Pressed Against Semiconductor Element Patents (Class 257/719)
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Patent number: 8933557Abstract: A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).Type: GrantFiled: July 28, 2010Date of Patent: January 13, 2015Assignee: Fuji Electric Co., Ltd.Inventors: Hiromichi Gohara, Akira Morozumi, Keiichi Higuchi
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Publication number: 20140374898Abstract: A semiconductor device includes a terminal case, a beam portion which has elasticity and is connected to the terminal case, divided insulating substrates with a conductive pattern, a fastener which is disposed at the center of the terminal case, and an elastic sealing resin which fills the terminal case.Type: ApplicationFiled: September 10, 2014Publication date: December 25, 2014Inventor: Kousuke KOMATSU
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Patent number: 8916966Abstract: One embodiment of an integrated circuit includes a discrete device that defines a top surface, an integrated circuit substrate, and a heat dissipation structure fully covering the top surface of the discrete device and being thermally connected to the integrated circuit substrate.Type: GrantFiled: September 28, 2004Date of Patent: December 23, 2014Assignee: TriQuint Semiconductor, Inc.Inventor: Kenneth W. Mays
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Patent number: 8912644Abstract: A semiconductor device includes an IGBT as a vertical semiconductor element provided between first, and second lead frames, in pairs, the first, and second lead frames being opposed to each other, first and second sintered-metal bonding layers provided on first and second bonding surfaces of the IGBT, in pairs, respectively, a through-hole opened in the second lead frame, and a heat-release member having a surface on one side thereof, bonded to a second sintered-metal bonding layer of the second bonding surface while a side (lateral face) of a surface of the heat-release member, on the other side thereof, being fitted into the through-hole. A solder layer is formed in a gap between an outer-side wall of the side of the surface of the heat-release member, on the other side thereof, and an inner-side wall of the through-hole.Type: GrantFiled: April 25, 2013Date of Patent: December 16, 2014Assignee: Hitachi, Ltd.Inventors: Eiichi Ide, Toshiaki Morita
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Patent number: 8905120Abstract: A heat dissipating module is adapted for dissipating thermal energy from an electronic element mounted on a circuit board, and includes a heat sink, a heat conductive board including a plurality of tube portions that extend through the circuit board, a heat conductive tube that interconnects the heat sink and the circuit board, and a plurality of fixing elements. Each fixing elements includes a first end part be secured to the heat conductive board, a second end part exposed from an end opening of a respective tube portion, and a pair of interference parts that extend resiliently, respectively and outwardly through lateral openings of the respective the tube portion for abutting against the circuit board. The heat dissipating module further includes a resilient unit disposed between and connected resiliently to the circuit board and the heat conductive board.Type: GrantFiled: December 1, 2011Date of Patent: December 9, 2014Assignee: Wistron CorporationInventor: Ho-Yuan Tsai
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Patent number: 8885344Abstract: A terminal board is electrically connected to a module terminal of a semiconductor module. The semiconductor module and a cooling unit are laminated on the terminal board. A spring member is disposed on the semiconductor module and the cooling unit. A spring support tool is disposed on the spring member in order to apply, to the spring member, an urging force for pressing the semiconductor module and the cooling unit against the terminal board.Type: GrantFiled: February 22, 2012Date of Patent: November 11, 2014Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Hideki Asakura, Daijiro Noda, Kazuo Kayano
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Patent number: 8879264Abstract: A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play.Type: GrantFiled: October 4, 2012Date of Patent: November 4, 2014Assignee: Gemtek Technology Co., Ltd.Inventor: Yu-Jen Tsai
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Patent number: 8872328Abstract: An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.Type: GrantFiled: December 19, 2012Date of Patent: October 28, 2014Assignee: General Electric CompanyInventors: Eladio Clemente Delgado, John Stanley Glaser, Brian Lynn Rowden
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Patent number: 8861203Abstract: An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.Type: GrantFiled: August 30, 2012Date of Patent: October 14, 2014Assignee: Adlink Technology Inc.Inventor: Chih-Liang Fang
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Publication number: 20140291833Abstract: In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the cooler. The cooler has a pressed part in which the semiconductor module is pressed, and a strut fixing part to which the strut is fixed. The strut fixing part has higher rigidity than the pressed part.Type: ApplicationFiled: March 26, 2014Publication date: October 2, 2014Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takato SATO, Yukio ONISHI, Hiroyuki KONO, Hiroaki YOSHIZAWA, Toshio WATARI, Hiromi YAMASAKI
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Patent number: 8845909Abstract: A process of fabricating a heat dissipation substrate is provided. A metal substrate having an upper surface, a lower surface, first recesses located on the upper surface and second recesses located on the lower surface is provided. The metal substrate is divided into carrier units and connecting units connecting the carrier units. A first and a second insulating materials are respectively filled into the first and the recesses. A first conductive layer is formed on the upper surface and the first insulating material. A second conductive layer is formed on the lower surface and the second insulating material. The first and the second conductive layers are patterned to form a first and a second patterned conductive layers. The first and the second insulating materials are taken as an etching mask to etch the connecting units of the metal substrate so as to form a plurality of individual heat dissipation substrates.Type: GrantFiled: May 30, 2013Date of Patent: September 30, 2014Assignee: Subtron Technology Co., Ltd.Inventor: Tzu-Shih Shen
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Patent number: 8836092Abstract: A lead frame for assembling a semiconductor device has a die pad surrounded by lead fingers. Each of the lead fingers has a proximal end close to but spaced from an edge of the die pad and a distal end farther from the die pad. A semiconductor die is attached to a surface of the die pad. The die has die bonding pads on its upper surface that are electrically connected to the proximal ends of the lead fingers with bond wires. An encapsulation material covers the bond wires, semiconductor die and the proximal ends of the lead fingers. Prior to assembly, hot spots of the die are determined and the lead fingers closest to the hot spots are selected to project closer to the die than the other lead fingers. These longer lead fingers assist in dissipating the heat at the die hot spot.Type: GrantFiled: October 29, 2012Date of Patent: September 16, 2014Assignee: FreeScale Semiconductor, Inc.Inventors: Chetan Verma, Piyush Kumar Mishra, Cheong Chiang Ng
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Patent number: 8816496Abstract: Electronic assemblies and methods are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a package positioned in the socket, the package including a substrate, a die, and a heat spreader, the die positioned between the substrate and the heat spreader. The assembly also includes a load plate positioned on the heat spreader, the load plate covering a majority of the heat spreader, the load plate applying a force to the heat spreader that couples the package to the socket. Other embodiments are described and claimed.Type: GrantFiled: December 23, 2010Date of Patent: August 26, 2014Assignee: Intel CorporationInventors: Ted Lee, Tejinder Pal S. Aulakh
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Patent number: 8815647Abstract: A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.Type: GrantFiled: September 4, 2012Date of Patent: August 26, 2014Assignee: Infineon Technologies AGInventors: Ralf Otremba, Bernd Roemer, Erich Griebl, Fabio Brucchi
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Patent number: 8796842Abstract: A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip.Type: GrantFiled: August 20, 2010Date of Patent: August 5, 2014Assignees: ATI Technologies ULC, Advanced Micro Devices, Inc.Inventors: Gamal Refai-Ahmed, Michael Z. Su, Bryan Black
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Patent number: 8780563Abstract: The invention provides a load distributed heat sink system for securing a heat sink to a heat-generating electronic component while distributing the load on the circuit board. Provided is a heat sink system having heat sink, a heat sink clip, and a circuit board. The heat sink is generally disposed on one side of the circuit board over a component, and the heat sink clip is generally disposed on the opposing side of the circuit board. The ends of heat sink clip reach to the other side and attach onto the heat sink on. The heat sink clip further includes a load spreader, which is urged onto the circuit board by the heat sink clip, both retaining the heat sink system in place and distributing load on the circuit board.Type: GrantFiled: December 12, 2011Date of Patent: July 15, 2014Assignee: Rockwell Automation Technologies, Inc.Inventor: Douglas Alan Lostoski
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Patent number: 8773857Abstract: A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.Type: GrantFiled: June 19, 2012Date of Patent: July 8, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Chih-Hao Yang, Xiang-Kun Zeng, Bao-Quan Shi, Jing-Jun Ni
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Patent number: 8772927Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.Type: GrantFiled: November 7, 2011Date of Patent: July 8, 2014Assignee: International Business Machines CorporationInventors: Raschid Jose Bezama, Evan George Colgan, Michael Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei
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Publication number: 20140151872Abstract: A semiconductor module includes semiconductor device, at least one cooler, at least one fastening member. The semiconductor device has a flat shape. The at least one cooler is arranged adjacent to the semiconductor device. The at least one fastening member has a pressure-contact part that is configured to apply a pressure to the at least one cooler. Furthermore, the at least one fastening member fastens a layered body including the semiconductor device and the at least one cooler in a layer direction of the layered body. A dent configured to accommodate the pressure-contact part is provided in the at least one cooler.Type: ApplicationFiled: December 3, 2013Publication date: June 5, 2014Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takaoki Ogawa, Makoto Imai, Shizuyasu Matsubayashi
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Patent number: 8743548Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.Type: GrantFiled: September 23, 2011Date of Patent: June 3, 2014Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Atushi Kawabata
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Patent number: 8710640Abstract: A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector; and mounting a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation.Type: GrantFiled: December 14, 2011Date of Patent: April 29, 2014Assignee: Stats ChipPac Ltd.Inventors: DaeSik Choi, JoungIn Yang, MinJung Kim, KyungEun Kim
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Patent number: 8704346Abstract: In a package wherein a lead part coupled to a semiconductor element by wire bonding, an element retention member to retain the semiconductor element on the top face side and radiate heat on the bottom face side, and an insulative partition part to partition the lead part from the element retention member with an insulative resin appear, a creeping route ranging from the top face to retain the semiconductor element to a package bottom face on a boundary plane between the element retention member and an insulative partition part includes a bent route having a plurality of turns. Consequently, it is possible to inhibit an encapsulation resin to seal a region retaining the semiconductor element from exuding toward the bottom face side of the package.Type: GrantFiled: November 16, 2010Date of Patent: April 22, 2014Assignee: Sumitomo Chemical Co., Ltd.Inventors: Tatsuhiko Sakai, Kiyomi Nakamura, Yasuo Matsumi
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Publication number: 20140084449Abstract: A semiconductor housing includes a fixing mechanism and at least one side having structurings. A method for producing a semiconductor device is provided in which a thermally conductive paste is applied on the at least one side of the semiconductor housing and/or of a heat sink. The semiconductor housing is fixed to the heat sink by means of the fixing mechanism. A pressure is exerted on the thermally conductive paste by means of the fixing mechanism and the thermally conductive paste is diverted by means of diversion channels depending on the pressure exerted.Type: ApplicationFiled: September 25, 2013Publication date: March 27, 2014Inventors: Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Juergen Schredl
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Patent number: 8670239Abstract: A heat-release configuration includes a printed board on which a semiconductor component is mounted, a heat-release plate which is mounted on the semiconductor component, and configured to diffuse heat generated by the semiconductor component; and a supporting clamp which is mounted on the heat-release plate, and configured to fix the heat-release plate to the printed board via a hole provided in the printed board, the supporting clamp including a sectional L-shape in a horizontal direction having two flat surfaces substantially orthogonal to each other, the supporting clamp having on a lower side of each of the flat surfaces a leading end portion which is inserted into the hole of the printed board and a locking claw which is formed in the leading end portion and projects outside the L-shape.Type: GrantFiled: January 6, 2011Date of Patent: March 11, 2014Assignee: Ricoh Company, Ltd.Inventors: Takahiko Hasegawa, Mineyo Takahashi
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Patent number: 8659903Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.Type: GrantFiled: December 6, 2011Date of Patent: February 25, 2014Assignee: Palo Alto Research Center IncorporatedInventor: David Eric Schwartz
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Patent number: 8659130Abstract: A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate.Type: GrantFiled: April 26, 2011Date of Patent: February 25, 2014Assignee: Hitachi Automotive Systems, Ltd.Inventors: Yusuke Takagi, Kaoru Uchiyama, Tokihito Suwa, Kinya Nakatsu, Takeshi Tokuyama, Shinji Hiramitsu
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Patent number: 8653651Abstract: According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.Type: GrantFiled: February 27, 2012Date of Patent: February 18, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Masayuki Uchida, Takashi Togasaki, Satoru Hara, Kentaro Suga
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Patent number: 8648461Abstract: A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, a first radiator member arranged on and thermally coupled to the semiconductor element, and a second radiator member arranged on and thermally coupled to the first radiator member. The second radiator member includes projections which project out toward the first radiator member. The projections are formed on a circumference of a concentric circle with respect to a center point of the second radiator member. The first radiator member includes grooves in which the projections are movable. The grooves are formed on a circumference of a concentric circle with respect to a center point of the first radiator member. The projections are fitted to terminating ends of the grooves with the center point of the first radiator member and the center point of the second radiator member coincided.Type: GrantFiled: October 26, 2012Date of Patent: February 11, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventor: Masafumi Seki
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Patent number: 8648462Abstract: A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back surface thereof, a heat pipe having a first region defined as arrangement parts of the active element and the passive element on its one end side and electrically connected to one of the first and second electrodes of the active element and the passive element arranged in the first region, a cooling fin arranged in a second region defined on the other end side of the heat pipe, and a heat pipe provided to sandwich the active element, the passive element, and the cooling fin arranged on the heat pipe along with the heat pipe and electrically connected to the other of the first and second electrodes of the active element and passive element.Type: GrantFiled: May 24, 2011Date of Patent: February 11, 2014Assignee: Mitsubishi Electric CorporationInventor: Koichi Ushijima
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Patent number: 8624388Abstract: In a manufacturing method of a package carrier, a substrate including a first metal layer, a second metal layer having a top surface and a bottom surface opposite to each other, and an insulating layer between the first and second metal layers is provided. The second metal layer has a greater thickness than the first metal layer. A first opening passing through the first metal layer and the insulating layer and exposing a portion of the top surface of the second metal layer is formed. The first metal layer is patterned to form a patterned conductive layer. Second openings are formed on the bottom surface of the second metal layer. The second metal layer is divided into thermal conductive blocks by the second openings that do not connect the first opening. A surface passivation layer is formed on the patterned conductive layer and the exposed portion of the top surface.Type: GrantFiled: March 21, 2011Date of Patent: January 7, 2014Assignee: Subtron Technology Co., Ltd.Inventor: Shih-Hao Sun
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Patent number: 8625280Abstract: A cold plate has blades arranged to be interleaved with memory modules, with clips coupling blades to memory modules. A liquid cooling loop is thermally coupled to the blades of the cold plate.Type: GrantFiled: October 30, 2009Date of Patent: January 7, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Timothy Rau, Glenn C. Simon
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Publication number: 20140001629Abstract: Packaged semiconductor die and CTE-engineering die pairs and methods to form packaged semiconductor die and CTE-engineering die pairs are described. For example, a semiconductor package includes a substrate. A semiconductor die is embedded in the substrate and has a surface area. A CTE-engineering die is embedded in the substrate and coupled to the semiconductor die. The CTE-engineering die has a surface area the same and in alignment with the surface area of the semiconductor die.Type: ApplicationFiled: December 21, 2011Publication date: January 2, 2014Inventor: Chuan Hu
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Publication number: 20140001630Abstract: The pressure unit includes a spring member that is formed into a coil form obtained by winding a wire rod and that has a periodically changing pitch angle and a housing member to which end portions of the spring member are attached, and the pressure unit pressurizes a semiconductor stacked unit obtained by alternately stacking a semiconductor element module and a cooling tube that makes contact with the semiconductor element module and cools the semiconductor element module.Type: ApplicationFiled: March 15, 2012Publication date: January 2, 2014Applicant: NHK SPRING CO., LTD.Inventors: Noritoshi Takamura, Michiya Masuda, Ichiro Sasuga, Nobuharu Kato, Kengo Tsurugai
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Patent number: 8610263Abstract: A P-side package unit and a N-side package unit are arranged on a main surface of a metal heatsink such that a main surface extends in a direction perpendicular to the main surface of the heatsink. Each of the P-side package unit and the N-side package unit is fixed by an end edge portion of a heatsink being clipped by a rail-shaped unit mounting part provided on the main surface of the heatsink.Type: GrantFiled: October 20, 2010Date of Patent: December 17, 2013Assignee: Mitsubishi Electric CorporationInventors: Yasunari Hino, Kiyoshi Arai
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Publication number: 20130328185Abstract: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.Type: ApplicationFiled: February 21, 2012Publication date: December 12, 2013Applicant: Hitachi Automotive Systems, Ltd.Inventors: Shinji Hiramitsu, Atsushi Koshizawa, Masato Higuma, Hiroshi Tokuda, Keiji Kawahara
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Patent number: 8587016Abstract: Provided are a light emitting device package and a lighting system comprising the same. The light emitting device package comprises a package body having an inclined side surface and a light emitting device on the inclined side surface of the package body.Type: GrantFiled: February 19, 2010Date of Patent: November 19, 2013Assignee: LG Innotek Co., Ltd.Inventor: Yong Seon Song
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Patent number: 8570745Abstract: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.Type: GrantFiled: December 2, 2011Date of Patent: October 29, 2013Assignee: Lotes Co., Ltd.Inventors: Ted Ju, Chin Chi Lin
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Patent number: 8536697Abstract: A heat spreader die holder that covers at least 50% of both major sides of a semiconductor die. The heat spreader die holder includes at least one opening. The heat spreader die holder is attached to a substrate. Electrically conductive structures of the die are electrically coupled to electrically conductive structures of the substrate.Type: GrantFiled: November 30, 2011Date of Patent: September 17, 2013Assignee: Freescale Semiconductor, Inc.Inventors: Yuan Yuan, Burton J. Carpenter
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Patent number: 8531025Abstract: A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.Type: GrantFiled: May 30, 2007Date of Patent: September 10, 2013Assignee: International Business Machines CorporationInventors: David L. Edwards, Sushumna Iruvanti, Hilton T. Toy, Wei Zou
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Patent number: 8520393Abstract: Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.Type: GrantFiled: April 1, 2008Date of Patent: August 27, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Steven S. Homer, Dustin L. Hoffman, Jeffrey A. Lev, Mark S. Tracy, Luis C. Armendariz, Mark H. Ruch
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Patent number: 8519409Abstract: The present disclosure relates to structures of LED components that integrate thermoelectric devices with LEDs on LED emitter substrates for cooling the LEDs. The present disclosure also related to methods for integrating LED dies with thermoelectric elements. The LED component includes an LED emitter substrate with a cavity in a downward facing surface of the LED emitter substrate and thermal vias that extend from a bottom of the cavity to an area close to an upward facing surface of the LED emitter substrate. The device also includes thermoelectric elements disposed in the cavity where the thermoelectric elements connect with their corresponding thermal vias. The device further includes a thermoelectric substrate in the cavity to electrically connect to the thermoelectric elements. The device further includes an LED die on the upward facing surface of the LED emitter substrate such that the LED die is opposite the cavity.Type: GrantFiled: November 15, 2010Date of Patent: August 27, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Kuang Yu, Hsing-Kuo Hsia
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Patent number: 8514579Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.Type: GrantFiled: May 10, 2010Date of Patent: August 20, 2013Assignee: Infineon Technologies AGInventors: Thilo Stolze, Olaf Hohlfeld, Peter Kanschat
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Patent number: 8488325Abstract: A memory module is provided having a plurality of integrated circuit packages. The memory module includes a first thermal conduit in thermal communication with a first set of integrated circuit packages on the first side, and substantially thermally isolated from a second set of one or more integrated circuit packages on the first side. The memory module further includes a second thermal conduit in thermal communication with the set of one or more integrated circuit packages.Type: GrantFiled: November 1, 2010Date of Patent: July 16, 2013Assignee: Netlist, Inc.Inventor: Enchao Yu
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Patent number: 8482923Abstract: Provided is a heat sink clip for fastening a heat sink on a printed circuit board (PCB). The heat sink clip includes two hooks and a wire clip. The two hooks are inversely fixed to the PCB at two opposite sides of the heat sink. The wire clip includes a pressing wire pressing the heat sink, two pairs of deforming wires extending from the lateral of the pressing wire along two radial directions of the pressing wire and away from the PCB, and two engaging wires engaging with the respective hooks such that the deforming wires are bent towards the PCB.Type: GrantFiled: August 11, 2011Date of Patent: July 9, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Liang Tan, Xiao-Feng Ma
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Patent number: 8462510Abstract: A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure.Type: GrantFiled: May 11, 2011Date of Patent: June 11, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Yi Lin, Po-Yao Lin
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Patent number: 8437137Abstract: A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component.Type: GrantFiled: October 24, 2010Date of Patent: May 7, 2013Assignee: MSI Computer (Shenzhen) Co., Ltd.Inventors: Lin-Yu Lee, Shang-Chih Yang
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Patent number: 8421221Abstract: An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.Type: GrantFiled: May 17, 2010Date of Patent: April 16, 2013Assignee: STATS ChipPAC Ltd.Inventors: Dario S. Filoteo, Jr., Emmanuel Espiritu, Philip Lyndon Cablao
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Patent number: 8421235Abstract: The semiconductor device has a unit stack body including a plurality of units stacked on one another. Each unit includes a power terminal constituted of a lead part and a connection part. The connection part is formed with a projection and a recess. When the units are stacked on one another, the projection of one unit is fitted to the recess of the adjacent unit, so that the power terminals of the respective unit are connected to one another.Type: GrantFiled: June 30, 2011Date of Patent: April 16, 2013Assignee: Denso CorporationInventors: Shigeo Ide, Akihiro Niimi
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Publication number: 20130083488Abstract: A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main body part to the package board and of which a tip is attached to the package board, and wherein the leg part, comprising: a first leg part allocated in a corner of the package board; and a second leg part which is allocated inside the first leg part between the heating element and the chip part on the package board.Type: ApplicationFiled: August 24, 2012Publication date: April 4, 2013Applicant: FUJITSU LIMITEDInventors: Manabu WATANABE, Kenji FUKUZONO
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Patent number: 8410602Abstract: In one embodiment, the present invention includes a socket for a semiconductor package, where the socket has a frame with a segmented design, where socket streets are located between the segments. One or more of the streets may include a conduit to enable thermal transfer during operation of the semiconductor package. Other embodiments are described and claimed.Type: GrantFiled: October 15, 2007Date of Patent: April 2, 2013Assignee: Intel CorporationInventors: Venkat Natarajan, Arun Chandrasekhar, Pr Patel, Vittal Kini