Abstract: A nozzle-mounting device for removably mounting, on a nozzle holder, a suction nozzle for holding an electric component by suction, wherein the nozzle holder includes one of a first fitting portion and a second fitting portion which respectively have an inner circumferential surface and an outer circumferential surface and which are arranged to effect a fitting engagement with each other at the inner and outer circumferential surfaces, while the suction nozzle includes the other of the first and second fitting portions, and one of the first and second fitting portions is provided with a first abutting portion located at an axially intermediate portion of mutually fitting parts of the inner and outer circumferential surfaces, while the other of the first and second fitting portions is provided with a second abutting portion arranged to be brought into abutting contact with the first abutting portion in a direction intersecting the axes of the fitting portions, and wherein a pressing device is provided to force

Abstract: A beam configured pick and place machine has nozzles of differing lengths for carrying large components simultaneously.

Abstract: An apparatus for feeding a plurality of electric-component tapes each of which includes a carrier tape and holds a plurality of electric components in a lengthwise direction of the carrier tape, and supplying, from the each electric-component tape, the electric components, one by one, to an object device, the apparatus including a feeding device which feeds a first electric-component tape in a lengthwise direction thereof, and a connection-portion detecting device which detects a connection portion where a terminal end portion of the first electric-component tape being fed by the feeding device is connected to an initial end portion of a second electric-component tape.

Abstract: A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction.

Abstract: A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.

Abstract: An apparatus is provided to simplify the construction of an assembling apparatus and shorten a tact time thereof for inserting a plurality of fuse into a box. In a fuse box assembling apparatus 1, fuses are fed one by one through outlets 2a of parts feeding units 2 provided for the respective kinds of fuses, and are inserted into a movable magazine 30. The movable magazine 30 is displaced to the respective outlets 2a by a displacing unit 5, thereby collecting necessary fuses in a specified order. The fuses are transferred from the movable magazine 30 to a fixed magazine 40 at once by a transferring mechanism 6 of the mounting unit 4, and are inserted one by one into a box by an inserting mechanism 7. Simultaneously with a fuse inserting operation, fuses to be inserted next are collected in the movable magazine 30.

Abstract: Disclosed herein are methods of fabricating three dimensional Micro-Electro-Mechanical-Systems (MEMS). This method involved stacking of silicon-containing components which are separated by spacers. The stacked components are precision aligned and then may be bonded, retained or fastened together to form a rigid structure. Spaces created between MEMS device components by the separations may be filled with an electrically isolating fluid such as a gas or vacuum. Also disclosed is a method of aligning components relative to each other and an alignment jig which may be used to align the components.

Abstract: In NC data creating device and method, a data input portion separates part data of a part to be mounted and mount coordinate data indicating the mount position of the part from design information of a board input and stores the production time of the board input, a feeding means characteristic management portion creates and manages feeding means characteristic data indicating the relationship between the part and the part feeding means on the basis of the part data, a recognizing method management portion creates and manages recognizing method data indicating the relationship between the part and a method of recognizing the part on the basis of the part data, a mount time management portion creates and manages the mount time data indicating the mount time required for mounting onto the board every part type on the basis of the part data, and numerical control data creating means creates numerical control data on the basis of the data of each storage portion and each management portion.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

Abstract: A nozzle rotating apparatus of a module head of a surface mounting device is capable of correcting an error occurring when a nozzle picks an electronic component and places it on a printed circuit board. The nozzle rotating apparatus of a module head of a surface mounting device for picking up an electronic component and placing it at a predetermined position, includes: a head movable in a predetermined direction along an upper portion of a substrate and having at least one shaft; a driving means for driving the head; a nozzle mounted at a lower predetermined portion of the head to pick up and place the electronic component; pinions installed at the outer periphery of the shaft installed at a predetermined portion of the head; a rack engaged with the pinions; and a driving force transmitting means for moving the rack to a predetermined direction.

Abstract: An electronic parts replacing apparatus comprises: a holder for holding a piece of electronic parts to be replaced; a head detachably provided to the holder; and a guide bar for guiding the head to move close to or away from a circuit board. After holding the piece of electronic parts to be replaced on the circuit board by the holder and then integrating the head to the holder, the piece of electronic parts to be replaced are removed by moving the holder to a direction away from the circuit board. After removing the piece of electronic parts to be replaced from the holder and then holding a new piece of replacing electronic parts, the piece of replacing electronic parts are mounted on the circuit board by moving the head close to the circuit board.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: A component mounting apparatus and method allows for components supplied from component supplying members to be simultaneously or continuously held by component holding members without being affected by positional displacements of the component holding members relative to a head, a positional displacement of the component supplying members or the like. With a positional displacement amount (&Dgr;y) along a Y direction relative to a reference position of a nozzle taken into account, at a component supply cassette, driving a motor for moving components one by one along the Y direction to a component supply position is controlled, thereby positionally adjusting a component at the component supply position and absorbing the positional displacement amount.

Abstract: An electric-component mounting system, including a board supporting device, a movable member, a main moving device which moves the movable member, a rotatable body attached to the movable member, a rotatable-body rotating device which rotates the rotatable body, suction nozzles supported by the rotatable body along a circle whose center is located on an axis line of the rotatable body, such that each suction nozzle is not rotatable relative to the body and is movable relative to the body in a direction parallel to the axis line, an engaging member rotatable relative to the rotatable body about the axis line, movable relative to the body in the direction parallel to the axis line, and including a nozzle-engaging portion engageable with one suction nozzle, an engaging-member rotating device which rotates the engaging member to two rotation phases of the rotatable body at each of which the nozzle-engaging portion is engageable with one suction nozzle, an engaging-member moving device which moves the engaging mem

Abstract: Components are allocated to pipettes of different pipette types in accordance with an inverse greedy method or in accordance with a sequence of flow methods or a linear program as a result of which, for a given consecutive-ones characteristic of all the possible allocations, an optimun solution is ensured for a number of cycles, which can be predetermined, for the process of population a printed circuit board by means of an automatic placement machine.

Abstract: The invention provides a method for processing leadframe items to form IC packages, each of the leadframe items comprising an IC carried by a suitable leadframe, the leadframe items being of two or more types. The method includes receiving the two or more types of leadframe items along respective input paths, moving at least two holders alternately between a processing region and a respective leadframe item reception position, each of the holders moving to the processing region and at a time when the other of the holders moves to its respective reception position, the reception positions being on respective ones of the input paths, each of the holders receiving leadframe items of the respective type at the respective reception position and delivering them to the processing region and encapsulating the ICs at the processing position.

Abstract: A method of mounting electronic components on a circuit substrate using an electronic component mounting device. The electronic component mounting device is operatively associated with (1) a component-supply table which includes a displaceable table and a plurality of component-supply units on the displaceable table and (2) a table displacing device which displaces the displaceable table in a desired direction and which positions the component-supply portion of each component-supply unit at a predetermined component-supply position. The electric component mounting device includes a plurality of component holders which are positioned at a component received position opposed to the component supply position. The method includes causing the component holder to receive, at the component receive position, an electric component from the component-supply portion of each component-supply unit which is positioned at the component-supply position.

Abstract: The storage system includes a storage platform cantilevered above a surface mount placement machine. The storage platform is attached to a vertical support member positioned adjacent to the surface mount placement machine. A storage tray is located on the storage platform and extends above the surface mount placement machine.

Abstract: In the invention, there is provided an apparatus for mounting electronic components in which a plurality of mounting heads pick up electronic components concurrently from a plurality of component feeding units for mounting the electronic components on a print circuit board, with assured pick-up and holding of the electronic components. The component feeding units 3 do not always have an identical pick-up position 10 among all the units 3 used in a mounting operation because of the variation in the manufacturing and the mounting of the units. The shift due to the variation along the direction of feeding, the Y direction, is corrected by moving the position of the nozzle 21 along the Y direction with a controlled rotation of the mounting head 7 around an horizontal axis using the nozzle selection motor 22 for selecting the nozzle 21.

Abstract: An apparatus for mounting one or more electric components on a circuit substrate, the apparatus including a nozzle moving device which moves a suction nozzle having an end surface that applies a suction to an electric component and thereby holds the component, in a direction intersecting an axis line of the suction nozzle, and an elevating and lowering device which elevates and lowers the suction nozzle so that the suction nozzle performs at least one of sucking and holding the electric component and mounting the component on the circuit substrate, the elevating and lowering device including a movable member, and a connecting device which connects the movable member to the suction nozzle such that the suction nozzle continues moving while the movable member continues moving, the connecting device including a downward-movement control device which changes, while the apparatus performs an electric-component mounting operation, at least one of a position of an end of a downward movement of the suction nozzle cau

Abstract: A fastener for fastening and releasing a first electrical contact on a cable with a second electrical contact on a computer component, and a method for fastening and releasing the first and second electrical contacts, are shown and described. The computer component generally has an attachment orifice defining a fastening axis. In one embodiment, the fastener has a body, an elongated casing, an engagement element and an actuator. The elongated casing can project from the body along the fastening axis when the first and second electrical contacts are aligned for engagement. The engagement element can be positioned along the casing at a location spaced apart from the body. The casing and/or the engagement element is movable between release and fasten positions. In the release position, the engagement element is generally near the fastening axis and the casing and/or the engagement element is generally configured to be received in the attachment orifice.

Abstract: A device for aligning a PC board (2) on a manual press (50) for insertion of an electronic component (1) into an insertion zone (z). The device comprises a manually operated X-Y table, to which the PC-board (2) is secured. The X-Y table comprises an X carriage (40) movable along an X-axis and a Y carriage (11) movable along a Y-axis. Respective correction carriages (21,25) are movably mounted to each of the X and Y carriages. Respective correction carriages have corresponding correction motors for moving each of the correction carriages relative to the X and Y carriages. Encoders (17,18) are respectively connected to the X and Y carriages for detecting a position of the X and Y carriages. The encoders are connected to control units for operating correction motors of the correction carriages in response to a signal from the encoders indicating the position of the X and Y carriages.

Abstract: A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a predetermined arrangement, which comprises: determining a particular arrangement axis direction in which intervals between adjacent linear arrangement axes connecting the bumps becomes the shortest; and adhering the adhesive film in the direction substantially at a right angle with the determined arrangement axis direction, so as to markedly reduce voids included in the adhesion surface upon adhering an adhesive film such as underfill onto a semiconductor wafer.

Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface.

Abstract: A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.

Abstract: An apparatus for automatically resetting a printed-wiring-board supporting device including a supporting table and a plurality of supporting members which are set on a surface of the supporting table to support a back surface of a printed wiring board, the apparatus including a supporting-member storing device in which the supporting members are stored, a holding head which can hold each of the supporting members, a moving device which moves the holding head relative to each of the supporting table and the storing device, in a direction parallel to the surface of the supporting table, so that the holding head takes a prescribed one of the supporting members from the storing device and sets the supporting member at a prescribed setting position on the surface of the supporting table, and takes the supporting member from the setting position and stores the supporting member in the storing device, and a control device which controls the moving device.

Abstract: A parts mounting system includes a plurality of mounting units and a parts distributor unit for distributing parts to the mounting units. The parts distributor unit includes a specifying section for specifying types of parts that can be mounted by each of the mounting units, as division-specified parts, and a distributor section for sequentially distributing parts, based on the types of parts, from the parts other than the division-specified parts, to the mounting units. The distributor section sequentially distributes the division-specified parts to the mounting units so that the division-specified parts are divided thereby to reduce a difference in mounting time by each mounting unit after the parts other than division-specified parts are distributed.

Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Abstract: The system of the present invention provides a pair of assembly modules for assembling electronic components to a series of printed circuit boards or like substrates. The pair of assembly modules are operatively connected in series, and each module includes a pair of assembly stations operating in parallel within the module. Means are provided to bypass the first assembly module and deliver unpopulated substrates to the second module for processing, while simultaneously bypassing the second assembly module with substrates populated by the first assembly module. In the event that one of the assembly stations of either assembly module is inoperative, it may be bypassed and the assembly of its electronic components redistributed to the remaining, operative assembly stations to optimize the productivity of the system.

Abstract: An apparatus for moving an operative suction nozzle which holds an electric component. The apparatus mounts the electric component held by the operative suction nozzle on a circuit board. The apparatus includes a device which supplies the electric component to the operative suction nozzle; a device which supports the circuit substrate; a nozzle storing device which stores normal suction nozzles; and a nozzle moving device. A nozzle-defect detecting device which detects a defeat of the operative suction nozzle is provided. Also provided is a nozzle exchanging device which automatically operates the nozzle moving device to move the defective suction nozzle having the detected defect, to the nozzle storing device so that the defective suction nozzle is exchanged with the normal suction nozzle stored by the nozzle storing device.

Abstract: An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.

Abstract: A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board includes an eliminating unit, which melts the solder, and removes the battery contact part from the board part while the solder is melted. An assembling unit mounts an unused battery contact part on the board part. The unused battery contact part has an unused form of the first battery contact part. A soldering unit connects the unused battery contact part to the board part by use of solder.

Abstract: Mounting parts is performed by recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking up a part on the part feeder, moving an image sensor installed to be capable of moving to a position close to the particular part feeder, picking up a part from the particular part feeder with a suction nozzle installed at the head unit, moving the head unit to a position above the image sensor, detecting an image of the part held by the suction nozzle, moving the suction nozzle to a printed circuit board from the image sensor, and aligning the part with the printed circuit board while determining and compensating for an error generated when the part is picked up, and mounting the aligned part on the printed circuit board.

Abstract: A mounter head is provided for a surface mounting apparatus which is capable of easily controlling a pitch of a mounting device as well as preventing backlash when the device is mounted on a printed circuit board. The mounter head includes a rack block having a rack for moving up and down by means of a pinion rotated by a driving source; a nozzle shaft installed at one side of the moving unit; a nozzle secured to the lower end of the nozzle shaft for sucking a device to be mounted; and a driving source installed corresponding to each nozzle shaft for rotating each nozzle.

Abstract: An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An apparatus for mounting electronic parts enhancing the versatility in the operation for mounting electronic parts and facilitating the operation and maintenance. The apparatus for mounting electronic parts includes four electronic parts-mounting units, means for conveying a mounting board, and a communications system for communication among the mounting units. Each mounting unit includes a communication portion for inputting/outputting data to and from the communications system, a selection filter for selectively obtaining sequence data related to the preset machine logic number from the input sequence data, and an operation control unit for controlling the operation for mounting electronic parts based on the obtained sequence data. The mounting unit works as a parent unit to receive a systematic control function of the whole apparatus, and the mounting units work as child units.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract: A part mounting apparatus mounts a part, such as a film electronic part, accurately and efficiently on a substrate, such as a glass substrate. A measuring device (21) moves along the edges of a glass substrate (31) and measures the distance between the measuring device (21) and the glass substrate (31) at predetermined positions. The measuring device (21) gives measured data to a controller (22). The controller (22) determines the state of deformation of the glass substrate (31) on the basis of the measured data and controls suctions to be applied by suction pads (12) included in a substrate conveying unit (10) to the glass substrate (31) on the basis of the measured data. The glass substrate (31) being conveyed by the substrate conveying unit (10) receives downward suctions of the suction pads (12) and upward reaction forces of props (13).

Abstract: An electronic component mounting apparatus uses sensors and a controller to correct the position at which a component holder, generally a suction nozzle, captures a component, thus avoiding component capture errors and failures. More specifically, sensors detect a deviation amount between a predetermined location on a component absorbed by a suction nozzle and the suction position of the suction nozzle. The deviation amount is multiplied by a sensitivity coefficient, and the resulting adjusted deviation amount is then applied by the controller to correct the position of the suction nozzle when capturing a subsequent component. Accordingly, the subsequent component is absorbed by the suction nozzle normal to the component and at a position substantially centered with respect to the component, reducing the occurrence of suction errors.

Abstract: A method of transferring component tape information to a component mounting machine, a tape guide for guiding a component tape in a component mounting machine, and a tape magazine for receiving the tape guide. The tape guide is arranged for quick and ready attachment and detachment into and from the component mounting machine. The loading and/or unloading of a component tape into and from the tape guide can be performed away from the component mounting machine. The ability to be releasably mounted is achieved by providing the tape guide with a lock that enables ready and quick attachment and detachment to an interacting lock in a component mounting machine, or in a tape magazine arranged for insertion into a component mounting machine, and a guide for guiding the component tape. The tape guide further includes an identifier for holding the identity of the tape guide, which can be associated with information relating to the component tape.

Abstract: A method of supplying circuit components to a component mounting device from a feeder. The component mounting device removes the components from the feeder and transfers them to and mounts them on a circuit substrate. The method includes providing a plurality of feeders which each include a main portion, a feeding mechanism, a component supply portion and a component holding portion. The component holding portions hold the circuit components. The main portions of the feeders are mounted on a movable table such that the component holding portions of the feeders are arranged along a line. The main portions support the feeding mechanisms, which feed the circuit components one by one from the component holding portions to component supply portions. The movable table is moved along the line.

Abstract: A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where the sides act as leaf springs gripping the substrate. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. In the preferred embodiment, the lid and sides are formed from an integral piece of stainless steel. Also provided are flares at the bottom of each side to aid in guiding the lid onto the substrate. Protrusions are provided in the sides to prevent the lid from slipping too far onto the substrate and contacting the components mounted to the substrate. Also provided is at least one hole in the top surface to allow the lid to be pried free from the substrate after completion of the steps where vacuum probe movement is required.

Abstract: The invention encompasses an electrical apparatus. Such apparatus comprises a first substrate having first circuitry supported thereby. The first circuitry defines at least a portion of a radio frequency identification device. At least one first electrical node is supported by the substrate and in electrical connection with the first circuitry. The apparatus further comprises an input device comprising a second substrate and second circuitry on the second substrate. The second circuitry is in electrical communication with at least one second electrical node. Neither of the first nor second electrical nodes is a lead, and the second electrical node is adhered to the first electrical node to electrically connect the input device with the radio frequency identification device. The invention also encompasses a termite-sensing apparatus. Additionally, the invention encompasses methods of forming electrical apparatuses, and methods for sensing termites.

Abstract: An apparatus for supporting an electric-component mounter including a substrate supporting device which supports a circuit substrate, an electric-component supplying device which supplies a plurality of electric components to be mounted on the circuit substrate, a mounting device which receives the electric components from the electric-component supplying device and mounts the electric components on the circuit substrate supported by the substrate supporting device, and a base member which supports the substrate supporting device, the electric-component supplying device, and the mounting device, the apparatus including at least one elastic member which is provided between the base member and a surface of a floor which supports the base member, and at least one damper which damps vibration of the base member and the floor surface relative to each other, the vibration resulting from elastic deformation of the elastic member.

Abstract: The invention provides a method of forming an electrical contact device and a pre-assembly for producing the electrical contact device. The electrical contact device is formed by providing a conducting frame and an insulating frame which is added to predetermined portions of the conducting frame to form the pre-assembly. A plurality of fine pitch electrical leads are disposed in parallel spaced apart relation and connected to each other by connecting strips. An insulating material is applied to the conducting frame to form the insulating frame. The insulating frame encapsulates portions of the electrical leads which extend from opposite sides of the center of the insulating frame retaining, therefore, the electrical leads in position and electrically isolated from one another. Portions of the conducting frame are then removed from the pre-assembly to obtain the electrical device.

Abstract: A component pick and place apparatus includes a housing including; a rotatable frame and a plurality of pick-up and place heads mounted on the frame. The pick-up and place heads are rotatable from a first position to at least a second position, and includes a spindle which is movable from a retracted position to an extended position. A first actuator moves the spindle at the first position from the retracted position to the extended position for picking up or placing the component; and a second actuator moves a spindle so that when a pick-up and place head is at the second position a spindle is moved from the retracted position to the extended position for ascertaining the position of the picked-up component. This apparatus eliminates positional errors of the pick-up and place head spindle as it moves from its retracted position to its extended position when the component is placed.

Abstract: The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.

Abstract: An electronic parts-mounting apparatus including a rotating vertical shaft and at least one mounting head arranged around the vertical shaft has a lift cam mechanism that operates to lift and lower an associated one of the at least one mounting head as each mounting head is rotated with the vertical shaft. The lift cam mechanism includes a cylindrical cam having an annular protruding portion concentrically disposed with respect to the vertical shaft that provides upper and lower cam surfaces. Upper and lower rolling cam followers are arranged respectively on the upper and lower cam surfaces of the protruding portion to sandwich the protruding portion therebetween. One end of a support member has one of the upper and lower cam followers mounted thereon and the other end of the support member has the associated one of the at least one mounting head connected thereto.