Abstract: A display panel and a display apparatus are provided. The display panel includes a substrate, binding pins provided at a side of the substrate, and insulating layers. The substrate has a display region and a binding region that are arranged along a first direction. The binding pins are arranged along a second direction and are located in the binding region of the substrate. The insulating layers and the binding pins are arranged on a same side of the substrate. At least one insulating layer includes at least one first aperture provided at a side of the binding region away from the display region. An orthographic projection of the first aperture on the substrate overlaps with an orthographic projection of the binding pin on the substrate in the first direction.

Abstract: Color conversion layers, methods of making color conversion layers, monolithic color, micro-light-emitting diode displays and methods of making monolithic, color, micro-light-emitting diode displays are disclosed.

Abstract: An array substrate is provided. The array substrate includes a plurality of light emitting elements and a plurality of pixel driving circuits configured to drive light emission in the plurality of light emitting elements. In a first region, transistors of multiple pixel driving circuits of the plurality of pixel driving circuits are present, and the plurality of light emitting elements are absent. In a second region, multiple light emitting elements of the plurality of light emitting elements are present, and transistors of the plurality of pixel driving circuits are absent.

Abstract: A display panel and a display apparatus are provided; the display panel is divided into a display region and a non-display region at least partially surrounding the display region; a fan-out region is provided in the non-display region; the display panel includes a substrate and a first power trace provided on the substrate; a first portion of the first power trace is provided in the fan-out region and configured to transmit a first power signal; and the first portion includes: a sheet-shaped trace proximal to an edge of the display panel, and a plurality of stripe-shaped traces spaced apart from one another and extending from the sheet-shaped trace toward the display region. According to the present disclosure, the first power trace in the fan-out region is configured to include the plurality of strip-shaped traces.

Abstract: A display substrate (1) and a display device, which can reduce the number of power lines (22), and improve the light transmittance of a first display sub-region (111).

Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.

Abstract: A display panel includes a substrate; an array layer on the substrate; a display layer located on a side of the array layer away from the substrate, where the display layer includes a plurality of light-emitting devices; an optical layer located on a side of the display layer away from the array layer, wherein the optical layer includes a first optical structure, and at least a portion of the first optical structure is arranged corresponding to intervals between the plurality of light-emitting devices; and a light-shielding member located on a side of the optical layer facing the substrate, where the light-shielding member includes a light pass area, and the light pass area and the first optical structure overlap each other.

Abstract: An ultra-high-resolution micro-display screen and a manufacturing process therefor. In the process, multiple LED light-emitting structures are formed by means of pre-arranging isolation columns and a conductive solder on a drive backplate, performing alignment-free pressing on the driving backplate (10) and an LED epitaxial wafer, and performing exposure and development on the LED epitaxial wafer. According to the method, accurate alignment does not need to be performed, and there are few pixel defects. LED units of a micro-display screen are embedded into the conductive solder, such that a high soldering adhesion is achieved, and the reliability and stability of the display screen can be improved.

Abstract: Provided is a display substrate, which includes a base substrate, a circuit structure layer disposed on the base substrate, multiple ultrasonic sensing elements and multiple micro light-emitting elements. The multiple ultrasonic sensing elements are disposed on a side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer, and the multiple light-emitting elements are disposed on the side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer. An orthographic projection of the multiple ultrasonic sensing elements on the base substrate does not overlap with an orthographic projection of the multiple micro light-emitting elements on the base substrate.

Abstract: The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, and d2?2 ?m and |d2?d3|?3 ?m.

Abstract: Proposed are a display substrate and a preparation method therefor, and a display apparatus. The display substrate includes a drive circuit layer disposed on a substrate and a light emitting structure layer disposed at a side of the drive circuit layer away from the substrate, the drive circuit layer includes a plurality of circuit units, the light emitting structure layer includes a plurality of light emitting devices; at least one circuit unit includes a first power supply line, an initial signal line including a first initial signal line extending in a first direction and a second initial signal line extending in a second direction, and a pixel drive circuit; the first direction intersects the second direction, and an orthographic projection of the second initial signal line on the substrate overlaps at least partially with an orthographic projection of the first power supply line on the substrate.

Abstract: A flexible display panel, a flexible display device and a method of forming the flexible display panel are provided. The flexible display panel includes: a substrate; thin film transistors arranged in an array on the substrate; an electroluminescent device arranged on the thin film transistors and driven by the thin film transistors, including a pixel defining layer and an electroluminescent material defined by the pixel defining layer; a thin film encapsulation layer on the electroluminescent device; a quantum dot photoconversion layer on the thin film encapsulation layer, including an isolation portion and a quantum dot luminescent material surrounded by the isolation portion, where an orthographic projection of the isolation portion onto the substrate covers an orthographic projection of the pixel defining layer onto the substrate; and a cover plate arranged on the quantum dot photoconversion layer.

Abstract: A display substrate and a display apparatus are provided, including a first side for displaying and a second side opposite the first side, a base substrate, a display area, at least one connection line and at least one transfer electrode. Each of the at least one connection line at least partially extends in a first direction and is connected to first power lines respectively connected to adjacent first pixel unit groups in a first display area in the first direction; and each of the at least one transfer electrode at least partially extends in the first direction and is connected to first signal lines that are respectively connected to the adjacent first pixel unit groups in the first display area in the first direction, film layers where at least part of the at least one transfer electrode and each of the at least one connection line are located are different.

Abstract: The light-emitting device includes a first light-emitting part including a first light-emitting element and a first light-transmissive member disposed over the first light-emitting element, a second light-emitting part including a second light-emitting element and a second light-transmissive member disposed over the second light-emitting element, a first light-shielding member disposed between a first lateral surface of the first light-transmissive member and a second lateral surface of the second light-transmissive member and containing a first additive, and a second light-shielding member disposed between a first element lateral surface of the first light-emitting element and a second element lateral surface of the second light-emitting element, holding the first light-emitting part and the second light-emitting part, and containing a second additive having a higher thermal conductivity than the first additive.

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Abstract: A backlight module includes a first substrate, a control circuit, a plurality of light source points, a filling layer, and a reflection structure. The control circuit is arranged on a first side of the first substrate. The plurality of light source points are arranged on a side of the control circuit away from the first substrate, include at least one type of LED, and are controlled by the control circuit to emit light to a side of the LED away from the first substrate. The filling layer covers the plurality of light source points and a gap between neighboring light source points. The reflection structure is arranged on a side of the filling layer away from the plurality of light source points and configured to reflect the light emitted by the plurality of light source points.

Abstract: A displaying apparatus includes a pixel unit. The pixel unit includes at least one pixel having a light emitting device and a light conversion layer for converting a first wavelength of light of the light emitting device into a second wavelength of light different from the first wavelength; and an insulation layer covers side surfaces of the light emitting device and the light conversion layer.

Abstract: A display panel and a method of manufacturing the same are provided. In the display panel, a second inorganic film is additionally provided and disposed between the first inorganic film and the organic film, and a gap is formed between the second inorganic film and the bank, so that the surface roughness between the organic film and each of the first inorganic film and the second inorganic film is increased, and binding forces between the adjacent films are increased to prevent the display panel from encountering a film peeling phenomenon in a curling or bending process and increase the yield.

Abstract: A display panel includes a display region with a thin film transistor and a plurality of data lines and a non-display region. Thin film transistor includes a gate, a source region and a drain region, data lines include a plurality of first type data lines which are located at an edge of display region and close to a side of non-display region. First type data line includes a first sub-data line extending in a first direction, a conductive connection line extending in a second direction and a second sub-data line extending in a first direction. First sub-data line is connected with source region or drain region. A first insulating layer is between conductive connection line and first sub-data line. A second insulating layer is between second sub-data line and conductive connection line, and second sub-data line is closer to a central axis of display panel than first sub-data line.

Abstract: The invention relates to a light source display, comprising a plurality of light-emitting elements (LEEs), such as for example LEDs, being arranged on a horizontal and vertical grid resulting in an array or a matrix of LEEs or LEDs forming a LEE or LED board. More particularly, the invention relates to a display with a drive circuit configuration comprising at least two drive circuits, wherein at least one of the LEEs or LEDs driven by a first driver of a first drive circuit is residing physically with a second drive circuit. Herewith, improved visual performance of the display can be achieved, as well as improved interplay of the display with a camera recording an image from the display, or else the display can be enhanced for 3D application.

Abstract: Provided are a display substrate, a display device, and a method for manufacturing the display substrate. The display substrate includes: a first inorganic encapsulation layer covering pixels of an island region and covering a signal line of a bridge region, a first organic encapsulation layer covering the first inorganic encapsulation layer, and multiple insulating layers located in the bridge region and between the first inorganic encapsulation layer and a substrate.

Abstract: A counter substrate is provided. The counter substrate includes a bank layer on a base substrate and defining a plurality of bank apertures; a quantum dots material layer on the base substrate, the quantum dots material layer including a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures; and a support layer on a side of the quantum dots material layer and the bank layer away from the base substrate. The support layer includes one or more support portions, orthographic projections of which on the base substrate adjacent to a periphery of an orthographic projection of a respective one of the plurality of bank apertures on the base substrate. An orthographic projection of the bank layer on the base substrate at least partially overlaps with an orthographic projection of the support layer on the base substrate.

Abstract: A headlamp device includes a headlamp, an object detector, and a controller. The headlamp is mounted on a vehicle and includes a light emitting unit composed of multiple light emitting cells. The object detector detects an object around the vehicle and generates an object detection signal including object coordinates corresponding to a location of the detected object. The controller controls light of the headlamp based on information on the object coordinates. The controller may control the light emitting unit such that at least some light emitting cells are turned off according to an object detection signal.

Abstract: A light emitting diode, LED, filament (100) arranged to emit LED filament light is provided. The LED filament comprises a LED filament (110), elongating along an axis, A, comprising array(s) (120) of a plurality of LEDs (130) arranged to emit LED light (140), and an encapsulant (150) enclosing the array(s) of the LEDs, wherein the encapsulant comprises a light-transmissive material. The LED filament further comprises an elongated reflector (160) having a first reflectivity, R1, arranged to reflect the LED light, wherein the reflector, by partially enclosing a cross-section, CB, perpendicular to the axis, A, of the LED filament in a radial direction, R, partially encloses the encapsulant along the LED filament, whereby the reflector defines at least one opening (180) along the LED filament, wherein the encapsulant is not covered by the reflector along the at least one opening.

Abstract: A light emitting device may include at least one first electrode and at least one second electrode disposed on different layers on a substrate; a first insulating layer disposed between the first electrode and the second electrode; and at least one light emitting diode electrically connected between the at least one first electrode and the second electrode.

Abstract: The disclosure relates to vacuum forming methods, apparatuses and resulting displays that represent improvements in various key areas. The methods, for example, greatly improve manufacturing throughput through reduced curing times. The methods further facilitate improved control of glass shape to a targeted shape and improved control of bond line thickness, which result in improved survivability and long-term reliability, for example.

Abstract: A light emitting display device comprises a substrate having subpixel areas, a plurality of first electrodes, each of the first electrodes in a corresponding one of the subpixel areas, a bank covering an edge portion of each of the first electrodes, the bank, a disconnection portion disposed at boundary areas between the subpixel areas, an undercut area in the disconnection portion, the undercut area formed under an end of the bank that extends past an end of a first electrode from the plurality of first electrodes, a light emitting element layer including a first portion and a second portion, the first portion disposed on the first electrode, the bank, and electrically connected to the first electrode, and the second portion disposed in the disconnection portion but is not electrically connected to the first electrode, and a second electrode on the light emitting element layer.

Abstract: A display device includes a planarization layer on a substrate, a plurality of inner banks and a plurality of outer banks arranged on the planarization layer and extending in one direction, a first alignment electrode and a second alignment electrode on the plurality of inner banks and spaced from each other, a light emitting element on the first alignment electrode and the second alignment electrode and located between the first alignment electrode and the second alignment electrode, and a first contact electrode on the first alignment electrode and contacting a first end of the light emitting element, and a second contact electrode on the second alignment electrode and contacting a second end of the light emitting element. The plurality of outer banks are in contact with the plurality of inner banks at the same layer, and are spaced from each other with the plurality of inner banks interposed therebetween.

Abstract: A micro LED and a manufacturing method thereof are provided. The micro LED includes a first semiconductor layer, an active layer, and a second semiconductor layer that are successively stacked together. The first semiconductor layer and the second semiconductor layer are of different types. The active layer includes a first quantum well layer and a second quantum well layer stacked together. The second quantum well layer and the second semiconductor layer form a nanoring. The first quantum well layer is configured to emit light of a first color. The second quantum well layer forming a sidewall of the nanoring is configured to emit light of a second color different from the first color. The first semiconductor layer is electrically coupled to a first electrode, and the second semiconductor layer is electrically coupled to a second electrode. A manufacturing method for a micro LED is provided.

Abstract: An array substrate, a manufacturing method thereof, and a display panel are provided. The array substrate includes a base substrate, an array layer disposed on the base substrate, a light-emitting device layer disposed on the array layer, and an encapsulation layer covering the light-emitting device layer. The base substrate includes a first portion defined in a main display region and a second portion defined in a functional region, the second portion includes a first surface close to the array layer, and the first surface includes a first convex surface protruding in a direction toward to the array layer.

Abstract: A wavelength conversion component includes a plurality of semiconductor multilayer film segments, a first member arranged between adjacent ones of the semiconductor multilayer film segments, and a substrate disposed above the plurality of semiconductor multilayer film segments, the substrate defining a groove.

Abstract: Provided is a display device including a first dam surrounding the display area, a second dam surrounding the first dam, a first sensor electrode and a second sensor electrode overlapping the display area, a first sensor wiring and a second sensor wiring over the first dam and electrically connected to the first sensor electrode and the second sensor electrode, respectively, a first wiring under the second dam and electrically connected to the first sensor wiring at a first contact portion, and a second wiring under the second dam and electrically connected to the second sensor wiring at a second contact portion.

Abstract: A lighting board (10), comprising: a printed circuit board (12); a set of solid state lighting elements mounted on the printed circuit board, each having a light emitting surface; a set of electrical components (16) mounted on the printed circuit board; and a reflective covering over the printed circuit board, wherein the reflective covering is provided over the set of electrical components and over the set of lighting elements, and comprises openings at least for the light emitting surfaces of the lighting elements.

Abstract: A light emitting device including first, second, and third light emitting parts disposed near each other and each including a first-type semiconductor layer, a first active layer, and a second-type semiconductor layer, a first pad electrically coupled with the second-type semiconductor layer of the first light emitting part, a second pad electrically coupled with the second-type semiconductor layer of the second light emitting part, a third pad electrically coupled with the second-type semiconductor layer of the third light emitting part, and a common pad electrically coupled with the first-type semiconductor layer of the first, second, and third light emitting parts, in which, in a current density per light emitting part of about 20 A/cm2, one of the first, second, and third light emitting parts that is configured to emit light having the longest peak wavelength has a largest normalized external quantum efficiency.

Abstract: According to one embodiment, a manufacturing method of a semiconductor device is provided. The manufacturing method includes removing a portion of an edge region from a front surface of a first substrate to form a notch in the edge region; bonding the front surface of the first substrate and a front surface of a second substrate together to forma stacked substrate, wherein the stack substrate includes an opening at a position corresponding to the notch; and filling the opening with an embedding member.

Abstract: A circuit board includes a base layer, a seed layer formed on the base layer, and a first electrode layer formed on the seed layer. The seed layer is formed of a metal oxide with a thickness of 100 to 400 ?. The circuit board may further include an insulation layer formed on the first electrode layer and a second electrode layer formed on the insulation layer.

Abstract: An active matrix substrate includes a gate driver including a shift register including a plurality of unit circuits connected in multiple stages. Each of the plurality of unit circuits includes an output node, a first node, a first TFT including a first gate terminal supplied with the set signal, a first source terminal connected to the first node, and a first drain terminal supplied with a first power supply potential higher than a low-level potential of the set signal, and a second TFT including a second gate terminal connected to the first node, a second source terminal connected to the output node, and a second drain terminal supplied with the clock signal. The first TFT includes a semiconductor layer, and a first and a second gate electrodes disposed on a side of the semiconductor layer opposite to the substrate and connected to the first gate terminal.

Abstract: A display panel and a display device are provided. The display panel includes a substrate an array layer on the substrate; a display layer located on a side of the array layer away from the substrate, wherein the display layer includes a plurality of light-emitting devices; an optical layer located on a side of the display layer away from the array layer, wherein the optical layer includes a first optical structure, and the first optical structure is arranged corresponding to intervals between the plurality of light-emitting devices; and a first light-shielding member located on a side of the optical layer facing the substrate, wherein the first light-shielding member forms a light pass opening, and the light pass opening and the first optical structure overlap each other.

Abstract: Provided is a display device including a substrate including a display area including a plurality of pixel areas, and a non-display area outside the display area, a pixel circuit layer including a plurality of circuit elements in the display area, a display element layer including a plurality of light-emitting elements in the display area on the pixel circuit layer, and first and second alignment lines on the substrate, and each including a main line at the same layer as at least one electrode on the display element layer, and a sub line electrically connected to the main line and at the same layer as at least one electrode on the pixel circuit layer, wherein the first alignment line and the second alignment line do not include the main line in the non-display area, and include the sub line to be spaced apart from one edge of the substrate.

Abstract: A light emitting module includes a board, light sources, first and second wirings, and an insulating member. Each of the light sources includes first and second electrodes exposed from an upper side. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The insulating member covers the first wiring and the second extending portions of the second wiring while a portion of each of the second extending portions of the second wiring is exposed from the insulating member through a corresponding one of the openings. The second connecting portions of the second wiring are arranged on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring. The second connecting portions of the second wiring are respectively connected to the second extending portions at the openings.

Abstract: A light emitting module and a driving method thereof, and a displaying device. The light emitting module includes: a light emitting base plate, wherein the light emitting base plate includes M rows and N columns of light emitting regions, and each of the light emitting regions includes a plurality of light emitting devices that are connected in series; and a driving assembly, wherein the driving assembly includes one or more driving chips, each of the driving chips includes a plurality of first leads and a plurality of second leads, each of the first leads is connected to the first terminal of a corresponding one instance of the light emitting regions, and each of the second leads is connected to the second terminal of a corresponding one instance of the light emitting regions; wherein a total quantity of the second leads in the driving assembly is integer multiples of N.

Abstract: The present invention relates to a nano-scale light emitting diode (LED) electrode assembly emitting polarized light, a method of manufacturing the same, and a polarized LED lamp having the same, and more particularly, to a nano-scale LED electrode assembly in which partially polarized light close to light that is linearly polarized having one direction is emitted as an emitted light when applying a driving voltage to the nano-scale LED electrode assembly and also nano-scale LED devices are connected to a nano-scale electrode without defects such as an electrical short circuit while maximizing a light extraction efficiency, a method of manufacturing the same, and a polarized LED lamp having the same.

Abstract: A displaying apparatus includes a pixel unit. The pixel unit includes at least one pixel having a light emitting device and a light conversion layer for converting a first wavelength of light of the light emitting device into a second wavelength of light different from the first wavelength; and an insulation layer covers side surfaces of the light emitting device and the light conversion layer.

Abstract: A light emitting element includes: a semiconductor layered structure; a first electrically insulating film covering surfaces of the semiconductor layered structure and defining a first opening in each of a first region and a second region of a first semiconductor layer, and defining a second opening in a portion above a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer through each first opening; a second electrode electrically connected to the second semiconductor layer through the second opening; a first terminal located on the first electrode and electrically connected to the first electrode; a second terminal located on the second electrode and electrically connected to the second electrode; and a metal member located on a portion of the first electrically insulating film located over the second semiconductor layer and electrically insulated from the first terminal and the second terminal.

Abstract: A display device includes a display panel including: a display area at which an image is displayed and a bezel area which is adjacent to the display area, and a pixel including a pixel circuit and a light emitting layer, the pixel circuit defining a stacked structure; a window; and a pattern film between the display panel and the window, the pattern film including: a first film including a first area and a second area which respectively correspond to the display area and the bezel area of the display panel, and a pattern layer on the second film in the second area thereof. The pattern layer of the pattern film includes a same stacked structure as the stacked structure defined by the pixel circuit of the display panel.

Abstract: An apparatus comprising a substrate, one or more nanowire pillars, each having a base portion and a tip portion, a first electrode connected to the tip portions of the one or more nanowire pillars, an internal hollow cavity positioned between the substrate and the first electrode, such that at least a portion of each of the one or more nanowire pillars extend through the internal hollow cavity, and a second electrode proximate the first side of the substrate. High-performance broadband photodetectors and other optoelectronics for converting light to electricity with enhanced absorption and carrier collection.

Abstract: Provided are a micro light emitting diodes and a method of transferring the same. The method includes providing an array substrate with the micro light emitting diodes; adhering abnormal micro light emitting diodes of the array substrate on a first carrying plate; adhering the abnormal micro light emitting diodes on the first carrying plate to a laser deformation glue layer of a second carrying plate; irradiating the laser deformation glue layer by a laser to flip the abnormal micro light emitting diodes; transferring the abnormal micro light emitting diodes from the second carrying plate to a third carrying plate; and transferring again to the array substrate.

Abstract: A method of manufacturing a light-emitting module according includes providing an intermediate structure, the intermediate structure including a board, and a plurality of light sources, and forming first and second wirings on an upper surface of the intermediate structure. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The forming of the first and second wirings includes forming the first extending portions and the first connecting portions and the second extending portions, forming an insulating member covering at least the first connecting portions while at least a portion of each of the second extending portions is exposed from the insulating member, and forming the second connecting portions on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring.

Abstract: Provided is a display device including a substrate including a display area including a plurality of pixel areas, and a non-display area outside the display area, a pixel circuit layer including a plurality of circuit elements in the display area, a display element layer including a plurality of light-emitting elements in the display area on the pixel circuit layer, and first and second alignment lines on the substrate, and each including a main line at the same layer as at least one electrode on the display element layer, and a sub line electrically connected to the main line and at the same layer as at least one electrode on the pixel circuit layer, wherein the first alignment line and the second alignment line do not include the main line in the non-display area, and include the sub line to be spaced apart from one edge of the substrate.

Abstract: A liquid crystal device as an electro-optical device includes, an insulating layer including a first recess and a second recess that is provided continuously with the first recess and is deeper than the first recess, and a capacitance element including, a first capacitance electrode provided along a bottom surface of the second recess and a side wall of the second recess and provided along a bottom surface of the first recess, a capacitance insulating layer stacked on the first capacitance electrode, and a second capacitance electrode stacked on the capacitance insulating layer, wherein an upper surface of the second capacitance electrode at a position overlapping with the second recess, an upper surface of the first capacitance electrode at a position overlapping with the first recess, and a part of the capacitance insulating layer, are provided on the same surface as an upper surface of the insulating layer.