Abstract: A display panel includes a base substrate including: a plurality of pixel regions and a peripheral region adjacent thereto; a pixel defining film disposed on the base substrate and having a plurality of openings, each of which corresponding to a respective one of the plurality of pixel regions; a plurality of light emitting elements disposed on the base substrate corresponding to the plurality of openings and configured to generate first color light; an encapsulation member disposed on the plurality of light emitting elements; a light shield pattern disposed on the encapsulation member and overlapping the peripheral region when viewed in a plan view; and a light control layer disposed on the encapsulation member and the light shield pattern and overlapping the plurality of pixel regions. The pixel defining film includes a first color material, and the light shield pattern includes a second color material different from the first color.

Abstract: An optoelectronic device includes a LED that is suited to the emission of a radiation and that includes an active layer, and a conversion layer that extends over the active layer of the LED and that includes a plurality of fluorophores suited to the conversion of the radiation emitted by the LED, wherein the conversion layer is confined laterally by a mirror reflecting both the radiation converted by the fluorophores and the radiation not converted by the fluorophores, and vertically between a first and a second multilayer reflective filters forming a resonant Fabry-Perot cavity that blocks the radiation not converted by the fluorophores and has a transmittance peak for the radiation converted by the fluorophores.

Abstract: To increase emission efficiency of a fluorescent light-emitting element by efficiently utilizing a triplet exciton generated in a light-emitting layer. The light-emitting layer of the light-emitting element includes at least a host material and a guest material. The triplet exciton generated from the host material in the light-emitting layer is changed to a singlet exciton by triplet-triplet annihilation (TTA). The guest material (fluorescent dopant) is made to emit light by energy transfer from the singlet exciton. Thus, the emission efficiency of the light-emitting element is improved.

Abstract: A display device of the present disclosure includes a plurality of recess portions provided on a pixel formation surface, and a pixel arranged in each of the plurality of recess portions, in which a light-emitting unit of the pixel is formed on a side wall and a bottom surface of each of the plurality of recess portions. A manufacturing method of a display device of the present disclosure is a manufacturing method of a display device having the above-described configuration. Furthermore, an electronic device of the present disclosure is an electronic device including a display device having the above-described configuration.

Abstract: A light emitting structure includes a substrate, at least one light emitting chip disposed on the substrate and, a side wall disposed on the substrate and surrounding the at least one light emitting chip, a cover disposed on the side wall, an anti-reflective coating disposed on the cover, and a protective layer disposed on outside of the cover, wherein the cover, the side wall and the substrate define an enclosed space for accommodating the at least one light emitting chip.

Abstract: A display apparatus includes a substrate including a display area including a first display device, a second display device, and a third display device. The display apparatus includes a first protection layer disposed on the first, second, and third display devices, a first color conversion layer disposed on the first protection layer corresponding to the first display device and including first quantum dots converting incident light into first light, a second color conversion layer disposed on the first protection layer corresponding to the second display device and including second quantum dots converting incident light into second light, and a third color conversion layer disposed on the first protection layer corresponding to the third display device and including light scattering particles converting incident light into third light.

Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.

Abstract: A display apparatus includes a display area extending in a first direction and a second direction, first to fourth sub-pixels, and a spacer. The first sub-pixel emits a first color light, and includes first and second sides extending in a third direction inclined at a predetermined angle with the first direction, and third and fourth sides extending in a fourth direction perpendicular to the third direction. The second sub-pixel emits a second color light, and is disposed adjacent to the second side of the first sub-pixel in the fourth direction. The third sub-pixel emits a third color light, and is disposed adjacent to the fourth side of the first sub-pixel in the third direction. The fourth sub-pixel emits the first color light, and is disposed adjacent to the second and third sub-pixels. The spacer is disposed between the first and second sub-pixels and between the third and fourth sub-pixels.

Abstract: The present invention discloses a quantum rod light emitting diode device, including a substrate, and a cathode, an electron functional layer, a light emitting layer, a hole functional layer and an anode sequentially stacked on the substrate. The light emitting layer includes quantum rods disposed therein. The quantum rods are oriented along a same direction. The light emitting layer of the quantum rod light emitting diode device of the present invention include the oriented quantum rods to change incident light into polarized light, which enhances transmittance of polarized light.

Abstract: A light emitting device package including a printed circuit board having a front surface and a rear surface, at least one light emitting device disposed on the front surface and emitting light in a direction toward the front surface, and a molding layer disposed on the printed circuit board and surrounding the light emitting device, in which the light emitting device includes a light emitting structure disposed on the printed circuit board, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, and the molding layer covers an upper surface of the substrate and includes a fine concavo-convex part formed on a surface of the molding layer exposed to the outside.

Abstract: Described herein are electronics that incorporate heterocyclic organic compounds. More specifically, described herein are organic electronics systems that are combined with donor-acceptor organic semiconductors, along with methods for making such devices, and uses thereof.

Abstract: Discussed are a display device, and a method of manufacturing the display device. The display device includes a substrate having a plurality of metal pads, and a semiconductor light-emitting element electrically connected to the plurality of metal pads through self-assembly. Specifically, each metal pad includes a bonding metal electrically connected to a conductive electrode of a respective semiconductor light-emitting element, and a coating layer encompassing the bonding metal.

Abstract: A holographic display panel with precise control in the wavelengths of projected light, and therefore sharpness of image, includes a light source and a filter layer. The light source emits at least a first color light and a second color light. The filter layer is located on an optical path of the first color light and an optical path of the second color light. The filter layer includes first and second filter units. Each of the first filter units filters and restricts wavelengths of the first color light, each of the second filter units filters and restricts wavelengths of the second color light.

Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

Abstract: A display panel includes: an upper display substrate including a plurality of pixel areas arranged in each of a plurality of pixel columns and a light blocking area disposed adjacent to the pixel areas; and a lower display substrate including a plurality of display elements respectively overlapping the pixel areas, wherein the upper display substrate includes: a base substrate; a color filter layer disposed on the base substrate; and a light control layer disposed on the color filter layer and including transmission portions respectively at least partially overlapping first pixel areas arranged in a first one of the pixel columns and first conversion portions respectively at least partially overlapping second pixel areas arranged in a second one of the pixel columns, wherein the light blocking area includes a first light blocking area defined between the transmission portion and the first conversion portion, and a second light blocking area defined between the first conversion portions, and a first shortest d

Abstract: An electronic apparatus includes a display panel including a base substrate, a pixel definition layer to define openings, light-emitting devices including light-emitting patterns in the openings, and an encapsulation layer covering the light-emitting device, a cover panel including a window layer, a color filter layer, and a color control layer, the color filter layer being on the window layer, the color control layer being on the color filter layer and including a quantum dot, and a refraction control layer including first refraction patterns, overlapping the light-emitting patterns, respectively, and having a first refractive index, and a second refraction pattern adjacent to the first refraction patterns and having a second refractive index that is lower than the first refractive index, wherein, when measured in a first direction, a largest width of each of the first refraction patterns is larger than a width of each of the light-emitting patterns.

Abstract: An optoelectronic device is specified, with a radiation-emitting semiconductor chip configured to generate electromagnetic radiation, and an active element configured to change a physical state, wherein the active element is embedded in a component of the component, and the physical change of state comprises the following: temperature change, sound generation, mechanical motion.

Abstract: A method for manufacturing a display apparatus including a plurality of modular includes arranging the plurality of modular displays on a chassis, each modular display from among the plurality of modular displays comprising a respective plurality of pixels including a red inorganic light emitting element, a green inorganic light emitting element, and a blue inorganic light emitting element, forming a film on the plurality of modular displays, and forming a cover between light emitting elements of the plurality of modular displays by removing a region of the film corresponding to the light emitting elements of the plurality of modular displays.

Abstract: Disclosed is a unit pixel of a microdisplay. In the unit pixel, sub-pixels which respectively form blue, green, and red light are vertically stacked on a growth substrate. Accordingly, the overall area of the unit pixel is reduced, and a transfer process is easily performed.

Abstract: A lighting device includes a lighting unit emitting an output light having a light spectrum. The light spectrum in a range from 520 nm to 780 nm has a main peak, and the light spectrum in a range from 400 nm to 470 nm has a sub peak with a maximum intensity at a first wavelength. A first sub peak integral is an integral of the light spectrum calculated from a wavelength of the first wavelength minus 20 nm to the first wavelength. A second sub peak integral is an integral of the light spectrum calculated from the first wavelength to a wavelength of the first wavelength plus 20 nm. A ratio of the first sub peak integral to the second sub peak integral is in a range from 20% to 98%.

Abstract: A semiconductor component and an illumination device is disclosed. In an embodiment the semiconductor component includes a semiconductor chip configured to generate a primary radiation having a first peak wavelength and a radiation conversion element arranged on the semiconductor chip. The radiation conversion element includes a quantum structure that converts the primary radiation at least partly into secondary radiation having a second peak wavelength and a substrate that is transmissive to the primary radiation.

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.

Abstract: A display (100) comprising a plurality of LED chips (604), each LED chip (604) comprising a plurality of light emitting elements (606a-c). Each LED chip (604) is arranged such that a first light emitting element (606a) is configured to illuminate a sub-pixel, and a second light emitting element (606b) is configured to illuminate a sub-pixel using substantially the same wavelength of light as the first light emitting element. There is also described an LED chip, a display pixel, a controlling method, a computer device and a computer program for a display.

Abstract: Discussed is a display device comprising a substrate; a plurality of cells provided with a partition wall protruding on the substrate, and sequentially arranged along one direction; a plurality of semiconductor light-emitting elements respectively accommodated in the plurality of cells; and a first electrode provided with a plurality of electrode lines arranged on a bottom of the plurality of cells, and electrically connected to the plurality of semiconductor light-emitting elements, wherein the bottom of the plurality of cells comprise a first region covered by the plurality of electrode lines, and a second region formed between the plurality of electrode lines.

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

Abstract: A micro light emitting device display apparatus including a substrate, a plurality of micro light emitting devices, an isolation layer, and an air gap is provided. The micro light emitting devices are discretely disposed on the substrate. The isolation layer is disposed between the micro light emitting devices. The air gap is disposed between the micro light emitting devices, the isolation layer, and the substrate.

Abstract: A light emitting device for a display including first, second, and third LED stacks each including a first semiconductor layer, an active layer, and a second semiconductor layer, first, second, and third transparent electrodes in ohmic contact with a lower surface of the first LED stack, an upper surface of the second LED stack, and an upper surface of the third LED stack, respectively, a first electrode pad disposed on the first semiconductor layer of the third LED stack, a lower second electrode pad disposed on the third transparent electrode, and first, second, and third bump pads disposed on the first LED stack and electrically connected to the LED stacks, respectively, and a common bump pad disposed electrically connected to each LED stack, in which an upper surface of the first electrode pad is located at substantially the same elevation as that of the lower second electrode pad.

Abstract: A light-emitting device includes a panel substrate, a light-emitting chip, and a light extracting layer. The light-emitting chip is disposed on the panel substrate. The light extracting layer covers the light-emitting chip and the panel substrate, and the light extracting layer has a side portion. Taking the position where the edge of the light-emitting chip is in contact with the panel substrate as the origin, the side portion and the origin define a circle tangential to the surface of the side portion. The circle has a radius c which satisfies the following formula (1): 1 40 ? H ? c ? H ( 1 ) where H is a height of the light-emitting chip. The light-emitting device disclosed herein has a light extracting layer having a very small thickness, and provides excellent light-emitting efficiency and lifetime of the light-emitting device.

Abstract: An organic light emitting diode display substrate includes a light emitting unit layer, a first band gap layer and a color conversion layer. The first band gap layer and the color conversion layer are on a light exit path of the light emitting unit layer. The light emitting unit layer includes first, second and third light emitting units periodically arranged on a driving substrate and emitting light of a first color. The color conversion layer converts a part of the light of the first color into light of a second color and a third color. The first band gap layer is between the light emitting unit layer and the color conversion layer. The first band gap layer transmits the light of the first color in a light exit direction, and reflects the light of the second color and the light of the third color.

Abstract: A display device and method of manufacturing same includes: a display panel having a pixel area and a peripheral area adjacent to the pixel area, a light control layer disposed on the display panel and at least partially overlapping the pixel area, a light blocking portion at least partially overlapping the peripheral area, and a protective layer disposed between the light control layer and the light blocking portion.

Abstract: Disclosed herein is an apparatus comprising: a pixel define layer (PDL) on a support and having a hole therein; a light emitting layer (EML) at least partially within the hole; and a first reflective layer on a sidewall of the hole and configured to reflect light emitted by the EML. Also disclosed herein is a display panel and a system comprising a plurality of the apparatus. Further disclosed herein is a method of making the apparatus.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: The disclosure provides a mass transfer method and device for micro light emitting diode chips. The method includes the following steps: performing magnetic pole electroplating on the micro light emitting diode chips obtained by peeling off the sapphire substrate to enable corresponding magnetic poles to be generated at corresponding positions of the micro light emitting diode chips; peeling off the transfer substrate, and placing the micro light emitting diode chips obtained by peeling off the transfer substrate in a dispersion liquid to form a solution in which micro light emitting diode chips are dispersed; and the display substrate picks up the micro light emitting diode chips dispersed under the action of the magnetic field force.

Abstract: Instead of discrete LED chips, monolithic LED strips reduce manufacturing time and inaccuracy when building high-resolution displays with small LED pixels of less than 100 micrometers. Guide strips next to LED strips align the monolithic LED strips and increase light emission area. A monolithic LED strip formed on a substrate has a P contact and an N contact. A first transfer layer is on an upper surface of the monolithic LED strip. The first transfer layer separates the monolithic LED strip from the substrate. A second transfer layer applied to the lower surface of the monolithic LED strip separates the monolithic LED strip from the first transfer layer. A display backplane is prepared with positive electrodes, negative electrodes, positive contact pads, and negative contact pads.

Abstract: An emissive display device including LEDs, including a plurality of pixels, each including: an elementary control cell formed inside and on top of a semiconductor substrate; a first LED capable of emitting in a first wavelength range, arranged on the upper surface of the elementary control cell and having a first conduction region connected to a first connection pad of the elementary control cell; and a second LED capable of emitting in a second wavelength range, having a surface area smaller than that of the first LED, arranged on the upper surface of the first LED opposite a central region of the first LED, and having a first conduction region connected to a second connection pad of the elementary control cell via a first conductive via crossing the first LED.

Abstract: The present invention relates to a display device and, more particularly, to a display device using a semiconductor light emitting element.

Abstract: A method of manufacturing a flexible laminate electronic device and the flexible laminate electronic device itself is disclosed. The method includes placing electronic components over a flexible substrate layer that includes electrical connections between ones of the electronic components. A first flexible additive layer that includes apertures is positioned to align ones of the electronic components in respective ones of the apertures. A subsequent flexible additive layer is arranged over the first flexible additive layer and the apertures are aligned around respective portions of ones of the electronic components protruding above the first flexible additive layer. A flexible cover layer is emplaced over the subsequent flexible additive layer.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.

Abstract: Aspects of the present disclosure relate to a lighting device that is configured to provide light with a high color rendering index (CRI) value and/or uniform planar illumination. The lighting device may include a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit broad spectrum light having a first CRI value, a photo-luminescent material disposed above the LED mounted to the circuit board configured to increase the CRI of the broad spectrum light emitted by the LED from the first CRI value to a higher, second CRI value, and an elastomer encapsulating at least part of the circuit board. Additionally, the lighting device may include a lens disposed over the LED configured to increase the maximum emission angle of light from the LED and a diffuser disposed above the lens and configured to diffuse the broad spectrum light.

Abstract: The present disclosure provides an OLED display panel including a substrate, and a gate electrode, an active layer, a source electrode, and a drain electrode of a TFT device disposed on the substrate, and an anode of an OLED device disposed on the substrate; wherein the source electrode, the drain electrode, and the anode are formed in a same layer, and the anode is connected to the source electrode. The source electrode, the drain electrode, and the anode are arranged in a same layer, so that the source electrode, the drain electrode, and the anode are formed through a single process, thereby simplifying a manufacturing process and saving costs.

Abstract: According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board; a light emitting diode (LED) array mounted to the circuit board and configured to emit broad spectrum light at any one of a plurality of different color correlated temperature (CCT) values within a range of CCT values, the LED array comprising a first LED configured to emit narrow spectrum light and a second LED that is different from the first LED and configured to emit broad spectrum light; and at least one elastomer encapsulating at least part of the circuit board and the LED array mounted to the circuit board.

Abstract: A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed below the first LED sub-unit, and a filler disposed between the electrode pads, in which the electrode pads include a common electrode pad electrically connected in common to the first, second, and third LED sub-units, and first, second, and third electrode pads connected to the first, second, and third LED sub-units, respectively, the first, second, and third LED sub-units are independently drivable, light generated in the first LED sub-unit is configured to be emitted to the outside of the light emitting device through the second and third LED sub-units, and light generated in the second LED sub-unit is configured to be emitted to the outside through the third LED sub-unit.

Abstract: A MEMS component includes a semiconductor substrate stack having a first semiconductor substrate and a second semiconductor substrate, wherein the semiconductor substrate stack has a cavity formed within the first and second semiconductor substrates, and wherein at least the first or the second semiconductor substrate has an access opening for gas exchange between the cavity and an environment. A radiation source is arranged at the first semiconductor substrate, and a radiation detector is arranged at the second semiconductor substrate. Two mutually spaced apart reflection elements are arranged in a beam path between the radiation source and the radiation detector, wherein one reflection element is partly transmissive to the emitted radiation from the cavity in the direction of the radiation detector, and wherein an interspace between the two mutually spaced apart reflection elements has a length that is at least ten times the wavelength of the emitted radiation.

Abstract: A multi-pixel LED package is disclosed. The multi-pixel LED package includes: n pixel groups (where n is a natural number equal to or greater than 2), each of which includes a plurality of pixels, each of which includes a first LED chip, a second LED chip, and a third LED chip; and a substrate on which the n pixel groups are arrayed.

Abstract: A light-emitting device manufacturing method including providing a light-emitting structure including one or more light-emitting elements and a covering member covering the light-emitting elements. Each of the light-emitting elements have first and second electrodes. The light-emitting structure has a first surface and a second surface opposite to the first surface, and lower surfaces of the first and second electrodes of each light-emitting element are closer to the first surface than the second surface. The method further includes forming a groove structure on the first surface side by irradiation with laser light such that at least part of the first and second electrodes are exposed to an inside of the groove structure, and forming a plurality of wirings inside of the groove structure.

Abstract: A red luminophor, LED device and method for making the LED device. The red luminophor includes one or more materials selected from SrLiAl3N4:Eu2+, CaLiAl3N4:Eu2+, Sr4LiAl11N14:Eu2+ and Li2Ca2(Mg2Si2N6):Eu2+. The LED device includes the red luminophor. The method for making the LED device includes preparing a carrier; installing a blue LED onto the carrier; mixing the red luminophors and the transparent sealant to form a mixture; dispensing the mixture on the blue LED and the carrier to form an integration; and heating and curing the integration. The red luminophor has continuous light radiation in the wavelength range of 600 nm-750 nm, with the emission peak at 650-680 nm and the FWHM of less than 90 nm. Its emission light intensity at the wavelength of 730 nm is not less than 30% of its maximum emission light intensity, which matches the absorption needs of phytochrome of plant.

Abstract: A display device including a first sub-pixel and a second sub-pixel is provided. The first sub-pixel includes a first light emitting unit and a first wavelength conversion layer disposed thereon. The first sub-pixel provides a first light emitted from the first light emitting unit and converted by the first wavelength conversion layer. The first light includes a first main-peak and a first sub-peak. The second sub-pixel includes a second light emitting unit and a second wavelength conversion layer disposed thereon. The second sub-pixel provides a second light emitted from the second light emitting unit and converted by the second wavelength conversion layer. The second light includes a second main-peak and a second sub-peak. A first wavelength difference between the first main-peak and the second main-peak is less than 20 nm, and the first wavelength difference is less than a second wavelength difference between the first sub-peak and the second sub-peak.

Abstract: A light emitting device includes a substrate layer, a first electrode layer, a light emitting layer, and a patterned second electrode layer. The patterned second electrode layer includes a periodic grating structure having a grating period ?g less than or equal to 200 nm and the patterned second electrode layer and the light emitting layer are separated by at most 100 nm.

Abstract: An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.