Abstract: The present invention pertains to a high-voltage MOS device. The high-voltage MOS device includes a substrate, a first well, a first field oxide layer enclosing a drain region, a second field oxide enclosing a source region, and a third field oxide layer encompassing the first and second field layers with a device isolation region in between. A channel region is situated between the first and second field oxide layers. A gate oxide layer is provided on the channel region. A gate is stacked on the gate oxide layer. A device isolation diffusion layer is provided in the device isolation region.

Abstract: A process and an architecture related to a vertical MOSFET device and a capacitor for use in integrated circuits. Generally, the integrated circuit structure includes a semiconductor layer with a major surface formed along a plane thereof and further including a first doped region formed in the surface. A second doped region of a different conductivity type than the first doped region is positioned over the first region. A third doped region of a different conductivity type than the second region is positioned over the second region. In one embodiment of the invention, a semiconductor device includes a first layer of semiconductor material and a first field-effect transistor having a first source/drain region formed in the first layer. A channel region of the transistor is formed over the first layer and an associated second source/drain region is formed over the channel region. The integrated circuit further includes a capacitor having a bottom plate, dielectric layer and a top capacitor plate.

Abstract: A ferroelectric memory capacitor is formed by forming a barrier layer, a first metal layer, a ferroelectric layer, a second metal layer, and a hard mask layer, on dielectric layer (70). Using the patterned hard mask layer (255), the layers are etched to form an etched barrier layer (205), and etched first metal layer (215), and etched ferroelectric layer (225), and etched second metal layers (235, 245). The etched layers form a ferroelectric memory capacitor (270) with sidewalls that form an angle with the plane of the upper surface of the dielectric layer (70) between 78° and 88°. The processes used to etch the layers are plasma processes performed at temperatures between 200° C. and 500° C.

Abstract: A method for reducing the effective thickness of a gate oxide using nitrogen implantation and anneal subsequent to dopant implantation and activation is provided. More particularly, the present invention provides a method for fabricating semiconductor devices, for example, transistors, which include a hardened gate oxide and which may be characterized by a relatively large nitrogen concentration at the polysilicon/gate oxide interface and a relatively small nitrogen concentration within the gate oxide and at the gate oxide/substrate interface. Additionally, the present invention provides a method for fabricating a semiconductor device having a metal gate strap (e.g., a metal silicide layer) disposed over the polysilicon layer thereof, which device includes a hardened gate oxide and which may be characterized by a relatively large nitrogen concentration at the silicide/polysilicon interface to substantially prevent cross-diffusion.

Abstract: Interconnections are formed over an interlayer insulating film which covers MISFETQ1 formed on the principal surface of a semiconductor substrate, while dummy interconnections are disposed in a region spaced from such interconnections. Dummy interconnections are disposed also in a scribing area. Dummy interconnections are not formed at the peripheries of a bonding pad and a marker. In addition, a gate electrode of a MISFET and a dummy gate interconnection formed of the same layer are disposed. Furthermore, dummy regions are disposed in a shallow trench element-isolation region. After such dummy members are disposed, an insulating film is planarized by the CMP method.

Abstract: ESD protection devices without current crowding effect at the finger's ends. It is applied under MM ESD stress in sub-quarter-micron CMOS technology. The ESD discharging current path in the MMOS or PMOS device structure is changed by the proposed new structures, therefore the MM ESD level of the NMOS and PMOS can be significantly improved. In this invention, 6 kinds of new structures are provided. The current crowding problem can be successfully solved, and have a higher MM ESD robustness. Moreover, these novel devices will not degrade the HBM ESD level and are widely used in ESD protection circuits.

Abstract: A capacitor capable of functioning as a capacitor even when an AC voltage is applied thereto is provided without increasing the manufacturing steps of a semiconductor device. A transistor is used as a MOS capacitor where a pair of impurity regions formed on opposite sides of a channel formation region are each doped with impurities of different conductivity so as to be used as a source region or a drain region. Specifically, assuming that an impurity region that is doped with N-type impurities is referred to as an N-type region while an impurity region that is doped with P-type impurities is referred to as a P-type region, a transistor is provided where a channel formation region is interposed between the N-type region and the P-type region, which is used as a MOS capacitor.

Abstract: A method of forming a gate oxide film for high voltage region of semiconductor devices includes forming patterns on a semiconductor substrate having a high voltage region, thereby exposing only a gate oxide film formation region for high voltage, forming a metal oxidization layer on the entire surface, and performing a process of removing the patterns, thereby forming the metal oxidization layer only in the gate oxide film formation region for high voltage.

Abstract: Methods of fabricating MIM capacitors are provided. One example method includes forming an insulating layer including a void on a semiconductor substrate, forming a first hole connected to the void by patterning the insulating layer, forming a lower electrode by forming a tungsten layer filling in the first hole such that the tungsten flows into the void, forming a dielectric layer, forming a second hole penetrating the dielectric layer and protruding toward the insulating layer, forming a connecting contact connected to the lower electrode by filling in the second hole, and forming an upper electrode on the dielectric layer.

Abstract: A capacitor includes a first electrode and a second electrode arranged so that a main surface of the first electrode opposes a main surface of the second electrode, a first pseudo electrode layer disposed on the main surface of the first electrode, and a dielectric layer disposed between the first pseudo electrode layer and the main surface of the second electrode. The first pseudo electrode layer includes conductive particles electrically coupled to the first electrode.

Abstract: VSS 302 is provided to a gate portion 304 and VDD 301 is provided to a source portion 305 and a drain portion 306 of a MOS transistor which constitutes a decoupling capacitor, and a potential NWVDD 303 different from that provided to the source portion 305 and the drain portion 306 is provided to a substrate portion 307. If NWVDD 303 is set higher than VDD 301, a depletion layer 309 is spread, so that a leakage current can be reduced instead of reducing a capacitance of the decoupling capacitor. In addition, if NWVDD 303 is set lower than VDD 301 so as not to cause latchup, the depletion layer 309 is reduced, so that the capacitance of the decoupling capacitor can be increased. By changing the potential NWVDD 303 provided to the substrate portion 307, a capacitance value and a leakage current value of the decoupling capacitor can be controlled.

Abstract: A semiconductor device includes a semiconductor substrate having a resistivity of at least 30 ?·cm, a first MISFET formed on the semiconductor substrate to function as a protective element, and a second MISFET protected by the first MISFET.

Abstract: It is an object to obtain a semiconductor device having such a structure that respective electrical characteristics of an insulated gate type transistor and an insulated gate type capacitance are not deteriorated and a method of manufacturing the semiconductor device. An NMOS transistor Q1 and a PMOS transistor Q2 which are formed in an NMOS formation region A1 and a PMOS formation region A2 respectively have P? pocket regions 17 and N? pocket regions 27 in vicinal regions of extension portions 14e and 24e of N+ source-drain regions 14 and P+ source-drain regions 24, respectively. On the other hand, an N-type variable capacitance C1 and a P-type variable capacitance C2 which are formed in an N-type variable capacitance formation region A3 and a P-type variable capacitance formation region A4 respectively do not have a region of a reverse conductivity type which is adjacent to extraction electrode regions corresponding to the P? pocket regions 17 and the N? pocket regions 27.

Abstract: A MOS varactor is formed having a gate electrode comprising at least two abutting oppositely doped regions shorted together, in which the two regions are implanted simultaneously with source/drain implants for first and second types of transistor; at least one contact to a lower electrode is also formed simultaneously with the source/drain implants for the first type of transistor; the varactor insulator is formed simultaneously with the gate insulator for one type of transistor; and the lower electrode is formed simultaneously with a well for the first type of transistor, so that no additional mask is required.

Abstract: It is an object to obtain a semiconductor device having such a structure that respective electrical characteristics of an insulated gate type transistor and an insulated gate type capacitance are not deteriorated and a method of manufacturing the semiconductor device. An NMOS transistor Q1 and a PMOS transistor Q2 which are formed in an NMOS formation region A1 and a PMOS formation region A2 respectively have P31 pocket regions 17 and N31 pocket regions 27 in vicinal regions of extension portions 14e and 24e of N+ source-drain regions 14 and P+ source-drain regions 24, respectively. On the other hand, an N-type variable capacitance C1 and a P-type variable capacitance C2 which are formed in an N-type variable capacitance formation region A3 and a P-type variable capacitance formation region A4 respectively do not have a region of a reverse conductivity type which is adjacent to extraction electrode regions corresponding to the P31 pocket regions 17 and the N31 pocket regions 27.

Abstract: It is an object to obtain a semiconductor device including a capacitance having a great Q-value. In an SOI substrate comprising a support substrate (165), a buried oxide film (166) and an SOI layer (171), an isolating oxide film 167 (167a to 167c) is selectively formed in an upper layer portion of the SOI layer (171) with a part of the SOI layer (171) remaining as a P? well region (169). Consequently, an isolation (partial isolation) structure is obtained. An N+ diffusion region (168) is formed in the SOI layer (171) between the isolating oxide films (167a) and (167b) and a P+ diffusion region (170) is formed in the SOI layer (171) between the isolating oxide films (167b) and (167c). Consequently, there is obtained a junction type variable capacitance (C23) having a PN junction surface of the P? well region (169) provided under the isolating oxide film (167b) and the N+ diffusion region (168).

Abstract: A semiconductor device includes a semiconductor substrate, an insulated gate type transistor formed in the semiconductor substrate, and an insulated gate type capacitor formed in the semiconductor substrate. The insulated gate type transistor includes a gate insulating film of the transistor selectively formed on the semiconductor substrate, a gate electrode of the transistor formed on the gate insulating film of the transistor, and source-drain regions formed to interpose a body region of the transistor provided under the gate electrode of the transistor in a surface of the semiconductor substrate. The insulated gate type capacitor includes a gate insulating film of the capacitor selectively formed on the semiconductor substrate, a gate electrode of the capacitor formed on the gate insulating film of the capacitor, and extraction electrode regions formed to interpose a body region of the capacitor provided under the gate electrode of the capacitor in the surface of the semiconductor substrate.

Abstract: A capacitor formed by a process using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates and a dielectric is formed from the first conductive plate.

Abstract: There are provided an analog capacitor having at least three high-k dielectric layers, and a method of fabricating the same. The analog capacitor includes a lower electrode, an upper electrode, and at least three high-k dielectric layers interposed between the lower electrode and the upper electrode. The at least three high-k dielectric layers include a bottom dielectric layer contacting the lower electrode, a top dielectric layer contacting the upper electrode, and a middle dielectric layer interposed between the bottom dielectric layer and the top dielectric layer. Further, each of the bottom dielectric layer and the top dielectric layer is a high-k dielectric layer, the absolute value of the quadratic coefficient of VCC thereof being relatively low compared to that of the middle dielectric layer, and the middle dielectric layer is a high-k dielectric layer having a low leakage current compared to those of the bottom dielectric layer and the top dielectric layer.