Abstract: Laterally insulated integrated circuit chips are fabricated from a semiconductor wafer. Peripheral trenches are formed in the wafer which laterally delimit integrated circuit chips to be formed. A depth of the peripheral trenches is greater than or equal to a desired final thickness of the integrated circuit chips. The peripheral trenches are formed by a process which repeats successive steps of a) ion etching using a sulfur hexafluoride plasma, and b) passivating using an octafluorocyclobutane plasma. Upon completion of the step of forming the peripheral trenches, lateral walls of the peripheral trenches are covered by an insulating layer of a polyfluoroethene. A thinning step is performed on the lower surface of the wafer until a bottom of the peripheral trenches is reached. The insulating layer is not removed.

Abstract: Systems are provided for a frame of an optic element of a lighting system. In one example, a baffle frame including extended exterior sidewalls and inner angled walls extending below a bottom surface of the optic element may reduce light reflecting off a workpiece and escaping outside and interior of the baffle frame.

Abstract: An optical system for collimation of incoming light, comprising: a body (102); a recess (110) formed on a first side (104) of the body (102), the recess (110) having a central light entry surface (114) and a side light entry surface (112); a central light exit surface (118) provided at a second side of the body (108), which second side (108) is opposite to said first side (104); said central light entry surface (114) being arranged in relation to the central light exit surface (118) such that incoming light falling on the central light entry surface (114) is directed to the central light exit surface (118), a total internal reflection surface (116) provided at a side surface of the body (102), which is arranged such that incoming light falling on the side light entry surface (112) of the recess (110) is directed towards the total internal reflection surface (116) so as to be subject to total internal reflection towards the second side (108) of the body (102); and a rejection area (120) surrounding said centra

Abstract: A vehicle includes a truck bed and a lighting assembly configured to illuminate the truck bed. The lighting assembly includes a light source, a collimator positioned in front of the light source, and an outer lens positioned in front of the collimator. The collimator and the outer lens establish a lens arrangement having a unitary body. The light generated by the light source is collected within the collimator and is directed at a downward angle toward a floor of the truck bed by the outer lens.

Abstract: A laser component has a housing, which includes a carrier having a cavity with a bottom surface and a sidewall, wherein the cavity widens starting from the bottom surface, the side wall is inclined relative to the bottom surface by an angle different from 45°, a laser chip, an emission direction of which is oriented parallel to the bottom surface, is arranged on the bottom surface in the cavity, a reflective element is arranged in the cavity and bears on an edge between the bottom surface and the side wall, a reflective surface of the reflective element defines an angle with the bottom surface of the cavity, and the emission direction defines an angle of 45° with the reflective surface of the reflective element.

Abstract: There is provided a luminaire (1) and a collimating optics (2) for LED lights (5). The collimating optics (2) comprises a reflection collimator (3) having a first aperture (7) for allowing incoming light from a LED light (5) to enter the collimator (3) and a second aperture (9) for allowing outgoing light to exit the collimator (3). The reflection collimator (3) further has a wall (15) with a reflective inner surface for guiding the incoming light from the first aperture (7) towards the second aperture (9). A first convex lens (11) is arranged at a distance from the first aperture (7) for refracting the incoming light, and a second convex lens (13) is arranged at the second aperture (9) for refracting and collimating the outgoing light. With the disclosed collimating optics the collimating capability is improved without the size of the optics being increased.

Abstract: A light emitting diode can emit light along an axis. An optic can be positioned to direct the emitted light off of the axis. The optic can comprise a base and a projection that rises from the base towards the light emitting diode. The projection can comprise a cavity that is oriented to receive the light emitted by the light emitting diode. The cavity can be slanted relative to the axis of the light emitting diode. A convex surface disposed at the bottom of the cavity can condense, focus, or collimate light. The projection can further comprise sides that totally internally reflect light.

Abstract: A tractrix-based optical device is provided. The tractrix-based optical device includes a light receiving surface, a light emitting surface, and an intermediate portion of transparent material between the light receiving surface and the light emitting surface. The intermediate portion includes a boundary connective surface that adheres to a tractrix when in cross-section to provide total internal reflection of light propagating from the light receiving surface to the light emitting surface. The tractrix-based optical device can align and correlate light from multiple off-axis light emitting elements, or from an extended source light emitting element, thereby providing a generally uniform output distribution.

Abstract: An automated luminaire with an array of light sources configured in a plurality of primary TIR optics with central light blocks. The light blocks are configured to block or redirect light beam at angles likely to cause undesirable light spill.

Abstract: A display apparatus according to an embodiment of the present disclosure comprises: a substrate; a light-emitting unit including a light emitting element mounted on the substrate and a lens placed above the light-emitting element; a reflective layer placed on the upper surface of the substrate; an optical sheet placed above the reflective layer and placed at a height at which the optical sheet is spaced from the light-emitting unit; and a display panel placed on the upper surface of the optical sheet, wherein the lens has a cutout portion formed therein by depressing a part of the side surface thereof toward the center thereof, thereby providing an anisotropic light distribution.

Abstract: A light guide element and a lamp are provided. The light guide element includes a light-incident surface, a light-emitting surface, an outer surface and an inner surface. The light-incident surface has a first outer peripheral edge and a first inner peripheral edge. The light-emitting surface is opposite to the light-incident surface and has a second outer peripheral edge and a second inner peripheral edge. The outer surface connects the first outer peripheral edge and the second outer peripheral edge. The inner surface connects the first inner peripheral edge and the second inner peripheral edge. A first opening defined by the inner surface adjacent to the first inner peripheral edge is larger than a second opening defined by the inner surface adjacent to the second inner peripheral edge.

Abstract: A daytime running lamp (1) for being retrofitted on a road vehicle, comprising a reflector (4) with a reflective surface (5) for reflecting light in a general direction (I) of illumination and a plurality of light sources (3) arranged in a pattern having an extension along a horizontal axis (A). The light emitted by the plurality of light sources (3) has directional components in two opposite horizontal directions (H1, H2) along the horizontal axis (A) and a directional component in a vertical direction (V) perpendicular to the horizontal axis (A). The reflective surface (5) has a curvature such that the directional component in the vertical direction (V) is directed towards the general direction (I) of illumination, and the directional component in at least one of the horizontal directions (H1, H2) upon reflection in the reflective surface (5) is substantially unchanged by the reflection.

Abstract: The invention relates to a lighting apparatus, particularly for a motor vehicle, having a plurality of illuminants as light sources that each produce an individual light distribution, having means for setting the direction of radiation of the individual light distribution of the illuminants and having means for setting the focusing of the individual light distribution of the illuminants and having control means for controlling the settings of the individual light distributions to produce a superimposed overall light distribution by dint of superimposition of the individual light distributions of at least single illuminants.

Abstract: A lens for distribution of light from a light emitter. The lens has thick and thin wall portions between inner and outer lens surfaces. The thick wall portion(s) are at least twice as thick as the thin wall portion(s). At least one of the inner and outer surfaces has a texturing for diffusion of emitter light passing therethrough. The lens may include at least one interface between two materials with different indices of refraction. At least one surface of the interface may have a texturing for diffusion of emitter light passing therethrough. And, a method for manufacturing of the lens by forming a lens region with a textured surface portion by injecting the thermoplastic elastomer into an injection-molding cavity defined by a shape-forming configuration with a texturing in at least one area of the cavity. The shape-forming configuration is configured to shape a thermoplastic elastomer into such thickness that the set elastomer retains the texturing.

Abstract: A light guide element and a lamp are provided. The light guide element includes a light-incident surface, a light-emitting surface, an outer surface and an inner surface. The light-incident surface has a first outer peripheral edge and a first inner peripheral edge. The light-emitting surface is opposite to the light-incident surface and has a second outer peripheral edge and a second inner peripheral edge. The outer surface connects the first outer peripheral edge and the second outer peripheral edge. The inner surface connects the first inner peripheral edge and the second inner peripheral edge. A first opening defined by the inner surface adjacent to the first inner peripheral edge is larger than a second opening defined by the inner surface adjacent to the second inner peripheral edge.

Abstract: A display apparatus according to an embodiment of the present disclosure comprises: a substrate; a light-emitting unit including a light emitting element mounted on the substrate and a lens placed above the light-emitting element; a reflective layer placed on the upper surface of the substrate; an optical sheet placed above the reflective layer and placed at a height at which the optical sheet is spaced from the light-emitting unit; and a display panel placed on the upper surface of the optical sheet, wherein the lens has a cutout portion formed therein by depressing a part of the side surface thereof toward the center thereof, thereby providing an anisotropic light distribution.

Abstract: An optical lens for an LED includes an upper portion defining a light extraction face, a lower portion and an annular flange between the upper and lower portions. The lower portion has a wall section defining a cavity for receiving the LED therein, and a curved lateral side. A lateral light generated by the LED and running against the curved lateral side has at least a part being refracted or reflected thereby to run through the light extraction face of the optical lens.

Abstract: A unit has at least one light emitting diode (LED), a light-guiding lens in front of the LED, a downwardly inclined transparent window disposed in front of the light guiding lens, and light-shielding coatings disposed on a surface of the transparent window facing the light guiding lens, above and below the front face of the light-guiding lens. The light-guiding lens includes a light incident portion; a first reflecting surface for upwardly reflecting light from an upper half of the light incident portion; second reflecting surfaces for laterally reflecting light from a lower half of the light incident portion; third reflecting surfaces for upwardly reflecting light from the second reflecting surfaces; a fourth reflecting surface for forwardly reflecting the light from the first and third reflecting surfaces; and a light exiting surface for projecting light from the fourth reflecting surface forward.

Abstract: Disclosed are a light unit and a display apparatus including the same. The light unit includes a lens including a flat light incident part having a pattern and a light exit part, a plurality of light emitting devices below the incident part of the lens, and a substrate having the light emitting devices mounted thereon.

Abstract: A light guide element and a lamp are provided. The light guide element includes a light-incident surface, a light-emitting surface, an outer surface and an inner surface. The light-incident surface has a first outer peripheral edge and a first inner peripheral edge. The light-emitting surface is opposite to the light-incident surface and has a second outer peripheral edge and a second inner peripheral edge. The outer surface connects the first outer peripheral edge and the second outer peripheral edge. The inner surface connects the first inner peripheral edge and the second inner peripheral edge. A first opening defined by the inner surface adjacent to the first inner peripheral edge is larger than a second opening defined by the inner surface adjacent to the second inner peripheral edge.

Abstract: Simple yet powerful mathematical solutions are provided for producing a minimally-spreading de-pixelization light spread function with four-fold bilateral symmetry to create a High Dynamic Range LED-LCD display where the point spread functions of each LED regardless of intensity can be designed such that adjacent rows and columns of LEDs within an array blend smoothly and uniformly to create a non-pixelated continuous image in two dimensions on the diffuser screen and with minimal luminance overlap to minimize the computational demands required at video rate of an HDR display. The resulting image has substantially visually perfect uniform luminance, linear luminance and quadratic luminance gradient. Additionally a new display architecture is unveiled and described that emulates the mathematically developed light spread functions mentioned. This new architecture comprises several sub-aspects to tune the display device to the desired design requirements.

Abstract: Disclosed are a light emitting device package. The light emitting device package includes a body having recess; a first lead frame including a first and second portions on a first region of the body; a second lead frame including a third and fourth portions on a second region of the body; a third lead frame between the first and second lead frame. The body has a length of the first direction greater than a width of the second direction, wherein the second portion of the first lead frame extends toward the second lead frame and has a small width, and wherein the fourth portion of the second lead frame extends toward the first lead frame. A first light emitting device is disposed on the first portion of the first lead frame and a second light emitting device is disposed on the third portion of the second lead frame.

Abstract: A light source system comprising projection optics, which are capable of producing a far-field image of a light source. The light source comprises a fluorescent medium that when illuminated by light from laser emitters of a first waveband emits light of a second or more wavebands of longer wavelength. The resulting light emission produces a color perceived as white. The light source is illuminated by a plurality of laser emitters arranged to illuminate the light source in an array-like manner. Control of the output of one or more of the laser emitters results in a variation of the spatial emission distribution from the light source and hence a variation of the far-field beam spot distribution via non-mechanical means.

Abstract: The present invention relates to a compact optic lens for a high intensity light source having improved output beam characteristics. The compact optic lens provides increased light output without increasing device cost or device size to enable coverage of many beam angles.

Abstract: An organic light-emitting display device includes a first substrate and a second substrate; an organic light-emitting device disposed between the first and second substrates and includes a pixel electrode separately formed in each pixel, a common electrode, and an organic light-emitting layer disposed between the pixel electrode and the common electrode; and an electrode unit and at least one wiring unit that are disposed between the first substrate and the second substrate, the electrode unit including at least one thin-film transistor for transmitting a light-emitting signal to the pixel electrode and at least one capacitor, wherein an optical property modification layer obtained by modifying an optical property of at least one of the electrode unit and the wiring unit is formed on a surface of the at least one of the electrode unit and the wiring unit.

Abstract: Provided are a light emitting device, a method for fabricating the light emitting device, and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer under the first conductive type semiconductor layer, and a second conductive type semiconductor layer under the active layer, a conductive support member, and a protection member on the light emitting structure. The light emitting structure has a first width and a second width. A difference between the first width and the second width defines a stepped structure or an inclined structure. The protection member is disposed on the stepped or the inclined structure defined by the difference between the first and second widths of the light emitting structure.

Abstract: A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

Abstract: An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.

Abstract: There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member.

Abstract: A light emitting apparatus and a production method of the apparatus are provided that can emit light with less color unevenness at high luminance. The apparatus includes a light emitting device, a transparent member receiving incident light emitted from the device, and a covering member. The transparent member is formed of an inorganic material light conversion member including an externally exposed emission surface, and a side surface contiguous to the emission surface. The covering member contains a reflective material, and covers at least the side surfaces of the transparent member. Substantially only the emission surface serves as the emission area of the apparatus. It is possible to provide emitted light having excellent directivity and luminance. Emitted light can be easily optically controlled. In the case where each light emitting apparatus is used as a unit light source, the apparatus has high secondary usability.

Abstract: A light emitting module is disclosed. The light emitting module includes a lead frame body, lead frame, a heat spreader, an intermediate heat sink, and at least one light emitting element (LED). The lead frame body defines a cavity which accurately registers the heat spreader and includes optical or reflective walls surrounding the light emitting elements soldered on metallized traces of the heat spreader. The lead frame body encases and supports portions of the lead frame. The lead frame extends from outside the body into the cavity to accurately align with solder pads of the heat spreader. All the pre-aligned mechanical, thermal and electrical contacts are then soldered by solder reflow process under tight environmental control to prevent damage to the light emitting element. A robust, healthy 3-dimensional optical-electro-mechanical assembly having a very low thermal resistance in a thermal path from its light emitting element to its intermediate heatsink is created.

Abstract: A semiconductor light emitting element includes a semiconductor multilayer structure including a first conductive type layer, a second conductive type layer, and a light emitting layer sandwiched between the first conductive type layer and the second conductive type layer, and a reflecting layer formed on the second conductive type layer for reflecting the light emitted from the light emitting layer. The light is extracted in a direction from the light emitting layer toward the first conductive type layer. The first conductive type layer includes a concavo-convex region on a surface thereof not opposite to the light emitting layer, for changing a path of light, and at least a part of the reflecting layer is formed extending to right above an edge of the concavo-convex region.

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.

Abstract: A method for manufacturing a radiation-emitting component (1) in which a field distribution of a near field (101, 201) in a direction perpendicular to a main emission axis of the component is specified. From the field distribution of the near field, an index of refraction profile (111, 211, 511) along this direction is determined. A structure is determined for the component such that the component will have the previously determined index of refraction profile. The component is constructed according to the previously determined structure. A radiation-emitting component is also disclosed.

Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.

Abstract: Apparatuses and methods for producing light emitting devices maximizing luminous flux output are disclosed. In one possible embodiment, a light emitting device comprises a substrate and a reflective layer at least partially covering the substrate. The reflective layer is non-yellowing, and may be substantially light transparent. One or more light emitting diode (LED) chips are disposed on the substrate. The light emitting device may emit white light. The reflective layer may comprise a silicone carrier with light reflective particles dispersed in the silicone carrier. A light diffusion lens may also be disposed on the substrate and surrounding the LED chips. Furthermore, one or more microspheres, light scattering particles, and/or phosphor particles may be dispersed in the lens. In one possible method for producing a light emitting device, a substrate is provided.

Abstract: An optoelectronic semiconductor body (1) having an active semiconductor layer sequence (10) and a reflective layer system (20) is described. The reflective layer system (20) comprises a first radiation-permeable layer (21), which adjoins the semiconductor layer sequence (10), and a metal layer (23) on the side of the first radiation-permeable layer (21) facing away from the semiconductor layer sequence (10). The first radiation-permeable layer (21) contains a first dielectric material. Between the first radiation-permeable layer (21) and the metal layer (23) there is disposed a second radiation-permeable layer (22) which contains an adhesion-improving material. The metal layer (23) is applied directly to the adhesion-improving material. The adhesion-improving material differs from the first dielectric material and is selected such that the adhesion of the metal layer (23) is improved in comparison with the adhesion on the first dielectric material.

Abstract: In one aspect, there is an apparatus that comprises a plurality of light emitting chips that each have active areas that have elongated aspect ratios. This chips are mounted in a generally rectangular package. The chips are each arranged around a periphery of the package so that each narrow side of each chip abuts either a sidewall forming the periphery of the package or a long side another of the chips. Some of the chips receive a biasing voltage through one or more other of the chips.

Abstract: A housing for an optoelectronic component including a main housing body formed by a first plastics material, and which has a recess, and a coating formed by a second plastics material, and which, at least in a region of the recess, connects at least in places to the main housing body and is in direct contact with the main housing body, wherein the first plastics material is different from the second plastics material, and the first plastics material and the second plastics material differ from one another with regard to at least one of the following material properties: temperature resistance with regard to discoloration, temperature resistance with regard to deformation, temperature resistance with regard to destruction, and resistance to electromagnetic radiation.

Abstract: A light emitting device, comprising: a package which is formed of a resin and has a recess which is provided with a bottom face and two pairs of opposite inner walls surrounding the bottom face, the package having two pairs of opposite side walls made of the inner walls and corresponding outer walls; a lead frame exposed at the bottom face; a light emitting element which is provided on the lead frame; and a sealing resin provided in the recess for sealing the light emitting element, wherein the lead frame has a bottom plate portion and a reflector portion exposed along one of the pair of opposite inner walls, and a first angle between the reflector portion and the bottom face is greater than a second angle between another one of the pair of opposite inner walls which is opposite to the reflector portion and the bottom face, is provided.

Abstract: An object of the present invention is to provide a light emitting diode having a heterogeneous material structure and a method of manufacturing thereof, in which efficiency of extracting light to outside is improved by forming depressions and prominences configured of heterogeneous materials different from each other before or in the middle of forming a semiconductor material on a substrate in order to improve the light extraction efficiency.

Abstract: A semiconductor structure includes a temporary substrate; a first semiconductor layer positioned on the temporary substrate; a dielectric layer comprising a plurality of patterned nano-scaled protrusions disposed on the first semiconductor layer; a dielectric layer surrounding the plurality of patterned nano-scaled protrusions and disposed on the first semiconductor layer; and a second semiconductor layer positioned on the dielectric layer, wherein the top surfaces of the patterned nano-scaled protrusions are in contact with the bottom of the second semiconductor layer. An etching process is performed on the semiconductor structure to separate the first semiconductor layer and the second semiconductor layer, in order to detach the temporary substrate from the second semiconductor layer and transfer the second semiconductor layer to a permanent substrate.

Abstract: A liquid crystal polyester resin composition of the present invention comprises: 100 parts by mass of a liquid crystal polyester; and 50 to 150 parts by mass of titanium oxide, wherein the liquid crystal polyester comprises 2 to 30 mole % of a repeating structural unit represented by the following formula (1), and 40 to 80 mole % of a repeating structural unit represented by the following formula (2).

Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a wavelength conversion unit disposed on the substrate to cover at least an upper surface of the light emitting element; and a reflection unit formed to cover a side surface and a lower surface of the substrate and having a resin and a reflective filler dispersed in the resin. Light emitting devices having uniform characteristics can be obtained by minimizing a chromaticity distribution of white light with respect to the different light emitting devices.

Abstract: The present invention is a package for optical semiconductor devices, and an optical semiconductor device using the package, which can prevent discoloration of a plating layer formed on a lead frame even when a silicone resin is used as a sealing resin for an optical semiconductor device, and which enables high luminous efficiency for a long time. Specifically, in the package for semiconductor devices, a plating laminate 15, wherein a pure Ag plating layer 4, a thin reflective plating layer 6 serving as the uppermost layer for improving the light reflection ratio, and a resistant plating layer 5 serving as an intermediate layer therebetween and having chemical resistance against at least either metal chlorides or metal sulfides are laminated, is formed on at least the surface of a lead electrode. The reflective plating layer 4 is composed of a pure Ag thin film, and the resistant plating layer 5 is composed of a complete solid solution Au—Ag alloy plating layer.

Abstract: A ceramics substrate for mounting a light-emitting element includes a ceramic sintered body, the ceramic sintered body having a mounting section on which a light-emitting element is mounted, in a surface portion on a mounting section side of the ceramic sintered body, a ratio of crystal grains having a crystal grain size of 0.2 ?m to 1.0 ?m in equivalent circle diameter being in a range of 45% to 80%, a ratio of crystal gains having a crystal grain size of 2.0 ?m to 6.0 ?m in equivalent circle diameter being in a range of 5% to 15%, and a ratio of crystal grains having a crystal grain size of more than 6.0 ?m in equivalent circle diameter being 2.7% or less.

Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.