is reflected and directed toward the surface of the base region.

Abstract: A method of producing a photovoltaic panel, including the steps of producing a light-transmitting, photovoltaic-element holding member which holds, along a reference surface, a plurality of photovoltaic elements each of which includes a P-type layer and an N-type layer, and forming, on one of opposite sides of the photovoltaic-element holding member, a first electrode which is electrically connected to the respective P-type layers of the photovoltaic elements, and a second electrode which is electrically connected to the respective N-type layers of the photovoltaic elements.

Abstract: A method for the fabrication of a light-sensing diode in a high-resistivity semiconductor substrate. A high-energy implant of ions into the substrate is patterned to form an annular well of the same conductivity type as the substrate; followed by a second high-energy implant of the opposite conductivity type, within the center of the annulus; followed by a third implant, of lower energy and high dosage, to form a region of the first conductivity type extending laterally near the substrate surface. The resulting diode junction is thereby patterned to include two planes near the substrate surface, allowing incident light to traverse the junction twice.

Abstract: A series of connections of photodiodes has a plurality of alternating N-type conductivity surface areas with P-type conductivity surface areas with each member of the P-type conductivity surface areas being separated by a member of N-type conductivity surface areas. Metal conductors connect the P-type conductivity areas to the N-type conductivity areas at an N+ implanted area within the N-type conductivity surface area to form the series connection of photodiodes.

Abstract: A multiple-trench photosensor for use in a CMOS imager having an improved charge capacity. The multi-trench photosensor may be either a photogate or photodiode structure. The multi-trench photosensor provides the photosensitive element with an increased surface area compared to a flat photosensor occupying a comparable area on a substrate. The multi-trench photosensor also exhibits a higher charge capacity, improved dynamic range, and a better signal-to-noise ratio. Also disclosed are processes for forming the multi-trench photosensor.

Abstract: A CMOS image sensor is disclosed which has a photodiode formed by implanting ions into an area of a substrate. The photodiode surface area corresponds to about 15% to 40% of the surface area of a photoreceptor part region of the sensor. Thus, the capacitance associated with the photodiode is reduced relative to prior art photodiodes, and, thus, the output signals generated by the detected light are increased. Further, by reducing the size of the photodiode in manufacturing the CMOS image sensor, the junction region is reduced to thereby improve the absorption efficiency of light and high integration of the CMOS image sensor can be achieved to thereby prevent deterioration of device characteristics.

Abstract: The solar cell of the present invention includes a titanium dioxide semiconductor that is held between a pair of electrodes so that the titanium dioxide semiconductor and at least one of the electrodes form a rectification barrier.

Abstract: A structure with an optically active layer embedded in a Si wafer, such that the outermost epitaxial layer exposed to the CMOS processing equipment is always Si or another CMOS-compatible material such as SiO2. Since the optoelectronic layer is completely surrounded by Si, the wafer is fully compatible with standard Si CMOS manufacturing. For wavelengths of light longer than the bandgap of Si (1.1 &mgr;m), Si is completely transparent and therefore optical signals can be transmitted between the embedded optoelectronic layer and an external waveguide using either normal incidence (through the Si substrate or top Si cap layer) or in-plane incidence (edge coupling).

Abstract: A photodetector (and method for producing the same) includes a semiconductor substrate, a buried insulator formed on the substrate, a buried mirror formed on the buried insulator, a semiconductor-on-insulator (SOI) layer formed on the conductor, alternating n-type and p-type doped fingers formed in the semiconductor-on-insulator layer, and a backside contact to one of the p-type doped fingers and the n-type doped fingers.

Abstract: An MR/FIR light detector is disclosed herein that has extraordinarily high degree of sensitivity and a high speed of response. The detector includes an MR/FIR light introducing section (1) for guiding an incident MR/FIR light (2), a semiconductor substrate (14) formed with a single-electron transistor (14) for controlling electric current passing through a semiconductor quantum dot (12) formed therein, and a BOTAI antenna (6, 6a, 6b, 6c) for concentrating the MW/FIR light (2) into a small special zone of sub-micron size occupied by the semiconductor quantum dot (12) in the single-electron transistor (14). The quantum dot (12) forming a two-dimensional electron system absorbs the electromagnetic wave concentrated efficiently, and retains an excitation state created therein for 10 nanoseconds or more, thus permitting electrons of as many as one millions in number or more to be transferred with respect to a single photon absorbed.

Abstract: Provided with a solid state image sensor, which is adapted to simplify the process with enhancement of the morphology of the device and has photo-diodes formed on a semiconductor substrate, and transfer gates disposed around the photo-diodes to transfer signal charges generated from the photo-diodes, the solid state image sensor including: an insulating layer forming on the whole surface of the semiconductor substrate and having a contact hole exposing a defined portion of the transfer gates; a metal line formed to include the inside of the contact hole; and a light-shielding layer formed in the same layer with the metal line without overlapping the upper parts of the photo-diodes.

Abstract: A light-sensing diode having improved efficiency due to an extended junction geometry that provides more than one level of interaction with the light input.

Abstract: In a photoelectric conversion device having numerous crystalline semiconductor grains deposited on a substrate, the substrate includes an aluminum layer or an aluminum alloy layer, an intermediate layer, and a base material layer, in which the intermediate layer is arranged such that it is composed mainly of one or a plurality of elements selected from among nickel, titanium, chromium, and cobalt. With the constitution as above, it is possible to suppress reaction between the aluminum electrode layer and the base material layer, thereby maintaining the high adhesiveness of the aluminum electrode layer. A photoelectric conversion device with high reliability and high conversion efficiency is therefore realized.

Abstract: An optical structure includes a substrate having semiconductor material and a grating structure. The grating structure has the property of emitting at least one frequency band so that light having a frequency from that frequency band cannot propagate in the grating structure. The grating structure has a configuration of pores and a defective region. The pores are disposed outside the defective region in a periodic array, and the periodic array is disturbed in the defective region. A surface of the grating structure is provided with a conductive layer at least in the vicinity of the defective region. A method for producing the optical structure is also provided.

Abstract: A multiple-trench photosensor for use in a CMOS imager having an improved charge capacity. The multi-trench photosensor may be either a photogate or photodiode structure. The multi-trench photosensor provides the photosensitive element with an increased surface area compared to a flat photosensor occupying a comparable area on a substrate. The multi-trench photosensor also exhibits a higher charge capacity, improved dynamic range, and a better signal-to-noise ratio. Also disclosed are processes for forming the multi-trench photosensor.

Abstract: A thermoelectric infrared detector comprising a substrate and two kinds of conducting pillars. The pillars longitudinally extend away from the substrate towards incident infrared radiation. The pillars have upper, hot ends remote from the substrate and lower ends at the substrate. Pairs of adjacent pillars of different kinds are electrically connected by a conducting junction at their upper ends, and thereby define thermocouples. The junctions of different pairs of pillars are exposed to the incident radiation.

Abstract: The invention relates to a light-sensitive semiconductor component that consists of pixels (1), wherein n doped dot zones (7) are provided, in a preferably hexagonal pattern, on the surface of a p doped channel region, the dot zones (7) of a pixel (1) being electrically connected to one another by means of leads (6) and to a collecting lead (4). The dot zones (7) form parallel connected semiconductor diodes whereby minority charge carriers that are generated by the incidence of light in the channel region can be detected after having traveled to the dot zones (7) by diffusion. The described arrangement enables a high sensitivity to be achieved throughout the channel region and also a minimum capacitance of the semiconductor constructed by means of the CMOS technique. Diffusion of charge carriers out of a pixel is prevented by a guard ring (3) of an opposed type of doping.

Abstract: In order to reduce the capacitance of a light-receiving element, the present invention provides a light-receiving element comprises a first semiconductor region of the first conductivity type, a second semiconductor region of the second conductivity type, provided on the first semiconductor region, a third semiconductor region of the first conductivity type, provided between the second semiconductor region and an insulating film and an electrode region of the second conductivity type, provided in the second semiconductor region where the third semiconductor region is absent on and above the second semiconductor region, and connected to an anode or cathode electrode consisting of a conductor.

Abstract: A photodetector (and method for producing the same) includes a semiconductor substrate, a buried insulator formed on the substrate, a buried mirror formed on the buried insulator, a semiconductor-on-insulator (SOI) layer formed on the conductor, alternating n-type and p-type doped fingers formed in the semiconductor-on-insulator layer, and a backside contact to one of the p-type doped fingers and the n-type doped fingers.

Abstract: A method and system for control of light transmitted through a p-type semiconductor material, configured as part of a metal-insulator-semiconductor (MIS) structure. A variable gate voltage is applied to generate a variable number of sub-band charge carriers near an insulator-semiconductor interface in the MIS structure. Where the gate voltage is lower than a threshold voltage, transmission of light propagating adjacent to and parallel to the interface is relatively high. As the gate voltage is increased to a value larger than the threshold voltage, the number of sub-band carriers raised to a first sub-band energy level increases approximately monotonically.

Abstract: An insulating substrate and a scanning circuit region are provided on a semiconductor device. The scanning circuit region is provided with a switching transistor for outputting charge formed on the insulating substrate and a clock wiring determining switching timing of the switching transistor. A shield conductor member is provided below the scanning circuit region.

Abstract: A solar cell having a p-type semiconductor layer and an n-type semiconductor layer made of a first compound semiconductor material, and a semiconductor layer sandwiched between the p-type semiconductor layer and the n-type semiconductor layer. The semiconductor layer includes at least a quantum well layer which is made of a second compound semiconductor material and has a plurality of projections of at least two different sizes.

Abstract: A photoelectric conversion device according to the present invention comprises an aluminum substrate or a substrate formed with an aluminum layer thereon, numerous p type crystalline semiconductor particles deposited on the substrate, an insulator interposed among the numerous p type crystalline semiconductor particles, and a n type semiconductor region formed on the upper portions of the p type crystalline semiconductor particles. An alloy portion comprising the aluminum and the semiconductor material is formed in a boundary part between the aluminum layer and the p type crystalline semiconductor particles, and a p+ region is formed in an interfacial part between the alloy portion and the p type crystalline semiconductor particle on the side of the p type crystalline semiconductor particle.

Abstract: The solar cell of the present invention includes a titanium dioxide semiconductor that is held between a pair of electrodes so that the titanium dioxide semiconductor and at least one of the electrodes form a rectification barrier.