Abstract: Provided is a semiconductor element having, while maintaining the same integratability as a conventional MOSFET, excellent switch characteristics compared with the MOSFET, that is, having the S-value less than 60 mV/order at room temperature. Combining the MOSFET and a tunnel bipolar transistor having a tunnel junction configures a semiconductor element that shows an abrupt change in the drain current with respect to a change in the gate voltage (an S-value of less than 60 mV/order) even at a low voltage.

Abstract: A method for producing a tunnel field-effect transistor is disclosed. Connection regions of different doping types are produced by means of self-aligning implantation methods.

Abstract: The present invention discloses a tunneling current amplification transistor, which relates to an area of field effect transistor logic devices in CMOS ultra large scale semiconductor integrated circuits (ULSI). The tunneling current amplification transistor includes a semiconductor substrate, a gate dielectric layer, an emitter, a drain, a floating tunneling base and a control gate, wherein the drain, the floating tunneling base and the control gate forms a conventional TFET structure, and a doping type of the emitter is opposite to that of the floating tunneling base. A position of the emitter is at the other side of the floating tunneling base with respect to the drain. A type of the semiconductor between the emitter and the floating tunneling base is the same as that of the floating tunneling base.

Abstract: An electronic device can include a tunnel structure that includes a first electrode, a second electrode, and tunnel dielectric layer disposed between the electrodes. In a particular embodiment, the tunnel structure may or may not include an intermediate doped region that is at the primary surface, abuts a lightly doped region, and has a second conductivity type opposite from and a dopant concentration greater than the lightly doped region. In another embodiment, the electrodes have opposite conductivity types. In a further embodiment, an electrode can be formed from a portion of a substrate or well region, and the other electrode can be formed over such portion of the substrate or well region.

Abstract: A method for forming a tunneling layer of a nonvolatile trapped-charge memory device and the article made thereby. The method includes multiple oxidation and nitridation operations to provide a dielectric constant higher than that of a pure silicon dioxide tunneling layer but with a fewer hydrogen and nitrogen traps than a tunneling layer having nitrogen at the substrate interface. The method provides for an improved memory window in a SONOS-type device. In one embodiment, the method includes an oxidation, a nitridation, a reoxidation and a renitridation. In one implementation, the first oxidation is performed with O2 and the reoxidation is performed with NO.

Abstract: A vertical fin structure for a semiconductor transistor includes a semiconductor substrate, a fin layer on top of the substrate, a capping layer overlaying the fin layer, wherein the substrate comprises group IV semiconductor material, the fin layer comprises group IV semiconductor material, the capping layer comprises semiconductor compound from group III-V. The fin layer can comprise Ge, SiGe, SiC, or any combinations thereof. The semiconductor substrate can comprise Si, Ge, SiGe, or SiC. The capping layer can comprise GaAs, InGaAs, InAs, InSb, GaSb, GaN, InP, or any combinations thereof. The capping layer can provide more than a 4 percent lattice mismatch with the semiconductor substrate. The fin layer can be located in between shallow trench insulation (STI) layers that provide isolation from adjacent devices. The vertical fin structure can further include a high-k dielectric layer overlaying the capping layer and a metal gate layer overlaying the high-k dielectric layer.

Abstract: Scaling a nonvolatile trapped-charge memory device and the article made thereby. In an embodiment, scaling includes multiple oxidation and nitridation operations to provide a tunneling layer with a dielectric constant higher than that of a pure silicon dioxide tunneling layer but with a fewer hydrogen and nitrogen traps than a tunneling layer having nitrogen at the substrate interface. In an embodiment, scaling includes forming a charge trapping layer with a non-homogenous oxynitride stoichiometry. In one embodiment the charge trapping layer includes a silicon-rich, oxygen-rich layer and a silicon-rich, oxygen-lean oxynitride layer on the silicon-rich, oxygen-rich layer. In an embodiment, the method for scaling includes a dilute wet oxidation to density a deposited blocking oxide and to oxidize a portion of the silicon-rich, oxygen-lean oxynitride layer.

Abstract: A tunnel transistor is provided including a drain, a source and at least a first gate for controlling current between the drain and the source, wherein the first sides of respectively the first and the second gate dielectric material are positioned substantially along and substantially contact respectively the first and the second semiconductor part.

Abstract: Disclosed is a ferromagnetic tunnel junction structure which is characterized by having a tunnel barrier layer that comprises a non-magnetic material having a spinel structure. The ferromagnetic tunnel junction structure is also characterized in that the non-magnetic material is substantially MgAl2O4. The ferromagnetic tunnel junction is also characterized in that at least one of the ferromagnetic layers comprises a Co-based full Heusler alloy having an L21 or B2 structure. The ferromagnetic tunnel junction structure is also characterized in that the Co-based full Heusler alloy comprises a substance represented by the following formula: Co2FeAlxSi1-x (0?x?1). Also disclosed are a magnetoresistive element and a spintronics device, each of which utilizes the ferromagnetic tunnel junction structure and can achieve a high TMR value, that cannot be achieved by employing conventional tunnel barrier layers other than a MgO barrier.

Abstract: An electronic device can include a tunnel structure that includes a first electrode, a second electrode, and tunnel dielectric layer disposed between the electrodes. In a particular embodiment, the tunnel structure may or may not include an intermediate doped region that is at the primary surface, abuts a lightly doped region, and has a second conductivity type opposite from and a dopant concentration greater than the lightly doped region. In another embodiment, the electrodes have opposite conductivity types. In a further embodiment, an electrode can be formed from a portion of a substrate or well region, and the other electrode can be formed over such portion of the substrate or well region.

Abstract: Structures include a tunneling device disposed over first and second lattice-mismatched semiconductor materials. Process embodiments include forming tunneling devices over lattice-mismatched materials.

Abstract: A microelectronic device includes a tunneling pocket within an asymmetrical semiconductive body including source- and drain wells. The tunneling pocket is formed by a self-aligned process by removing a dummy gate electrode from a gate spacer and by implanting the tunneling pocket into the semiconductive body or into an epitaxial film that is part of the semiconductive body.

Abstract: A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.

Abstract: The present disclosure provides an improved magnetic memory cell. The magnetic memory cell includes a switching element and two magnetic tunnel junction (MTJ) devices. A conductor connects the first and second MTJ devices in a parallel configuration, and serially connecting the parallel configuration to an electrode of the switching element. The resistance of the first MTJ device is different from the resistance of the second.