Abstract: In one general aspect, a semiconductor structure can include a power transistor including a body region extending in a silicon region, a gate electrode insulated from the body region by a gate dielectric, a source region extending in the body region where the source region is of opposite conductivity type from the body region, a source interconnect contacting the source region, and a backside drain. The semiconductor structure can include an RC snubber monolithically integrated with the power transistor in a die. The RC snubber can include a snubber electrode insulated from the silicon region by a snubber dielectric such that the snubber electrode and the silicon region form a snubber capacitor.

Abstract: An electronic device comprising a semiconductor structure having an integrated circuit back end capacitor and an integrated circuit back end thin film resistor and a method of manufacturing the same is provided. The semiconductor structure comprises a first dielectric layer, a bottom plate of the capacitor and a thin film resistor body. Furthermore, there is a second dielectric layer which is disposed on the bottom plate of the capacitor and on top of the thin film resistor body. A top plate of the capacitor is disposed on the second dielectric layer in a region of the second dielectric layer which is defined by the lateral dimensions of the bottom plate of the capacitor. The bottom plate and the resistor body are laterally spaced apart layers which are both disposed on the first dielectric layer and which are composed of a same thin film material.

Abstract: Passive devices such as resistors and capacitors are provided for a 3D non-volatile memory device. In a peripheral area of a substrate, a passive device includes alternating layers of a dielectric such as oxide and a conductive material such as heavily doped polysilicon or metal silicide in a stack. The substrate includes one or more lower metal layers connected to circuitry. One or more upper metal layers are provided above the stack. Contact structures extend from the layers of conductive material to portions of the one or more upper metal layers so that the layers of conductive material are connected to one another in parallel, for a capacitor, or serially, for a resistor, by the contact structures and the at least one upper metal layer. Additional contact structures can connect the circuitry to the one or more upper metal layers.

Abstract: A capacitor structure includes a conductive region; a first dielectric layer over the conductive region; a conductive material within the first dielectric layer, wherein the conductive material is on the conductive region and forms a first plate electrode of the capacitor structure; an insulating layer within the first dielectric layer and surrounding the conductive material; a first conductive layer within the first dielectric layer and surrounding the insulating layer, wherein the first conductive layer forms a second plate electrode of the capacitor structure; a second conductive layer laterally extending from the first conductive layer at a top surface of the first dielectric layer; a second dielectric layer over the first dielectric layer; and a third conductive layer within the second dielectric layer and on the conductive material.

Abstract: A semiconductor display device with an interlayer insulating film in which surface levelness is ensured with a limited film formation time, heat treatment for removing moisture does not take long, and moisture in the interlayer insulating film is prevented from escaping into a film or electrode adjacent to the interlayer insulating film. A TFT is formed and then a nitrogen-containing inorganic insulating film that transmits less moisture compared to organic resin film is formed so as to cover the TFT. Next, organic resin including photosensitive acrylic resin is applied and an opening is formed by partially exposing the organic resin film to light. The organic resin film where the opening is formed, is then covered with a nitrogen-containing inorganic insulating film which transmits less moisture than organic resin film does.

Abstract: Apparatus and a method are provided for reducing noise in mixed-signal and digital circuits. One apparatus (200) includes a metal-oxide-semiconductor field-effect transistor (MOSFET) (210). MOSFET (210) includes a doped substrate (2210) with a source formed proximate a substrate tie (2224) and a substrate tie (2250) adjacent substrate (2210). A ground rail (255) is coupled to the source and substrate tie (2224), and a ground rail (285) is coupled to substrate tie (2250). Ground rails (255) and (285) are configured to be coupled to different ground networks (250 and 280). One method includes producing a model of a semiconductor device including a standard semiconductor cell (710). The semiconductor cell is identified as a noise-sensitive or a noise-producing semiconductor cell (720), and the semiconductor cell is replaced with a corresponding noise-aware semiconductor cell (730).

Abstract: A semiconductor integrated circuit that includes a circuit element with a reduced parasitic capacitance and has a short start-up time. A well of the different type of conduction from that of the substrate is formed in the area of the surface of the semiconductor substrate under the circuit element. A constant voltage, which biases the junction between the well and the semiconductor substrate in a reverse direction, is applied to the well through a resistor having a higher impedance compared with the impedance of the capacitance of the reverse-biased junction between the well and the substrate at the frequency of the signal applied to the circuit element.

Abstract: A semiconductor package features a ring-shaped silicon decoupling capacitor that reduces simultaneous switching noise. The decoupling capacitor is fabricated on a substrate from silicon using a wafer fabrication process and takes the form of an annular capacitive structure that extends around a periphery of a substrate-mounted integrated circuit (IC). The decoupling capacitor has a reduced thickness on or below a chip level and takes the place of a conventional power/ground ring. Therefore, the decoupling capacitor can be disposed within the package without increasing the thickness and the size of the package. The decoupling capacitor may be coupled to various power pins, allowing optimum wire bonding, shortened electrical connections, and reduced inductance. Bonding wires connected to the decoupling capacitor have higher specific resistance, lowering the peak of the resonance frequency and thereby reducing simultaneous switching noise.

Abstract: An integrated circuit (IC) includes power supply interconnects that couple to a power source. The integrated circuit includes electronic devices that perform desired functions and further includes decoupling capacitor circuits that provide noise reduction throughout the integrated circuit. In one embodiment, each decoupling capacitor circuit includes a decoupling capacitor and a switching circuit. The switching circuit connects the decoupling capacitor to the power supply interconnects during a connect mode when the switching circuit detects no substantial decoupling capacitor leakage. However, the switching circuit effectively disconnects the decoupling capacitor from the power supply interconnects during a disconnect mode when the switching circuit detects substantial decoupling capacitor leakage. The decoupling capacitor circuit self-initializes in the connect mode without external control signals and is thus self-contained.

Abstract: Generally provided is a circuit assembly construction for controlling impedance in an electronic package. A large scale, parallel-plate capacitor includes two electrodes separated by a dielectric material. The electrodes serve as reference voltage planes for the electronic package. At least one of the electrodes is patterned such that both electrodes are accessible from a common side of the capacitor. The capacitor is positioned with a first electrode mounted adjacent to an interconnect circuit portion of the electronic package. An electronic device portion of the electronic package is electrically connected, directly or indirectly, to one or more of the electrodes of the capacitor.

Abstract: An apparatus comprises a first plurality of contacts disposed on a first side of the apparatus, adapted to engage with a first corresponding plurality of contacts on an external integrated circuit package. The apparatus further comprises a plurality of capacitive storage structures selectively coupled to the first plurality of contacts, one or more traces, and a second plurality of contacts disposed on the first side. The second plurality of contacts are adapted to engage with a second corresponding plurality of contacts on the external integrated circuit package, wherein at least two of the second plurality of contacts are adapted to be coupled to at least a first trace of the one or more traces to form a first resistive structure.

Abstract: In one disclosed embodiment a layer is formed over a transistor gate and a field oxide region. For example, a polycrystalline silicon layer can be deposited over a PFET gate oxide and a silicon dioxide isolation region on the same chip. The layer is then doped over the transistor gate without doping the layer over the field oxide. A photoresist layer can be used as a barrier to implant doping, for example, to block N+ doping over the field oxide region. The entire layer is then doped, for example, with P type dopant after removal of the doping barrier. The second doping results in formation of a high resistivity resistor over the field oxide region, without affecting the transistor gate. Contact regions are then formed of a silicide, for example, for connecting the resistor to other devices.

Abstract: This invention discloses a method for calibrating a gate resistance measurement of a semiconductor power device that includes a step of forming a RC network on a test area on a semiconductor wafer adjacent to a plurality of semiconductor power chips and measuring a resistance and a capacitance of the RC network to prepare for carrying out a wafer-level measurement calibration of the semiconductor power device. The method further includes a step of connecting a probe card to a set of contact pads on the semiconductor wafer for carrying out the wafer-level measurement calibration followed by performing a gate resistance Rg measurement for the semiconductor power chips.

Abstract: An integrated circuit and fabrication method are presented. The integrated circuit includes a capacitor containing a base electrode, a covering electrode, and a dielectric between the base and covering electrodes. The dielectric contains an oxide of a material contained in the base electrode, which may be produced by anodic oxidation. A peripheral edge of the dielectric is uncovered by the covering electrode. A base layer on the capacitor includes a cutout adjacent to the dielectric. During fabrication, the base layer protects the material of the base electrode that is to be anodically oxidized from chemicals, and also protects the surrounding regions from anodic oxidation. A precision resistor may be fabricated simultaneously with the capacitor.

Abstract: A decoupling capacitor includes a fixed resistance in series with the capacitor, the resistance formed by contacts connecting a polysilicon layer to metal and a diffusion layer to metal; the contacts being of location and quantity sufficient for limiting defect current while allowing the capacitor to function at high frequency. N pairs of contacts in at least two sets of contacts are separated by a distance K sufficient to achieve a leakage limiting resistance of R and a bandwidth limiting resistance of R/2.

Abstract: A semiconductor integrated circuit that includes a circuit element with a reduced parasitic capacitance and has a short start-up time. A well of the different type of conduction from that of the substrate is formed in the area of the surface of the semiconductor substrate under the circuit element. A constant voltage, which biases the junction between the well and the semiconductor substrate in a reverse direction, is applied to the well through a resistor having a higher impedance compared with the impedance of the capacitance of the reverse-biased junction between the well and the substrate at the frequency of the signal applied to the circuit element.