Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: Provided are a chip mounting method and device. The chip mounting device comprises: a bonding head on which a device is loaded; and a controller which places the bonding head at a preparation height above a board, determines a search height at which a mounting position on the board, on which the device is to be mounted, is searched for by the controller, and lowers the bonding head from the preparation height to a bonding height via the search height and mounts the device on the mounting position on the board, by controlling movements of the bonding head, wherein the controller determines that the device touches the board if at least one of a plurality of conditions is satisfied.

Abstract: An exemplary surface mount machine nozzle includes a mounting element, a pneumatic suction nozzle and a fixing pin. The mounting element defines one of a pivot hole and an elongated perforation in a sidewall thereof. The pneumatic suction nozzle defines another one of the pivot hole and the elongated perforation therein. The fixing pin horizontally extends through the pivot hole and the perforation for connecting the mounting element and the pneumatic suction nozzle together. The fixing pin is slidable along the elongated perforation such that the pneumatic suction nozzle is telescopically slidable relative to the mounting element.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element being alignable with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligning with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: A challenge to be met by the present invention is to feed a carrier tape with superior positional accuracy by means of a simple, inexpensive configuration, thereby enhancing punching accuracy of a component and implementing highly reliable component mounting. A carrier tape feeder that feeds a carrier tape (11), to thus feed and position a component (10) to be punched next to a component pickup section (23) is built from a positioning feed roller (25) including sprocket wheels (61) that feed the carrier tape (11) by causing sprocket holes (13) formed in the carrier tape (11) to engage with teeth (62) and rotating the sprocket wheels and a support wheel section (63) around which there is wound at least a neighborhood of the sprocket holes (13) of the carrier tape (11) in a widthwise direction thereof, to thus support the carrier tape 811); and a rotation device (65) that rotationally drives the positioning feed roller (25).

Abstract: A press-in contact and a press-in tool for connecting an electronic component to a printed circuit board, the press-in contact of the electronic component being pressed into a contact opening of the printed circuit board by the press-in tool. Also a method for producing a press-in contact. The press-in contact includes at least one guide region which can be received in a guide contour of the press-in tool in a position-fixing manner. The maximum length of the guide region is a multiple of the maximum width or is substantially equal to or only slightly shorter than the maximum width and/or the guide region is highly rigid in the press-in direction (z direction) and flexible in the other directions (x/y directions). The method according to the invention is characterized in that contiguous, interlinked contours of the press-in contacts, which contours are produced as a ribbon or band, are supplied to a separating station and are separated at predetermined separation points into individual press-in contacts.

Abstract: An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

Abstract: An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.

Abstract: In a construction in which the intermediate stage 5 is interposed between the substrate positioning stage 4 and the electronic component supply stage 3; and in which it is possible to select either a mode of the bonding head 10A transferring to the substrate positioning stage 4 the electronic component P taken out of the electronic component supply stage 3 by the pickup head 6 and mounted on the intermediate stage 5 or a mode for transporting the electronic components, which has been taken directly out of the electronic component supply stage 3, to the substrate positioning stage 4 by means of the bonding head 10A, the pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of the beam member 8b of the gantry 8 positioned at the end of the base 2, and a space S that allows entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7.

Abstract: A component placement machine for assembling at least one component on to at least one printed circuit board (PCB) is provided. The component placement machine comprises at least one head configured for picking a component from at least one feeder and placing the picked component on to a PCB of a first PCB product. The component placement machine also includes at least one feeder bank system separate from the head, wherein the feeder system includes a first feeder bank and a second feeder bank and a positioning system for moving both the entire first feeder bank and the entire second feeder bank in both a horizontal X direction and a perpendicular horizontal Y direction, wherein the feeder bank system is configured to enable a setup of a second PCB product on the component placement machine while the component placement machine assembles the PCB of the first PCB product.

Abstract: A component placement apparatus includes: a tray storing device having slots for storing trays, a tray transporting device for transporting a tray from the tray storing device to a pickup area, a controller for controlling the transport of the trays into and out of the tray storing device, and at least one component pickup and placement device for picking-up a component in a tray located in the pickup area and placing the component on a substrate. The tray storing device includes first and second parts located proximal and distal the pickup area, respectively. The first part stores trays (i) from which at least one component may be removed and/or (ii) that are expected to be needed at the pickup area in the short term. The second part stores trays, which are empty, full, or are not expected to be needed in the pickup area in the short term.

Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.

Abstract: A tool for reconfiguring the pins of an SAE J560 electrical connector includes a handle and head. A plurality of openings provided in the free end of the head lead to a plurality of parallel equal diameter channels within the head. An elongate separator pin with a conical nose and a cylindrical body is concentrically fixed within each channel. The separator pins are configured to properly separate split electrode pins of an SAE J560 electrical connector, which inevitable deform through repeated coupling and decoupling.

Abstract: An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts.

Abstract: A flexible printed circuit (FPC) connector assembling fixture is provided for assembling an FPC connector. The assembling fixture includes a base that is set horizontally. A lower slidable carriage is slidably coupled to the base. Upper and lower molds are respectively and rotatably coupled to an upper slidable carriage and the lower slidable carriage. A terminal fitting mechanism and a cover mounting mechanism are respectively mounted to the upper and lower molds. Guide posts are mounted to the base. The upper mold is slidably coupled to the base with the guide posts. The lower mold forms an accommodation chamber. The cover mounting mechanism includes a push rod and first and second slide channels. The second slide channel is in communication with the accommodation chamber and the first slide channel. The push rod is received in and slidably coupled to the second slide channel.

Abstract: When bump electrodes 26 of a semiconductor light emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light emitting element 2 to emit light, the optical properties of the semiconductor light emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light emitting element.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board (PCB). The connector tool is a machined structure having a plurality of walls that define intersecting slots that mate with an array of male connector pins and include one or more ribs to reduce damage if the tool is dropped on the floor. The ribbed walls strengthen the connector tool, but do not interfere with the mating array of male connector pins. The connector tool also includes push shoulders to contact the connector apart from the array of male connector pins so as to seat the connector onto the PCB without connector tool and connector damage.

Abstract: In an electronic component mounting system constituted by interconnecting a plurality of mounting apparatuses, a board ID code attached by digital data to the board is read in a board supply apparatus located in the uppermost stream and transmitted to the mounting apparatuses on the downstream side via communication means. By comparing the transmitted board ID code with mounting nonrequirement board code data (defective board code, read error code, dummy board code, etc.) preparatorily stored in a storage section in the mounting apparatus, it is determined whether or not execution of mounting operation of the board is required, and the board determined to be not required to be subjected to mounting is unloaded to the downstream side without carrying out mounting works and without line stop.

Abstract: A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).

Abstract: A positioning apparatus for transferring at least one electronic component, in particular a chip, from a first flat support to at least one predetermined location on a second flat support which extends parallel to the first support, comprising an ejection device for removing the component from the first support by means of an ejection movement, wherein a camera device is provided for detecting position data of the predetermined location, of the component to be removed from the first support and optionally of the ejection device, which together with the camera device are arranged essentially on an imaginary common straight line. A positioning method is also described.

Abstract: An assembly fixture for fixing a part/component to a printed circuit board includes a platform, an elevating unit, and a carrying body. The platform has a receiving area and a plurality of positioning pillars. The elevating unit is disposed on the platform. The carrying body is coupled with the elevating unit, configured to correspond in position to the receiving area, configured to carry the printed circuit board, and provided therein with a plurality of through holes corresponding in position to the positioning pillars, respectively. The elevating unit is capable of descending to enable the positioning pillars to protrude from the printed circuit board and the through holes, respectively, for positioning the part/component on the printed circuit board. The assembly fixture is effective in positioning the part/component on the printed circuit board to render an assembly process of the printed circuit board easy, quick, safe, and precise.

Abstract: A method and system for packaging and mounting a sensor to a flex plate for use in sensing, for example, torque. In some instances, a SAW sense die can be adhesively bonded to a metal disc that includes at least one locating feature formed in the metal disc. An insulator having lead pins can be adhesively bonded to the metal disc, and may surrounds at least part of a periphery of the sense die in a particular orientation. In some instances, a cap may be bonded over the insulator. The metal disc, along with the SAW sense die, can be aligned to the flex plate by, for example, matching the at least one locating feature formed in the metal disc with at least one corresponding locating feature of a cutout in the flex plate. The aligned metal disc and the flex plate can be bonded together by, for example, laser welding.

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate.

Abstract: In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.

Abstract: An automatic or semiautomatic method of assembly of radiation digital imaging tiles to form a one or two dimensional imaging panel whereby the imaging tiles are provided with alignment mark(s), inherent or specific, and a mother board or substrate is also provide with alignment mark(s) and the imaging tiles are mounted on the mother board by means of mechanical pick and place mechanism, whereby the distances of corresponding alignment mark are set to predetermined values, programmed in the automatic machine.

Abstract: A row bar for forming sliders has a row of slider forming portions, each slider forming portion having a slider to be cut from the row bar and a medial region adjacent the slider, each medial region having a first guide pad disposed thereon; wherein each slider has: a slider body; a magnetic writer and a magnetic reader disposed on the slider body; a second guide pad disposed on the slider body; two electrical lapping guides disposed on the slider body and electrically connecting to the first guide pad and the second guide pad respectively; a row of bonding pads formed on the slider body and electrically connecting to the magnetic reader and the magnetic writer; and a grounding pad disposed on the slider body and electrically connecting to the first guide pad and the second guide pad. The invention also discloses a method of manufacturing the slider.

Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.

Abstract: An electronic component mounting device having high productivity while enhancing the electromagnetic shielding effect, and a method for manufacturing the same, including a housing formed by a conductive metal material and electronic components to be mounted inside the housing. The housing is configured by a first box body and a second box body fixed so that respective openings face each other and has a conductive layer stacked through an insulating layer arranged on an outer side of the first box body. The first box body includes a through-hole for retrieving a conductive wire connected to the electronic component to the conductive layer, and the through-hole is arranged at a position covered by the conductive layer.

Abstract: An automatic assembly jig adapted for assembling an electronic component and a case is provided. The jig includes a working platform, a carrier, a pressure exerting device and at least a gear. The working platform has a guiding rail. The carrier is disposed on the working platform and is slidably mounted on the guiding rail. The pressure exerting device is disposed above the working platform. The gear is disposed on the working platform and connected with the carrier, so as to drive the carrier moving along the guiding rail to the position under the pressure exerting device.

Abstract: A removing apparatus, for removing an electrical connector from a PCB, comprises a base, a pulling member, a pair of opposite clipping members, a lower supporting member and at least one resilient member. The pulling member connects to the base to be operated to bring the base up and down. The two clipping members pivotally mount to the base. The lower supporting member mounts below the base. The resilient member located between the base and the lower supporting member. When the base moves downwardly, the latch of the clipping member can engage with the electrical connector and pick it up from the PCB, when the base moves back, it is easy and secure to remove the electrical connector from the PCB.

Abstract: The invention is a modular assembly of modular objects for autonomously executing a variety of tasks. The modular assembly consists of a modular object called a platform, one or more modular objects called modules which are mounted to the platform in accordance with a modular assembly system, and a modular bus system for distributing electrical power and electrical signals among the modular objects in the modular assembly. The modular assembly system utilizes modular object fasteners (MOFs) and MOF-accommodating features of modular objects for facilitating the attachment of a plurality of modular objects to one another thereby creating a modular assembly in any one of a variety of configurations, an MOF being activatable when object attachment surfaces associated with two modular objects are superimposed and two object attachment points on the object attachment surfaces coincide.

Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Abstract: An assembling jig for lens module comprises a crutch, a mobile carrier and a pressing mechanism. The crutch includes a level mounting base and an erect support wall joined to one side of the mounting base. A firm carrier is fixed on the mounting base. The mobile carrier fixed on the firm carrier comprises a carrier base, several positioning blocks disposed around the top surface of the carrier base, the positioning blocks surrounding a restraining groove in which a PCB with a lens socket is received. The pressing mechanism disposed on the support wall includes a pressing member can move up and down and a drive gear connected to one end of the pressing member. This kind of lens module component assembling jig features in assembling lens component steadily and can be applied to different kinds of lens component. Thus it abates the cost of assembling the lens component.

Abstract: An electric parts mounting apparatus includes rotary type multi-nozzle mounting heads. Each of the mounting heads has a plurality of suction nozzles disposed in a radial manner on a rotor mechanism, which rotates around a rotation shaft. A parts mount mechanism is configured such that the axial direction of the rotation shaft coincides with an arrangement direction of tape feeders. A shaft-to-shaft distance of the suction nozzles is set to be plural times as large as a pitch of the feeder arrangement. In a pick up process, a plurality of electronic parts can be simultaneously picked up from the tape feeders. In a parts mounting process, while one of the mounting heads mounts the part, the other mounting head can complete a nozzle changeover operation such that the suction nozzle holding an electronic part to be mounted next is moved to an operation position.

Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Abstract: The present invention generally relates to an automated solar cell electrical connection device that is positioned within an automated solar cell fabrication system. The automated solar cell electrical connection device includes a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device.

Abstract: A harness making device having at least two receiving sections, a pivoting gripping device, a cable preparation device, and a cable transfer. Each receiving section is utilized for receiving a connection mechanism. The connection mechanism, in each case, connects an end portion of a cable to a connector. The gripping device is located in a fixed position between the at least two receiving sections, and is constructed to guide the end portion of the cable to the connection mechanism. Additionally, a cable preparation device is positioned to prepare a cable loop with the cable. The cable transfer, which is constructed to receive the at least one cable from the cable preparation device, positions the cable to the pivoting gripping device.

Abstract: Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography.

Abstract: A component mounting method of mounting a component onto a board by a component mounting apparatus (200) which includes a transportation device (220) having a plurality of rails capable of transporting a plurality of boards in parallel, and the method includes: positioning the rails (S108 to S112) so that a center of a mounting area in a forward-backward direction is at an intermediate position between two component supply units (211a, 211b), the mounting area covering an area in which two mounting heads (213a, 213b) mount components on one or more of the boards which are transported by the transportation device (220), and the intermediate position being equally distant in the forward-backward direction from the two mounting supply units (211a, 211b); and alternately mounting (S114) the components in the mounting area by the two mounting heads (213a, 213b).

Abstract: An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.

Abstract: In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.

Abstract: A panel is mounted on the stage while the one end electrode of the FPC (flexible board) is mounted on the mounting part of one surface of the panel and the other surface of the panel is facing upward. A mounting method includes bending the other end side of the flexible board, after holding the other end portion including the other end electrode, which is positionally adjusted based on the position recognition result of the mounting portion the press tool recognizing the position of the other end electrode, matching the positions of the mounting portion and the other end electrode by relative positional adjusting, and mounting the other end electrode on the mounting portion by temporarily pressing the other end electrode on the mounting portion.

Abstract: A quick circuit board press-mount device comprises: a positioning device, having a positioning board and a back board, and the positioning board having an adjusting knob with a screw rod portion, and the back board having an adjusting notch; an adjusting device, having a combining board, an insert board extended forward from the front end of the combining board, and the insert board having a screw hole for securing the screw rod portion, and the insert board being inserted into the adjusting notch, and the insert board having a lateral connecting board extended from a side from the combining board, and the lateral connecting board having an elliptic adjusting slot for securing a position screw hole of the back board by a screw rod; and a press-mount element, coupled to the combining board, so that the circuit board module and the interface card can be mounted conveniently and quickly.

Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.

Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Abstract: Embodiments of the present invention provide a module and process for forming electrical connections on a solar cell substrate in a solar cell production line. The module generally provides a substrate handling system, a substrate positioning system, a cross-buss attachment assembly, and a side-buss attachment assembly. The module may provide adaptations for automatically adjusting the module to receive and process various sizes of solar cell substrates.

Abstract: An inspection camera unit that images an inspection target part of a circuit board can be mounted, replaceably with a mounting head, on a moving mechanism of any one of a plurality of mounting machine modules arranged in alignment along a direction of conveying the circuit board. Also, an inspection image processing unit that processes an image signal output from the inspection camera unit to inspect the inspection target part of the circuit board can be mounted, replaceably with a feeder, on a feeder mount base of any one of the mounting machine modules. The inspection image processing unit is provided with a computer for image processing, a display panel that displays inspection information, and others.

Abstract: A manufacturing method of a printed circuit board unit is provided. A portion of bumps which is arranged on an electronic component is pressed to lower heights of the portion of bumps as compared to other bumps.

Abstract: A control system includes at least one part mounter installing parts on a printed circuit board and a control device integrally controlling the operation of the at least one part mounter. The control device controls the part mounter using information about the printed circuit board and information on a production process flow of the printed circuit board. The control device integrally controls the operations of the part mounters, including receiving and storing information on parts that the part mounters install, information on a feeder that supplies the parts, and information on arrangement of the parts on the printed circuit board, receiving and displaying operation information and operation situations from the part mounters, and controlling operations of the part mounters using the stored information and displayed information.