For Plural Devices Patents (Class 257/723)
  • Patent number: 10336610
    Abstract: A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 2, 2019
    Assignee: ROBERT BOSCH GMBH
    Inventors: Heiko Stahl, Andreas Scheurle, Hendrik Specht, Marlene Winker, Ralf Hausner, Volker Schmitz
  • Patent number: 10332818
    Abstract: A component carrier has an interconnected stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack and a diode, and at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: June 25, 2019
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Mike Morianz, Gerald Weis, Johannes Stahr
  • Patent number: 10325879
    Abstract: An embodiment package includes a first fan-out tier having a first device die, a molding compound extending along sidewalls of the first device die, and a through intervia (TIV) extending through the molding compound. One or more first fan-out redistribution layers (RDLs) are disposed over the first fan-out tier and bonded to the first device die. A second fan-out tier having a second device die is disposed over the one or more first fan-out RDLs. The one or more first fan-out RDLs electrically connects the first and second device dies. The TIV electrically connects the one or more first fan-out RDLs to one or more second fan-out RDLs. The package further includes a plurality of external connectors at least partially disposed in the one or more second fan-out RDLs. The plurality of external connectors are further disposed on conductive features in the one or more second fan-out RDLs.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: June 18, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Kuo-Chung Yee
  • Patent number: 10314172
    Abstract: A flexible substrate and a display device are provided. The flexible substrate comprises at least two chip regions in which functional chips are arranged. A bendable region is arranged between two adjacent chip regions, the flexible substrate is bended at the bendable region, and two chip regions adjacent with the bendable region overlap. According to the present disclosure, the flexible substrate can be bended in the bendable region, so that chip regions on both sides of the bendable region overlap, thus decreasing the space occupied by the flexible substrate.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: June 4, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Bo Zhang
  • Patent number: 10297571
    Abstract: According to one embodiment, a semiconductor package includes a substrate with first and second pad, first semiconductor chip above the substrate, first wire, first mold member, second semiconductor chip above the first mold member, third semiconductor chip above the second semiconductor chip, second wire, and a second mold member. The first wire electrically connects the first pad and the first semiconductor chip. The first mold member seals the first wire and the first semiconductor chip. The second wire electrically connects the second pad and the second semiconductor chip. The second mold member seals the second wire, the second and the third semiconductor chips, and the first mold member.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: May 21, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Isao Ozawa
  • Patent number: 10283434
    Abstract: An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: May 7, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Taiji Sakai, Seiki Sakuyama, Nobuhiro Imaizumi, Aki Dote
  • Patent number: 10283477
    Abstract: A method of fabricating a 3D fan-out structure for an integrated circuit device includes providing a substrate carrier having first and second opposing surfaces and an aperture extending between the first and second surfaces. A first semiconductor die is bonded to the first surface of the substrate carrier such that the first die covers the aperture of the substrate carrier. An encapsulant and a second die are deposited within the aperture of the substrate carrier such that an active surface of the second die is exposed and coplanar with the second surface of the substrate carrier. One or more redistribution layers are then applied on the second surface of the substrate carrier to form a 3D fan-out structure.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: May 7, 2019
    Assignee: NXP USA, INC.
    Inventors: Wei Gao, Zhiwei Gong, Dehong Ye
  • Patent number: 10283400
    Abstract: Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. Methods and systems for a semiconductor device package with a die-to-die first bond are disclosed and may include bonding one or more semiconductor die comprising electronic devices to an interposer die.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: May 7, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Michael G. Kelly, Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner
  • Patent number: 10283443
    Abstract: A semiconductor device includes a plurality of redistribution layers, a dielectric layer, and a conductive structure. The redistribution layers are formed overlying a device die to provide an electrical connection between the device die and an external connector in a package. The dielectric layer is arranged between the redistribution layers to form a capacitor structure. The conductive structure is formed and coupled between the device die and the redistribution layers.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: May 7, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Shiang Liao, Chewn-Pu Jou
  • Patent number: 10276484
    Abstract: A package includes a chip formed in a first area of the package and a molding compound formed in a second area of the package adjacent to the first area. A first polymer layer is formed on the chip and the molding compound, a second polymer layer is formed on the first polymer layer, and a plurality of interconnect structures is formed between the first polymer layer and the second polymer layer. A metal-insulator-metal (MIM) capacitor is formed on the second polymer layer and electrically coupled to at least one of the plurality of interconnect structures. A metal bump is formed over and electrically coupled to at least one of the plurality of interconnect structures.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuo-Mao Chen, Der-Chyang Yeh, Chiung-Han Yeh
  • Patent number: 10255543
    Abstract: An RFID system includes an RFID antenna assembly configured to be positioned on a product module assembly of a processing system. The product module assembly is configured to releasably engage at least one product container. A first RFID tag assembly configured to be positioned on the at least one product container. The at least one product container is configured to position the first RFID tag assembly within a detection zone of the RFID antenna assembly whenever the product module assembly releasably engages the at least one product container.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 9, 2019
    Assignee: DEKA Products Limited Partnership
    Inventors: James J. Dattolo, David Blumberg, Jr., Eric J. VanWyk
  • Patent number: 10251275
    Abstract: A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other. A plurality of signal input pins are provided to the first edge portion, a plurality of signal output pins are provided to the third edge portion, a plurality of between-element communication input pins are provided to the second edge portion, and a plurality of between-element communication output pins are provided to the fourth edge portion, respectively. A common signal is input to the first and second elements and a communication is performed between the first element and the second element. Loss of control function can be surely prevented while suppressing enlargement of the board and increase of development/production cost.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: April 2, 2019
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventor: Yoshiki Santo
  • Patent number: 10240771
    Abstract: A novel LED lamp comprising: a lamp body; an LED mounted to the lamp body; an outer (exit) window; and a hinged clamp for releasably mounting the outer (exit) window to the lamp body such that light emitted from the LED passes through the outer (exit) window.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: March 26, 2019
    Assignee: ProPhotonix Limited
    Inventors: Karol Murphy, Peter Panek
  • Patent number: 10242976
    Abstract: In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die. and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: March 26, 2019
    Assignee: INTEL CORPORATION
    Inventor: Myung Jin Yim
  • Patent number: 10231334
    Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Ai Kiar Ang, Michael Lauri
  • Patent number: 10230294
    Abstract: A power conversion device includes a gate voltage adjustment unit (a detection circuit 12) which acts on a drive signal from a gate drive circuit 11 that sends a drive signal to the respective gates of a plurality of semiconductor elements Q1 to Q2 provided in parallel, and which adjusts the gate voltages of the semiconductor elements. The gate voltage adjustment unit superimposes an induction voltage generated on the basis of a difference between a magnetic flux due to a current flowing through one of the plurality of semiconductor elements and a magnetic flux due to a current flowing through each of the other semiconductor elements, onto a gate voltage sent to at least one gate of the plurality of semiconductor elements.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: March 12, 2019
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Yusuke Zushi, Tatsuhiro Suzuki, Keiichiro Numakura, Taku Shimomura, Tetsuya Hayashi
  • Patent number: 10217702
    Abstract: A semiconductor device includes a BGA package including first bumps. A first semiconductor die is mounted to the BGA package between the first bumps. The BGA package and first semiconductor die are mounted to a carrier. A first encapsulant is deposited over the carrier and around the BGA package and first semiconductor die. The carrier is removed to expose the first bumps and first semiconductor die. An interconnect structure is electrically connected to the first bumps and first semiconductor die. The BGA package further includes a substrate and a second semiconductor die mounted, and electrically connected, to the substrate. A second encapsulant is deposited over the second semiconductor die and substrate. The first bumps are formed over the substrate opposite the second semiconductor die. A warpage balance layer is formed over the BGA package.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: February 26, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Kang Chen
  • Patent number: 10205018
    Abstract: Certain aspects of the present disclosure generally relate to a semiconductor device. The semiconductor device generally includes a substrate, a channel disposed above the substrate, and a first dielectric layer disposed adjacent to a first side of the channel. The semiconductor device may also include a first non-insulative region disposed between the first dielectric layer and the substrate, and a second dielectric layer disposed adjacent to a second side of the channel, wherein the first dielectric layer and the second dielectric layer comprise high-k layers. In certain aspects, a second non-insulative region may be disposed above the second dielectric layer, and a third non-insulative region may be disposed adjacent to a third side of the channel.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: February 12, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Xia Li, Bin Yang, Gengming Tao
  • Patent number: 10180249
    Abstract: A novel LED lamp comprising: a lamp body; an LED mounted to the lamp body; an outer (exit) window; and a hinged clamp for releasably mounting the outer (exit) window to the lamp body such that light emitted from the LED passes through the outer (exit) window.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: January 15, 2019
    Assignee: ProPhotonix Limited
    Inventors: Karol Murphy, Peter Panek
  • Patent number: 10180248
    Abstract: A novel LED lamp comprising: a lamp body; an LED mounted to the lamp body; an outer (exit) window; and a hinged clamp for releasably mounting the outer (exit) window to the lamp body such that light emitted from the LED passes through the outer (exit) window.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: January 15, 2019
    Assignee: ProPhotonix Limited
    Inventors: Karol Murphy, Peter Panek
  • Patent number: 10177119
    Abstract: A semiconductor package is disclosed including a number of stacked semiconductor die, electrically connected to each other with wire bonds. The stacked semiconductor die are provided in a mold compound such that a spacing exists between a top die in the die stack and a surface of the mold compound. The wire bonds to the top die may be provided in the spacing. An RDL pad is affixed to the surface of the mold compound. Columns of bumps may be formed on the die bond pads of the top die in the die stack to electrically couple the RDL pad to the die stack across the spacing.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: January 8, 2019
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Cong Zhang, Fuqiang Xiao, Bin Xu, Haijun Wu, Chin Tien Chiu, Zengyu Zhou
  • Patent number: 10170387
    Abstract: A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: January 1, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Wan-Yu Lee, Ying-Hao Kuo, Kuo-Chung Yee
  • Patent number: 10163687
    Abstract: A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: December 25, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: David Fraser Rae, Lizabeth Ann Keser, Reynante Tamunan Alvarado
  • Patent number: 10163822
    Abstract: A method includes mounting a wafer-level package substrate over a carrier, and pre-cutting the wafer-level package substrate to form trenches extending from a top surface of the wafer-level package substrate into the wafer-level package substrate. A plurality of dies is bonded over the wafer-level package substrate. The plurality of dies is molded in a molding material to form a wafer-level package, with the wafer-level package including the wafer-level package substrate, the plurality of dies, and the molding material. The carrier is detached from the wafer-level package. The wafer-level package is sawed into a plurality of packages, with each of the plurality of packages including a portion of the wafer-level package substrate and one of the plurality of dies.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu
  • Patent number: 10163789
    Abstract: Provided is a semiconductor device that includes: an integrated circuit (IC) chip including a terminal array that is a matrix of terminals arranged in at least seven rows and at least seven columns, the terminals including a reference terminal to which a reference voltage is applied; a capacitor electrically connected to the reference terminal; and a substrate including one main surface as a mounting surface on which the IC chip and the capacitor are mounted. The IC chip is an application specific integrated circuit (ASIC) chip or a field-programmable gate array (FPGA) chip. The reference terminal is disposed at a position within three rows or three columns from an outer edge of the terminal array.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: December 25, 2018
    Assignee: JOLED INC.
    Inventor: Shunsuke Itakura
  • Patent number: 10157875
    Abstract: A chip package including a first substrate is provided. The first substrate includes a sensing device. A second substrate is attached onto the first substrate and includes an integrated circuit device. A first conductive structure is electrically connected to the sensing device and the integrated circuit device through a redistribution layer disposed on the first substrate. An insulating layer covers the first substrate, the second substrate and the redistribution layer. The insulating layer has a hole therein and a second conductive structure is disposed under the bottom of the hole. A method for forming the chip package is also provided.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: December 18, 2018
    Assignee: XINTEC INC.
    Inventors: Ho-Yin Yiu, Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang
  • Patent number: 10141252
    Abstract: A semiconductor package includes: a passivation layer having a first surface and a second surface opposite to the first surface, the passivation layer defining a through hole extending from the first surface to the second surface, the through hole being further defined by a first sidewall and a second sidewall of the passivation layer; a first conductive layer on the first surface of the passivation layer and the first sidewall; a second conductive layer on the second surface of the passivation layer and the second sidewall; and a third conductive layer between the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 27, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuan-Fu Sung, Shin-Hua Chao, Ming-Chi Liu, Hung-Sheng Chen
  • Patent number: 10111577
    Abstract: An endoscopic instrument is provided with an LED illumination module having at least one LED arranged at the distal end of the instrument and having an electrical connection lead attached to this LED. The connection lead is a coaxial cable, which extends from the distal end to the proximal end of the instrument, and is designed for leading away the waste heat produced by the LED. At least one electrical conductor of the coaxial cable is connected to the LED in a heat-conducting manner.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: October 30, 2018
    Assignee: Richard Wolf GmbH
    Inventors: Bernd Claus Weber, Rudolf Heimberger, Klaus Schrumpf, Adrian Mahlkow
  • Patent number: 10098179
    Abstract: A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: October 9, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Shintaro Yamamichi, Hirokazu Honda, Masaki Watanabe, Junichi Arita, Norio Okada, Jun Ueno, Masashi Nishimoto, Michitaka Kimura, Tomohiro Nishiyama
  • Patent number: 10083941
    Abstract: Stacked semiconductor dies are provided with selective capillary under fill to avoid wafer warpage during curing. In one embodiment, a method of manufacturing a semiconductor device includes forming at least three stacks of semiconductor dies over a substrate, the stacks spaced apart from one another by gaps. A first sealing material such as a capillary under fill material is deposited into a first subset of the gaps. A second sealing material such as a mold resin is deposited into a second subset of the gaps. The first and second sealing materials are cured, and the die stacks are then singulated.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 25, 2018
    Assignee: Micron Technology, Inc.
    Inventor: Mitsuhisa Watanabe
  • Patent number: 10074635
    Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: September 11, 2018
    Assignee: Cree, Inc.
    Inventors: Nishant Tiwari, Colin Kelly Blakely, Jesse Colin Reiherzer, Mark Edmond, Arthur Fong-Yuen Pun, Michael Bergmann
  • Patent number: 10068899
    Abstract: An integrated circuit (IC) structure uses a single semiconductor substrate having a first side and an opposing, second side. A first plurality of active devices are positioned on the first side of the single semiconductor substrate, and a second plurality of active devices are positioned on the opposing, second side of the single semiconductor substrate. A TSV may electrically couple active devices on either side. Use of a single semiconductor substrate with active devices on both sides reduces the number of semiconductor layers used and allows annealing without damaging BEOL interconnects during fabrication.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: September 4, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Ian D. W. Melville, Mukta G. Farooq
  • Patent number: 10068849
    Abstract: A plurality of unit MISFET elements connected in parallel with each other to make up a power MISFET are formed in an LDMOSFET forming region on a main surface of a semiconductor substrate. A control circuit that controls a gate voltage of the power MISFET is formed in a driver circuit region on the main surface of the semiconductor substrate. A wiring structure having a plurality of wiring layers made of the same metal material is formed on the semiconductor substrate. The gate electrodes of the plurality of unit MISFET elements formed in the LDMOSFET forming region are electrically connected to each other via gate wirings formed in all of the plurality of wiring layers made of the same metal material.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: September 4, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Koujirou Matsui, Takehiko Sakamoto, Kazuyuki Umezu, Tomoaki Uno
  • Patent number: 10056297
    Abstract: A method for improving the cleaving of the back metal along the edges of the die of a semiconductor wafer mounted on a deformable plastic film including the step of depositing a layer of material on metal located on the wafer back side in etched streets.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: August 21, 2018
    Inventors: Paul C. Lindsey, Jr., Darrell W. Foote
  • Patent number: 10043729
    Abstract: A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: August 7, 2018
    Assignee: ABB Technology Oy
    Inventors: Jorma Manninen, Mika Silvennoinen, Kjell Ingman
  • Patent number: 10032692
    Abstract: Various embodiments relating to semiconductor package structures having reduced thickness while maintaining rigidity are provided. In one embodiment, a semiconductor package structure includes a substrate including a surface, a semiconductor die including a first interface surface connected to the surface of the substrate and a second interface surface opposing the first interface surface, a mold compound applied to the substrate surrounding the semiconductor die. The second interface surface of the semiconductor die is exposed from the mold compound. The semiconductor package structure includes a heat dissipation cover attached to the second interface surface of the semiconductor die and the mold compound.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: July 24, 2018
    Assignee: Nvidia Corporation
    Inventors: Shantanu Kalchuri, Brian Schieck, Abraham Yee
  • Patent number: 10002852
    Abstract: A first integrated circuit (IC) package has a package substrate on bottom. The package substrate comprises a bottom redistribution circuitry configured according to printed circuit board (PCB) design rule and a top redistribution circuitry configured according to integrated circuit (IC) design rule. The first IC package has a plurality of top metal pads and a plurality of copper pillars configured on a top side according to IC design rule. A second IC package has a plurality of bottom metal pads configured according to IC design rule configured on a top side of the first IC package. The first IC package electrically couples to the second IC package through the plurality of copper pillars.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: June 19, 2018
    Inventor: Dyi-Chung Hu
  • Patent number: 9991925
    Abstract: A cover panel is disposed on a surface of an electronic apparatus and is made of sapphire. A flexible printed wiring board extends in a state of being curved in the electronic apparatus. A gap reduction member is in contact with at least a curved portion of the flexible printed wiring board from the cover panel side.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: June 5, 2018
    Assignee: KYOCERA Corporation
    Inventors: Katsumi Arao, Akito Iwai
  • Patent number: 9980381
    Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: May 22, 2018
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Seng Huan Chuah, Friedrich Josef Bollmann, Khai Jin Choo, Weng Kong Hor, Sih Hau Tan
  • Patent number: 9966363
    Abstract: A semiconductor apparatus includes a first semiconductor die and a second semiconductor die stacked onto the first semiconductor die in a horizontally shifted manner. The first semiconductor die includes a first chip selection terminal and a first lower terminal electrically connected to the first chip selection terminal. The second semiconductor die includes a second chip selection terminal electrically connected to a first upper terminal of the first semiconductor die via a second lower terminal of the second semiconductor die. The first upper terminal which is electrically connected to the second chip selection terminal is not electrically connected to the first lower terminal which is electrically connected to the first chip selection terminal.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: May 8, 2018
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Po-Chun Lin, Chin-Lung Chu
  • Patent number: 9966359
    Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate. The semiconductor package may include a first semiconductor chip flip-chip bonded to a first surface of the substrate. The semiconductor package may include second semiconductor chips respectively flip-chip bonded to portions of the first surface of the substrate adjacent to both ends of the first semiconductor chip. The semiconductor package may include a third semiconductor chip solder-jointed to the first surface of the substrate covering the first semiconductor chip and portions of the second semiconductor chips.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: May 8, 2018
    Assignee: SK hynix Inc.
    Inventors: Sang Eun Lee, Eun Ko, Yong Jae Park
  • Patent number: 9953911
    Abstract: A method includes attaching a semiconductor structure on a carrier, depositing a molding compound layer over the carrier, wherein the semiconductor structure is embedded in the molding compound layer, exposing a first photo-sensitive material layer and a second photo-sensitive material layer to light, developing the first photo-sensitive material layer and the second photo-sensitive material layer to form an opening having a first portion in the first photo-sensitive material layer and a second portion in the second photo-sensitive material layer, wherein a width of the second portion is greater than a width of the first portion, filling the opening with a conductive material to form a via in the first photo-sensitive material layer and a redistribution layer in the second photo-sensitive material layer and forming a bump over the redistribution layer.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: April 24, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Wei Chiu, Sao-Ling Chiu
  • Patent number: 9947625
    Abstract: A wiring board with embedded component and integrated stiffener is characterized in that an embedded semiconductor device, a first routing circuitry, an encapsulant and an array of vertical connecting elements are integrated as an electronic component disposed within a through opening of a stiffener, and a second routing circuitry is disposed beyond the through opening of the stiffener and extends over the stiffener. The mechanical robustness of the stiffener can prevent the wiring board from warping. The embedded semiconductor device is electrically coupled to the first routing circuitry and surrounded by the vertical connecting elements in electrical connection with the first and second routing circuitries. The first routing circuitry provides primary fan-out routing for another semiconductor device to be assembled on the wiring board, whereas the second routing circuitry not only provides further fan-out wiring structure, but also mechanically binds the electronic component with the stiffener.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: April 17, 2018
    Assignee: BRIDGE SEMICONDUCTOR CORPORATION
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 9922943
    Abstract: A method includes mounting a wafer-level package substrate over a carrier, and pre-cutting the wafer-level package substrate to form trenches extending from a top surface of the wafer-level package substrate into the wafer-level package substrate. A plurality of dies is bonded over the wafer-level package substrate. The plurality of dies is molded in a molding material to form a wafer-level package, with the wafer-level package including the wafer-level package substrate, the plurality of dies, and the molding material. The carrier is detached from the wafer-level package. The wafer-level package is sawed into a plurality of packages, with each of the plurality of packages including a portion of the wafer-level package substrate and one of the plurality of dies.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: March 20, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu
  • Patent number: 9905540
    Abstract: A fan-out package may include a core supporter having a through hole, a first semiconductor chip disposed on a first surface of the core supporter in a way that a portion of the first semiconductor chip is exposed by the through hole, a second semiconductor chip disposed on a second surface of the core supporter, a first photosensitive dielectric layer disposed on the first surface of the core supporter to cover the first semiconductor chip, a second photosensitive dielectric layer disposed on the second surface of the core supporter to cover the second semiconductor chip and to fill the through hole, a first trace pattern disposed on the second photosensitive dielectric layer, and a first conductive via penetrating the second photosensitive dielectric layer in the through hole to be connected to both of the first trace pattern and the first semiconductor chip.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: February 27, 2018
    Assignee: SK hynix Inc.
    Inventor: Jong Hyun Nam
  • Patent number: 9906165
    Abstract: Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of IGBT chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and a second wire. Similarly, the third semiconductor chip on which the control circuit is formed and a second semiconductor chip of a plurality of IGBT chips are electrically connected via a low-side relay board. That is, the second semiconductor chip and the third semiconductor chip are electrically connected via the first wire, the low-side relay board and the second wire.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: February 27, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kuniharu Muto, Koji Bando, Takamitsu Kanazawa, Ryo Kanda, Akihiro Tamura, Hirobumi Minegishi
  • Patent number: 9905517
    Abstract: Signal transmission characteristics of a semiconductor device are improved. A plurality of wirings of a wiring substrate on which a semiconductor chip is mounted include a first wiring and a second wiring that constitute a differential pair for use in transmitting a differential signal. Moreover, the first wiring and the second wiring respectively have first portions that extend in parallel with each other with a first clearance and second portions that are formed on the same wiring layer as the first portions, and extend in parallel with each other with a second clearance and third portions that are installed between the first portions and the second portions and designed to detour in such directions as to allow the mutual clearance to become greater than the first clearance and the second clearance.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: February 27, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kazuhiko Hiranuma, Kazuyuki Sakata
  • Patent number: 9905466
    Abstract: A method of partitioning a wafer includes defining a scribe line surrounding a set of dies. The method further includes etching a plurality of trenches into the wafer, wherein each trench of the plurality of trenches is located between adjacent dies of the set of dies, and a width of each trench of the plurality of trenches is less than a width of the scribe line. The method further includes thinning the wafer to expose a bottom surface of the plurality of trenches. The method further includes cutting along the scribe line to separate the set of dies from another portion of the wafer.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: February 27, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Hsiang Huang, Chung-Chuan Tseng, Chia-Wei Liu, Li Hsin Chu
  • Patent number: 9899324
    Abstract: A method includes providing a semiconductor substrate having horizontal and vertical scribe lines thereon defining semiconductor areas for printed circuits and/or semiconductor devices, and forming a metallic structure on the semiconductor substrate to serve as a bus bar for the printed circuits and/or semiconductor devices. A semiconductor structure is realized with the method, the semiconductor structure including a semiconductor substrate having horizontal and vertical scribe lines thereon defining semiconductor areas for printed circuits and/or semiconductor devices, a metallic structure on the semiconductor substrate serving as a bus bar for the printed circuits and/or semiconductor devices, and printed circuits and/or semiconductor devices in the semiconductor areas.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: February 20, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Shafaat Ahmed, Sadanand Vinayak Despande, Atsushi Ogino
  • Patent number: 9899347
    Abstract: A wide I/O semiconductor device is disclosed including a memory die stack wire bonded to an interface chip. The stack of memory die may be wire bonded to the interface chip using a wire bond scheme optimized for die-to-die connection and optimized for the large number of wire bond connections in a wide I/O semiconductor device. This method can achieve significant BW increase by improving packaging yield and costs, not possible with current packaging schemes.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: February 20, 2018
    Assignee: SanDisk Technologies LLC
    Inventors: Michael Mostovoy, Gokul Kumar, Ning Ye, Hem Takiar, Venkatesh P. Ramachandra, Vinayak Ghatawade, Chih-Chin Liao