Including Measuring Or Testing Of Device Or Component Part Patents (Class 29/593)
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Patent number: 7939770Abstract: An integral type second lever constituting member (A) is mounted on a constitution, in which a first lever member (5) is assembled in a Roberval's mechanism composed of a stationary block (1), a floating frame (2) and upper and lower sub-levers (3, 4). The integral type second lever constituting member (A) is mounted by mounting a force point portion (9) and a fulcrum portion (8) on the Roberval's mechanism through screw-fastened holes (8a, 9a), thereby to assemble a load measuring mechanism as a whole. At the screw-fastening time, the turning torque of the screw is supported by a connecting portion (10), and this connecting portion (10) is removed after the integral type second lever constituting member (A) was mounted. In the load measuring mechanism of an electronic balance, the second lever member can be mounted easily and reliably.Type: GrantFiled: April 27, 2007Date of Patent: May 10, 2011Assignee: A & D Company, LimitedInventors: Naoto Izumo, Satoshi Suzaki
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Publication number: 20110099796Abstract: A machine and a method for a processing machine for longitudinal objects, in particular for cables and wires, which permits the reliable identification of a cable, a wire or another profile material inserted into the processing machine. On the basis of the identification of the cable, wire or profile material, the machine or the method determines the coordinated processing parameters in an automatic or automated manner. The processing parameters thus determined can subsequently be used without problems for automatic or automated actuation of the processing machine for processing the inserted cables, wires or profile materials.Type: ApplicationFiled: June 10, 2009Publication date: May 5, 2011Applicant: SCHLEUNIGER HOLDING AGInventors: Michael Jost, Jorn Rohrbach, Christoph Heinger
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Patent number: 7934879Abstract: A camera module includes a lens module, an image sensor, a circuit board for supporting the image sensor, and a lens holder for connecting the lens module and the circuit board. A method for fabricating the camera module includes the following steps. Firstly, at least one cleaning hole is created in the lens holder, and the at least one cleaning hole is filled with a removable sealing stuff. Then, the printed circuit board, the image sensor, the lens holder and the lens module of the camera module are combined together. Then, a testing procedure is performed to detect whether any pollutant is present within the assembled camera module. Once any pollutant within the assembled camera module is detected, the sealing stuff is removed from the at least one cleaning hole, a cleaning procedure is done to remove the pollutant, and the at least one cleaning hole is sealed again.Type: GrantFiled: May 14, 2009Date of Patent: May 3, 2011Assignee: Primax Electronics Ltd.Inventors: Hsiang-Kai Liao, Po-Chun Chang
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Publication number: 20110098594Abstract: A method for scaling the impedance measured during the course of an electrophysiology study accounts for impedance drifts. By scaling the impedance there is greater assurance that previously recorded positional information can be used to accurately relocate an electrode at a prior visited position. The scale factor may be based upon a mean value across several sensing electrodes. Alternatively, the scale factor may be calculated specifically with respect to an orientation of a dipole pair of driven electrodes.Type: ApplicationFiled: January 7, 2011Publication date: April 28, 2011Inventor: John A. Hauck
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Publication number: 20110089973Abstract: A semiconductor device includes a plurality of core chips and an interface chip stacked together. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and a bidirectional buffer circuit that drives the through silicon vias. The interface chip also includes a logic-level holding circuit that holds a logic level of the through silicon vias. The bidirectional buffer circuit includes an input buffer and an output buffer. The driving capability of a first inverter of the logic-level holding circuit is smaller than the driving capability of the output buffer of the bidirectional buffer circuit.Type: ApplicationFiled: October 8, 2010Publication date: April 21, 2011Applicant: Elpida Memory, Inc.Inventor: Chikara Kondo
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Publication number: 20110086255Abstract: Battery packs having electrically insulating material between conductive surfaces of electrical components are described herein. In some embodiments, a battery pack includes a battery cell with a first conductive surface, an electrically conductive member with a second conductive surface, and electrically insulating material positioned between the first and second conductive surfaces. The electrically insulating material has at least one passage that enables the first and second conductive surfaces to be electrically connected. For example, the passage in the electrically insulating material may be formed by, during, or as a result of a process in which the first and second conductive surfaces are attached, such as by a welding process that both ablates a portion of the electrically insulating material to form the through passage and that physically joins the first and second conductive surfaces, thereby creating an electrical connection therebetween.Type: ApplicationFiled: October 13, 2010Publication date: April 14, 2011Applicant: Micro Power Electronics, Inc.Inventors: Thomas P. Maxwell, Eric Petterson
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Publication number: 20110078894Abstract: A method of adjustment on manufacturing of a monolithic oscillator including circuit elements and a BAW resonator, this method including the steps of: a) forming the circuit elements and the resonator and electrically connecting them; b) covering the resonator with a frequency adjustment layer; c) measuring the output frequency of the oscillator; d) modifying the thickness of the frequency adjustment layer to modify the output frequency of the oscillator.Type: ApplicationFiled: October 1, 2010Publication date: April 7, 2011Applicant: STMICROELECTRONICS SAInventors: Pierre Bar, Sylvain Joblot, Jean-Francois Carpentier
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Publication number: 20110078895Abstract: A method of manufacturing a wiring substrate includes forming a conducting layer on a first insulating layer including a first glass cloth; forming a photosensitive resist layer on the conducting layer; recognizing a first origin position on the first insulating layer; forming a mask on the resist layer by positioning the mask with respect to the first origin position, the mask being formed so as to position wiring patterns only on positions overlapping the first glass cloth in a planar view; and exposing the resist layer via the mask and forming the wiring patterns only on the positions overlapping the first glass cloth in the planar view.Type: ApplicationFiled: October 4, 2010Publication date: April 7, 2011Applicant: FUJITSU LIMITEDInventor: Makoto SUWADA
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Publication number: 20110080687Abstract: A method of adjustment in the manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the capacitance between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode.Type: ApplicationFiled: October 1, 2010Publication date: April 7, 2011Applicant: STMICROELECTRONICS SAInventors: Pierre Bar, Sylvain Joblot, David Petit
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Patent number: 7918012Abstract: A sensor, and methods of making, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The sensor is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.Type: GrantFiled: October 30, 2007Date of Patent: April 5, 2011Assignee: Abbott Diabetes Care Inc.Inventors: Yi Wang, Benjamin J. Feldman
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Publication number: 20110061225Abstract: A manufacturing apparatus for an electronic component includes a plurality of press members contacting a housing of a connector, pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, and provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit provided to the respective arm sections and adapted to measure a stress generated when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.Type: ApplicationFiled: September 15, 2010Publication date: March 17, 2011Applicant: FUJITSU LIMITEDInventors: Shunsuke Sone, Hirokazu Yamanishi
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Publication number: 20110066396Abstract: A sensor device includes: a sensor module mounted on a conductor board; a sensitive element which is sensitive to a variable; a self-test control unit implementing a self-test program, the self-test control unit applying a self-test variable to the sensitive element, taking the self-test program into account; a detection unit detecting a characteristic of the sensitive element which is altered as a result of the applied self-test variable and providing an actual self-test response, taking the altered characteristic into account; and a comparator unit provided on or in the sensor module, the comparator unit comparing the actual self-test response to at least one specified setpoint self-test response and providing comparative information.Type: ApplicationFiled: July 9, 2010Publication date: March 17, 2011Inventors: Patrick Goerlich, Riad Stefo, Wolfram Bauer, Rainer Willig, Burkhard Kuhlmann, Mathias Reimann, Ermin Esch, Michael Baus, Gregor Wetekam, Michael Veith, Emma Abel, Wolfgang Fuerst
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Publication number: 20110066212Abstract: A TANK filter is provided for a lead wire of an active medical device (AMD). The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the TANK filter to attenuate current flow through the lead wire along a range of selected frequencies. In a preferred form, the TANK filter is integrated into a TIP and/or RING electrode for an active implantable medical device.Type: ApplicationFiled: November 3, 2010Publication date: March 17, 2011Applicant: GREATBATCH LTD.Inventors: Robert A. Stevenson, Warren S. Dabney, Christine A. Frysz, Richard L. Brendel
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Publication number: 20110063887Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array, and a control circuit. The memory cell array includes plural memory cells arranged in rows and columns and each including a diode and resistance-change element. The control circuit tests the diodes for the respective memory cells. The control circuit tests the diode at least at one of times before and after one of a write operation, erase operation and read operation with respect to the memory cell is performed.Type: ApplicationFiled: August 23, 2010Publication date: March 17, 2011Inventor: Kazushige KANDA
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Patent number: 7905666Abstract: An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.Type: GrantFiled: February 6, 2008Date of Patent: March 15, 2011Assignee: Oki Semiconductor Co., Ltd.Inventors: Tokihiro Terashima, Hiroshi Wada
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Publication number: 20110047782Abstract: In a combination of, for example, a rotor having eight magnetic poles and a stator having twelve slots and pulsating components of permeance, which generate a sinusoidal cogging torque having maxima of the same number as the number of poles of the rotor, pressurizing parts arranged in predetermined positions, applying a force at an outer periphery of the stator and directed inwardly cancels the pulsating components of the cogging torque.Type: ApplicationFiled: November 10, 2010Publication date: March 3, 2011Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Yukari Toide, Akihiro Daikoku, Masatsugu Nakano, Hideaki Arita, Shinichi Yamaguchi, Moriyuki Hazeyama, Takashi Yoshioka, Tomohiro Kikuchi, Katsumi Hayami, Takashi Miyazaki
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Publication number: 20110041317Abstract: Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.Type: ApplicationFiled: November 2, 2010Publication date: February 24, 2011Applicant: Micron Technology, Inc.Inventor: Thomas Kinsley
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Patent number: 7891078Abstract: A method of improving efficiency of manufacturing a vacuum electronic device, includes placing sensors on the device's interior during its construction and obtaining a first measured characteristic value; comparing the first measured characteristic value with a desired characteristic value; determining whether the first measured characteristic value is within a predetermined percentage of the desired characteristic value; adjusting a component of the device and measuring the characteristic of the device to obtain a second measured characteristic, comparing the second measured characteristic value with a desired characteristic value, determining whether the second measured characteristic value is within a predetermined percentage of the desired characteristic value; and repeating the previous step until the second measured characteristic value is within the predetermined percentage of the desired characteristic value.Type: GrantFiled: January 7, 2008Date of Patent: February 22, 2011Assignee: The United States of America as represented by the Secretary of the NavyInventors: Ayax D. Ramirez, Stephen D. Russell
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Publication number: 20110035932Abstract: Disclosed herein is an electrical component comprising a segment having a diameter in the range of about 1 micrometers to about 10 cm, the segment comprising a plurality of non-metallic, resistive fibers in a non-metallic binder. The segment is precisely trimmed to impart to the segment an electrical resistance within 1% of the desired resistance value. A manufacturing system and methods of manufacturing components having precise specifications also are disclosed.Type: ApplicationFiled: October 27, 2010Publication date: February 17, 2011Applicant: XEROX CORPORATIONInventors: Joseph A. Swift, Stanley J. Wallace, Richard W. Seyfried, Kathleen A. Feinberg, Roger L. Bullock
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Publication number: 20110032036Abstract: A multi-chip system in which at least one of the chips includes a performance parameter encoded thereon. After system assembly, the performance parameter can be obtained by a companion chip and used to automatically or semi-automatically fine tune the companion chip to the specific parameters of the at least one chip.Type: ApplicationFiled: October 20, 2010Publication date: February 10, 2011Applicants: STMicroelectronics, Inc., STMicroelectronics S.r.l.Inventors: Giorgio Pedrazzini, Sandro Cerato, Alberto Salina
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Publication number: 20110025171Abstract: There is provided a method for testing a piezoelectric/electrostrictive actuator, wherein the displacement of a piezoelectric/electrostrictive actuator is estimated on the basis of the relations between one or more frequency characteristic values selected from the group consisting of the heights and areas of the peaks of the resonance waveforms and the difference of the maximum and minimum of the first order or first to higher orders of the resonance frequency characteristic values of the piezoelectric/electrostrictive actuator and the k-th order (k=1 to 4) of the first or first to higher orders of resonance frequencies. According to this piezoelectric/electrostrictive actuator testing method, a piezoelectric/electrostrictive actuator can be tested with high precision without actually driving the same as a product and without being accompanied by any disassembly/breakage.Type: ApplicationFiled: October 15, 2010Publication date: February 3, 2011Applicant: NGK Insulators, Ltd.Inventors: Naoki Goto, Takao Ohnishi
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Publication number: 20110026938Abstract: The present invention relates generally to optical rotary joints (35) for enabling optical communication between a rotor and a stator, improved methods of mounting such optical rotary joints on supporting structures such that the rotor and stator remain properly aligned, and to improved optical reflector assemblies for use in such optical rotary joints.Type: ApplicationFiled: April 28, 2006Publication date: February 3, 2011Applicant: MOOG INC.Inventors: K. Peter Lo, Noris E. Lewis, Heath E. Kouns, Martin J. Oosterhuis
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Patent number: 7866026Abstract: A sensor, and methods of making, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The sensor is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.Type: GrantFiled: August 1, 2006Date of Patent: January 11, 2011Assignee: Abbott Diabetes Care Inc.Inventors: Yi Wang, Benjamin J. Feldman
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Publication number: 20110002153Abstract: The invention relates to a method for making a stack of memory circuits, wherein the method includes the step of testing the validity of at least two memory circuits. According to the invention, the method includes the phase of configuring each memory circuit, the configuration phase including the step of writing, within a configuration device of each memory circuit included in the stack, a piece of information on an identifier allocated to the memory circuit in the stack, and a piece of information on the results of the validity test of the memory circuit. The invention also relates to a method for addressing a memory circuit, to a stack of memory circuits, and to an electronic device including such a stack.Type: ApplicationFiled: February 23, 2009Publication date: January 6, 2011Applicant: GEMALTO SAInventors: Pierre Gravez, Michel Thill
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Publication number: 20100325872Abstract: Razor handles are provided for razors having a battery-powered functionality. Methods of manufacturing such handles are also provided. In one implementation, the handle includes a unitary grip portion constructed to receive a razor head at one end thereof, and a battery cover, mounted on the grip portion. The grip portion and the battery cover, when joined, may together define a water-tight unit prior to mounting of the razor head on the grip portion.Type: ApplicationFiled: September 2, 2010Publication date: December 30, 2010Inventors: Fred Schnak, Luis Burrel, Stefan Rehbein, Gerrit Rönneberg, Uwe Schaaf, Evan Pennell, Patrick F. McNally, Thomas Hoppenstedt, Keith A. Swenson
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Publication number: 20100319184Abstract: A method of collective fabrication of remotely interrogatable sensors, each sensor comprising at least one first resonator and one second resonator, each resonator comprising acoustic wave transducers designed such that they exhibit respectively a first and a second operating frequency, is provided.Type: ApplicationFiled: June 21, 2010Publication date: December 23, 2010Applicant: SENSEORInventors: Jean-François Leguen, Luc Chommeloux
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Publication number: 20100322024Abstract: A plurality of memory blocks includes real memory cells and redundancy memory cells, are accessed independently during a normal operation mode, and are accessed simultaneously during a test mode in order for common data to be written to the plurality of memory blocks. A block control unit selects the plurality of memory blocks irrespective of a block address signal in order to execute a compression test. During the test mode, a redundancy access unit simultaneously accesses the redundancy memory cells of the plurality of memory blocks when a forced redundancy signal supplied to a block address terminal indicates first level. Therefore, the redundancy memory cells of the plurality of memory blocks may simultaneously access and test without providing any special terminal. As a result, before a defect is relieved, an operation test of the redundancy memory cells may efficiently execute, which may shorten the test time.Type: ApplicationFiled: August 5, 2010Publication date: December 23, 2010Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventor: Yoshimasa YAGISHITA
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Publication number: 20100315717Abstract: This invention discloses a low cost method to manufacture electrooptic devices at low cost and discloses materials that may be used in fabrication of electrooptic devices.Type: ApplicationFiled: June 15, 2010Publication date: December 16, 2010Inventors: Anoop Agrawal, Juan Carlos Lopez Tonazzi
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Patent number: 7849581Abstract: Provided are fabrication, characterization and application of a nanodisk electrode, a nanopore electrode and a nanopore membrane. These three nanostructures share common fabrication steps. In one embodiment, the fabrication of a disk electrode involves sealing a sharpened internal signal transduction element (“ISTE”) into a substrate, followed by polishing of the substrate until a nanometer-sized disk of the ISTE is exposed. The fabrication of a nanopore electrode is accomplished by etching the nanodisk electrode to create a pore in the substrate, with the remaining ISTE comprising the pore base. Complete removal of the ISTE yields a nanopore membrane, in which a conical shaped pore is embedded in a thin membrane of the substrate.Type: GrantFiled: May 3, 2007Date of Patent: December 14, 2010Assignee: University of Utah Research FoundationInventors: Henry S. White, Bo Zhang, Ryan J. White, Eric N. Ervin, Gangli Wang
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Publication number: 20100293777Abstract: Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.Type: ApplicationFiled: August 2, 2010Publication date: November 25, 2010Inventors: Chris Savarese, Noel H.C. Marshall, Lauro C. Cadorniga, Susan McGill, Harold W. Ng
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Patent number: 7832079Abstract: The invention relates to a vacuum interrupter chamber and a method for producing the same according to the preambles of patent claims 1 and 3. In order here to improve a vacuum interrupter chamber of this type and a method for producing the same and the subsequent casting to the extent that the advantages described above are utilized but the disadvantages described are avoided, it is proposed according to the invention that, in preparation for later casting, the vacuum interrupter chamber (1) is provided on the outer surface with a protective sheath (2) consisting of an elastic or elastomeric or plastomeric material, which is applied to the surface of the vacuum interrupter chamber without further expanding mechanical aids by heat shrinkage alone.Type: GrantFiled: June 27, 2005Date of Patent: November 16, 2010Assignee: ABB Technology AGInventors: Oliver Claus, Hartmut Mildes, Till Rümenapp
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Publication number: 20100281685Abstract: In a displacement detecting method, displacement between a strip-shaped electrode (13) and the strip-shaped separator (14) is detected. The strip-shaped separator (14) is semitransparent. In the method, first, the strip-shaped electrode (13) is photographed through the strip-shaped separator (14) at a position where the strip-shaped electrode (13) and the strip-shaped separator(14) are stacked (photographing step). Based on an image photographed in the photographing step, displacement between the strip-shaped electrode (13) and the strip-shaped separator (14) is detected (displacement detecting step). In a displacement amount measuring method of measuring the displacement amount, the displacement amount between the strip-shaped electrode (13) and the strip-shaped separator (14) is calculated based on the image photographed in the photographing step.Type: ApplicationFiled: December 12, 2008Publication date: November 11, 2010Inventors: Hideki Hori, Kenji Tsuchiya, Masataka Takeda
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Patent number: 7827660Abstract: A bimorphic structure responsive to changes in an environmental condition, sensor structures incorporating one or more of such bimorphic structures, and a method of forming such bimorphic structures. The sensor structure has an electrically-conductive first contact on a substrate, and a bimorph beam anchored to the substrate so that a portion thereof is suspended above the first contact. The bimorph beam has a multilayer structure that includes first and second layers, with the second layer between the first layer and the substrate. A portion of the first layer projects through an opening in the second layer toward the first contact so as to define an electrically-conductive second contact located on the beam so as to be spaced apart and aligned with the first contact for contact with the first contact when the beam sufficiently deflects toward the substrate.Type: GrantFiled: July 30, 2008Date of Patent: November 9, 2010Assignee: Evigia Systems, Inc.Inventors: Bishnu Prasanna Gogoi, Navid Yazdi
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Patent number: 7829793Abstract: An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.Type: GrantFiled: July 13, 2006Date of Patent: November 9, 2010Assignee: Magnecomp CorporationInventors: Christopher Schreiber, Christopher Dunn
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Publication number: 20100267265Abstract: Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.Type: ApplicationFiled: April 19, 2010Publication date: October 21, 2010Inventor: Farshid Dilmaghanian
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Publication number: 20100258458Abstract: A sensor housing (10) is sealed against the penetration of dust by means of sealing compound (7) by grooves at the interfaces of abutting housing members (1, 2, 3; 8, 9) being so configured that they form at least one channel (4) in the assembled state. After assembly and fixing of the housing members the sealing compound (7) is injected into the channel (4) through an inlet opening (5). This permits even complex contact geometries to be mutually sealed in a simple manner.Type: ApplicationFiled: December 16, 2008Publication date: October 14, 2010Inventors: Franz Nömmer, Antonius Rossberger
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Publication number: 20100252908Abstract: An electrically alterable circuit (EAC), suitable for use in an integrated circuit, includes a first interconnect, a link element, and a second interconnect. A first set of interconnect vias provides an electrically conductive connection between the first interconnect and a first end of the link element; A second set of interconnect vias provides an electrically conductive connection between the second interconnect and a second end of the link element. The EAC further includes a third interconnect and a one or more fuse vias that provide an electrical connection between the third interconnect and the link element. A conductance of the one or more fuse vias is less than a conductance of the first set of interconnect vias, a conductance of the second set of interconnect vias, or both.Type: ApplicationFiled: April 3, 2009Publication date: October 7, 2010Applicant: FREESCALE SEMICONDUCTOR, INC.Inventor: Mark E. Schlarmann
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Publication number: 20100256942Abstract: A sensor includes an electronic module that comprises several electronic subassemblies and a processor that can be electrically coupled to the electronic subassemblies. The subassemblies respectively feature a programmable storage device with subassembly-specific data of the respective subassembly. The content of the respective programmable storage devices can be read out and evaluated by the processor.Type: ApplicationFiled: October 9, 2009Publication date: October 7, 2010Inventors: Martin GAISER, Juergen HAAS, Juergen MOTZER
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Publication number: 20100251857Abstract: The present invention relates to an insulation stripping device for the partial removal of a cable insulation, comprising at least one electrically conductive blade (100) for cutting through the cable insulation, and to an adjustment means for use with an insulation stripping device of this type. The present invention further relates to a method for finishing cables and to an adjustment method for adjusting a blade (100) position in an insulation stripping device. According to the present invention, the insulation stripping device comprises a capacitive sensor unit, which is connected to the conductive blade (100) and is formed in such a way as to emit an output signal if the conductive blade (100) contacts a electrical conductor (104) of the cable.Type: ApplicationFiled: November 6, 2008Publication date: October 7, 2010Inventors: Steven Whittaker, Harald Biehl
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Patent number: 7805831Abstract: A carrier tape package 20 is used in an electronic components placing apparatus for feeding electronic components by a tape feeder, and has a carrier tape 22 housed in a wound state on a tape reel 21. In the carrier tape package 20, a data storage unit 23, in which an IC tag 25 having carrier tape information containing identification information of electronic components P held in the carrier tape 22 is held in a holder 24, is attached to the tape reel 21. At the instant when the carrier tape 22 is mounted in the tape feeder, the carrier tape information is read out by a reader/writer belonging to the tape feeder from the data storage unit 23 mounted on the leading end portion of the tape feeder.Type: GrantFiled: May 16, 2006Date of Patent: October 5, 2010Assignee: Panasonic CorporationInventors: Hidehiro Saho, Hiroyoshi Nishida
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Publication number: 20100242258Abstract: A method of lubricating MEMS devices using fluorosurfactants 42. Micro-machined devices, such as a digital micro-mirror device (DMD™) 940, which make repeated contact between moving parts, require lubrication in order to prevent the onset of stiction (static friction) forces significant enough to cause the parts to stick irreversibly together, causing defects. These robust and non-corrosive fluorosurfactants 42, which consists of a hydrophilic chain 40 attached to a hydrophobic fluorocarbon tail 41, are applied by nebulization and replace the more complex lubricating systems, including highly reactive PFDA lubricants stored in polymer getters, to keep the parts from sticking. This lubrication process, which does not require the use of getters, is easily applied and has been shown to provide long-life, lower-cost, operable MEMS devices.Type: ApplicationFiled: June 4, 2010Publication date: September 30, 2010Applicant: TEXAS INSTRUMENTS INCORPORATEDInventor: Seth Miller
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Publication number: 20100242259Abstract: An electronic module capable of easily determining connection reliability of an ACF connection portion is provided. Electrode wirings of a board serving as an electronic parts of a display panel are connected with ACF bonding wirings of an FPC through an ACF to make electrical connection between the FPC and the board. Two branch portions branched from each of the ACF bonding wirings extend to an edge of the FPC. Low resistance measurement of the connection portion can be performed using the electrode wiring of the board and the branch portions, so whether or not the ACF connection portion is faulty can be determined.Type: ApplicationFiled: June 7, 2010Publication date: September 30, 2010Applicant: CANON KABUSHIKI KAISHAInventor: Kumiko Kaneko
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Publication number: 20100242619Abstract: An encapsulated fiber Bragg grating sensor is provided wherein the EFL of sensor as well as the coefficient of friction between the sensor and the encapsulating tubing is controlled to minimize measurement errors caused by tensile and compressive strains. A method of manufacturing such a sensor is also provided.Type: ApplicationFiled: February 25, 2010Publication date: September 30, 2010Applicant: SABEUS, INC.Inventors: Michel Le Blanc, Gerald Baker
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Publication number: 20100236337Abstract: A flow rate meter that includes a container of known and fixed volume. Electrodes, or sensors, are placed inside the container at several different heights. An electronic circuit uses the electrodes, or sensors, to measure the time it takes this container of known and fixed volume to fill a certain distance with water or water-based solution. The electronic circuit calculates the flow rate in engineering units from this elapsed time by knowing the volume of the container between the fixed electrodes.Type: ApplicationFiled: March 8, 2010Publication date: September 23, 2010Applicant: INNOQUEST, INC.Inventor: William C. Hughes
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Publication number: 20100231414Abstract: A signal alignment monitoring system is provided. The system includes a signal assembly including at least one signal lamp. The system also includes an alignment monitoring apparatus coupled to the signal assembly. The alignment monitoring apparatus includes a source for emitting electromagnetic energy and a detector for sensing electromagnetic energy emitted by the source to facilitate determining an alignment of the signal assembly.Type: ApplicationFiled: March 12, 2009Publication date: September 16, 2010Inventor: Forrest Henry Ballinger
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Patent number: 7793404Abstract: A resonant-oscillating-device fabrication method for integrally forming a structure comprising a support, a beam vibratably extending from the support, and an oscillating element which is supported by the beam so as to oscillate in resonance with the vibration of the beam at a desired resonant frequency, by using a substrate. The resonant-oscillating-device fabrication method having a thickness measurement step of measuring the thickness of the substrate, an etching condition determination step of determining conditions of etching a portion forming the beam in the substrate to provide the desired resonant frequency, in accordance with the thickness of the substrate measured in the thickness measurement step, and an etching step of etching the substrate in accordance with the etching conditions.Type: GrantFiled: March 28, 2007Date of Patent: September 14, 2010Assignee: Brother Kogyo Kabushiki KaishaInventors: Kenichi Murakami, Nobuaki Asai
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Publication number: 20100224216Abstract: A camera module includes a lens module, an image sensor, a circuit board for supporting the image sensor, and a lens holder for connecting the lens module and the circuit board. A method for fabricating the camera module includes the following steps. Firstly, at least one cleaning hole is created in the lens holder, and the at least one cleaning hole is filled with a removable sealing stuff. Then, the printed circuit board, the image sensor, the lens holder and the lens module of the camera module are combined together. Then, a testing procedure is performed to detect whether any pollutant is present within the assembled camera module. Once any pollutant within the assembled camera module is detected, the sealing stuff is removed from the at least one cleaning hole, a cleaning procedure is done to remove the pollutant, and the at least one cleaning hole is sealed again.Type: ApplicationFiled: May 14, 2009Publication date: September 9, 2010Applicant: PRIMAX ELECTRONICS LTD.Inventors: Hsiang-Kai Liao, Po-Chun Chang
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Patent number: 7788789Abstract: The present invention provides a method of fabricating a crystal oscillator with pedestal for surface mounting, which is provided on a base surface of a crystal oscillator from which a pair of lead wires extends and which is formed by injection molding using a mold with a liquid-crystal polymer as raw material; wherein protrusions that follow the shape of said mold are provided on at least a corner around the outer periphery of the surface of the oscillator pedestal facing said base surface of said crystal oscillator; a non-defective product is assumed to be one in which the upper surface of each of said protrusions is a flat surface, but a defective product is assumed to be one in which the flat surface of said protrusion is ridged; and only a non-defective product is mounted onto the base surface of the crystal oscillator. This makes it possible to provide a method of fabricating a crystal oscillator by which reliability is increased while the strength of the oscillator pedestal is maintained.Type: GrantFiled: January 29, 2007Date of Patent: September 7, 2010Assignee: Nihon Dempa Kogyo Co., Ltd.Inventor: Hiroshi Yamaguchi
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Publication number: 20100218364Abstract: A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.Type: ApplicationFiled: May 7, 2010Publication date: September 2, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna, Arun Sharma
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Publication number: 20100212127Abstract: A method of manufacturing a filter circuit including series and parallel coupled BAW resonators is given which compensates for frequency tolerances of the resonators which are due to the manufacturing process. The new method includes measuring a resonance frequency of at least one type of the BAW resonators produced on a wafer and defining a deviation from a desired frequency. A trimming layer is then deposited onto the entire wafer. At last, a thickness portion of the trimming layer is selectively removed, the portion being dependent on a location on the wafer and on the calculated deviation of the resonance frequency at this location.Type: ApplicationFiled: February 24, 2009Publication date: August 26, 2010Inventors: Habbo Heinze, Edgar Schmidhammer, Monika Schmiedgen