Including Measuring Or Testing Of Device Or Component Part Patents (Class 29/593)
  • Patent number: 7939770
    Abstract: An integral type second lever constituting member (A) is mounted on a constitution, in which a first lever member (5) is assembled in a Roberval's mechanism composed of a stationary block (1), a floating frame (2) and upper and lower sub-levers (3, 4). The integral type second lever constituting member (A) is mounted by mounting a force point portion (9) and a fulcrum portion (8) on the Roberval's mechanism through screw-fastened holes (8a, 9a), thereby to assemble a load measuring mechanism as a whole. At the screw-fastening time, the turning torque of the screw is supported by a connecting portion (10), and this connecting portion (10) is removed after the integral type second lever constituting member (A) was mounted. In the load measuring mechanism of an electronic balance, the second lever member can be mounted easily and reliably.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: May 10, 2011
    Assignee: A & D Company, Limited
    Inventors: Naoto Izumo, Satoshi Suzaki
  • Publication number: 20110099796
    Abstract: A machine and a method for a processing machine for longitudinal objects, in particular for cables and wires, which permits the reliable identification of a cable, a wire or another profile material inserted into the processing machine. On the basis of the identification of the cable, wire or profile material, the machine or the method determines the coordinated processing parameters in an automatic or automated manner. The processing parameters thus determined can subsequently be used without problems for automatic or automated actuation of the processing machine for processing the inserted cables, wires or profile materials.
    Type: Application
    Filed: June 10, 2009
    Publication date: May 5, 2011
    Applicant: SCHLEUNIGER HOLDING AG
    Inventors: Michael Jost, Jorn Rohrbach, Christoph Heinger
  • Patent number: 7934879
    Abstract: A camera module includes a lens module, an image sensor, a circuit board for supporting the image sensor, and a lens holder for connecting the lens module and the circuit board. A method for fabricating the camera module includes the following steps. Firstly, at least one cleaning hole is created in the lens holder, and the at least one cleaning hole is filled with a removable sealing stuff. Then, the printed circuit board, the image sensor, the lens holder and the lens module of the camera module are combined together. Then, a testing procedure is performed to detect whether any pollutant is present within the assembled camera module. Once any pollutant within the assembled camera module is detected, the sealing stuff is removed from the at least one cleaning hole, a cleaning procedure is done to remove the pollutant, and the at least one cleaning hole is sealed again.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: May 3, 2011
    Assignee: Primax Electronics Ltd.
    Inventors: Hsiang-Kai Liao, Po-Chun Chang
  • Publication number: 20110098594
    Abstract: A method for scaling the impedance measured during the course of an electrophysiology study accounts for impedance drifts. By scaling the impedance there is greater assurance that previously recorded positional information can be used to accurately relocate an electrode at a prior visited position. The scale factor may be based upon a mean value across several sensing electrodes. Alternatively, the scale factor may be calculated specifically with respect to an orientation of a dipole pair of driven electrodes.
    Type: Application
    Filed: January 7, 2011
    Publication date: April 28, 2011
    Inventor: John A. Hauck
  • Publication number: 20110089973
    Abstract: A semiconductor device includes a plurality of core chips and an interface chip stacked together. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and a bidirectional buffer circuit that drives the through silicon vias. The interface chip also includes a logic-level holding circuit that holds a logic level of the through silicon vias. The bidirectional buffer circuit includes an input buffer and an output buffer. The driving capability of a first inverter of the logic-level holding circuit is smaller than the driving capability of the output buffer of the bidirectional buffer circuit.
    Type: Application
    Filed: October 8, 2010
    Publication date: April 21, 2011
    Applicant: Elpida Memory, Inc.
    Inventor: Chikara Kondo
  • Publication number: 20110086255
    Abstract: Battery packs having electrically insulating material between conductive surfaces of electrical components are described herein. In some embodiments, a battery pack includes a battery cell with a first conductive surface, an electrically conductive member with a second conductive surface, and electrically insulating material positioned between the first and second conductive surfaces. The electrically insulating material has at least one passage that enables the first and second conductive surfaces to be electrically connected. For example, the passage in the electrically insulating material may be formed by, during, or as a result of a process in which the first and second conductive surfaces are attached, such as by a welding process that both ablates a portion of the electrically insulating material to form the through passage and that physically joins the first and second conductive surfaces, thereby creating an electrical connection therebetween.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 14, 2011
    Applicant: Micro Power Electronics, Inc.
    Inventors: Thomas P. Maxwell, Eric Petterson
  • Publication number: 20110078894
    Abstract: A method of adjustment on manufacturing of a monolithic oscillator including circuit elements and a BAW resonator, this method including the steps of: a) forming the circuit elements and the resonator and electrically connecting them; b) covering the resonator with a frequency adjustment layer; c) measuring the output frequency of the oscillator; d) modifying the thickness of the frequency adjustment layer to modify the output frequency of the oscillator.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 7, 2011
    Applicant: STMICROELECTRONICS SA
    Inventors: Pierre Bar, Sylvain Joblot, Jean-Francois Carpentier
  • Publication number: 20110078895
    Abstract: A method of manufacturing a wiring substrate includes forming a conducting layer on a first insulating layer including a first glass cloth; forming a photosensitive resist layer on the conducting layer; recognizing a first origin position on the first insulating layer; forming a mask on the resist layer by positioning the mask with respect to the first origin position, the mask being formed so as to position wiring patterns only on positions overlapping the first glass cloth in a planar view; and exposing the resist layer via the mask and forming the wiring patterns only on the positions overlapping the first glass cloth in the planar view.
    Type: Application
    Filed: October 4, 2010
    Publication date: April 7, 2011
    Applicant: FUJITSU LIMITED
    Inventor: Makoto SUWADA
  • Publication number: 20110080687
    Abstract: A method of adjustment in the manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the capacitance between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 7, 2011
    Applicant: STMICROELECTRONICS SA
    Inventors: Pierre Bar, Sylvain Joblot, David Petit
  • Patent number: 7918012
    Abstract: A sensor, and methods of making, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The sensor is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: April 5, 2011
    Assignee: Abbott Diabetes Care Inc.
    Inventors: Yi Wang, Benjamin J. Feldman
  • Publication number: 20110061225
    Abstract: A manufacturing apparatus for an electronic component includes a plurality of press members contacting a housing of a connector, pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, and provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit provided to the respective arm sections and adapted to measure a stress generated when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.
    Type: Application
    Filed: September 15, 2010
    Publication date: March 17, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Shunsuke Sone, Hirokazu Yamanishi
  • Publication number: 20110066396
    Abstract: A sensor device includes: a sensor module mounted on a conductor board; a sensitive element which is sensitive to a variable; a self-test control unit implementing a self-test program, the self-test control unit applying a self-test variable to the sensitive element, taking the self-test program into account; a detection unit detecting a characteristic of the sensitive element which is altered as a result of the applied self-test variable and providing an actual self-test response, taking the altered characteristic into account; and a comparator unit provided on or in the sensor module, the comparator unit comparing the actual self-test response to at least one specified setpoint self-test response and providing comparative information.
    Type: Application
    Filed: July 9, 2010
    Publication date: March 17, 2011
    Inventors: Patrick Goerlich, Riad Stefo, Wolfram Bauer, Rainer Willig, Burkhard Kuhlmann, Mathias Reimann, Ermin Esch, Michael Baus, Gregor Wetekam, Michael Veith, Emma Abel, Wolfgang Fuerst
  • Publication number: 20110066212
    Abstract: A TANK filter is provided for a lead wire of an active medical device (AMD). The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the TANK filter to attenuate current flow through the lead wire along a range of selected frequencies. In a preferred form, the TANK filter is integrated into a TIP and/or RING electrode for an active implantable medical device.
    Type: Application
    Filed: November 3, 2010
    Publication date: March 17, 2011
    Applicant: GREATBATCH LTD.
    Inventors: Robert A. Stevenson, Warren S. Dabney, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20110063887
    Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array, and a control circuit. The memory cell array includes plural memory cells arranged in rows and columns and each including a diode and resistance-change element. The control circuit tests the diodes for the respective memory cells. The control circuit tests the diode at least at one of times before and after one of a write operation, erase operation and read operation with respect to the memory cell is performed.
    Type: Application
    Filed: August 23, 2010
    Publication date: March 17, 2011
    Inventor: Kazushige KANDA
  • Patent number: 7905666
    Abstract: An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: March 15, 2011
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Tokihiro Terashima, Hiroshi Wada
  • Publication number: 20110047782
    Abstract: In a combination of, for example, a rotor having eight magnetic poles and a stator having twelve slots and pulsating components of permeance, which generate a sinusoidal cogging torque having maxima of the same number as the number of poles of the rotor, pressurizing parts arranged in predetermined positions, applying a force at an outer periphery of the stator and directed inwardly cancels the pulsating components of the cogging torque.
    Type: Application
    Filed: November 10, 2010
    Publication date: March 3, 2011
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Yukari Toide, Akihiro Daikoku, Masatsugu Nakano, Hideaki Arita, Shinichi Yamaguchi, Moriyuki Hazeyama, Takashi Yoshioka, Tomohiro Kikuchi, Katsumi Hayami, Takashi Miyazaki
  • Publication number: 20110041317
    Abstract: Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.
    Type: Application
    Filed: November 2, 2010
    Publication date: February 24, 2011
    Applicant: Micron Technology, Inc.
    Inventor: Thomas Kinsley
  • Patent number: 7891078
    Abstract: A method of improving efficiency of manufacturing a vacuum electronic device, includes placing sensors on the device's interior during its construction and obtaining a first measured characteristic value; comparing the first measured characteristic value with a desired characteristic value; determining whether the first measured characteristic value is within a predetermined percentage of the desired characteristic value; adjusting a component of the device and measuring the characteristic of the device to obtain a second measured characteristic, comparing the second measured characteristic value with a desired characteristic value, determining whether the second measured characteristic value is within a predetermined percentage of the desired characteristic value; and repeating the previous step until the second measured characteristic value is within the predetermined percentage of the desired characteristic value.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: February 22, 2011
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Ayax D. Ramirez, Stephen D. Russell
  • Publication number: 20110035932
    Abstract: Disclosed herein is an electrical component comprising a segment having a diameter in the range of about 1 micrometers to about 10 cm, the segment comprising a plurality of non-metallic, resistive fibers in a non-metallic binder. The segment is precisely trimmed to impart to the segment an electrical resistance within 1% of the desired resistance value. A manufacturing system and methods of manufacturing components having precise specifications also are disclosed.
    Type: Application
    Filed: October 27, 2010
    Publication date: February 17, 2011
    Applicant: XEROX CORPORATION
    Inventors: Joseph A. Swift, Stanley J. Wallace, Richard W. Seyfried, Kathleen A. Feinberg, Roger L. Bullock
  • Publication number: 20110032036
    Abstract: A multi-chip system in which at least one of the chips includes a performance parameter encoded thereon. After system assembly, the performance parameter can be obtained by a companion chip and used to automatically or semi-automatically fine tune the companion chip to the specific parameters of the at least one chip.
    Type: Application
    Filed: October 20, 2010
    Publication date: February 10, 2011
    Applicants: STMicroelectronics, Inc., STMicroelectronics S.r.l.
    Inventors: Giorgio Pedrazzini, Sandro Cerato, Alberto Salina
  • Publication number: 20110025171
    Abstract: There is provided a method for testing a piezoelectric/electrostrictive actuator, wherein the displacement of a piezoelectric/electrostrictive actuator is estimated on the basis of the relations between one or more frequency characteristic values selected from the group consisting of the heights and areas of the peaks of the resonance waveforms and the difference of the maximum and minimum of the first order or first to higher orders of the resonance frequency characteristic values of the piezoelectric/electrostrictive actuator and the k-th order (k=1 to 4) of the first or first to higher orders of resonance frequencies. According to this piezoelectric/electrostrictive actuator testing method, a piezoelectric/electrostrictive actuator can be tested with high precision without actually driving the same as a product and without being accompanied by any disassembly/breakage.
    Type: Application
    Filed: October 15, 2010
    Publication date: February 3, 2011
    Applicant: NGK Insulators, Ltd.
    Inventors: Naoki Goto, Takao Ohnishi
  • Publication number: 20110026938
    Abstract: The present invention relates generally to optical rotary joints (35) for enabling optical communication between a rotor and a stator, improved methods of mounting such optical rotary joints on supporting structures such that the rotor and stator remain properly aligned, and to improved optical reflector assemblies for use in such optical rotary joints.
    Type: Application
    Filed: April 28, 2006
    Publication date: February 3, 2011
    Applicant: MOOG INC.
    Inventors: K. Peter Lo, Noris E. Lewis, Heath E. Kouns, Martin J. Oosterhuis
  • Patent number: 7866026
    Abstract: A sensor, and methods of making, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The sensor is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: January 11, 2011
    Assignee: Abbott Diabetes Care Inc.
    Inventors: Yi Wang, Benjamin J. Feldman
  • Publication number: 20110002153
    Abstract: The invention relates to a method for making a stack of memory circuits, wherein the method includes the step of testing the validity of at least two memory circuits. According to the invention, the method includes the phase of configuring each memory circuit, the configuration phase including the step of writing, within a configuration device of each memory circuit included in the stack, a piece of information on an identifier allocated to the memory circuit in the stack, and a piece of information on the results of the validity test of the memory circuit. The invention also relates to a method for addressing a memory circuit, to a stack of memory circuits, and to an electronic device including such a stack.
    Type: Application
    Filed: February 23, 2009
    Publication date: January 6, 2011
    Applicant: GEMALTO SA
    Inventors: Pierre Gravez, Michel Thill
  • Publication number: 20100325872
    Abstract: Razor handles are provided for razors having a battery-powered functionality. Methods of manufacturing such handles are also provided. In one implementation, the handle includes a unitary grip portion constructed to receive a razor head at one end thereof, and a battery cover, mounted on the grip portion. The grip portion and the battery cover, when joined, may together define a water-tight unit prior to mounting of the razor head on the grip portion.
    Type: Application
    Filed: September 2, 2010
    Publication date: December 30, 2010
    Inventors: Fred Schnak, Luis Burrel, Stefan Rehbein, Gerrit Rönneberg, Uwe Schaaf, Evan Pennell, Patrick F. McNally, Thomas Hoppenstedt, Keith A. Swenson
  • Publication number: 20100319184
    Abstract: A method of collective fabrication of remotely interrogatable sensors, each sensor comprising at least one first resonator and one second resonator, each resonator comprising acoustic wave transducers designed such that they exhibit respectively a first and a second operating frequency, is provided.
    Type: Application
    Filed: June 21, 2010
    Publication date: December 23, 2010
    Applicant: SENSEOR
    Inventors: Jean-François Leguen, Luc Chommeloux
  • Publication number: 20100322024
    Abstract: A plurality of memory blocks includes real memory cells and redundancy memory cells, are accessed independently during a normal operation mode, and are accessed simultaneously during a test mode in order for common data to be written to the plurality of memory blocks. A block control unit selects the plurality of memory blocks irrespective of a block address signal in order to execute a compression test. During the test mode, a redundancy access unit simultaneously accesses the redundancy memory cells of the plurality of memory blocks when a forced redundancy signal supplied to a block address terminal indicates first level. Therefore, the redundancy memory cells of the plurality of memory blocks may simultaneously access and test without providing any special terminal. As a result, before a defect is relieved, an operation test of the redundancy memory cells may efficiently execute, which may shorten the test time.
    Type: Application
    Filed: August 5, 2010
    Publication date: December 23, 2010
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventor: Yoshimasa YAGISHITA
  • Publication number: 20100315717
    Abstract: This invention discloses a low cost method to manufacture electrooptic devices at low cost and discloses materials that may be used in fabrication of electrooptic devices.
    Type: Application
    Filed: June 15, 2010
    Publication date: December 16, 2010
    Inventors: Anoop Agrawal, Juan Carlos Lopez Tonazzi
  • Patent number: 7849581
    Abstract: Provided are fabrication, characterization and application of a nanodisk electrode, a nanopore electrode and a nanopore membrane. These three nanostructures share common fabrication steps. In one embodiment, the fabrication of a disk electrode involves sealing a sharpened internal signal transduction element (“ISTE”) into a substrate, followed by polishing of the substrate until a nanometer-sized disk of the ISTE is exposed. The fabrication of a nanopore electrode is accomplished by etching the nanodisk electrode to create a pore in the substrate, with the remaining ISTE comprising the pore base. Complete removal of the ISTE yields a nanopore membrane, in which a conical shaped pore is embedded in a thin membrane of the substrate.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: December 14, 2010
    Assignee: University of Utah Research Foundation
    Inventors: Henry S. White, Bo Zhang, Ryan J. White, Eric N. Ervin, Gangli Wang
  • Publication number: 20100293777
    Abstract: Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.
    Type: Application
    Filed: August 2, 2010
    Publication date: November 25, 2010
    Inventors: Chris Savarese, Noel H.C. Marshall, Lauro C. Cadorniga, Susan McGill, Harold W. Ng
  • Patent number: 7832079
    Abstract: The invention relates to a vacuum interrupter chamber and a method for producing the same according to the preambles of patent claims 1 and 3. In order here to improve a vacuum interrupter chamber of this type and a method for producing the same and the subsequent casting to the extent that the advantages described above are utilized but the disadvantages described are avoided, it is proposed according to the invention that, in preparation for later casting, the vacuum interrupter chamber (1) is provided on the outer surface with a protective sheath (2) consisting of an elastic or elastomeric or plastomeric material, which is applied to the surface of the vacuum interrupter chamber without further expanding mechanical aids by heat shrinkage alone.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: November 16, 2010
    Assignee: ABB Technology AG
    Inventors: Oliver Claus, Hartmut Mildes, Till Rümenapp
  • Publication number: 20100281685
    Abstract: In a displacement detecting method, displacement between a strip-shaped electrode (13) and the strip-shaped separator (14) is detected. The strip-shaped separator (14) is semitransparent. In the method, first, the strip-shaped electrode (13) is photographed through the strip-shaped separator (14) at a position where the strip-shaped electrode (13) and the strip-shaped separator(14) are stacked (photographing step). Based on an image photographed in the photographing step, displacement between the strip-shaped electrode (13) and the strip-shaped separator (14) is detected (displacement detecting step). In a displacement amount measuring method of measuring the displacement amount, the displacement amount between the strip-shaped electrode (13) and the strip-shaped separator (14) is calculated based on the image photographed in the photographing step.
    Type: Application
    Filed: December 12, 2008
    Publication date: November 11, 2010
    Inventors: Hideki Hori, Kenji Tsuchiya, Masataka Takeda
  • Patent number: 7827660
    Abstract: A bimorphic structure responsive to changes in an environmental condition, sensor structures incorporating one or more of such bimorphic structures, and a method of forming such bimorphic structures. The sensor structure has an electrically-conductive first contact on a substrate, and a bimorph beam anchored to the substrate so that a portion thereof is suspended above the first contact. The bimorph beam has a multilayer structure that includes first and second layers, with the second layer between the first layer and the substrate. A portion of the first layer projects through an opening in the second layer toward the first contact so as to define an electrically-conductive second contact located on the beam so as to be spaced apart and aligned with the first contact for contact with the first contact when the beam sufficiently deflects toward the substrate.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: November 9, 2010
    Assignee: Evigia Systems, Inc.
    Inventors: Bishnu Prasanna Gogoi, Navid Yazdi
  • Patent number: 7829793
    Abstract: An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: November 9, 2010
    Assignee: Magnecomp Corporation
    Inventors: Christopher Schreiber, Christopher Dunn
  • Publication number: 20100267265
    Abstract: Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.
    Type: Application
    Filed: April 19, 2010
    Publication date: October 21, 2010
    Inventor: Farshid Dilmaghanian
  • Publication number: 20100258458
    Abstract: A sensor housing (10) is sealed against the penetration of dust by means of sealing compound (7) by grooves at the interfaces of abutting housing members (1, 2, 3; 8, 9) being so configured that they form at least one channel (4) in the assembled state. After assembly and fixing of the housing members the sealing compound (7) is injected into the channel (4) through an inlet opening (5). This permits even complex contact geometries to be mutually sealed in a simple manner.
    Type: Application
    Filed: December 16, 2008
    Publication date: October 14, 2010
    Inventors: Franz Nömmer, Antonius Rossberger
  • Publication number: 20100252908
    Abstract: An electrically alterable circuit (EAC), suitable for use in an integrated circuit, includes a first interconnect, a link element, and a second interconnect. A first set of interconnect vias provides an electrically conductive connection between the first interconnect and a first end of the link element; A second set of interconnect vias provides an electrically conductive connection between the second interconnect and a second end of the link element. The EAC further includes a third interconnect and a one or more fuse vias that provide an electrical connection between the third interconnect and the link element. A conductance of the one or more fuse vias is less than a conductance of the first set of interconnect vias, a conductance of the second set of interconnect vias, or both.
    Type: Application
    Filed: April 3, 2009
    Publication date: October 7, 2010
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventor: Mark E. Schlarmann
  • Publication number: 20100256942
    Abstract: A sensor includes an electronic module that comprises several electronic subassemblies and a processor that can be electrically coupled to the electronic subassemblies. The subassemblies respectively feature a programmable storage device with subassembly-specific data of the respective subassembly. The content of the respective programmable storage devices can be read out and evaluated by the processor.
    Type: Application
    Filed: October 9, 2009
    Publication date: October 7, 2010
    Inventors: Martin GAISER, Juergen HAAS, Juergen MOTZER
  • Publication number: 20100251857
    Abstract: The present invention relates to an insulation stripping device for the partial removal of a cable insulation, comprising at least one electrically conductive blade (100) for cutting through the cable insulation, and to an adjustment means for use with an insulation stripping device of this type. The present invention further relates to a method for finishing cables and to an adjustment method for adjusting a blade (100) position in an insulation stripping device. According to the present invention, the insulation stripping device comprises a capacitive sensor unit, which is connected to the conductive blade (100) and is formed in such a way as to emit an output signal if the conductive blade (100) contacts a electrical conductor (104) of the cable.
    Type: Application
    Filed: November 6, 2008
    Publication date: October 7, 2010
    Inventors: Steven Whittaker, Harald Biehl
  • Patent number: 7805831
    Abstract: A carrier tape package 20 is used in an electronic components placing apparatus for feeding electronic components by a tape feeder, and has a carrier tape 22 housed in a wound state on a tape reel 21. In the carrier tape package 20, a data storage unit 23, in which an IC tag 25 having carrier tape information containing identification information of electronic components P held in the carrier tape 22 is held in a holder 24, is attached to the tape reel 21. At the instant when the carrier tape 22 is mounted in the tape feeder, the carrier tape information is read out by a reader/writer belonging to the tape feeder from the data storage unit 23 mounted on the leading end portion of the tape feeder.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: October 5, 2010
    Assignee: Panasonic Corporation
    Inventors: Hidehiro Saho, Hiroyoshi Nishida
  • Publication number: 20100242258
    Abstract: A method of lubricating MEMS devices using fluorosurfactants 42. Micro-machined devices, such as a digital micro-mirror device (DMD™) 940, which make repeated contact between moving parts, require lubrication in order to prevent the onset of stiction (static friction) forces significant enough to cause the parts to stick irreversibly together, causing defects. These robust and non-corrosive fluorosurfactants 42, which consists of a hydrophilic chain 40 attached to a hydrophobic fluorocarbon tail 41, are applied by nebulization and replace the more complex lubricating systems, including highly reactive PFDA lubricants stored in polymer getters, to keep the parts from sticking. This lubrication process, which does not require the use of getters, is easily applied and has been shown to provide long-life, lower-cost, operable MEMS devices.
    Type: Application
    Filed: June 4, 2010
    Publication date: September 30, 2010
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Seth Miller
  • Publication number: 20100242259
    Abstract: An electronic module capable of easily determining connection reliability of an ACF connection portion is provided. Electrode wirings of a board serving as an electronic parts of a display panel are connected with ACF bonding wirings of an FPC through an ACF to make electrical connection between the FPC and the board. Two branch portions branched from each of the ACF bonding wirings extend to an edge of the FPC. Low resistance measurement of the connection portion can be performed using the electrode wiring of the board and the branch portions, so whether or not the ACF connection portion is faulty can be determined.
    Type: Application
    Filed: June 7, 2010
    Publication date: September 30, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Kumiko Kaneko
  • Publication number: 20100242619
    Abstract: An encapsulated fiber Bragg grating sensor is provided wherein the EFL of sensor as well as the coefficient of friction between the sensor and the encapsulating tubing is controlled to minimize measurement errors caused by tensile and compressive strains. A method of manufacturing such a sensor is also provided.
    Type: Application
    Filed: February 25, 2010
    Publication date: September 30, 2010
    Applicant: SABEUS, INC.
    Inventors: Michel Le Blanc, Gerald Baker
  • Publication number: 20100236337
    Abstract: A flow rate meter that includes a container of known and fixed volume. Electrodes, or sensors, are placed inside the container at several different heights. An electronic circuit uses the electrodes, or sensors, to measure the time it takes this container of known and fixed volume to fill a certain distance with water or water-based solution. The electronic circuit calculates the flow rate in engineering units from this elapsed time by knowing the volume of the container between the fixed electrodes.
    Type: Application
    Filed: March 8, 2010
    Publication date: September 23, 2010
    Applicant: INNOQUEST, INC.
    Inventor: William C. Hughes
  • Publication number: 20100231414
    Abstract: A signal alignment monitoring system is provided. The system includes a signal assembly including at least one signal lamp. The system also includes an alignment monitoring apparatus coupled to the signal assembly. The alignment monitoring apparatus includes a source for emitting electromagnetic energy and a detector for sensing electromagnetic energy emitted by the source to facilitate determining an alignment of the signal assembly.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 16, 2010
    Inventor: Forrest Henry Ballinger
  • Patent number: 7793404
    Abstract: A resonant-oscillating-device fabrication method for integrally forming a structure comprising a support, a beam vibratably extending from the support, and an oscillating element which is supported by the beam so as to oscillate in resonance with the vibration of the beam at a desired resonant frequency, by using a substrate. The resonant-oscillating-device fabrication method having a thickness measurement step of measuring the thickness of the substrate, an etching condition determination step of determining conditions of etching a portion forming the beam in the substrate to provide the desired resonant frequency, in accordance with the thickness of the substrate measured in the thickness measurement step, and an etching step of etching the substrate in accordance with the etching conditions.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: September 14, 2010
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Kenichi Murakami, Nobuaki Asai
  • Publication number: 20100224216
    Abstract: A camera module includes a lens module, an image sensor, a circuit board for supporting the image sensor, and a lens holder for connecting the lens module and the circuit board. A method for fabricating the camera module includes the following steps. Firstly, at least one cleaning hole is created in the lens holder, and the at least one cleaning hole is filled with a removable sealing stuff. Then, the printed circuit board, the image sensor, the lens holder and the lens module of the camera module are combined together. Then, a testing procedure is performed to detect whether any pollutant is present within the assembled camera module. Once any pollutant within the assembled camera module is detected, the sealing stuff is removed from the at least one cleaning hole, a cleaning procedure is done to remove the pollutant, and the at least one cleaning hole is sealed again.
    Type: Application
    Filed: May 14, 2009
    Publication date: September 9, 2010
    Applicant: PRIMAX ELECTRONICS LTD.
    Inventors: Hsiang-Kai Liao, Po-Chun Chang
  • Patent number: 7788789
    Abstract: The present invention provides a method of fabricating a crystal oscillator with pedestal for surface mounting, which is provided on a base surface of a crystal oscillator from which a pair of lead wires extends and which is formed by injection molding using a mold with a liquid-crystal polymer as raw material; wherein protrusions that follow the shape of said mold are provided on at least a corner around the outer periphery of the surface of the oscillator pedestal facing said base surface of said crystal oscillator; a non-defective product is assumed to be one in which the upper surface of each of said protrusions is a flat surface, but a defective product is assumed to be one in which the flat surface of said protrusion is ridged; and only a non-defective product is mounted onto the base surface of the crystal oscillator. This makes it possible to provide a method of fabricating a crystal oscillator by which reliability is increased while the strength of the oscillator pedestal is maintained.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: September 7, 2010
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Hiroshi Yamaguchi
  • Publication number: 20100218364
    Abstract: A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
    Type: Application
    Filed: May 7, 2010
    Publication date: September 2, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna, Arun Sharma
  • Publication number: 20100212127
    Abstract: A method of manufacturing a filter circuit including series and parallel coupled BAW resonators is given which compensates for frequency tolerances of the resonators which are due to the manufacturing process. The new method includes measuring a resonance frequency of at least one type of the BAW resonators produced on a wafer and defining a deviation from a desired frequency. A trimming layer is then deposited onto the entire wafer. At last, a thickness portion of the trimming layer is selectively removed, the portion being dependent on a location on the wafer and on the calculated deviation of the resonance frequency at this location.
    Type: Application
    Filed: February 24, 2009
    Publication date: August 26, 2010
    Inventors: Habbo Heinze, Edgar Schmidhammer, Monika Schmiedgen