Abstract: A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is selectively encased in an insulated jacket to ensure adequate electrical insulation between the conductor layer and adjacent conductive surfaces. Preferably, the module is constructed for double side cooling by sandwiching the chip between a pair of ceramic substrates and providing intermediate flexible circuit leadframes on both sides of the chip for electrically accessing the chip terminals.

Abstract: An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.

Abstract: A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.

Abstract: Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without flux. Other embodiments are described and claimed.

Abstract: Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.

Abstract: A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.

Abstract: A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.

Abstract: According to one embodiment, an electronic apparatus includes a connector electrically connecting a sub-board to a main board, a heat producing component mounted on the sub-board, a heat pipe opposed to the heat producing component, a pressing member, and fixing members. The pressing member includes a main part opposed to the heat pipe, and a plurality of fixing parts extending from the main part and being located closer to the connector than the main part is. The plurality of fixing members fix the fixing parts of the pressing member to the sub-board, and fix the sub-board to support members at positions that are closer to the connector than the main part is.

Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Abstract: A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component.

Abstract: A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.

Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.

Abstract: A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink.

Abstract: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

Abstract: A memory heat sink device having an enlarged heat dissipating area is provided. The memory heat sink device includes two cooling fins that are respectively attached to a front side and a back side of a memory. Raised dots are protruded from a front (or back) side of the cooling fin attached to the front (or back) side of the memory. Each of the raised dots on the cooling fin has at least one sectional area and at least one connection portion. Thus, the heat sink area of the cooling fin increases and heat generated by the memory is easily dissipated by the sectional area through thermal convection.

Abstract: A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.

Abstract: An electronic device comprises a printed circuit board, a heat sink and a plurality of locking devices securing the heat sink to the printed circuit board. Each locking device comprises a shaft, a knob and an elastic member. The shaft has a plurality of outer teeth protruding outwardly from an outer surface of a top end thereof. The outer teeth are arranged along an axial direction of the shaft. The knob has an inner tooth meshing with the outer teeth of the shaft. The elastic member is compressed between a bottom of the knob and the heat sink. A length of the elastic changes when the inner tooth of the knob meshes with different outer teeth along the axial direction of the shaft to adjust a pressure of the locking device on the heat sink.

Abstract: A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.

Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

Abstract: An electrical connector assembly for electrically connecting an electrical package to a printed circular board, includes an electrical connector mounted on a printed circular board, and a heat dissipating device located upon the electrical package. The heat dissipating device includes a supporting body located upon the electrical connector, two latching pieces retaining the supporting body and heat pipes assembled on the supporting body. The latching piece rivets with the supporting body on a center part thereof, so when one end of the latching pieces is pressed downwardly, the opposite end will not be influenced.

Abstract: The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

Abstract: An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axle pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.

Abstract: For retaining a heatsink in contact with a processor on a board, a plurality of spaced apart mounting studs are mounted on the board. Each mounting stud includes a pivotally mounted resilient arm and a catch. A pair of the studs are positioned such that the resilient arm of one of the studs pivots to extend to engage the resilient arm catch of an adjacent one of the studs.

Abstract: An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

Abstract: A heat-dissipating structure and a heat-dissipating semiconductor package having the same are disclosed in the present invention. The heat-dissipating semiconductor package includes a chip carrier, a flip chip semiconductor chip attached and electrically connected to the chip carrier, and a heat sink bonded to the flip chip semiconductor chip via a thermal interface material, such as a solder material, wherein a groove is formed on the heat sink around the bonding area of the thermal interface material, and a blocking layer, such as a metal oxide layer, is formed on the surface of the groove to reduce the wetting capability of the thermal interface material, thus further prevents the thermal interface material from wetting the groove in the fusion process performed the thermal interface material, therefore, it ensures the thermal interface material has sufficient thickness for forming solder bonding between the heat sink and the flip chip semiconductor chip.

Abstract: Provided is a socket for testing a main board having a water-cooled cooler fixing structure that fixes a water-cooled cooler to the top surface of a central processing unit (CPU) mounted to a main board for a computer during testing of the fraction defective of the main board.

Abstract: An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.

Abstract: A thermal module (10) includes a fin assembly (14), a heat pipe (16) thermally contacting with a heat generating electronic component (60) disposed on a printed circuit board (50) and the fin assembly, and a resilient fastener (20) attaching an evaporation section (164) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element (40) being attached to the printed circuit board, and an engaging element (30) embedded in the mounting element. The engaging element includes a base plate (32) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip (34) sandwiched between the first surface of the base plate of the engaging element and the mounting element.

Abstract: A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.

Abstract: A heat sink assembly includes a heat sink main body and a contact member attached to a base of the heat sink main body. The contact member includes a container with thermal grease contained therein and a movable cover movably attached to the container. The container includes a bottom plate configured to contact a heat generating component, and a plurality of holes defined in the bottom plate. When the heat sink is attached to the heat generating component, the movable cover is pressed towards the container and impels the thermal grease out from the holes to spread the thermal grease between the bottom plate of the container and the heat generating component.

Abstract: A fixing apparatus is provided for retaining a heat sink to a circuit board. The fixing apparatus includes a mount fixed to the circuit board, two locking members attached to the mount, and a clip. The mount defines a receiving hole accommodating the heat sink. The clip includes a positioning portion abutting against the heat sink, and two retaining arms extending from opposite ends of the positioning portion. The positioning portion presses the heat sink against the circuit board in response to the retaining arms engaging with the locking members.

Abstract: An electronic device comprises a semiconductor device having a package substrate with bumps. The semiconductor device is bonded to a mounting substrate by flip-chip bonding. A standoff member supports the package substrate on the mounting substrate with a predetermined standoff between the package substrate and the mounting substrate. The standoff member comprises a hole provided in the mounting substrate, an insertion portion provided to be contained in the hole, and a standoff portion provided to contact and support the package substrate such that the standoff portion has a height, equivalent to the predetermined standoff, on the mounting substrate and enables relative displacement of the package substrate to the mounting substrate.

Abstract: A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.

Abstract: The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light.

Abstract: A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the heat sink base plate extends outward a distance or overhang length from the primary mount to an edge. The apparatus includes a secondary heat sink mounting assembly supported upon the processor board that includes a damping element with an resilient body positioned proximate to the edge of the base plate, whereby the body abuts the base plate during movement of the base plate toward the board, e.g., upon application of a dynamic or shock load that causes the overhanging portions of the base plate of the heat sink to vibrate or oscillate about the support locations of the primary mount.

Abstract: An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: An easily disassembling cooling apparatus is assembled onto a circuit board. The circuit board has an electronic element. The cooling apparatus includes a pair of fastening blocks, one or two heat conducting blocks, and at least one heat pipe. The pair of fastening blocks are fastened onto the circuit board and each has a track slot and a concave opening. The heat conducting block is installed between the fastening blocks and contacts the electronic element. One end of the heat pipe is assembled with the heat conducting block. The fastening plate is installed in the track slots of the fastening blocks, flexibly wedged in the concave openings, and has a flexible arm that flexibly presses onto the heat pipe or one of the heat conducting blocks. Thereby, the welding process is not required in the assembling process. The assembling time is reduced, and the electronic element is reliably cooled.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.

Abstract: Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.

Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.

Abstract: There is provided a heatsink for radiating heat from a heat-producing device. The heatsink includes a heatsink body; a clip that has a pair of arms and is fitted to the heatsink body along a heat radiation surface of the heat-producing device such that the heat-radiation surface of the heat-producing device and the heatsink body closely contact with each other while being sandwiched between the pair of arms; and a guide plate integrally formed with the heatsink body. The guide plate is configured such that an interval between the guide plate and the heatsink body is smaller than an arm interval between the pair of arms of the clip on a front side in a fitting direction of the clip and is larger than the arm interval on a deep side in the fitting direction of the clip.

Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.

Abstract: The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.

Abstract: A fastener includes a connecting pole, a sleeve, an elastic element enclosing the sleeve and a baffling portion. The connecting pole includes a shaft, a head and a thread portion. The sleeve includes an engaging portion and a receiving portion extending from the engaging portion. The engaging portion encloses a top end of the shaft therein and abuts against the head. The receiving portion encloses a bottom end of the shaft and a top end of the thread portion. The receiving portion includes a plurality of spaced resilient pieces. The baffling portion screws onto the thread portion of the connecting pole. When the connecting pole rotates relative to the sleeve, the baffling portion moves upwardly along the thread portion to push the pieces of the receiving portion outwardly to make the pieces abut against a bottom surface of a printed circuit board.

Abstract: A fastening apparatus for fastening a first device to a second device is disclosed. The apparatus comprises a standoff member disposed through a through hole of the first device; a clamp member having a clamp portion for clamping the standoff member; a sleeve member having a hollow body and enclosing the clamp member, wherein the clamp member is compressed in the hollow body; a resilient member wrapping around the sleeve member; a rotatable cam member pivotly coupled to the clamp member; and a cap member arranged between the rotatable cam member and the resilient member, wherein the rotatable cam member is rotated to a first location to compress the resilient member for causing a first preload force exerted on the second device.

Abstract: The invention relates to a power semiconductor module comprising at least one power semiconductor chip, and comprising a pressure apparatus which exerts a pressure on the top side of the power semiconductor chip when the power semiconductor module is fixed to a heat sink. In addition, a bonding wire which is arranged distant from the pressure element, is bonded to the top side. The invention also relates to methods for fabricating a power semiconductor module, and for fabricating a power semiconductor arrangement comprising a power semiconductor module and a heat sink.

Abstract: An apparatus is disclosed. The apparatus includes a processor having a major surface, where the processor generates heat when energized. It also includes a heat dissipation plate comprising a thermally conductive material, and includes a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion. The heat dissipation plate is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate, and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor. The heat dissipating material does not contact the second portion of the heat dissipating plate, and the pins are configured to be received in a socket assembly on a circuit board.

Abstract: An electronic device having an electrical circuit carrier and a body is specified, in which at least one riveted connection is formed between the electrical circuit carrier and the body. In the case of such a device, the electrical circuit carrier can be mechanically incorporated in a stable manner and with little technical complexity. An electrical circuit carrier having at least one rivet is also specified.