Abstract: A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material.

Abstract: A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes including first and second body portions and first and second lead out portions, respectively; first and second external electrodes formed on one surface of the ceramic body, respectively; and an insulating layer formed on one surface of the ceramic body and covering exposed portions of the first and second lead out portions, wherein inner connection portions between the first and second body portion and the first and second lead out portions may have a concave curved surface, respectively.

Abstract: A multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; a first internal electrode formed within the ceramic main body, including a capacitance formation part having an overlap region to form capacitance and a first lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; a second internal electrode alternately laminated together with the first internal electrode, having a second lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; first and second external electrodes; and insulating layers.

Abstract: A multilayer ceramic condenser includes a multilayer main body, a first outer electrode, a second outer electrode, a first side part and a second side part. The multilayer main body has a first side, a second side, a third side and a fourth side. The multilayer main body includes a plurality of inner electrodes and a dielectric layer between the inner electrodes. The dielectric layer is formed by a first ceramic dielectric powder. The first side part and the second side part are formed on the second side and the fourth side of the multilayer main body, and formed by a second ceramic dielectric powder having a smaller particle diameter than the first ceramic dielectric powder. A mean grain size of the first side part or the second side part is similar to or smaller than that of the dielectric layer of the multilayer main body.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to the third and fourth end surfaces, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive glass layers; first and second conductive resin layers containing copper and an epoxy; and first and second insulating layers.

Abstract: A metallized film capacitor includes first and second metal electrodes, a dielectric film disposed between the first and second metal electrodes, and first and second external electrodes which are connected to the first and second metal electrodes, respectively. At least one of the first metal electrode and the second metal electrode comprises magnesium. The magnesium is distributed unevenly in the at least one of the first metal electrode and the second metal electrode.

Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrodes facing each other while having the dielectric layer disposed therebetween, and alternately exposed to end surfaces of the ceramic body; first and second external electrodes electrically connected to the first and second internal electrodes, wherein each of the first and second external electrodes includes a first external electrode layer formed of material containing copper and glass and extending from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body; a second external electrode layer formed of material containing glass, disposed on the first external electrode layer, and being shorter than the first external electrode layer to expose portion of the first external electrode layer; and a third external electrode layer formed of material containing copper and glass and covering the first and second external electrode layers.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a dielectric layer laminated on the magnetic substrate; an external electrode formed on the dielectric layer in such a way that one surface thereof is exposed to an outside; a conductive pattern formed on a surface of the dielectric layer so as to be located on a same plane as the external electrode and having one end thereof connected with the external electrode; an insulator film formed on a surface of the conductive pattern; and a magnetic layer formed on the insulator film so as to cover an upper surface and a lateral surface of the conductive pattern.

Abstract: There is provided a multi-layered ceramic capacitor including: a ceramic body formed by multi-layering a plurality of dielectric layers; a plurality of first and second internal electrodes including at least one side exposed through edges of the dielectric layer; upper and lower cover layers formed at upper and lower portions of the ceramic body, respectively; first and second external electrodes formed to be spaced apart from each other at a lower surface of the lower cover layer; first and second connecting electrodes contacting outer peripheral surfaces of a plurality of second and first margin to connect exposed portions of the plurality of first and second internal electrodes, respectively; and an insulating side part formed so as to cover lateral surfaces at which the first and second internal electrodes are exposed.

Abstract: A metal-insulator-metal (MIM) capacitor using barrier layer metallurgy and methods of manufacture are disclosed. The method includes forming a bottom plate of a metal-insulator-metal (MIM) capacitor and a bonding pad using a single masking process. The method further includes forming a MIM dielectric on the bottom plate. The method further includes forming a top plate of the MIM capacitor on the MIM dielectric. The method further includes forming a solder connection on the bonding pad.

Abstract: A microwave resonator with impedance jump, comprises at least one line of high characteristic impedance of a determined length and one line of low characteristic impedance, at least the line of high characteristic impedance comprising a first line cut, a first link wire of a first determined impedance ensuring an electrical link for the passage of the signal from one side to the other of the first line cut. A method for producing a microwave resonator comprising an adjustment step is also provided.

Abstract: There are provide a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, inner electrodes formed in the multilayer body and formed to be spaced apart from the third side or the fourth side by a predetermined distance, groove portions formed on at least one of top and bottom surfaces of the multilayer body and formed parallel to the third or fourth side by a predetermined distance from the third side or the fourth side, and outer electrodes extended from the third side and the fourth side to the top surface or the bottom surface of the multilayer body to cover the groove portions.

Abstract: There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes: a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; first and second internal electrodes stacked to face one another, with the dielectric layer interposed therebetween, within the ceramic body; and insulating layers formed on both lateral surfaces of the ceramic body and having a thickness less than that of the ceramic body, wherein when the sum of the width of the ceramic body and widths of the insulating layers is defined as Wb, 0.90?W/Wb?0.97 is satisfied.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out parts, respectively; and a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out parts, wherein the first and second lead-out parts are formed to have concave-convex portions alternating with each other in the overlap area therebetween.

Abstract: The present invention provides an artificial microstructure including a first metal wire, a second metal wire parallel to the first metal wire, at least one first metal wire branch and at least one second metal wire branch. The at least one first metal wire branch and the at least one second metal wire branch are distributed in an interlacement arrangement. One end of the at least one first metal wire branch is connected to the first metal wire; the other end is a free end facing towards the second metal wire. One end of the at least one second metal wire branch is connected to the second metal wire, and the other end of the at least one second metal wire is a free end facing towards the first metal wire. The present invention also discloses a metamaterial with the artificial microstructures.

Abstract: Apparatus and methods related to negative differential resistance (NDR) are provided. An NDR device includes a spaced pair of electrodes and at least two different materials disposed there between. One of the two materials is characterized by negative thermal expansion, while the other material is characterized by positive thermal expansion. The two materials are further characterized by distinct electrical resistivities. The NDR device is characterized by a non-linear electrical resistance curve that includes a negative differential resistance range. The NDR device operates along the curve in accordance with an applied voltage across the pair of electrodes.

Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including dielectric layers, and first and second internal electrodes formed within the ceramic body and disposed to face each other having the respective dielectric layers interposed therebetween, wherein in a cross-section of the ceramic body in a length-thickness (L-T) direction, when an area of non-electrode regions in cover part internal electrodes among the first and second internal electrodes is defined as Acover and an area of non-electrode regions in center part internal electrodes among the first and second internal electrodes is defined as Acenter, a ratio of Acenter to Acover satisfies 0.33?Acenter/Acover?0.95.

Abstract: A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region.

Abstract: A method to leach a component that includes a polycrystalline structure. The method includes obtaining the component having the polycrystalline structure. The polycrystalline structure includes catalyst material deposited therein. The method also includes performing a leaching process on the polycrystalline structure to an intermediate leaching depth. The leaching process removes at least a portion of the catalyst material from the polycrystalline structure and forms one or more by-product materials deposited therein. The method also includes performing a cleaning process on the polycrystalline structure, which removes at least a portion of the by-product materials. The leaching process and the cleaning process are iteratively continued until the intermediate leaching depth reaches a desired leaching depth, both of which are measured from one end of the polycrystalline structure. The desired leaching depth is greater than at least one intermediate leaching depth.

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers having an average thickness of 0.6 ?m or less; and first and second internal electrodes, wherein the ceramic body includes a capacitance formation part and a non-capacitance formation part provided on at least one surface of upper and lower surfaces of the capacitance formation part, and when the capacitance formation part is divided into three regions in a thickness direction of the ceramic body, in a central region among the three regions, dielectric grains have an average particle size of 150 nm or less, and the number of dielectric grains per layer is 4 or more, and in upper and lower regions, dielectric grains have an average particle size of 200 nm or less, respectively, and the number of dielectric grains per layer is 3 or more.

Abstract: There is disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposite to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed in the multilayer body and having distal edges exposed to the first side or the second side, first and second side members formed on the first and second sides to cover the distal edges of the plurality of inner electrodes, and outer electrodes formed on the third side and the fourth side to be electrically connected to the inner electrodes. An angle between a virtual line connecting the distal edges of the plurality of inner electrodes and the first side member or the second side member is less than 90° (?/2).

Abstract: A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition.

Abstract: The present invention provides an inter-bus-bar built-in capacitor capable of reducing the size of a capacitor used in an inverter or the like or downsizing the capacitor, and provides power equipment as well as a power converting apparatus. The inter-bus-bar built-in capacitor is provided between a pair of opposing bus bars and includes a high-dielectric-constant material which has a relative dielectric constant of at least 50 when a voltage of 1,000 V is applied at a temperature of 25° C. Thus, it is possible to provide the inter-bus-bar built-in capacitor capable of reducing the size of a capacitor used in an inverter or the like or downsizing the capacitor and provide the power equipment as well as the power converting apparatus.

Abstract: A resonant circuit and an antenna device achieve a low resonance frequency without increasing a coil size, and improve communication performance. In the resonant circuit, two coil-shaped conductors are arranged so as to be opposed to each other with a dielectric sheet interposed therebetween. The two coil-shaped conductors are, at the opposed portions thereof, coupled with a capacitance interposed therebetween, and wound so that electric currents flowing through the respective conductors trend in the same direction in a planar view. The opposed area in at least a portion of the outermost windings and/or innermost windings of the coil-shaped conductors is larger as compared with the opposed area in any other winding, and the respective ends of the conductors define power feeding units.

Abstract: A metal substrate with a slot therein forms a slot antenna, the slot having a major axis and a minor axis. A dielectric layer has a plurality of terminals disposed on or in the dielectric layer and the layer is attached on one surface of the substrate. The terminals of a non-linear device, such as a diode, are connected to corresponding terminals of the dielectric layer. The non-linear device is positioned proximate the slot and is substantially aligned with a minor axis of the slot. A transmission line feeds an RF signal to the non-linear device that in turn frequency multiplies the RF signal to an RF signal that is radiated by the slot antenna. The dielectric layer is positioned in the slot such that the radiated RF signal has a desired output power. A protective layer is applied to the other surface of the substrate to cover the slot.

Abstract: One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The electrical bushing includes a holding element to hold the electrical bushing in or on the housing. The conducting element is set-up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The holding element is made, to at least 80% by weight with respect to the holding element, from a material selected from the group consisting of a metal from any of the subgroups IV, V, VI, VIII, IX, and X of the periodic system.

Abstract: A manufacturing method for an electronic component forms with a high degree of accuracy a portion of an outer electrode on a main surface of a dielectric block. Light irradiated from a second main surface side is detected by a detector disposed on a first main surface side, thereby detecting the positions of first and second inner electrodes, and a conductive layer is formed in a portion on a first main surface, determined based on the detection result by the detector, thereby forming first portions of individual first and second outer electrodes.

Abstract: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.

Abstract: Disclosed herein are an ultra thin film capacitor and a manufacturing method thereof. According to an exemplary embodiment of the present invention, there is provided an ultra thin film capacitor including: a substrate; a dielectric unit formed of thin film dielectric layers alternately stacked with a plurality of internal electrode layers on the substrate; an internal electrode unit formed of the plurality of internal electrode layers alternately stacked with the thin film dielectric layers in the dielectric unit on the substrate, the internal electrode layer including first electrode layers and a second electrode layer made of material having a specific resistance lower than that of the first electrode layer; and via electrodes formed at both sides of the internal electrode unit on the substrate and each being electrically connected alternately with the stacked internal electrode layers. Further, the manufacturing method thereof is proposed.

Abstract: A multilayer ceramic capacitor includes a multilayer body including a plurality of stacked dielectric layers including a dielectric ceramic that includes a plurality of crystal grains and a plurality of internal electrodes disposed at a plurality of interfaces between the dielectric layers, and external electrodes. The multilayer body includes a Ba and Ti containing perovskite compound, La, Mg, Mn and Al, and satisfies conditions such that in a case in which a content of Ti is set to 100 molar parts, a fraction of each content of La, Mg, Mn and Al relative to the content of Ti is such that La is about 0.2 to about 1.2 molar parts, Mg is about 0.1 molar part or less, Mn is about 1.0 to about 3.0 molar parts and Al is about 0.5 to about 2.5 molar parts, and an average number of crystal grains included in each of the dielectric layers in the stacking direction is one or more to three or less.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; and first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having at least one of the dielectric layers interposed therebetween. The second internal electrode may include a space part disposed to be adjacent to a portion thereof exposed to one end surface of the ceramic body so as to be not overlapped with the first internal electrode in the space part.

Abstract: A thin film capacitor and a method of manufacturing the same are provided. The thin film capacitor includes a metal foil, dielectric layers and internal electrode layers alternately disposed on the metal foil, and a top electrode layer on the topmost layer among the two or more dielectric layers. These layers have peripheries that define an outer profile flaring toward the metal foil as viewed from the stacking direction of the thin film capacitor, and at least one dielectric layer of two or more dielectric layers satisfies a relationship B>A>0 wherein A is a gap of the periphery of the internal electrode layer directly below the dielectric layer protruding from the periphery of the dielectric layer, and B is a gap of the periphery of the dielectric layer protruding from the periphery of the internal electrode layer or the top electrode layer directly above the dielectric layer. The thin film capacitor has a structure free from short-circuiting and reducing debris of broken dielectric material.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.

Abstract: In one embodiment, a system, comprising: a first non-magnetic conductive electrode; a second non-magnetic conductive electrode; a dielectric layer disposed between the first and second electrodes, the dielectric layer extending between the first and second electrodes; and first and second layers comprising plural pairs of magnetically coupled pairings of discrete magnets, the first and second layers separated by a non-magnetic material, wherein the magnets of at least the first layer are conductively connected to the first non-magnetic conductive electrode.

Abstract: A process for producing anodes includes providing a foil comprising tantalum or niobium. A surface of the foil is oxidized so as to form oxides on the foil surface. The foil is heated so that the oxides formed on the foil surface diffuse into the foil. A paste comprising a powder selected from the group consisting of a tantalum powder, a niobium powder, a niobium oxide powder and mixtures thereof is applied to the foil. The foil with the applied paste is sintered.

Abstract: There are provided a multilayer ceramic electronic component to be embedded in a board and a manufacturing method thereof, and particularly, a multilayer ceramic electronic component to be embedded in a board, in which a thickness of a ceramic body in an entire chip is increased by not allowing for an increase in a thickness of an external electrode while forming a band surface of the external electrode to have a predetermined length or greater for connecting the external electrode to an external wiring through a via hole, such that chip strength may be improved and the occurrence of damage such as breakage, or the like may be prevented, and a manufacturing method thereof, may be provided.

Abstract: A multi-layer capacitor includes an anode, a cathode, a dielectric material, a first endcap, and a second endcap. The anode and cathode are formed of one or more layers of interlaced conductive material. The dielectric material is interposed between each of the layers of the anode and the cathode. The first and second endcaps configured to interconnect each of the layers of the anode and cathode, respectively. The endcaps are formed of conductive nano material. A method of forming an endcap of a capacitor configured to interconnect one or more layers of conductive material includes the step of applying conductive nano material to exposed conductive surfaces of at least one of an anode and a cathode of the one or more layers of conductive material. The method also includes the step of exposing the nano material to a source of energy effective to initiate self-sintering of the nano material.

Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition are disclosed. The method generally includes the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. The methods provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein when it is defined that a thickness of a band of the first and second external electrodes is T1 and a thickness of the ceramic body is T2, a ratio (T1/T2) of the thickness of the band of the first or second external electrode to the thickness of the ceramic body is equal to or less than 0.18.

Abstract: A fabrication method for parallel-plate structures and a parallel-plate structure arrangement, wherein the structures have a middle layer, grown on a substrate and disposed between top and bottom electrode layers, wherein the middle layer and the top and bottom electrode layers are deposited on a bottom substrate, and wherein the middle layer is grown first and the top and bottom electrodes are essentially deposited afterwards.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed within the ceramic body, having the dielectric layer interposed therebetween, wherein, on a cross section of the ceramic body in a width-thickness direction thereof, when a distance between an uppermost internal electrode and a lowermost internal electrode measured at centers thereof in a width direction thereof is defined as a and a distance between the uppermost internal electrode and the lowermost internal electrode measured at edges thereof in the width direction thereof is defined as b, 0.953?a/b?0.996 is satisfied.

Abstract: There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 ?m?Te?1.0 ?m, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%?S?98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98.

Abstract: There is provided a multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the double side surfaces facing each other in a width direction, having the dielectric layers therebetween, and first and second external electrodes formed on the surfaces of the ceramic body in the width and thickness directions and electrically connected to the first and second internal electrodes, wherein when a length of the ceramic body is defined as L and a width of the ceramic body is defined as W, a ratio L/W of the length L to the width W of the ceramic body satisfies 1.39?L/W?2.12.

Abstract: Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. Organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Transition metal salts as salt or oxide matrices are formed at low temperatures utilizing mild reducing agents.

Abstract: Tunable MEMS resonators having adjustable resonance frequency and capable of handling large signals are described. In one exemplary design, a tunable MEMS resonator includes (i) a first part having a cavity and a post and (ii) a second part mated to the first part and including a movable layer located under the post. Each part may be covered with a metal layer on the surface facing the other part. The movable plate may be mechanically moved by a DC voltage to vary the resonance frequency of the MEMS resonator. The cavity may have a rectangular or circular shape and may be empty or filled with a dielectric material. The post may be positioned in the middle of the cavity. The movable plate may be attached to the second part (i) via an anchor and operated as a cantilever or (ii) via two anchors and operated as a bridge.

Abstract: A method of manufacturing a variable capacitor includes forming a capacitor conductor. The method also includes forming a phase change material adjacent the capacitor conductor. The method further includes forming a first contact on the capacitor conductor. The method additionally includes forming a second contact and a third contact on the phase change material.

Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes a plurality of holes. An average opening diameter of the plurality of holes is not greater than about 2.5 ?m. Some or all of the plurality of holes are embedded with the metal component of the outer external electrode.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.