Abstract: There is provided a component mounting apparatus, which includes: a nozzle which sucks a component; a nozzle supporting member, on which the nozzle is installed, which moves in a vertical direction with respect to an upper surface of a substrate on which the component sucked at the nozzle is mounted; an optical system which captures an image of a leading edge portion of the nozzle where the component is sucked in a component mounting operation, from a side direction, such that an optical axis of the optical system is inclined at a predetermined angle with respect to a sucking surface of the nozzle; and an analyzer which analyzes the image of the leading edge portion to determine whether a sucking state of the component sucked by the nozzle is normal or abnormal.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: Methods and apparatus for forming a housing, such as for an electronic device, from multi-layer materials are disclosed. The multi-layer materials include at least two layers. Typically, one or more of the layers are metal. However, different layers of the multi-layer materials can be different metals. In one embodiment, an inner layer of the multi-layer materials can be provided with or form internal features that can be for attaching parts or components to the multi-layer materials. In another embodiment, processing of an inner layer of the multi-layer materials can facilitate part formation with increased curvature and/or internal part clearance. In another embodiment, the multi-layer materials can include an intermediate layer that facilitates creation of internal features that can be for attaching parts or components to the multi-layer materials.

Abstract: The present invention is a method and apparatus for producing ready to use RFID devices in a convenient and economical manner. The apparatus of the present invention may be collocated with a manufacturer of consumer goods.

Abstract: An apparatus for manufacturing wireless communication devices for use in tracking or identifying other items uses cutting techniques that allow the size of an antenna for the wireless communication device to vary. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: An apparatus for mounting electronic parts includes a bulk feeder into which electronic parts in a bulk form are introduced, at least one inspection unit to inspect and align the electronic parts directed from the bulk feeder, an electronic part insertion unit to receive the electronic parts which have been completely inspected in the inspection unit, a positioning wheel installed to rotate along the bulk feeder, the inspection unit, and the electronic part inspection unit and serving to transfer the electronic parts, and a part supply unit to pick up the electronic parts received in the part insertion unit.

Abstract: A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in each of the mounting machines, the mounting head sucking a component supplied from the feeder for mounting on the circuit board; a moving mechanism in each of the mounting machines, the moving mechanism configured to removably mount and move the mounting head; an inspection camera unit configured to image an inspection target part of the circuit board; and an inspection image processing unit mounted, replaceably with the feeder, on the feeder mount base where the inspection camera unit is mounted, the inspection image processing unit processing an image signal output from the inspection camera unit to inspect the inspection target part.

Abstract: A device for assembling components having metal bonding pads includes plates that can move relative to each other, bearing metal components respectively and leaving between them a flat chamber surrounding the components when the latter are in contact with each other. The flat chambers can be saturated with deoxidizing gaseous fluid.

Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Abstract: A bonding apparatus includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of first air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. Each of the holding seats defines a plurality of second air holes. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.

Abstract: The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.

Abstract: There is provided a method of mounting conductive balls on pads on a substrate. The method includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.

Abstract: Even pressure is applied to a mounting target, even in a case where electronic components having different heights from each other are attempted to be mounted to a substrate, or in a case where an electronic component is attempted to be mounted to a substrate whose rear surface is provided with another electronic component. A mounting device 100 includes a lower pressurizing section 102 as a first pressurizing section and an upper pressurizing section 104 as a second pressurizing section, and pressurizes a substrate, a plurality of electronic components, and the like, sandwiched between the lower pressurizing section 102 and the upper pressurizing section 104, thereby mounting the substrate to the plurality of electronic components. The lower pressurizing section 102 or the upper pressurizing section 104 includes a dilatancy fluid 116.

Abstract: Maintenance of an electronic component working apparatus which carries out prescribed work using components is facilitated. A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulating means. The movement range regulating means allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus.

Abstract: A apparatus for mounting an interposer PCA into a chassis is disclosed. The apparatus comprises a bracket attached to the PCA. A geared handle is rotatably attached to one end of the bracket. The geared handle is configured to rotate between an open position and a closed position. Two geared segments are rotatably attached to the opposite end of the bracket and are meshed with the geared handle. A slot is formed in each geared segment and two slots are formed in the geared handle. The slots engage with insertion/ejection flanges on the chassis. The engaged slots force the PCA down into mating connectors in the chassis when the handle is rotated from the open position to the closed position.

Abstract: A rotation angle detection device of the present invention includes: a support body; a rotating body that can rotate with respect to the support body about a rotation axis and move in a rotation axis direction; a rotation angle detection unit that has a magnet attached to either of the support body and the rotating body, and a magnetic sensor attached to the other of the support body and the rotating body and facing the magnet in the rotation axis direction, and that detects a rotation angle of the rotating body on the basis of an output signal of the magnetic sensor; and a position detection unit that detects that the rotating body is positioned at a detection position in which a distance between the magnet and the magnetic sensor in the rotation axis direction becomes a predetermined detection distance.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component, the receptacle having a first abutting section and a second abutting section, the align fixture further having an elastic unit, one of the first abutting section and the second abutting section is flexibly mounted via the elastic unit, and the other one of the first abutting section and the second abutting section is fixedly mounted; the first abutting section and the second abutting section each form a stiff member and are adapted to engage the electronic component, the elastic unit is adapted to exert two force components on one of the first abutting section and the second abutting section, the force components being angled relatively to one another.

Abstract: A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.

Abstract: A component mounting apparatus includes two board transfer devices, a component supply unit, a component placing device, a setting unit, and a controller. Until production of the urgent boards is instructed, the two board transfer devices and the component placing device mount components on the regular boards in accordance with a first mounting program stored by the controller. When production of the urgent boards is instructed, a regular board is unloaded from the other board transfer device, which has been set by the setting unit to transfer urgent boards, the transfer way width of the other board transfer device is adjusted to the width of the urgent boards, and the other board transfer device and the component placing device are controlled so that component mountings on the urgent boards are performed on the other board transfer device in accordance with a second mounting program stored by the controller.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L1 and L2) including a plurality of nozzle shafts arranged in rows and at a predetermined nozzle arrangement pitch, a ? rotary drive mechanism that rotates the nozzle shafts around their axes is configured so as to include driven pulleys (28) coupled to the respective nozzle shafts; a plurality of idlers (30) interposed between the two rows of nozzles (L1 and L2); and endless drive belts (29A and 29B) that transmit rotation of the ?-axis motors (27A and 27B) to the driven pulleys (28).

Abstract: A surface mounting apparatus includes a conveyer supporting a printed wiring board being moved in a transportation direction, and a board transfer device that lowers a pair of tab members to positions spaced apart upstream and downstream of the printed wiring board and moves the tab members in the transportation direction. The board transfer device includes an interval changing device to change an interval between a pair of the tab members and a sensor to detect the position of the printed wiring board, an interference determination means to determine the absence or presence of the printed wiring board at the positions to which both the tab members are to be lowered according to the position of the printed wiring board detected by the sensor and interval setting means to move the tab members by driving the interval changing device according to a detection result of the interference determination means.

Abstract: Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.

Abstract: There is provided an apparatus and method for manufacturing a light emitting device package improved in terms of the reliability and process efficiency of a light emitting device. The apparatus includes a heating block including a recessed portion provided in an area in which a light emitting device package is disposed, and a protruding portion disposed within the recessed portion while corresponding to a recess formed in a lower surface of the light emitting device package; and a clamp disposed on a lead frame of the light emitting device package and fixing the lead frame and the light emitting device package to the heating block.

Abstract: In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device.

Abstract: An electronic component mounting apparatus in which an electronic component may be checked to provide highly accurate and efficient electronic component mounting. The apparatus includes a camera unit fixed on a head support and images an electronic component absorbed or to be absorbed onto a nozzle. The camera unit contains a camera module including a camera obtaining an image, a first lighting section disposed adjacently on a side of the camera closer to the nozzle and emitting light toward an imaging region of the camera, a second lighting section disposed adjacently on a side of the camera farther from the nozzle and emitting light toward the imaging region of the camera, and a baffle; and a bracket fixed on the head support and supporting the camera, the first lighting section, the second lighting section and the baffle.

Abstract: There is a need for providing an electronic component mounting apparatus, a component supply apparatus, and an electronic component mounting method capable of reducing inadvertent insertion of component supply tape and ensuring high reliability or capable of reducing wrong insertion of component supply tape, supplying new electronic component tape, and ensuring a high operation rate. Supply tape is inserted into an insertion entry of a component supply apparatus. An electronic component mounted on the supply tape is absorbed and is mounted on a printed board. Information about the electronic component mounted on the supply tape is read. Based on the read information, the component supply apparatus for inserting the supply tape is selected. The insertion entry is opened while it is closed when no supply tape is mounted.

Abstract: A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions.

Abstract: An apparatus for attaching first and second substrates of a flat display panel together includes a frame; an upper chamber fixed to an upper part of the frame and to which a first substrate can be attached and a lower chamber disposed under the upper chamber and to which a second substrate can be attached. A lifter acts to lift the lower chamber while controlling a gap between the upper chamber and the lower chamber. A position control stage interposed between the lower chamber and the lifter is used to adjust a position of the lower chamber relative to the upper chamber.

Abstract: A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path.

Abstract: A reconfigurable computer-controlled system is provided based on the positioning of bolts. A greater density of bolts per unit area increases the variety of figures or shapes that can be defined by a frame or tool used in the industry, such that it is no longer necessary to construct rigid surfaces with each change made to the shape of the product to be produced or surface to be formed. The use of the memory effect material as an actuator in the reconfigurability mechanism is the key to the success of the reconfigurable system and the control system owing to the permissibility of small bolts which can be adapted to standard sizes and shapes. The mechatronic system uses the positioning of bolts for the reconfigurability of surfaces to manufacture and shape materials.

Abstract: A method of operation of a programmer actuator system includes: placing a programming assembly, having socket boxes, in the programming actuator system; and clamping the programming assembly in the programming actuator system using a pivoting arm bracket.

Abstract: It is an objective of the present invention to eliminate wafer testing. Provided is a manufacturing apparatus comprising a detecting section that detects a position of a device terminal of a device; a generating section that generates a substrate-side terminal, which connects to the device terminal, on a substrate at a position corresponding to the device terminal; and a mounting section that mounts the device on the substrate and connects the device terminal to the substrate-side terminal. The detecting section captures an image of the device and detects the position of the device terminal based on the captured image, and the generating section prints a pattern of the substrate-side terminal on the substrate at a position corresponding to the device terminal.

Abstract: In an electronic component mounting apparatus, nozzle mechanisms are formed slender by providing shaft-type linear motors vertically upward of nozzle units and providing linear encoders vertically upward of the shaft-type linear motors, respectively. Thus, it becomes possible to reduce the occupational area of the individual nozzle mechanisms in XY directions (horizontal direction), thereby allowing the pitch of neighboring nozzles to be narrowed. It also becomes achievable to keep up with increasingly narrow mounting pitches of electronic components on boards of increasingly smaller-size and higher-integration.

Abstract: A component tube holding arrangement for holding one or more component tubes and for vibratory feeding of components in a picking position in a component mounting machine, as well as a combination of such a component tube holding arrangement and a vibratory feed magazine. The arrangement comprises a support surface for supporting component tubes, a reception portion for receiving component tubes, and at least one component stop at the reception portion defining a picking position for fed components. The arrangement also comprises identification means holding information of the identity of the arrangement. The arrangement is further arranged to be releasably mountable in a component mounting machine or in a vibratory feed magazine arranged to be loaded into the component mounting machine. The component tube holding arrangement lacks component feeding means and is arranged for allowing vibratory feeding means provided in the magazine.

Abstract: A carrier adapted to receive and align multiple electronic components, the carrier having receptacles each being adapted to receive an assigned one of the multiple electronic components, a first plate comprising a plurality of first abutting sections, the first abutting sections form one of boundaries of the respective assigned receptacles, a second plate comprising a plurality of second abutting sections, the second abutting sections form another of the boundaries of the respective assigned receptacles, and the first plate and the second plate are arranged slidably relative to each other.

Abstract: A apparatus for mounting an interposer PCA into a chassis is disclosed. The apparatus comprises a bracket attached to the PCA. A geared handle is rotatably attached to one end of the bracket. The geared handle is configured to rotate between an open position and a closed position. Two geared segments are rotatably attached to the opposite end of the bracket and are meshed with the geared handle. A slot is formed in each geared segment and two slots are formed in the geared handle. The slots engage with insertion/ejection flanges on the chassis. The engaged slots force the PCA down into mating connectors in the chassis when the handle is rotated from the open position to the closed position.

Abstract: Before a user starts the operation of an electronic component mounting apparatus, user's input representing as to whether the user is an operator, a programmer or a manager/maintenance person is accepted and further user level information representing degree of skill of the user as to the safety measures is accepted. The power supply of a mechanical portion operating a head portion is interrupted in accordance with the state of the apparatus including at least the user level information and the open/close state of a safety cover for covering the movable range of the head portion.

Abstract: A modular package may be utilized to mount an RF system-on-chip in one of plural configurations, such that the same modular package may be utilized to enable plural device formats, while reducing the amount of RF testing needed to change device formats. In one configuration, a surface mount device is mounted onto a first surface of a board, and the board is directly surface mounted onto a base board. Here, the base board includes a hole for accommodating the surface mount device, providing a thin device format. In a second configuration, a spacer is mounted onto the first surface of the board, such that a gap is provided between the board and the base board for accommodating the surface mount device, providing a relatively thicker device, but providing additional surface area where the hole otherwise would be, reducing the device size.

Abstract: It is intended to allow for efficiently performing a feeder replacement operation. A feeder 50 is formed in a shape elongated in one direction to allow a replacement operation therefor to be performed in such a manner that it is inserted and pulled out relative to a feeder installation section 150, along a longitudinal direction thereof. A rear end 111 which is a trailing one of longitudinally opposite ends of each of a plurality of feeders 50A, 50B, - - - , in an insertion direction, is provided with a guide portion for guiding one 50C of the feeders to be installed in adjacent relation to ones of the remaining feeders. For example, the guide portion can be formed by rounding corners of the rear end 111 of the feeder 50.

Abstract: A wiring design method for a wiring board comprises, if design rule errors are found in the wiring design, selecting one of the design rule errors as a selected design rule error, specifying a predetermined number of the second connection terminals as selected second connection terminals that correspond to the selected design rule error, and moving the selected second connection terminals to predetermined coordinate positions. Each time when the selected second connection terminals are moved to the post-movement coordinate positions, the method comprises connecting the second connection terminals and the first connection terminals, conducting the design rule check, and determining whether no design rule errors are detected newly and the selected design rule error is not detected either.

Abstract: A chip mounting system in which a whole system can be compact including a transfer stage and a tool holding member between a chip feeding section and a substrate holding section. In the chip mounting system, a transfer stage is disposed between a chip feeding stage and a substrate holding stage. A pick-up head and a mounting head are provided movably in a Y-axis direction in which the chip feeding stage and the substrate holding stage are aligned. A movable table which is movable in an X-axis direction, which intersects the Y-axis direction at right angles, is provided in a overwrapping movable region of the chip feeding stage and the substrate holding stage. The transfer stage and a tool holding member, which holds at least one of replacement tools for a pick-up tool and a mounting tool, are provided on the movable table.

Abstract: An electronic component mounting system formed by interlinking a plurality of electronic component mounting machines in series for enabling a machine operator to be prevented from mistaking the machine to which an operation section or a signal tower belongs for another. In each of the machines, an operation section placed to one direction side from a center in the board conveying direction of the machine on a machine side face is placed in an attitude in which the normal direction of an operation face is inclined toward the center line. A signal tower placed on one direction side from the center line on the top face of the machine is placed in an attitude in which at least one portion is inclined only at an angle ? toward the center line.

Abstract: An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.

Abstract: A component mounting apparatus including: plural spindles respectively including nozzles, each spindle rotating about a first pivot and each nozzle picking up a component; a head body rotating about a second pivot substantially parallel to a first pivot and rotatably supporting the spindles; and a controller controlling the spindles and the head body to perform: a pickup operation in which the spindle rotates about the first pivot from an initial orientation to a pickup orientation, the nozzle picks up the component, and the spindle rotates from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate; and a mounting operation in which the picked-up component is transferred to a mounting position of the substrate during which each spindle is retained at the initial orientation.

Abstract: A substrate conveyor track is provided with first to fourth conveyors. Two conveyors situated on both sides of the substrate conveyor track, and the other two conveyors situated at the center of the same. There is enabled selection of any one from a small substrate mounting mode for giving a single substrate conveyance width to the four conveyors and mounting electronic components on four small substrates having the single width; a large substrate mounting mode for actuating all movable conveyors to the center of the substrate conveyor track and mounting electronic components on two large substrates by the two conveyors; and a large-small-substrates mounting mode for bringing the two conveyors on one side of the substrate conveyor track, among the four conveyors, into the small substrate mounting mode and bringing one of the conveyors on the other side of the track into the large substrate mounting mode.

Abstract: A method for managing error information of a printed circuit board layout system is provided. The system provides an error file recording names of all the errors to be displayed in wiring diagrams, generates wiring diagram files, outputs a first user interface showing one wiring diagram. Each of the wiring diagram files includes an attribute table for describing error information. The attribute table comprises the names and the set of coordinates. The method comprises obtaining the error file and the attribute table, outputting a second user interface comprising a first display area and a second display area, outputting the name in the first display area, analyzing the obtained attribute table to provide a classifying table. Then outputting one selected name and at least one set of coordinates corresponding to the one selected name in the second display area according to the classifying table. A related system is also provided.

Abstract: A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture.

Abstract: A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.