Abstract: In a component pressing head which holds a component with a component holding tool provided at one end of a shaft member, rotates the component around an axis of the shaft member and presses the component in an axial direction of the axis, a first voice coil motor and a second voice coil motor are disposed between a upper plate and a lower plate so as to sandwich the shaft member from opposite sides thereof, so that a load is transmitted to the shaft member from the lower plate that is coupled to movable magnet holding portions of these two voice coil motors.

Abstract: A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fasteners associated with the compression devices. The device is able to assist in the formation of an electrical contact between a chip package in the land grid array assembly and a circuit board by the lower surface being pressed against the compression devices to compress the compression devices and then allowing the plurality of fasteners to be tightened.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: An electronic component mounting apparatus is configured to adjust a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for component picking and mounting operations, linear scale signals from linear scale reading heads are inputted to a Y2 driver and a Y1 driver, respectively. Each of the Y2 driver and the Y1 driver calculates a difference between positions of the drive axes of the beam and controls a moving member of a linear motor based on the difference so as to increase thrust of one drive axis when the one drive axis is in a more backward position than another drive axis and to reduce the thrust of one drive axis when the one drive axis in a more forward position than another drive axis.

Abstract: An electrically operated chucking apparatus including (a) an electrically operated chuck including at least two movable members movable toward and away from each other, and at least two drive devices which include respective electrically operated actuators operable to move the at least two movable members, respectively, toward and away from each other, and (b) a control device operable to control the at least two drive devices, and wherein the control device includes: a drive control portion operable to control the at least two drive devices such that each of at least one of an actual position and an actual speed of movement of the at least two movable members changes toward a predetermined target value; and a load detecting portion operable to detect a load acting on the at least two movable members during operation of the drive control portion to control the at least two drive device.

Abstract: A micro device using assembly system for feeding, programming, and placing micro devices on circuit boards includes a robotic handling system capable of picking up and placing the micro devices on the circuit boards on a conveyor system. A control system controls the conveyor system and the robotic handling system. An input feeder provides the micro devices and a programming system is capable of programming a plurality of micro devices in sockets which are in line parallel with the input feeder. The input feeder responds to communication with the control system to feed the unprogrammed micro devices while the programming system programs the micro devices and communicates to the control system. The robotic handling system responds to communication of the programming system with the control system to pickup and places the programmed micro devices on the circuit boards at high speed.

Abstract: Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

Abstract: A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

Abstract: The present invention features a method and apparatus wherein a component in a component placement machine is rejected during the placement cycle and subsequently retained in a component rejection station. A component is imaged and the image processed using an automated vision system. The image processing determines whether the component is placeable based upon a comparison of the component image to preprogrammed mechanical parameters for the component. A non-placeable component is rejected into a reject station with means to retain the component. Because a component can not escape the reject station, there is no degradation of the placement machine performance.

Abstract: When mounting semiconductor chips, the semiconductor chips are presented on a wafer table where they are picked one after the other by a pick and place system, transported and placed onto a substrate that rests on a supporting surface of a substrate table. The wafer table is aligned diagonally to the supporting surface of the substrate table whereby part of the wafer table is located under the substrate table. The pick and place system comprises a shuttle with a swivel arm carrying a bondhead. The swivel arm is swivelled back and forth between two predetermined swivel positions whereby in the first swivel position a longitudinal axis of the swivel arm embraces the angle ? with the perpendicular to the supporting surface of the substrate table and whereby in the second swivel position the longitudinal axis of the swivel arm runs orthogonally to the supporting surface of the substrate table.

Abstract: A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.

Abstract: A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring pattern, sealing the electric element with a thermosetting resin composition, and grinding or abrading the thermosetting resin composition and electric element from a side of the electric element opposite that of the wiring pattern. The method provides upper surfaces of the electric element and the thermosetting resin composition that are substantially flush with each other. The method provides an electric element built-in module suitable for high-density packaging with a reduced thickness without damaging the electric element and while maintaining mechanical strength.

Abstract: A suction head is inserted between first and second cameras relatively disposed facing one another with aligned optical axes, so that the first camera takes images of a head reference mark on the suction head, and the second camera of a first part suctioned to the suction head. Next, a stage is inserted between the first and second cameras so that the first camera takes images of a second part held on the stage, and the second camera of a stage reference mark thereupon. The relative positions between the first part and the suction head, and between the second part and the stage, are calculated based upon image information from the cameras, and the suction head and the stage are positioned, the first and second parts being relatively positioned based upon positional information and relative positional information from the first and second cameras, and mounting is performed.

Abstract: A device for installation of signalization spheres and verification of the status of a lightning-rod cable. A supporting structure, consisting of two bases equidistant, parallel to each other, linked to each other by axial segments, the axial segments acting as supports for activation engines, respectively, a grounding and idler tension system including a structure formed by two parallel rods that move along the vertical direction linked to two bases equidistant and parallel to each other in its intermediate portion through an axis. In its superior extremity through an axis and presenting in its inferior extremity slots for the introduction of an axis of a wheel. A first axial segment being equipped in its intermediate portion with a threaded rod which is linked it its inferior extremity to the axial segment of the bases superiorly equipped with a crank and spring. A fork is articulated over a pivot to the external part of the bases whereto are projected the feeding system.

Abstract: A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is to be transferred, adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on one of the substrates (a reference substrate) and alignment marks formed on other two of the substrates are aligned with each other, and transferring the object to be transferred from the first substrate to the second substrate, the transferring step including irradiating the object to be transferred from the first substrate with light transmitted through the mask substrate.

Abstract: A method of utilizing a removable protective tape to protect the active surfaces of semiconductor wafer and the individual semiconductor chips during semiconductor packaging processes is provided along with several configurations of apparatuses that may be used in such a method for removing protective tape portions from individual semiconductor chips during the assembly process.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: A method of installing a driver for a plug and play device is provided, wherein the plug and play device includes a main function device and a storage device meeting a standard specification. The storage device stores a driver required by the main function device. The main function device and storage device may be connected to the host in two different ways after the plug and play device is installed to the host. The first way is to connect the two devices to the host simultaneously. The host loads a built-in standard driver for the storage device from the host to access the storage device, and then loads the driver required by the main function device from the storage device to gain freely access to the main function device. The second way is to connect the storage device to the host, and to cause the host to copy the main function device driver from the storage device to the host's storage device (e.g., a disk drive). Next, the main function device is connected to the host.

Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.

Abstract: A component mounting machine is arranged to perform a method for handling boards in a component mounting machine includes the steps of moving a plurality of boards substantially simultaneously from a first plurality of cassettes, arranged in parallel at the machine, onto a board carrier; processing said plurality of boards by mounting components thereon; moving said plurality of boards substantially simultaneously and in parallel from the board carrier into a second plurality of board cassettes arranged in parallel at the machine and moving a next plurality of boards from said first plurality of cassettes onto the board carrier; repeating the steps of processing and moving the plurality of boards until said first plurality of cassettes are empty; and exchanging cassettes and repeating the method from step a.

Abstract: A plurality of flexible printed circuit boards are held on a transfer carrier, which is formed by a base plate and a resin layer formed on an upper surface of the base plate. Reference pins are positioned at reference pin openings of the carrier base plate and reference holes of the flexible printed circuit boards are positioned at the reference pins in order to adhere the board to the carrier resin layer. Electronic parts are mounted on the flexible printed circuit board by bonding the electronic parts to bonding portions of the flexible printed circuit board.

Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Abstract: According to the present invention, in the field of packaging the chip component, increase in speed and stability in packaging the chip component is achieved without significantly increasing the cost of the device. The size of the suction face of the suction nozzle is set so as to be larger than the relevant chip component. Near the inserting position P of the chip component, a push cover is provided in close proximity to the upper surface of the carrier tape. A hole is provided in the push cover at the inserting position P, and the size of the hole is slightly larger than the size of the tip face of the suction nozzle. After the chip component held to the suction nozzle enters the component-accommodating recess of the carrier tape, the suction of the suction nozzle is released and the carrier tape starts to move in the direction shown with an arrow, orthogonal to the suction nozzle. The suction nozzle is raised after the opening of the component-accommodating recess is completely under the push cover.

Abstract: A method of transferring component tape information to a component mounting machine, a tape guide for guiding a component tape in a component mounting machine, and a tape magazine for receiving the tape guide. The tape guide is arranged for quick and ready attachment and detachment into and from the component mounting machine. The loading and/or unloading of a component tape into and from the tape guide can be performed away from the component mounting machine. The ability to be releasably mounted is achieved by providing the tape guide with a lock that enables ready and quick attachment and detachment to an interacting lock in a component mounting machine, or in a tape magazine arranged for insertion into a component mounting machine, and a guide for guiding the component tape. The tape guide further includes an identifier for holding the identity of the tape guide, which can be associated with information relating to the component tape.

Abstract: The inventive device comprises a positioning device (4) for a fitting head (14). The positioning device is anchored on a support (3), which is detachably fastened to a supporting body (2) of the inventive device. A control device (17) for the positioning device (4) is additionally fastened to the support. These functional parts form a completely operative functional unit, which can be separately tested, calibrated and supplied by the supporting body (2). Different supports (3, 23) for different positioning devices (4, 20) can be fastened to the supporting body (2), whereby the inventive device can be optimally adapted to perform different fitting tasks.

Abstract: A system for performing an operation to a printed wiring board (PWB) having an apparatus for automatically resetting a PWB supporting device including a supporting table, supporting members which are set on a surface of the supporting table to support the PWB, a supporting-member storing device for storing the supporting members, a holding head for holding each of the supporting members, a moving device which moves the holding head relative to each of the supporting table and the storing device, in a direction parallel to the supporting table surface, so that the holding head takes a prescribed one of the supporting members from the storing device and sets the supporting member at a prescribed setting position on the surface of the supporting table, and takes the supporting member from the setting position and stores the supporting member in the storing device, and a control device which controls the moving device.

Abstract: An electronic parts mounting apparatus which holds an electronic part with a mounting head, photographs the electronic part by a line camera 11, processes an image of the electronic part photographed by the line camera to recognize a position of the electronic part by using a recognition unit 16, positions the electronic part to a substrate in accordance with the position recognition result, and mounts the electronic part on the substrate. Offset values which are pre-stored for each recognition system associated with its own light source, a light source for transmission illumination 15a or a light source for reflection illumination 15b, are used for offset values used when a position correction is made, at the time of positioning, based on the position recognition result.

Abstract: Mounting methods of electronic components in which the electronic components are mounted on plural printed circuit boards are disclosed. An exemplary method includes: supplying a printed circuit board on a first conveyor; transferring the printed circuit board to the third conveyor and simultaneously, transferring the printed circuit board transferred to the first conveyor to the second conveyor; mounting the electronic components to about half-portion of the printed circuit board by moving the printed circuit board to one side and simultaneously, mounting the electronic components to about half-portion from the original position of the printed circuit board; and transferring the printed circuit board to a fourth conveyor, simultaneously transferring the printed circuit board to the second conveyor to the third conveyor and then discharging the printed circuit boards sequentially.

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. The stub contacts may be formed by trimming the leads of an existing vertical surface mount package. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract: An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.

Abstract: Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.

Abstract: The present invention has for its object to provide a mechanism for preventing a liquid from splashing from a liquid tank, and a component mounting apparatus with this liquid splashing prevention mechanism. The liquid splash prevention mechanism has a first seal member with a circumferential outer face attached to a first driving lever in a lubricating oil tank, and a second seal member with an arc face set in the lubricating oil tank correspondingly to the first seal member so that a sealing gap for preventing lubricating oil from scattering is formed between the first seal member and the second seal member. Moreover, the lubricating oil is filled in the sealing gap. Scattering of the lubricating oil is more surely prevented by this arrangement. Quality degradation to be caused by adhesion of the lubricating oil to printed boards and the like can be prevented, and productivity can be improved.

Abstract: A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.

Abstract: In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.

Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

Abstract: Adjustment of image pickup conditions through alternative selection of two cameras different in resolution, adjustment of image lightness of a to-be-recognized component based on component information of the component, and performing control allows an image of the component to be picked up by either one of the cameras under the image pickup conditions.

Abstract: An electric-component mounting system including a substrate-holding device for holding at least one circuit substrate, at least one first mounting unit and at least one second mounting unit, each of which has at least one mounting head each operable to receive a selected one of the electric components while each mounting unit is located in a component-supplying area, and to mount the electric component onto the at least one circuit substrate held by the substrate-holding device located in a component-mounting area, and a mounting-unit moving device operable to move the at least one first mounting unit and the at least one second mounting unit past each other, between the component-supplying and component-mounting areas in opposite directions, along respective two paths, without an interference between the first mounting unit and second mounting units.

Abstract: A motherboard is assembled into an information handling system by coupling simulated electronic connectors of an assembly platform to electronic connectors of the motherboard to support movement of the motherboard to an installation position in the information handling system chassis. Openings in the assembly platform allow insertion of attachment devices to attach the motherboard to the chassis of the information handling system. Once the motherboard is secured to the chassis, the assembly platform is removed by pulling away from the motherboard to de-couple the simulated electronic connectors of the assembly board from the electronic connectors of the motherboard.

Abstract: An electric-component mounting system wherein a determining device is operated for presently required operations of working devices disposed on a common main body, to determine a cycle-time-determinant working device which determines a cycle time of the system such that the cycle time is determined by a required operating time of the cycle-time-determinant working device as calculated when the presently required operation is performed at predetermined maximum acceleration and deceleration values or a predetermined maximum operating speed, and a slowdown device determines actual acceleration and deceleration values or an actual operating speed of each of non-cycle-time-determinant working device, so as to be lower than the predetermined maximum acceleration and deceleration values or operating speed thereof, such that the presently required operation of each non-cycle-time-determinant working device can be completed within the cycle time determined by the cycle-time-determinant working device.

Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

Abstract: A method is described for producing a module to be incorporated in a card body wherein a module carrier is provided with a conductive structure on one side. During production of the module carrier, a material whose properties essential for a certain manner of connection with a layer of material of the card body upon incorporation of the module in the card body are adjusted to said layer of material is used at least for a first layer of the module carrier located on the side opposite the conductive structure.

Abstract: An apparatus for performing an operation on a circuit substrate, the apparatus including a plurality of operating devices which are provided in a space that is closed and opened by a safety cover and one of which performs the operation on the circuit substrate, a safety-cover switch which is switchable to an ON state thereof corresponding to a closed state of the safety cover, and to an OFF state thereof corresponding to an opened state of the safety cover, a maintenance-related control device which keeps, in a maintenance mode, at least one of the operating devices to a state thereof in which the one operating device is operable, and a maintenance-mode setting switch which cooperates with the safety-cover switch to provide a parallel circuit, and which is selectively operable to an ON state thereof in which the maintenance-mode setting switch allows setting of the maintenance mode, and to an OFF state thereof in which the maintenance-mode setting switch does not allow the setting of the maintenance mode.

Abstract: An electronic-circuit-component mounting system including at least two component mounting units concurrently operated to mount electronic circuit components on a printed-wiring board, wherein a relative position of the two units is obtained from positions of a common calibration mark fixed provided on machine base commonly for the two units, which positions are detected by fiducial-mark cameras of the two units, or obtained from positions of fiducial marks provided on a fiducial board, which positions are detected by the cameras while the fiducial board is located in alignment with component mounting areas of the two units, and wherein positioning errors of the printed-wiring board relative to the two units are calculated on the basis of the obtained relative position of the two units, and positions of at least two fiducial marks provided on the printed-wiring board, which positions are detected by the cameras of the two units.

Abstract: A method for conveying printed circuit boards (PCBs) in a system that includes at least two assembly modules, where each assembly module has multiple conveyors for delivering the PCBs so that while processing some PCBs, other PCBs can bypass particular assembly modules.

Abstract: An apparatus for mounting electronic parts and a method of mounting electronic parts capable of effectively performing image capturing at the time of position recognition of the electronic parts. In the apparatus, when images of electronic parts are taken for position recognition of the parts in the mounting of a plurality of the electronic parts held by a mounting head on a circuit board, it is adapted such that pixel signals are output only from specific necessary pixels. More specifically, pixel selecting information for allowing image signals to be selectively output from a plurality of specific pixels of a photodetecting section (10) of a CMOS area sensor is generated based on mounting schedule data (16C) related to a mounting sequence of the electronic parts and part data of the electronic parts stored in data storage (16). A pixel selector (11) is operated in accordance with the pixel selecting information, and thus the image signals are output from the selected specific pixels.

Abstract: A method of sequentially mounting, on a printed-wiring board supported by a board supporting device, a plurality of electric components which are sucked and held by respective ends of a plurality of suction nozzles which are supported by a rotatable body such that the suction nozzles are provided along a circle whose center is located on an axis line of the rotatable body and such that each of the suction nozzles is not rotatable relative to the rotatable body and is movable relative to the body in a direction parallel to the axis line of the body, the rotatable body being attached to a movable member which is movable to an arbitrary position on a movement plane parallel to the printed-wiring board supported by the board supporting device, such that the rotatable body is rotatable about the axis line thereof perpendicular to the movement plane.

Abstract: A cassette control device by which high-speed processing can be expected even by using an arithmetical unit with current processing capability, even when the number of cassettes increases simultaneously with an increase in the number of nozzles which can suck electronic parts. There is provided storage unit (18) having storage regions in which programs for respective operation patterns of the cassettes (3-1 to 3-M) are set for each of the nozzles. An arithmetic unit (19) extracts a specific program required for driving in a specific operation pattern based on a command (17) inputted according to the content of packaging, from a specific region which is provided in the storage unit (18) to correspond to a specific nozzle to be used, and the arithmetic unit (19) operates the specific cassette using the specific program.