Optical Element Associated With Device (epo) Patents (Class 257/E31.127)
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Patent number: 12136638Abstract: The present disclosure relates to a semiconductor device including a semiconductor substrate. A grid structure extends from a first side of the semiconductor substrate to within the semiconductor substrate. An image sensing element is disposed within the semiconductor substrate and is laterally surrounded by the grid structure. A plurality of protrusions are arranged along the first side of the semiconductor substrate. The plurality of protrusions are disposed over the image sensing element and are laterally surrounded by the grid structure. The plurality of protrusions are substantially identical to one another and have a characteristic dimension. An inner surface of the grid structure facing the image sensing element is spaced apart from a point of one of the plurality of protrusions by a predetermined reflective length that is based on the characteristic dimension of the plurality of protrusions.Type: GrantFiled: July 20, 2021Date of Patent: November 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chin-Chia Kuo, Jhy-Jyi Sze, Tung-Ting Wu, Yimin Huang
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Patent number: 12133007Abstract: The present disclosure relates to a solid-state image pickup device and an electronic apparatus by which a phase-difference detection pixel that avoids defects such as lowering of sensitivity to incident light and lowering of phase-difference detection accuracy can be realized. A solid-state image pickup device as a first aspect of the present disclosure is a solid-state image pickup device in which a normal pixel that generates a pixel signal of an image and a phase-difference detection pixel that generates a pixel signal used in calculation of a phase-difference signal for controlling an image-surface phase difference AF function are arranged in a mixed manner, in which, in the phase-difference detection pixel, a shared on-chip lens for condensing incident light to a photoelectric converter that generates a pixel signal used in calculation of the phase-difference signal is formed for every plurality of adjacent phase-difference detection pixels.Type: GrantFiled: June 1, 2023Date of Patent: October 29, 2024Assignee: Sony Group CorporationInventors: Sozo Yokogawa, Isao Hirota
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Patent number: 12132023Abstract: An integrated circuit includes a semiconductor substrate, contact pads, testing pads, conductive posts, dummy posts, and a protection layer. The contact pads and the testing pads are distributed over the semiconductor substrate. The conductive posts are disposed on the contact pads. The dummy posts are disposed on the testing pads and are electrically floating. The protection layer covers the conductive posts and the dummy posts. A distance between top surfaces of the conductive posts and a top surface of the protection layer is smaller than a distance between top surfaces of the dummy posts and the top surface of the protection layer.Type: GrantFiled: November 1, 2022Date of Patent: October 29, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang, Chia-Wei Wang
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Patent number: 12130495Abstract: Various embodiments include an engaging arrangement that may be used to attach a lens barrel to a lens carrier of a camera. In some embodiments, the engaging arrangement may restrict movement of the lens barrel relative to the lens carrier along at least an optical axis. In various examples, the engaging arrangement may include one or more grooves and one or more protrusions. For instance, a groove may be defined by the lens barrel or the lens carrier, and a protrusion may extend from the lens barrel or the lens carrier to at least partially into the groove. In some cases, the engaging arrangement may include an adhesive positioned continuously 360 degrees around the engaging arrangement between the lens barrel and the lens carrier.Type: GrantFiled: April 15, 2022Date of Patent: October 29, 2024Assignee: Apple Inc.Inventors: Paulom Shah, Aurelien R Hubert, Ho Seop Jeong, Julien C Vittu, Qiang Yang
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Patent number: 12124064Abstract: To provide a filter-based sensor capable of enhancing reliability and image quality. There is provided a solid-state imaging device including pillar structures, a filter element, a semiconductor substrate, and a photoelectric conversion element formed in the semiconductor substrate, in which the pillar structures are disposed above the semiconductor substrate in a cross-sectional view and the filter element is disposed between the semiconductor substrate and the pillar structures, and the pillar structures are configured to change a direction of an incident light.Type: GrantFiled: January 24, 2022Date of Patent: October 22, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Atsushi Toda
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Patent number: 12124049Abstract: Provided is an image sensor including a sensor substrate including a first pixel configured to sense light of a first wavelength, and a second pixel configured to sense light of a second wavelength, and a color separating lens array configured to concentrate the light of the first wavelength on the first pixel, and the light of the second wavelength on the second pixel, the color separating lens array including a first pixel-corresponding area corresponding to the first pixel, and a second pixel-corresponding area corresponding to the second pixel, wherein a first phase difference between the light of the first wavelength that has traveled through a center of the first pixel-corresponding area and a center of the second pixel-corresponding area is different than a second phase difference between the light of the second wavelength that has traveled through the center of the first pixel-corresponding area and the center of the second pixel-corresponding area.Type: GrantFiled: October 29, 2021Date of Patent: October 22, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seokho Yun, Sookyoung Roh
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Patent number: 12119361Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.Type: GrantFiled: June 8, 2023Date of Patent: October 15, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Nan Guo, Zhenyu Chen, Takehiko Tanaka, Jingfei He, Zhen Huang, Zhongyu Luan, Feifan Chen
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Patent number: 12119421Abstract: A photodetector including: an amplification region that includes a PN junction provided in a depth direction in a semiconductor layer and that is to be electrically coupled to a cathode; a separation region that defines a pixel region including the amplification region; a hole accumulation region that is provided along a side surface of the separation region and that is to be electrically coupled to an anode; and a gate electrode provided in a region between the amplification region and the hole accumulation region and stacked over the semiconductor layer with a gate insulating film interposed therebetween.Type: GrantFiled: December 18, 2020Date of Patent: October 15, 2024Assignee: Sony Semiconductor Solutions CorporationInventors: Katsuhisa Tanaka, Yusuke Otake
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Patent number: 12106598Abstract: A fingerprint sensing device has a sensing area, an operation area, and a peripheral area, and the operation area is disposed between the sensing area and the peripheral area. The fingerprint sensing device includes a substrate, a sensing element located at the sensing area, an operation element located at the operation area, a first signal line located at the peripheral area, a first planarization layer, a first insulating layer, and a first shading layer. The first planarization layer is located on the substrate and has a first trench, and the first trench overlaps the first signal line. The first insulating layer is located on the first planarization layer and in the first trench, and the first insulating layer has a first opening located in the first trench. The first shading layer is located on the first insulating layer and connected to the first signal line through the first opening.Type: GrantFiled: June 23, 2021Date of Patent: October 1, 2024Assignee: Au Optronics CorporationInventors: Shu-Wen Tzeng, Yan-Liang Chen, Jui-Chi Lo
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Patent number: 12100672Abstract: A device includes an interconnect device attached to a redistribution structure, wherein the interconnect device includes conductive routing connected to conductive connectors disposed on a first side of the interconnect device, a molding material at least laterally surrounding the interconnect device, a metallization pattern over the molding material and the first side of the interconnect device, wherein the metallization pattern is electrically connected to the conductive connectors, first external connectors connected to the metallization pattern, and semiconductor devices connected to the first external connectors.Type: GrantFiled: July 20, 2022Date of Patent: September 24, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jiun Yi Wu, Chen-Hua Yu
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Patent number: 12094238Abstract: An integral optical construction includes a lens layer including a structured first major surface having a plurality of microlenses. An optically opaque mask layer is disposed on the lens layer and defines a plurality of openings. Each of the openings extends from a first major surface of the mask layer facing the lens layer to an opposite second major surface of the mask layer. The openings are in a one-to-one correspondence with the microlenses. Regions of the mask layer between the openings have an optical density of greater than about 2 for at least a first visible wavelength in a visible wavelength range. An optical adhesive layer is disposed on, and makes physical contact with, the second major surface of the mask layer. The optical adhesive layer defines a recess at each of the openings. The recess includes a closed bottom and an opposite open top open to the opening.Type: GrantFiled: May 10, 2023Date of Patent: September 17, 2024Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Kristy A. Gillette, Zhaohui Yang, Encai Hao, William J. Gray
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Patent number: 12087797Abstract: An example image sensor structure includes an image layer. The image layer includes an array of light detectors disposed therein. A device stack is disposed over the image layer. An array of light guides is disposed in the device stack. Each light guide is associated with at least one light detector of the array of light detectors. A passivation stack is disposed over the device stack. The passivation stack includes a bottom surface in direct contact with a top surface of the light guides. An array of nanowells is disposed in a top layer of the passivation stack. Each nanowell is associated with a light guide of the array of light guides. A crosstalk blocking metal structure is disposed in the passivation stack. The crosstalk blocking metal structure reduces crosstalk within the passivation stack.Type: GrantFiled: February 28, 2023Date of Patent: September 10, 2024Assignee: ILLUMINA, INC.Inventors: Xiuyu Cai, Ali Agah, Tracy H. Fung, Dietrich Dehlinger
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Patent number: 12088898Abstract: A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.Type: GrantFiled: June 28, 2019Date of Patent: September 10, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhewen Mei, Qimin Mei, Bojie Zhao
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Patent number: 12082349Abstract: An electronic device includes a circuit board and a camera assembly. The circuit board has a mounting hole extending through the circuit board in a thickness direction, and the mounting hole includes a first end and a second end oppositely arranged along the thickness direction of the circuit board. The camera assembly includes a first part arranged in the mounting hole and a second part extending out from the first end of the mounting hole, and the first part includes a camera substrate assembly. A support member is arranged on the circuit board and at the mounting hole and the first part is arranged on the support member. The support member includes at least one conductive sheet. The at least one conductive sheet is further coupled to a metal wiring of the circuit board, and the at least one conductive sheet is insulated from the camera substrate assembly.Type: GrantFiled: April 29, 2022Date of Patent: September 3, 2024Assignee: HONOR DEVICE CO., LTD.Inventor: Xiaoyong Dong
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Patent number: 12080741Abstract: Provided is an image sensor including a light sensor array including a plurality of light sensors configured to detect an incident light and convert the incident light into an electrical signal, the plurality of light sensors being are provided in a plurality of pixels, a transparent layer provided on the light sensor array, a color separation element provided on the transparent layer and configured to separate the incident light into light of a plurality of colors based on a wavelength band, and a focusing element including a nanostructure in a region corresponding to at least one pixel among the plurality of pixels and configured to perform auto focusing.Type: GrantFiled: April 19, 2023Date of Patent: September 3, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sookyoung Roh, Seokho Yun
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Patent number: 12080738Abstract: An image sensor device is disclosed. The image sensor device includes: a substrate having a front surface and a back surface; a radiation-sensing region formed in the substrate; an opening extending from the back surface of the substrate into the substrate; a first metal oxide film including a first metal, the first metal oxide film being formed on an interior surface of the opening; and a second metal oxide film including a second metal, the second metal oxide film being formed over the first metal oxide film; wherein the electronegativity of the first metal is greater than the electronegativity of the second metal. An associated fabricating method is also disclosed.Type: GrantFiled: August 12, 2021Date of Patent: September 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chih-Yu Lai, Min-Ying Tsai, Yeur-Luen Tu, Hai-Dang Trinh, Cheng-Yuan Tsai
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Patent number: 12081689Abstract: Embodiments are disclosed for shielding of an optical element of an imaging device in a mobile device. In an embodiment, an imaging device includes: an optical element; a metallic shielding enclosure, wherein the optical element is partially located within the metallic shielding enclosure; an electrically conductive coating layer applied on a surface of the optical element that is outside the metallic shielding enclosure, wherein the electrically conductive coating layer is electrically connected to the metallic shielding enclosure.Type: GrantFiled: September 15, 2022Date of Patent: September 3, 2024Assignee: Apple Inc.Inventors: Julien Sarry, Henry M. Daghighian
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Patent number: 12081882Abstract: Provided is an imaging unit including an imaging section that includes a pixel capable of performing charge accumulation a plurality of times in response to an imaging instruction for generating one frame of image data; a storage section that stores a pixel signal based on output from the pixel; an updating section that updates the pixel signal already stored in the storage section by performing an integration process to integrate the pixel signal output from the pixel as a result of a new charge accumulation and the pixel signal already stored in the storage section; and a control section that controls whether the updating section performs the update, for each of a plurality of pixel groups that each include one or more pixels.Type: GrantFiled: December 13, 2022Date of Patent: September 3, 2024Assignee: NIKON CORPORATIONInventor: Takashi Kuriyama
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Patent number: 12068347Abstract: Provided is a solid-state imaging device capable of enhancing pixel sensitivity and preventing color mixture. A solid-state imaging device includes: a plurality of microlenses that condenses incident light; a plurality of color filters that transmits light of a specific wavelength included in the condensed incident light; a plurality of photoelectric conversion parts on which light having a specific wavelength transmitted through the color filter is incident; and a plurality of waveguide wall parts arranged between the color filters and surrounding the color filter. Then, each of the plurality of waveguide wall parts is formed in a position subjected to pupil correction.Type: GrantFiled: March 4, 2021Date of Patent: August 20, 2024Assignee: Sony Semiconductor Solutions CorporationInventor: Michiko Sakamoto
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Patent number: 12068345Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.Type: GrantFiled: August 2, 2022Date of Patent: August 20, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yu-Te Hsieh, I-Lin Chu
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Patent number: 12059370Abstract: A flexible device having a layered structure for delivering light or ultrasound to a skin surface. The device includes a flexible substrate that supports either a flexible light emitter layer or a flexible ultrasound emitter layer, as well as first and second flexible conductive layers. The device has a surface configured to face the skin surface, wherein (a) the light emitter layer emits pulsed light with an intensity that is substantially constant across the device's surface when driven by a power source connected to the conductive layers to thereby deliver a therapeutically effective dose of pulsed light to the skin surface or (b) the ultrasound emitter layer emits ultrasound with an intensity that is substantially constant across the device's surface when driven by a power source connected to the conductive layers to thereby deliver a therapeutically effective dose of ultrasound to the skin surface.Type: GrantFiled: January 23, 2019Date of Patent: August 13, 2024Inventors: Michael R. Hall, John C. Castel, Dawn Castel
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Patent number: 12061120Abstract: A floating bridge structure includes a substrate, a floating bridge layer, and at least one support. The floating bridge layer is on the substrate and substantially parallel to an upper surface of the substrate. The support extends on a vertical surface from the substrate to the floating bridge layer, in which the vertical surface is substantially perpendicular to the upper surface of the substrate.Type: GrantFiled: September 28, 2022Date of Patent: August 13, 2024Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shang-Yu Chuang, Kuang-Hao Chiang
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Patent number: 12055638Abstract: A device of acquisition of a depth image of a scene by detection of a reflected light signal. The device includes a stack of a first sensor and of a second sensor. The first sensor includes first depth photosites configured to acquire at least one first sample of charges photogenerated during first time periods. The second sensor includes second depth photosites arranged opposite the first photosites, the second photosites being configured to acquire at least one second sample of charges photogenerated during second time periods offset with respect to the first time periods by a first constant phase shift. The first sensor or the second sensor further includes third photosites configured to acquire at least one third sample during third time periods offset with respect to the first time periods by a second constant phase shift.Type: GrantFiled: October 6, 2021Date of Patent: August 6, 2024Assignee: Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Alexis Rochas, François Ayel, Yvon Cazaux, Gaelle Palmigiani
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Patent number: 12056952Abstract: A fingerprint sensor includes a substrate, a sensor pixel disposed on the substrate and including a light sensing element through which a sensing current flows according to an amount of incident light, a light-blocking conductive layer disposed on the sensor pixel and including a plurality of holes, a first fingerprint pad disposed on the substrate, and a conductive connector connected to the first fingerprint pad and to which a predetermined voltage is applied. The light-blocking conductive layer is electrically connected to the conductive connector.Type: GrantFiled: November 21, 2022Date of Patent: August 6, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jeong Heon Lee, Young Sik Kim, Jung Hak Kim, Kyo Won Ku, Hee Yeon Choi
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Patent number: 12058455Abstract: Provided is a technology capable of acquiring a saturation charge amount and improving low-light characteristics while suppressing an enlargement of a device and deterioration in pixel density.Type: GrantFiled: June 24, 2020Date of Patent: August 6, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takuya Kurihara, Yuji Torige
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Patent number: 12051713Abstract: The present technique relates to a solid-state image pickup element and an electronic apparatus each of which enables a pad to be formed in a shallow position while reduction of a quality of a back side illumination type solid-state image pickup element is suppressed. The solid-state image pickup element includes a pixel substrate in which a light condensing layer for condensing incident light on a photoelectric conversion element, a semiconductor layer in which the photoelectric conversion element is formed, and a wiring layer in which a wiring and a pad for outside connection are formed are laminated on one another, and at least a part of a first surface of the pad is exposed through a through hole completely extending through the light condensing layer and the semiconductor layer. The present technique, for example, can be applied to a back side illumination type CMOS image sensor.Type: GrantFiled: May 31, 2022Date of Patent: July 30, 2024Assignee: SONY GROUP CORPORATIONInventors: Keishi Inoue, Kenju Nishikido
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Patent number: 12048234Abstract: A display device includes a substrate, a thin film transistor disposed on the substrate, and a display element electrically connected to the thin film transistor. The substrate includes a first substrate layer, a second substrate layer disposed on the first substrate layer, a first barrier layer disposed between the first substrate layer and the second substrate layer, and a first ultraviolet light blocking layer disposed between the first substrate layer and the second substrate layer.Type: GrantFiled: March 23, 2022Date of Patent: July 23, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Seong Min Wang, Beohmrock Choi, Yongho Yang
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Patent number: 12046586Abstract: A light emitting device includes first and second electrodes disposed on a substrate; an insulating layer disposed on the substrate and including a groove extending in a first direction intersecting with the first and the second electrodes, and first and second contact portions that expose areas of the first and the second electrodes; light emitting elements disposed in the groove between the first and the second electrodes, each including first and second ends electrically connected to the first and second electrodes, respectively; a first contact electrode electrically connected to the light emitting elements on the first ends, and electrically connected to the first electrode on the first contact portion; and a second contact electrode electrically connected to the light emitting elements on the second ends, and electrically connected to the second electrode on the second contact portion.Type: GrantFiled: February 20, 2019Date of Patent: July 23, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Tae Jin Kong, Dae Hyun Kim, Myeong Hee Kim, Veidhes Basrur, Je Won Yoo, Xinxing Li, Hee Keun Lee, Bek Hyun Lim, Hyun Min Cho, Chang Il Tae
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Patent number: 12040343Abstract: A backside illuminated image sensor, including a semiconductor layer, a first gate structure, and a light sensing device, is provided. The semiconductor layer has a first surface and a second surface opposite to each other. The first gate structure is disposed on the second surface. The light sensing device is located in the semiconductor layer. The light sensing device extends from the first surface to the second surface.Type: GrantFiled: August 27, 2021Date of Patent: July 16, 2024Assignee: Powerchip Semiconductor Manufacturing CorporationInventors: Jun-Ming Su, Chih-Ping Chung, Ming-Yu Ho
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Patent number: 12035605Abstract: A texture recognition apparatus and a manufacturing method thereof are provided. The texture recognition apparatus includes a base substrate, a light source array and an image sensor array. The light source array is on a side of the base substrate and includes a plurality of light sources; the image sensor array is on a side of the base substrate and includes a plurality of image sensors, the plurality of image sensors are configured to receive light emitted from the plurality of light sources and reflected to the plurality of image sensors by a texture for texture collection; at least part of an photosensitive element of at least one image sensor of the plurality of image sensors is inclined relative to a surface of the base substrate.Type: GrantFiled: April 15, 2021Date of Patent: July 9, 2024Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yingming Liu, Xiaoliang Ding, Lei Wang, Yunke Qin
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Patent number: 12034030Abstract: A backside illuminated image sensor and a method of manufacturing the same are disclosed. The backside illuminated image sensor includes a substrate having a frontside surface and a backside surface, pixel regions disposed in the substrate, an insulating layer disposed on the frontside surface of the substrate, a bonding pad disposed on a frontside surface of the insulating layer, a second bonding pad connected to a backside surface of the bonding pad through the substrate and the insulating layer and exposed through the backside surface of the substrate, and a test pad connected to the backside surface of the bonding pad through the substrate and the insulating layer, exposed through the backside surface of the substrate, and for testing whether the second bonding pad is normally connected to the backside surface of the bonding pad.Type: GrantFiled: August 30, 2021Date of Patent: July 9, 2024Assignee: DB HITEK CO., LTD.Inventor: Chang Hun Han
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Patent number: 12027551Abstract: Transmitted light loss in an image pickup device is reduced in forming an underlying film of optical elements. The image pickup device includes photoelectric conversion units, optical elements, and an underlying film of the optical elements. The photoelectric conversion units convert incident light into electric signals. The optical elements provide the incident light to the photoelectric conversion units. The underlying film of the optical elements is provided in a region between a first open region and a second open region of the optical elements in a layer between the optical elements and the photoelectric conversion units. Furthermore, the underlying film of the optical elements may be provided in a light-shielding region and a contact region outside an effective pixel region.Type: GrantFiled: December 11, 2018Date of Patent: July 2, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Tomohiro Yamazaki
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Patent number: 12027563Abstract: The image sensor structure includes a substrate, a readout circuit array, a photoelectric layer and a filter layer. The filter layer has a first spectrum defining a first wavelength. The photoelectric layer has a second spectrum defining a second wavelength. The second wavelength is longer than the first wavelength. The first wavelength corresponds to a first line passing through a first point and a second point on a curve of the first spectrum of the filter layer. The first point aligns with an extinction coefficient of 0.9. The second point aligns with an extinction coefficient of 0.1. The second wavelength corresponds to a second line passing through a third point and a fourth point on a curve of the second spectrum of the photoelectric layer. The third point aligns with an extinction coefficient of 0.9. The fourth point aligns with an extinction coefficient of 0.1.Type: GrantFiled: June 11, 2021Date of Patent: July 2, 2024Assignee: VISERA TECHNOLOGIES COMPANY LIMITEDInventors: Lai-Hung Lai, Chin-Chuan Hsieh
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Patent number: 12021098Abstract: Disclosed is an image sensor comprising a substrate that includes a plurality of pixel groups each including a plurality of pixel regions, a plurality of color filters two-dimensionally arranged on a first surface of the substrate, and a pixel separation structure in the substrate. The pixel separation structure includes a first part that defines each of the pixel regions and a second part connected to the first part. The second part runs across an inside of each of the pixel regions.Type: GrantFiled: May 24, 2021Date of Patent: June 25, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Heegeun Park, Kyungho Lee, Jangho Moon, Minchul Lee, Soyoung Jeong
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Patent number: 12019233Abstract: An optical device, such as an eyepiece, including multiple layers of waveguides. The optical device can include an edge sealant for reducing light contamination, a lamination dam to restrict the wicking of the edge sealant between layers of the optical device, and venting gap(s) in the sealant and dam to allow air flow between the exterior and interior of the eyepiece. The gap(s) allow outgassing from the interior of the eyepiece of unreacted polymer and/or accumulated moisture, to prevent defect accumulation caused by chemical reaction of outgassed chemicals with the (e.g., ionic, acidic, etc.) surface of the eyepiece layers. The gap(s) also prevent pressure differences which may physically deform the eyepiece over time.Type: GrantFiled: July 22, 2019Date of Patent: June 25, 2024Assignee: Magic Leap, Inc.Inventors: Wendong Xing, Vikramjit Singh, Neal Paul Ricks, Jeffrey Dean Schmulen, Emory D. Carroll, K. Brent Binkley, Frank Y. Xu, Thomas Mercier, William Hudson Welch, Michael Anthony Klug
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Patent number: 12021054Abstract: Redistribution layers of integrated circuits include one or more arrays of conductive contacts that are configured and arranged to allow a bonding wave to displace air between the redistribution layers during bonding. This configuration and arrangement of the one or more arrays minimize discontinuities, such as pockets of air to provide an example, between the redistribution layers during the bonding.Type: GrantFiled: July 31, 2023Date of Patent: June 25, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Cheng-Yuan Li, Kuo-Cheng Lee, Yun-Wei Cheng, Yen-Liang Lin
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Patent number: 12021069Abstract: The semiconductor structure includes a die, a dielectric layer surrounding the die, a photoelectric device disposed adjacent to the die and surrounded by the dielectric layer, a first opening extending through the redistribution layer and configured to receive a light-conducting member, and a dielectric liner extending at least partially through the redistribution layer and surrounding the first opening. A method for forming a semiconductor structure includes forming a dielectric layer to surround a die; and disposing a photoelectric device surrounded by the dielectric layer; forming a redistribution layer over the die, the dielectric layer and the photoelectric device; forming a recess over the photoelectric device; disposing a dielectric material into the recess; removing a portion of the dielectric material to form a dielectric liner and a first opening over the photoelectric device. The dielectric liner extends at least partially through the redistribution layer and surrounding the first opening.Type: GrantFiled: October 27, 2020Date of Patent: June 25, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Jen-Yuan Chang, Chia-Ping Lai
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Patent number: 12007280Abstract: Systems, apparatuses, and methods for multi-application optical sensing are provided. For example, an optical sensing apparatus can include a photodetector array, a first circuitry, and a second circuitry. The photodetector array includes a plurality of photodetectors, wherein a first subset of the plurality of photodetectors are configured as a first region for detecting a first optical signal, and a second subset of the plurality of photodetectors are configured as a second region for detecting a second optical signal. The first circuitry, coupled to the first region, is configured to perform a first function based on the first optical signal to output a first output result. The second circuitry, coupled to the second region, is configured to perform a second function based on the second optical signal to output a second output result.Type: GrantFiled: March 6, 2023Date of Patent: June 11, 2024Assignee: ARTILUX, INC.Inventors: Chih-Wei Yeh, Hung-Chih Chang, Yun-Chung Na, Tsung-Ting Wu, Shu-Lu Chen
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Patent number: 12010417Abstract: A camera module and a terminal device are disclosed. The camera module includes a support mechanism, a filter and a sensor disposed corresponding to the filter, where the support mechanism includes substrates, support frames and buffers, the support frames each are disposed on the substrate, an edge of the filter is fixed on the support frame, and the buffers each are disposed between the substrate and the support frame. In this way, even if a suspended area of the filter increases relative to the sensor and shaking moment of the filter acting on the support frame increases, the support frame does not shake significantly relative to the substrate, and can keep its own stability under effective support by the buffer, which significantly reduces a probability of collision between the support frame and the filter, thereby ensuring assembly stability and integrity of the filter when the suspended area increases.Type: GrantFiled: December 25, 2020Date of Patent: June 11, 2024Assignee: HONOR DEVICE CO., LTD.Inventors: Wei Wang, Weibo Zhang, Xu Liu, Wancheng Qian
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Patent number: 12009381Abstract: A solid-state imaging device includes a first semiconductor substrate, an isolation region, a charge holding section, and a charge accumulation section. The first semiconductor substrate is a substrate in which a photoelectric converter is provided for each of unit regions. The isolation region is provided to run through the first semiconductor substrate in a thickness direction and electrically isolates the unit regions from each other. The charge holding section is electrically coupled to the photoelectric converter and configured to receive signal charge from the photoelectric converter. The charge accumulation section is shared by two or more of the unit regions and is a section to which the signal charge is transferred from the photoelectric converter and the charge holding section of each of the unit regions sharing the charge accumulation section.Type: GrantFiled: May 27, 2020Date of Patent: June 11, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Hironobu Fukui
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Patent number: 12010412Abstract: A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip.Type: GrantFiled: February 28, 2020Date of Patent: June 11, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Takehiko Tanaka, Xiaodi Liu, Zhen Huang, Zhenyu Chen
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Patent number: 12009377Abstract: Picture quality deterioration is curbed. A solid-state imaging device according to an embodiment includes: a semiconductor substrate (131) including a light-receiving element; an on-chip lens (132) disposed on a first surface of the semiconductor substrate; a resin layer (133) covering the on-chip lens; and a glass substrate (134) disposed on the side of the first surface of the semiconductor substrate separately from the resin layer.Type: GrantFiled: February 21, 2020Date of Patent: June 11, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yutaka Ooka, Taizo Takachi, Yuichi Yamamoto
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Patent number: 12009378Abstract: To provide a solid-state imaging device capable of improving image quality and an electronic apparatus equipped with the solid-state imaging device. There is provided a solid-state imaging device including a pixel array unit in which a plurality of pixels is one-dimensionally or two-dimensionally arrayed, the pixel array unit including a color filter and a semiconductor substrate for each pixel, a partition layer being formed between the color filters, the partition layer having a first width and a second width in order from a light incident side, the first width and the second width being different, and the second width being larger than the first width, and there is further provided an electronic apparatus equipped with the solid-state imaging device.Type: GrantFiled: April 3, 2019Date of Patent: June 11, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Tetsuya Yamaguchi
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Patent number: 11996425Abstract: A photosensitive element includes a semiconductor substrate, a light sensitive region formed in the semiconductor substrate, an inactive region at least partly surrounding the light sensitive region, and a protective layer having an opening leaving the light sensitive region uncovered by the protective layer. The protective layer is an anti-reflective coating having in at least a part of a spectral range between 300 nm and 1200 nm a reflectivity of less than 10% and a transmittance of less than 0.1%.Type: GrantFiled: January 18, 2023Date of Patent: May 28, 2024Assignee: First Sensor AGInventors: Ruben Chavez, Martin Wilke, Marc Schillgalies, Iman Sabri Alirezaei, Michael Pierschel
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Patent number: 11996428Abstract: An image sensor includes an array of image pixels and black level correction (BLC) pixels. Each BLC pixel includes a BLC pixel photodetector, a BLC pixel sensing circuit, and a BLC pixel optics assembly configured to block light that impinges onto the BLC pixel photodetector. Each BLC pixel optics assembly may include a first portion of a layer stack including a vertically alternating sequence of first material layers having a first refractive index and second material layers having a second refractive index. Additionally or alternatively, each BLC pixel optics assembly may include a first portion of a layer stack including at least two metal layers, each having a respective wavelength sub-range having a greater reflectivity than another metal layer. Alternatively or additionally, each BLC pixel optics assembly may include an infrared blocking material layer that provides a higher absorption coefficient than color filter materials within image pixel optics assemblies.Type: GrantFiled: March 3, 2021Date of Patent: May 28, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Feng-Chien Hsieh, Yun-Wei Cheng, Kuo-Cheng Lee, Hsin-Chi Chen
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Patent number: 11996430Abstract: Provided are a dual image sensor including an image sensor including a first area and a second area, the first area and the second area including a plurality of pixels, respectively, a band-pass filter layer provided on the first area, the band-pass filter layer configured to transmit light emitted by an object and having a specific wavelength corresponding to physical property information of the object to the image sensor, and a planarization layer provided on the second area and on the same plane as the band-pass filter layer.Type: GrantFiled: May 28, 2021Date of Patent: May 28, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyochul Kim, Younggeun Roh
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Patent number: 11996431Abstract: The present disclosure relates to a CMOS image sensor. The image sensor comprises a pixel region comprising a photodiode disposed within a substrate. A deep trench isolation (DTI) ring encloses the photodiode from top view and extends from a back-side to a first position within the substrate from cross-sectional view. A pair of shallow trench isolation (STI) structures is respectively disposed at an inner periphery and an outer periphery sandwiching the DTI ring from top view and extends from a front-side to a second position within the substrate from cross-sectional view. A pixel device is disposed at the front-side of the substrate directly overlying the DTI ring. The pixel device comprises a gate electrode disposed over the substrate and a pair of source/drain (S/D) regions disposed within the substrate and reaching on a top surface of the DTI ring.Type: GrantFiled: June 29, 2022Date of Patent: May 28, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Seiji Takahashi, Jhy-Jyi Sze, Tzu-Hsiang Chen
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Patent number: 11979675Abstract: Image sensing devices are disclosed. In one example, an image sensing device includes a pixel unit cell with both event sensing (EVS) pixels and imaging pixels. The EVS and imaging pixels are configured to include event sensing and imaging pixel transistors formed in the same transistor layer of an integrated circuit assembly that also includes the photodiodes of the EVS and imaging pixels. The photodiodes are separated by a rear deep trench isolation (RDTI), and the EVS and imaging pixel transistors are arranged along (e.g., underneath) boundary areas formed by the RDTI, maximizing the space available for the photodiodes and economizing on wiring requirements for the EVS and imaging pixels.Type: GrantFiled: April 25, 2022Date of Patent: May 7, 2024Assignee: Sony Semiconductor Solutions CorporationInventors: Hongyi Mi, Frederick T. Brady, Sungin Han, Pooria Mostafalu
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Patent number: 11978839Abstract: A light-emitting device includes a lead frame, a light-emitting diode (LED) chip, and an encapsulant. The LED chip is disposed on the lead frame, and includes a substrate, a semiconductor light-emitting unit disposed on a surface of the substrate, and a first electrode and a second electrode, which are disposed on the surface of the substrate, and which are located outwardly of the semiconductor light-emitting unit. The first and second electrodes are electrically connected to a lower surface of the semiconductor light-emitting unit, and are respectively connected to a first wiring bonding region and a second wiring bonding region on the lead frame. The encapsulant encapsulates the LED chip on the lead frame.Type: GrantFiled: June 28, 2021Date of Patent: May 7, 2024Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.Inventors: Chen-ke Hsu, Changchin Yu, Zhaowu Huang, Junpeng Shi, Weng-Tack Wong
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Patent number: 11977269Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.Type: GrantFiled: November 28, 2022Date of Patent: May 7, 2024Assignee: LG INNOTEK CO., LTD.Inventor: Youn Baek Jeong