With Shaped Contacts Or Opaque Masking Patents (Class 257/91)
  • Patent number: 11217606
    Abstract: A device substrate comprising a substrate, a first pad, a second pad, a plurality of first power lines, a plurality of second power lines, and a plurality of control units is provided. The first pad is disposed on the first side of the device substrate. The second pad is disposed on the second side of the device substrate. The second side is opposite the first side. The first power lines are electrically connected to the first pad. The second power lines are electrically connected to the second pad. The control unit is electrically connected to at least one of the first power line and the second power line. The first pad does not overlap the second pad in a first direction perpendicular to the first side or in a second direction perpendicular to the second side. A display panel is also provided. A tiled display is also provided.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: January 4, 2022
    Assignee: Au Optronics Corporation
    Inventors: Chen-Chi Lin, Peng-Bo Xi, Chia-Che Hung
  • Patent number: 11217652
    Abstract: A display device includes: a substrate including a display area, a peripheral area, and a pad area, a plurality of pixels in the display area, and the peripheral area surrounding the display area; a plurality of fan-out lines extending from the pad area to the display area; a first metal layer covering at least a portion of the plurality of fan-out lines in the peripheral area; a second metal layer overlapping at least a portion of the first metal layer, the second metal layer being over the first metal layer; a third metal layer over the second metal layer in the peripheral area; a first insulating layer between the first metal layer and the second metal layer and including first contact holes; and a second insulating layer between the second metal layer and the third metal layer and including second contact holes.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: January 4, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yujin Jeon, Wonse Lee
  • Patent number: 11181792
    Abstract: A display device including a substrate having a first TFT of an oxide semiconductor and a second TFT of a polysilicon semiconductor comprising: the oxide semiconductor 109 is covered by a first insulating film, a first drain electrode 110 is connected to the oxide semiconductor 109 via a first through hole 132 formed in the first insulating film, a first source electrode 111 is connected to the oxide semiconductor 109 via second through hole 133 formed in the first insulating film in the first TFT, a second insulating film is formed covering the first drain electrode 110 and the first source electrode 111, a drain wiring connects 12 to the first drain electrode 110 via a third through hole 130 formed in the second insulating film, a source wiring 122 is connected to the first source electrode 111 via a fourth through hole 131 formed in the second insulating film.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: November 23, 2021
    Assignee: JAPAN DISPLAY INC.
    Inventors: Toshihide Jinnai, Hajime Watakabe, Akihiro Hanada, Ryo Onodera, Isao Suzumura
  • Patent number: 11164994
    Abstract: A radiation-emitting semiconductor chip is disclosed. In an embodiment, a radiation-emitting semiconductor chip includes a semiconductor body configured to generate radiation, a first contact layer having a first contact area for external electrical contacting the semiconductor chip and a first contact finger structure connected to the first contact area, a second contact layer having a second contact area for external electrical contacting the semiconductor chip and a second contact finger structure connected to the second contact area, wherein the first contact finger structure and the second contact finger structure overlap in places, a current distribution layer electrically conductively connected to the first contact layer, a connection layer electrically conductively connected to the first contact layer via the current distribution layer and an insulation layer arranged in places between the connection layer and the current distribution layer, wherein the insulation layer has at least one opening.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: November 2, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Fabian Kopp, Attila Molnar, Bjoern Muermann, Franz Eberhard
  • Patent number: 11158773
    Abstract: An LED package is disclosed. The LED package includes: a base including a chip mounting surface; an LED chip including a central axis line perpendicular to the chip mounting surface; a total internal reflection (TIR) lens having a refractive index higher than that of a medium covering the upper and side surfaces of the LED chip and including entrance planes bordering the medium and exit planes from which light entering through the entrance planes is emitted; and a reflector coupled to the TIR lens. The entrance planes include main entrance planes having one or more radii of curvature and protruding toward the LED chip and a pair of lateral entrance planes connected to the main entrance planes at the edges of the main entrance planes and extending downward from the main entrance planes.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: October 26, 2021
    Assignee: LUMENS CO., LTD.
    Inventors: Seunghyun Oh, Sungsik Jo
  • Patent number: 11121286
    Abstract: A semiconductor device according to an embodiment includes a substrate, first and second light emitting structures disposed on the substrate, a first reflective electrode disposed on the first light emitting structure, a second reflective electrode disposed on the second light emitting structure, a connection electrode, a first electrode pad, and a second electrode pad. According to the embodiment, the first light emitting structure includes a first semiconductor layer of a first conductivity type, a first active layer disposed on the first semiconductor layer, a second semiconductor layer of a second conductivity type and disposed on the first active layer, and a first through hole provided through the second semiconductor layer and the first active layer to expose the first semiconductor layer.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: September 14, 2021
    Assignee: SUZHOU LEKTN SEMICONDUCTOR CO., LTD.
    Inventor: Jae Won Seo
  • Patent number: 11112070
    Abstract: The present invention relates to a nano-scale light emitting diode (LED) electrode assembly emitting polarized light, a method of manufacturing the same, and a polarized LED lamp having the same, and more particularly, to a nano-scale LED electrode assembly in which partially polarized light close to light that is linearly polarized having one direction is emitted as an emitted light when applying a driving voltage to the nano-scale LED electrode assembly and also nano-scale LED devices are connected to a nano-scale electrode without defects such as an electrical short circuit while maximizing a light extraction efficiency, a method of manufacturing the same, and a polarized LED lamp having the same.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: September 7, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Young Rag Do, Yeon Goog Sung
  • Patent number: 11107800
    Abstract: A display device can include a substrate on which a semiconductor element and a common electrode are disposed; a light emitting diode which is disposed on the substrate and includes an n-type layer, a light emitting layer, and a p-type layer; an insulating layer disposed on the substrate and the light emitting diode; and a first connecting electrode which is connected to the light emitting diode and the semiconductor element. Accordingly, it is possible to minimize defects which can be caused during a process of disposing the light emitting diode on the substrate.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: August 31, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: HyeonHo Son, HanSaem Kang, Bogyun Chung, Sungeun Bae, HyungJu Park, Eunjeong Shin, Jeenmoon Yang
  • Patent number: 11094847
    Abstract: A light-emitting device includes: a semiconductor stacked body including: an n-type semiconductor layer having an n-side contact surface, a light-emitting layer located on a region of the n-type semiconductor layer surrounding the n-side contact surface in a top-view, and a p-type semiconductor layer provided on the light-emitting layer; an n-side electrode contacting the n-side contact surface; a p-side electrode located on and contacting the p-type semiconductor layer; and an insulating film opposing a side surface of the light-emitting layer; wherein a first gap portion is located between the insulating film and the side surface of the light-emitting layer such that the side surface of the light-emitting layer is exposed at the first gap portion.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: August 17, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Hirofumi Kawaguchi
  • Patent number: 11056472
    Abstract: Provided is a stretchable display device. The stretchable display device includes a plurality of island substrates which defines a plurality of pixels and is spaced apart from each other, a lower substrate disposed below the plurality of island substrates and a connection line which electrically connects pads disposed on adjacent island substrates among the plurality of island substrates, wherein the upper substrate is made of a stretchable polymer material and includes a plurality of upper patterns overlapping an emission area of the plurality of island substrates and a second upper pattern in an area excluding the plurality of first upper patterns, and wherein the second upper pattern further includes a black pigment.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: July 6, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Seulki Kim, JiYoung Ahn
  • Patent number: 11043476
    Abstract: A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: June 22, 2021
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Seong Su Son, Jong Ik Lee, Jae Hee Lim, Jong Hyeon Chae, Seung Sik Hong
  • Patent number: 11011590
    Abstract: A display device includes a substrate including a display area and a non-display area adjacent to the display area. The non-display area includes a blocking region. An organic layer is disposed on the substrate. An emission layer is disposed in the display area of the substrate. An auxiliary pattern is disposed in the blocking region of the non-display area of the substrate. A thin film encapsulation layer is disposed on the substrate and overlaps the emission layer and the blocking region. The organic layer has a groove penetrating an entire thickness of the organic layer in the blocking region. The auxiliary pattern overlaps the groove. The auxiliary pattern includes a same material as a gate electrode disposed in the display area of the substrate.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: May 18, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Ki Hoon Kim, Deuk Jong Kim, Jae Hak Lee
  • Patent number: 10998479
    Abstract: A light emitting diode includes a first light emitting cell and a second light emitting cell comprising an n-type semiconductor layer, and a p-type semiconductor layer, respectively; reflection structures contacting the p-type semiconductor layers; a first contact layer in ohmic contact with the n-type semiconductor layer of the first light emitting cell; a second contact layer in ohmic contact with the n-type semiconductor layer of the second light emitting cell and connected to the reflection structure on the first light emitting cell. An n-electrode pad is connected to the first contact layer; and a p-electrode pad is connected to the reflection structure on the second light emitting cell. The first light emitting cell and the second light emitting cell are isolated from each other, and their outer side surfaces are inclined steeper than the inner sides. Therefore, a forward voltage may be lowered and light output may be improved.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: May 4, 2021
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Se Hee Oh, Hyun A Kim, Jong Kyu Kim, Hyoung Jin Lim
  • Patent number: 10989375
    Abstract: An LED light fixture is disclosed with an elongated housing that forms a open lower light channel and an upper light channel that is juxtaposed to the open lower light channel with electronics cavity or conduit positioned there between. The LED light fixture preferably has an elongated reflective insert that extends through the open lower light channel and creates a reflection channel from which the indirect and reflected light is emitted and a detachable cover structure that includes a diffusion lens and a removable baffle structure that attaches to side walls of the upper light channel.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: April 27, 2021
    Assignee: Finelite Inc.
    Inventors: Arlan R. Santos, David Daoud Aziz, Johannes Dale Toale, My Tien Nguyen, Aaron Matthew Smith, Kyle Tomas Martin, Timothy Shepard, Wenhui Zhang
  • Patent number: 10937936
    Abstract: Provided is a light-emitting diode (LED) display unit group and a display panel. The LED display unit group includes a circuit board, and a pixel unit array located on the circuit board. The pixel unit array includes a plurality of pixel units arranged in n rows and m columns, n and m are both positive integers and greater than or equal to 2. Each of the pixel units includes multiple LED light-emitting chips of at least two colors, each of the LED light-emitting chips includes an electrode A and an electrode B of opposite polarities. The LED light-emitting chip of each of the pixel units includes at least one dual-electrode chip, the dual-electrode chip has the electrode A and the electrode B located on a same side of the dual-electrode chip. All dual-electrode chips in the plurality of pixel units of a same color have connecting lines from the electrode A to the electrode B directed in a same direction.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: March 2, 2021
    Assignee: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Feng Gu, Kuai Qin, Yuanbin Lin, Bin Cai
  • Patent number: 10928015
    Abstract: The present invention relates to a light-emitting diode package comprising: a base having a seating surface; a light-emitting diode arranged on the seating surface; a lens arranged on the seating surface such that the lens covers the light-emitting diode; and a reflective part arranged on the seating surface such that the reflective part is spaced apart from the lens, and formed with a preset inclination angle (?), wherein the inclination angle (?) can be set according to a separation distance between the lens and the reflective part. Therefore, the light-emitting diode package can minimize a change in a beam angle and a field angle by comprising the reflective part formed with an inclination angle set as a predetermined angle according to the separation distance between the lens and the reflective part.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: February 23, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Ki Hyun Kim
  • Patent number: 10910536
    Abstract: The light emitting element includes: first and second light emitting cells each including an n-side semiconductor layer, an active layer and a p-side semiconductor layer; a first insulating film covering the first and second light emitting cells, and provided with first p-side and first n-side openings; a wiring electrode connected to the first light emitting cell at the first n-side opening, and connected to the second light emitting cell at the first p-side opening; a first electrode connected to the first light emitting cell; a second electrode connected to the second light emitting cell; a second insulating film provided with a second p-side opening formed above the first electrode, a second n-side opening formed above the second electrode, and a third opening formed above the wiring electrode; a first external connection portion connected to the first electrode; and a second external connection portion connected to the second electrode.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: February 2, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Keiji Emura, Takao Misaki, Takamasa Sunda, Yoshinori Fukui
  • Patent number: 10892392
    Abstract: A method for manufacturing a semiconductor device includes: forming a first metal portion on a substrate, the first metal portion comprising a plurality of pores; preparing a structure body comprising a semiconductor stacked body, wherein a concave portion is provided in a first surface of the structure body; and bonding the first metal portion to the structure body, such that a first part of the first metal portion is bonded to the concave portion of the first surface, and a second part of the first metal portion is bonded to a part of the first surface other than a location where the concave portion is provided. In bonding the first metal portion to the structure body, the first metal portion is bonded to the first surface such that at least a portion of the concave portion is filled with the first metal portion.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: January 12, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Kyota Sugitani
  • Patent number: 10890305
    Abstract: A lamp for a vehicle includes an array module comprising a plurality of micro Light Emitting Diode (LED) chips that are arranged in one or more patterns and that are configured to generate light, where the array module has a shape that is concave in a first direction.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: January 12, 2021
    Assignee: ZKW Group GmbH
    Inventors: Shinwoo Yoon, Yongkyo Kim, Hankyu Cho
  • Patent number: 10886360
    Abstract: A display panel and a manufacturing method thereof. The display panel includes a base substrate, and a pixel area and a non-pixel area on the substrate. The pixel area includes a light emitting element, the light emitting element including a first electrode, a light emitting layer, and a second electrode which are sequentially on the base substrate; the non-pixel area includes a first structural area, the first structural area including a conductive supporting block on one side of the light emitting layer close to the base substrate; the display panel further includes an electric connection layer which is on one side, which is away from the base substrate, of the light emitting element and the first structural area; the second electrode of the light emitting element is electrically connected with the electric connection layer, and is electrically connected with the conductive supporting block through the electric connection layer.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: January 5, 2021
    Assignees: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Jiewei Li, Dandan Zang, Yachao Tong, Chuan Yin, Xianjiang Xiong, Yong Cui
  • Patent number: 10854793
    Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes providing at least one light-emitting semiconductor chip comprising a sapphire substrate and an epitaxially grown layer sequence, arranging the light-emitting semiconductor chip with a side facing away from the sapphire substrate on a carrier, detaching the sapphire substrate from the semiconductor chip, applying a converter element on a region of the semiconductor chip in which the sapphire substrate was detached, arranging the semiconductor chip on an auxiliary carrier so that the converter element faces the auxiliary carrier and detaching the carrier from the semiconductor chip.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: December 1, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: David Racz, Matthias Sperl
  • Patent number: 10854802
    Abstract: A method for manufacturing a semiconductor device includes: forming a first metal portion on a substrate, the first metal portion comprising a plurality of pores; preparing a structure body comprising a semiconductor stacked body, wherein a concave portion is provided in a first surface of the structure body; and bonding the first metal portion to the structure body, such that a first part of the first metal portion is bonded to the concave portion of the first surface, and a second part of the first metal portion is bonded to a part of the first surface other than a location where the concave portion is provided. In bonding the first metal portion to the structure body, the first metal portion is bonded to the first surface such that at least a portion of the concave portion is filled with the first metal portion.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: December 1, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Kyota Sugitani
  • Patent number: 10804444
    Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE?1.2.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: October 13, 2020
    Assignee: Genesis Photonics Inc.
    Inventors: Cheng-Wei Hung, Long-Chi Tu, Jui-Fu Chang, Chun-Ming Tseng, Yun-Chu Chen
  • Patent number: 10777771
    Abstract: A display apparatus includes a substrate, a display area including a plurality of pixels, a non-display area outside the display area, a first dam surrounding the display area, a second dam surrounding the first dam, a third dam between the display area and the first dam. The third dam including a first insulating layer and a second insulating layer on the first insulating layer, and a thin film encapsulation layer covering the display area, the thin film encapsulation layer including at least one inorganic encapsulation layer and at least one organic encapsulation layer. The third dam includes a first region in which the second insulating layer is spaced along a direction in which the first insulating layer extends, and a second region in which the second insulating layer is continuously present along the direction in which the first insulating layer extends, the second region not overlapping the first region.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Juhee Lee, Jongwoo Park, Youngtae Choi, Daeyoun Cho
  • Patent number: 10777723
    Abstract: The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, a method for manufacturing an LED package structure, and a method for manufacturing a heat-dissipating substrate. The method for manufacturing the heat-dissipating substrate includes: providing a metal plate having a top surface and a bottom surface; implementing an etching process on the metal plate so as to form a first heat-dissipating block, a second heat-dissipating block, and a heat-dissipating plate spaced apart from each other; and filling an insulating material between the heat-dissipating plate and the first heat-dissipating block and between the heat-dissipating plate and the second heat-dissipating block so as to electrically isolate the heat-dissipating plate, the first heat-dissipating block, and the second heat-dissipating block from each other.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: September 15, 2020
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventor: Chen-Hsiu Lin
  • Patent number: 10757824
    Abstract: An electronic device includes a first electronic module including a first electronic unit and a second electronic unit. The first electronic unit includes a plurality of first electronic elements arranged in a plurality of rows, wherein a top row of the plurality of first electronic elements defines a first base line. The second electronic unit includes a plurality of second electronic elements arranged in a plurality of rows, wherein a top row of the plurality of second electronic elements defines a second base line. A shifting distance S between the first base line and the second base line satisfies 0<S?(P1+P2)/4, wherein P1 is defined by two adjacent first electronic elements located in the top row and its adjacent row, and P2 is defined by two adjacent second electronic elements located in the top row and its adjacent row.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: August 25, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Jui-Jen Yueh, Kuan-Feng Lee
  • Patent number: 10756125
    Abstract: A method for bending a GOA region of a flexible display panel is disclosed. The flexible display panel includes a substrate with an edge having a GOA bendable region. The method includes: an inflating assembly adheres to the GOA bendable region and a serving motor drives the inflating assembly to rotate and bend the GOA bendable region to the back surface of the substrate; and the inflating assembly inflates to press the GOA bendable region against the back surface of the substrate. A flexible display panel using the abovementioned method is also disclosed.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: August 25, 2020
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Guoqiang Jiang
  • Patent number: 10747080
    Abstract: An active device array substrate includes: a substrate, a switch device, an inter-layer dielectric layer, an insulation bump, a conductive layer, and a pixel electrode. The switch device is located on the substrate. The inter-layer dielectric layer is located on the switch device, and the inter-layer dielectric layer has at least one opening, where the opening does not cover at least one part of a drain electrode of the switch device. The insulation bump covers at least partially the opening. The conductive layer is located on a top surface and a side wall of the insulation bump, and is electrically connected to the drain electrode of the switch device through the opening. The pixel electrode is electrically connected to the conductive layer.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: August 18, 2020
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Chang-Hung Li, Hsien-Hung Su, Ming-Hsien Lee
  • Patent number: 10718497
    Abstract: An electronic product with a light emitting function is provided. The electronic product includes a supporting structure, a light emitting structure and a cavity. The light emitting structure is bonded on the supporting structure. The light emitting structure includes a film, a conductive circuit and a light emitting device. The conductive circuit is formed on the film. The conductive circuit is enclosed between the supporting structure and the film. The light emitting device is disposed on the conductive circuit. The cavity is formed between the supporting structure and the light emitting structure, and the light emitting device is received in the cavity.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: July 21, 2020
    Assignees: LITE-ON ELECTRONICS (GUANZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yi-Feng Pu, Tzu-Shu Lin
  • Patent number: 10693042
    Abstract: A light-emitting device and a display device using the same. The light-emitting device improves the reliability of a process of disposing light-emitting devices. The light-emitting device is configured to ensure electrical connections even if the light-emitting device is inverted while being disposed on a substrate. The light-emitting device includes an n-type semiconductor layer and a p-type semiconductor layer. N-type electrodes and p-type electrodes are disposed on both sides of top and bottom surfaces of the light-emitting device. Contact holes are provided to electrically connect one of the n-type electrodes to the n-type semiconductor layer and one of the p-type electrodes to the p-type semiconductor layer. When the light-emitting device is inverted while being disposed on a substrate, the light-emitting device operates ordinarily, thereby reducing the defect rate of a display device.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: June 23, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Taeil Jung, Il-Soo Kim, YongSeok Kwak
  • Patent number: 10658543
    Abstract: Provided is a semiconductor optical device with light extraction efficiency or light collecting efficiency higher than that of conventional devices and with a reduced peeling ratio of a wiring electrode portion, and a method of manufacturing the same. In the semiconductor optical, a wiring electrode portion 120 is provided on a surface of a semiconductor layer 110 that serves as a light emitting surface or a light receiving surface, the line width W1 of the wiring electrode portion 120 is 2 ?m or more and 5 ?m or less, the wiring electrode portion 120 has a metal layer 121 on the semiconductor layer 110 and a conductive hard film 122 on the metal layer 121, and the conductive hard film 122 is harder than the metal layer 121.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: May 19, 2020
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventor: Norio Tasaki
  • Patent number: 10636946
    Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: April 28, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Patent number: 10615319
    Abstract: A light emitting device includes: a light-emitting element; a resin package including a plurality of leads including first and second leads, a first resin portion, a second resin portion extending around an element mounting region, and a third resin portion, wherein the plurality of leads and the first resin portion define a recess having an inner side-wall surface; a light-reflective member being located between the inner side-wall surface and the second resin portion inside the recess; and an encapsulant located in a region of the recess that is surrounded by the light-reflective member, the encapsulant covering the second resin portion and the light-emitting element. The second resin portion has a depression in a surface thereof. A part of the encapsulant is located inside the depression of the second resin portion.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: April 7, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Mitsuhiro Isono, Kensuke Maehara
  • Patent number: 10608141
    Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: March 31, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
  • Patent number: 10608139
    Abstract: A method of manufacturing a light-emitting element includes: forming a plurality of rod-shaped layered structures by performing steps including: forming a first conductive-type semiconductor layer on a substrate, forming, on the first conductive-type semiconductor layer, an insulating film defining a plurality of openings and a plurality of rods of a first conductive-type semiconductor, wherein each of the rods is disposed through a respective one of the plurality of openings, forming a light-emitting layer covering outer surfaces of the plurality of rods, and forming a second conductive-type semiconductor layer covering outer surfaces of the light-emitting layer; forming a photoresist pattern covering a portion of the plurality of the rod-shaped layered structures; removing a portion of the insulating film in a region that is not covered by the photoresist pattern; and removing a portion of the plurality of rod-shaped layered structures in the region that is not covered by the photoresist pattern.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: March 31, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Atsuo Michiue
  • Patent number: 10586828
    Abstract: A light emitting element of an embodiment may comprise: a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, and first and second electrodes placed on the first and second conductive semiconductor layers respectively, wherein the light emitting structure includes a first mesa region, the first conductive type semiconductor layer includes a second mesa region, and the first electrode includes: a first region which is a partial region of the upper surface of the second mesa region; a second region which is the side surface of the second mesa region; and a third region arranged to extend from the edge of the side surface of the second mesa region, wherein the first, second, and third regions are formed such that the thickness of the first region (d1), the second region (d2), and the third region (d3) have a ratio of d1:d2:d3=1:0.9˜1.1:1.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: March 10, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Su Hyoung Son, Keon Hwa Lee, Byeong Kyun Choi, Kwang Ki Choi
  • Patent number: 10585299
    Abstract: A method of thinning a display panel and a display device are provided, to solve the technical issue in the related art that a color filter substrate of an ultrathin display panel is of a lower strength if the color filter substrate is too thin. According to the method of thinning the display panel, the intermediate layer is coated onto the surface of the first substrate away from the second substrate, the protection adhesive is attached on the intermediate layer, and the second substrate is chemically thinned at one side thereof, thereby protecting the first substrate from being chemically thinned during the chemical thinning.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: March 10, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Qingyong Meng, Ji Jin
  • Patent number: 10586892
    Abstract: One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: March 10, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Hee Hong, Deok Ki Hwang, Hoe Jun Kim, Woo Sik Lim
  • Patent number: 10580929
    Abstract: A UV LED package and an LED module including the same. The UV LED package includes an upper semiconductor layer; a mesa disposed under the upper semiconductor layer, having an inclined side surface, and comprising an active layer and a lower semiconductor layer; a first insulation layer covering the mesa and having an opening exposing the upper semiconductor layer; a first contact layer contacting the upper semiconductor layer through the opening of the first insulation layer; a second contact layer formed between the mesa and the first insulation layer and contacting the lower semiconductor layer; a first electrode pad and a second electrode pad disposed under the first contact layer and electrically connected to the first contact layer and second contact layer, respectively; and a second insulation layer located between the first contact layer and the first and second electrode pads, wherein the active layer emits UV light having a wavelength of 405 nm or less.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: March 3, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventor: Seo Won Cheol
  • Patent number: 10580933
    Abstract: Disclosed herein is a highly reliable light emitting diode. In the light emitting diode, a connector connecting light emitting cells to each other is spaced apart from bump pads in a lateral direction so as not to overlap each other. Accordingly, it is possible to provide a chip-scale flip-chip type light emitting diode having good properties in terms of heat dissipation performance and electrical reliability.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: March 3, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Se Hee Oh, Jong Kyu Kim, Hyun A Kim
  • Patent number: 10573797
    Abstract: The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, and a method for manufacturing a heat-dissipating substrate. The heat-dissipating substrate includes a first heat-dissipating block, a heat-dissipating plate and a second heat-dissipating block, spaced apart each other, and a lateral insulating member connected to thereof so as to electrically isolate the first heat-dissipating block, the second heat-dissipating block, and the heat-dissipating plate from each other. The first heat-dissipating block, the second heat-dissipating block, and the heat-dissipating plate each has two protrusions respectively formed on two opposite surfaces thereof. A height of each of the protrusions is at a micro level.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: February 25, 2020
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventor: Chen-Hsiu Lin
  • Patent number: 10561029
    Abstract: An electronic device includes a first electronic module, a second electronic module, and a shifting distance S. The first electronic module includes first electronic units arranged in rows, wherein the top row of first electronic units defines the first base line. The second electronic module is adjacent to the first electronic module. The second electronic module includes second electronic units arranged in rows, wherein the top row of second electronic units defines a second base line. There is a shifting distance S between the first base line and the second base line. The shifting distance S satisfies 0<S?(P1+P2)/4, wherein P1 is defined by two adjacent first electronic units located in the top row and its adjacent row, and P2 is defined by two adjacent second electronic units located in the top row and its adjacent row.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: February 11, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Jui-Jen Yueh, Kuan-Feng Lee
  • Patent number: 10553770
    Abstract: A light emitting device includes a light emitting element and a mounting substrate on which the light emitting element is mounted such that the mounting substrate faces an upper side of the light emitting element. The light emitting element includes a substrate, first and second light emitting cells each including a semiconductor layered structure that includes an n-side semiconductor layer and a p-side semiconductor layer in order from a substrate side, a first insulating layer, wiring electrodes, and a second insulating layer. One of the wiring electrodes is electrically connected to the n-side semiconductor layer of the first light emitting cell and to the p-side semiconductor layer of the second light emitting cell. The mounting substrate includes wiring terminals, one of which is electrically connected to the n-side semiconductor layer of the first light emitting cell and to the p-side semiconductor layer of the second light emitting cell.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: February 4, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Keiji Emura
  • Patent number: 10522588
    Abstract: An optoelectronic device comprises a substrate; a first optoelectronic unit formed on the substrate; a second optoelectronic unit formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another one
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: December 31, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
  • Patent number: 10503080
    Abstract: Provided is a 3D micro lithography-printing system using tilting and rotational UV-LEDs, in which a lithography module provided with LED lens for irradiating ultraviolet light for lithography is provided rotatable or revolvable in a left and right horizontal direction, and a substrate stage with a lithography object mounted thereto is provided movable forward and backward, changeable in forward and backward angles, and horizontally rotatable left and right, and thus, by changing the irradiation direction of ultraviolet light in a three-dimensional manner, a high-aspect ratio pillar and a 3D structure can be formed. In addition, various types of 3D structure can also be formed through a multi-layer lithography to a lithography object, and micro-forming within a range of approximately 5 ?m is also possible.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: December 10, 2019
    Assignees: SAMIL TECH CO., LTD., KANSAS STATE UNIVERSITY RESEARCH FOUNDATION
    Inventors: Jong Eun Kim, Jungkwun Kim
  • Patent number: 10497843
    Abstract: A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. An outer surface of the covering member defines a recess. The metal layer is connected to the pair of electrodes. The metal layer is arranged in the recess.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: December 3, 2019
    Assignee: NICHIA CORPORATION
    Inventor: Hiroki Yuu
  • Patent number: 10483479
    Abstract: A first light emitting unit includes a hole injection layer, a first hole transport layer, and a first light emitting layer. A second light emitting unit includes a hole injection layer, a second hole transport layer, a third hole transport layer, a third hole transport layer, and a second light emitting layer. The second hole transport layer is formed on the hole injection layer and includes a first hole transporting material. The third hole transport layer is formed on the second hole transport layer and includes a second hole transporting material. A fourth hole transport layer is formed on the third hole transport layer and includes the same material as the second hole transport layer, that is, the second hole transporting material. The third hole transport layer is formed by using a coating method, and the fourth hole transport layer is formed by a vapor deposition method.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: November 19, 2019
    Assignee: PIONEER CORPORATION
    Inventor: Akihiro Tanaka
  • Patent number: 10475850
    Abstract: A display device includes a substrate, and a first light-emitting diode element disposed over the substrate and having a first light-emitting path. The display device further includes a light-emitting angle changing layer disposed over the first light-emitting diode element. The display device further includes a second light-emitting diode element disposed over the substrate. The second light-emitting diode element is disposed at a position other than the region corresponding to the first light-emitting path. The first light-emitting diode element has a first light-emitting angle, the second light-emitting diode element has a second light-emitting angle, and the second light-emitting angle is greater than the first light-emitting angle.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: November 12, 2019
    Assignee: ACER INCORPORATED
    Inventors: Jui-Chieh Hsiang, Chih-Chiang Chen
  • Patent number: 10403796
    Abstract: A light emitting device and a method of fabricating the same. The light emitting device includes: a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, an active layer, and a partially exposed region of an upper surface of the first conductive type semiconductor layer; a transparent electrode disposed on the second conductive type semiconductor layer; a first insulation layer including a first opening and a second opening; a metal layer at least partially covering the first insulation layer; a first electrode electrically connected to the first conductive type semiconductor layer; and a second electrode electrically connected to the transparent electrode.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: September 3, 2019
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Chang Yeon Kim, Ju Yong Park, Sung Su Son
  • Patent number: 10403790
    Abstract: A semiconductor light-emitting device includes a light-emitting member that includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light-emitting layer between the first semiconductor layer and the second semiconductor layer, a first metal layer electrically connected to the first semiconductor layer, and a second metal layer electrically connected to the second semiconductor layer. The light-emitting member has a first surface including a front surface of the first semiconductor layer, a second surface including a front surface of the second semiconductor layer, a side surface including an outer periphery of the first semiconductor layer, and a recess extending inwardly of the second surface to an interior portion of the first semiconductor layer to expose an inner surface on a side of the recess facing the side surface.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: September 3, 2019
    Assignee: ALPAD CORPORATION
    Inventors: Hiroshi Katsuno, Masakazu Sawano, Kazuyuki Miyabe