Abstract: In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

Abstract: A method of mounting electrical components on a printed circuit board includes moving the printed circuit board to a first mounting location, picking up a plurality of electrical components with a corresponding plurality of mounter heads, and then placing the electrical components onto the printed circuit board with the mounter heads. The mounter heads are arranged so that they can move with respect to each other in both the X and Y directions, which allows the mounting device to mount a plurality of electrical components onto the printed circuit board substantially simultaneously, thereby reducing the amount of time required to produce a finished PCB. In some embodiments of the invention, the printed circuit board may be moved from a first position at which a first mounting head mounts electrical components onto the printed circuit board to a second mounting position at which a second mounting head mounts electrical components on the printed circuit board.

Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. A wafer support, to support a diced semiconductor wafer having microelectronic dies, is mounted to the frame. An ejector head is connected to the frame for movement below the wafer. A pick head is connected to the frame for movement above the wafer. The ejector head has a passageway therethrough and an intake and an outlet. An air pump is connected to the intake to shoot air from the outlet towards one of the dies. The air impinges the wafer support, exerting a force on the die, to assist the pick head in removing the die from the wafer support.

Abstract: A tool for reworking a connector attached to an electronic board having a plurality of stacked wafer modules thereon. The tool includes first and second jaws for grasping and removing a selected one of the modules from the board, a holding structure for holding the board, and movement structure for moving the two jaws relative to the holding structure, at least one of the jaws adapted for separating each selected module from a module on each opposing side of the selected module such that removal of the selected module is attained without damage to the separated, adjacent modules.

Abstract: An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.

Abstract: Clean accommodation and carrying of semiconductor devices are to be attained. A stack type tray is used which comprises a base portion 1d with plural pockets formed therein in a matrix shape and side walls formed along peripheral edges of the base portion. In the tray is buried an electronic tag which is constituted by a mu-chip having memory with non-contact recognizable information stored therein. Information pieces such as ID, manufacturer's name and product number of the tray, as well as product name, quantity and lot number of an object to be accommodated, are stored in the mu-chip of the electronic tag, and by accommodating a to-be-accommodated object in the tray equipped with the mu-chip and carrying it, the generation of dust can be prevented because paper label is not used.

Abstract: A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The recognition processing is performed using the component data of group 1 data, group 2 data, group 3 data, and group 4 data that are stored for the images taken in a random access memory (RAM). The group 1 data is used for lead inspection (for inspecting positioning error and bending of the lead), the group 2 data and the group 3 data are used for calculating amounts of adjustment in the X and Y directions, and the group 4 data is used for calculating the amount of adjustment in the &thgr; direction. This makes it possible to mount accurately components with pins and extrusions extruded from the molding, such as connectors, such that the pins and extrusions are accurately engaged with the holes formed in a print board.

Abstract: An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: Semiconductor chip mounting apparatus 90 is provided with semiconductor chip supply unit 10, semiconductor chip carrier unit 20, lead frame carrier unit 30, sensor unit 60 and a control unit 70. Semiconductor chip carrier unit 20 picks up a semiconductor chip 3 from semiconductor chip supply unit 10 and carries the same to mounting position 50 of lead frame 31 and mounts it on mounting position 50. Sensor unit 60 measures first and second positions of semiconductor chip carrier unit 20 before and during mounting operations, respectively. Control unit 70 compares the first position of semiconductor chip carrier unit 20 with the second one of semiconductor chip carrier unit 20 and calculates position deviations. Control unit 70 further provides position adjustment instructions when the position deviations are greater than a predetermined value thereby to improve the throughput and precision of semiconductor chip mounting apparatus 90.

Abstract: A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: To provide a method and apparatus for mounting components capable of mounting even such components as having narrow inter-component distances without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting the electronic components on a printed circuit board, includes a control section containing information on the components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that the components to be mounted are mounted in ascending order of height.

Abstract: A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape carries components that are positioned in sequence on the carrier tape and are covered by a cover tape. The tape guide includes an exposure mechanism for exposing the components at a picking position, wherein the exposure mechanism includes a separator for separating and lifting a lateral portion of the cover from the carrier tape, leaving the remaining portion of the cover at least partially attached to the carrier tape, and for bringing the lifted portion of the cover aside. The tape guide also includes a lock for enabling ready and quick attachment and detachment of the tape guide to and from the component mounting machine, a guiding for guiding the carrier tape towards a picking position, and a retainer for preventing accidental displacement of the carrier tape along the tape guide.

Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: A gripper having a grip tip for parts having different shapes is provided for a surface mount device. The gripper includes a piston installed inside of a through hole formed in a holder, and lifted or lowered by air flown in/out through the through hole, a moving unit connected to fixed blocks of the holder by a connection device configured to increase or decrease an interval according to the lifting or lowering operation of the piston, and multiple grip tips configured to support at least three points of a parts having a different shape.

Abstract: A method and apparatus for attaching an integrated circuit die to a leadframe or substrate. Specifically, a wafer, which is populated with integrated circuit dies, is electrically tested and a wafer map is generated depicting the electrically good dies. An adhesive material is deposited on only the electrically good dies in accordance with the wafer map. The electrically good integrated circuit die may then be attached to a leadframe or substrate.

Abstract: An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.

Abstract: An electric-component mounting system including: nozzle holders each carrying suction nozzles and rotatable to bring selected one of the suction nozzles; a turning device to turn the nozzle holders about a common axis of turning, for stopping each nozzle holder at predetermined working positions including nozzle-selecting, component-receiving and component-mounting positions; a holder rotating device which includes an engaging member engageable with and disengageable from an engaging portion of each nozzle holder, and which is disposed at the nozzle-selecting position, to rotate the nozzle holder, with the engaging member engaging the engaging portion; and an engaging-and-disengaging device to move the engaging member for engagement and disengagement with and from the engaging portion, and wherein each nozzle holder receives an electric component at the selected suction nozzle when each nozzle holder is located at the component-receiving position, and mounts the electric-component onto a circuit substrate whi

Abstract: The invention is directed to performing of an effective checking and aligning operation of component pick-up positions at component feeding units used for manufacturing by performing the operation sequentially at a time. A board recognition camera takes an image of a feeding position of a component feeding unit and the image is displayed being superimposed over a graphic image of a suction nozzle on a CRT. When an operator operates a trackball to move a cursor to an “execute visual alignment” menu and clicks a left button there, the stored image (memory image) becomes movable freely in any direction according to a trackball operation. The stored image (memory image) is moved to match a cross line and an outline of a graphic suction nozzle (component pick-up position) for visual alignment with a component feeding position. Then, the operator clicks both right and left buttons of the trackball to store an alignment value of the position in a RAM.

Abstract: In an electronic parts mounting apparatus provided with rotary type multi-nozzle type mounting heads 10A, 10B in each of which a plurality of suction nozzles 20 are disposed in a radial manner on a rotor mechanism 18 which rotates around a rotation shaft 18a, a parts mount mechanism 8 is configured in a manner that the axial direction of the rotation shaft 18a is made coincide with the arrangement direction of tape feeders 5 in a parts supply portion 4 and a shaft-to-shaft distance D of the suction nozzles 20 is set to be plural times as large as the pitch p of the feeder arrangement. Thus, in a pick-up process, a plurality of electronic parts can be simultaneously picked up from the tape feeders 5. In a parts mounting process, while one of the mounting heads performs the part mounting operation, the other mounting head can complete a nozzle change-over operation in a manner that the suction nozzle holding an electronic part to be mounted next is moved to a operation position.

Abstract: A method for connecting electrical components is provided. The method includes electrically connecting electrodes on two separate substrates with an anisotropic electroconductive adhesive layer. The thickness of the electroconductive adhesive layer prior to connection (X) is given by: 0.5×{(A1C1+A2C2)/(B+C)}≦X≦2×{(A1C1+A2C2)/(B+C)} where: A1 is a height of electrodes on a first substrate, B1 is a width of the electrodes on the first substrate and C1 is a width of an interelectrode space between the electrodes on the first substrate; A2 is a height of electrodes on a second substrate, B2 is a width of the electrodes on the second substrate and C2 is a width of an interelectrode space between the electrodes on the second substrate; and B+C=B1+C1=B2+C2.

Abstract: A die packing device including die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of to die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.

Abstract: A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.

Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.

Abstract: In a component placement machine, a placement head (4) is driven by a linear motor (5). The stationary part (7) of the motor is attached to the machine frame (1) on which a PCB (8) is attached. The movable part (6) of the motor is connected to a slide (2) on which the placement head (4) is attached. During driving the placement bead, reactive forces of the motor generate vibrations in the stationary part (7) of the motor and thus in the machine frame (20). This causes inaccuracies during the placement of components (9) on the PCB (8). To diminish this problem, the reactive forces are intercepted in a separate force frame (10) which is dynamically disconnected from the machine frame (1).

Abstract: A holding head includes an axially driveable shaft having a nozzle at one end of the shaft for holding a component, a motor for driving the shaft in an axial direction in response to power supplied to the motor, and a detecting device for detecting movement of the shall in the axial direction. A method of operating the component holding head comprises using the detecting device to detect movement of the shaft in the axial direction resulting from the shaft being driven by the motor, and controlling power supplied to the motor in response to the movement of the shaft as detected by the detecting device such that the distance that the shaft is driven by the motor in the axial direction is controlled.

Abstract: The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the stencil from the dies, the edges of the encapsulating material are partially cured in order to prevent or minimize slump of the encapsulant in the time period between removal of the stencil and full curing of the encapsulant. In particular, the stencil can be provided with a plurality of light pipes that terminate at the edges of the apertures within which the dies are placed. Ultraviolet (UV) or other curing light is provided through the light pipes to the edges of the encapsulating material. Some general or localized heating can be provided to enhance or accelerate the light curing of the edges of the encapsulant, but without substantially curing the remainder of the encapsulating material.

Abstract: In a film lamination apparatus and method, there is no one-side contact of a pressing roller that presses a film to be laminated. The film is laminated using a rotatable pressing roller having a heater incorporated therein. The pressing roller is pressed onto the film placed on a semiconductor substrate while generating heat by the heater inside the pressing roller. The pressing roller is rolled on the film so as to laminate the film on the semiconductor substrate by partially heating the film by the pressing roller while moving the pressing roller.

Abstract: The present invention provides an apparatus for bonding a semiconductor chip to substrate using a non-conductive adhesive tape. The non-conductive adhesive tape may be a polyimide tape. The apparatus may include a tape provider having a reel on which the non-adhesive tape may be spooled, rollers, and a tape cutter which cuts the tape to a suitable size. A tape holder and a tape presser may also be provided to hold the tape in place while the tape cutter cuts the tape. A tape pick-up tool may be provided to transfer the cut tape to a die bonding area on the substrate. The tape holder and the tape pick-up tool may include a suction opening for providing a suction force. The apparatus may further include a die pick up tool for transferring a semiconductor chip from a semiconductor chip provider to the adhesive tape affixed to the substrate.

Abstract: The invention relates to a device for mounting components on a carrier comprising a frame (25) in which a shaft (8) is accommodated, the shaft is provided with a longitudinal bore (16), and means for displacing said hollow shaft (8) in vertical direction through said frame (25), wherein said shaft (8) at one end (8a) facing away from the carrier can be coupled to means (17) for generating an under pressure or vacuum within said bore (16) and wherein the other end (8b) of the shaft facing towards the carrier is provided with means for picking up and mounting a component. According to the invention, the device is characterized in that said shaft (8) is coupled to a yoke (12) which forms part of said displacement means, which coupling can be temporarily disengaged the moment the shaft makes contact with a component or a carrier.

Abstract: A method of detecting a positioning error of an electric component with respect to a suction nozzle by which the electric component is held by suction under a negative pressure, wherein image data representative of images of the suction nozzle and a dog disposed near the suction nozzle are processed to obtain a relative position between the suction nozzle and the dog, a second image-taking step of taking an image of said electric component held by said suction nozzle and an image of said dog, and the positioning error of the electric component with respect to the suction nozzle is obtained on the basis of image data representative of images of the electric component and the dog, and the obtained relative position between the suction nozzle and the dog. Also disclosed in a method of mounting the electric component on a circuit substrate, on the basis of the obtained positioning error of the electric component.

Abstract: An electronic component taken out from a component storage section by a transfer head is held by suction, transferred and inspected as to whether it is good or defective by a good/defective component inspecting device. Thereafter, the electronic component is delivered to an alignment suction nozzle on a component alignment section. The sequence of the above-operations is then repeated, whereby the electronic components inspected and then aligned in the order of mounting can be supplied to a mounting head. Therefore, a mount time for the electronic components in a mount process is greatly shortened, so that productivity is expected to be improved. The electronic components can also be inspected before being aligned in the order of mounting, which further enhances mount efficiency.

Abstract: The present invention relates to a transfer type circuit board fabricating system including a conveyor device for transferring circuit boards in a predetermined transfer direction through a component placing device for placing electronic components on the circuit boards. The conveyor device includes a pair of conveying surfaces for conveying the circuit boards and a pair of board supports for supporting one of the circuit boards. Each board support extends between and is supported by the pair of conveying surfaces. A table having a surface is situated below both the pair of conveying surfaces and the pair of board supports. A pair of deflection shields extend from and at an acute angle with respect to the surface of the table to terminate at an edge. Each edge is flush with and adjacent to one of the conveying surfaces and is also beneath the pair of board supports.

Abstract: A mounting system for an electric component operates by transferring the electric component from a component supply device to a suction nozzle of a component-holding head on a circuit substrate. A relative position between a sucking surface of the suction nozzle and an axis of rotation of the component-holding head is obtained. A component-holding head and the component supply device are moved relative to each other on the basis of the obtained relative position, so as to minimize an error of relative positioning between the sucking surface and a predetermined sucking position of the electric component positioned at the component-supply portion. The head and the component supply device are then moved toward each other, for transferring the electronic components from the component supply device to the suction nozzle.

Abstract: The present invention includes a component placement apparatus that can obtain information on the presence/absence of hold members inexpensively and easily, and a component placement method carried out by the component placement apparatus. A replacement hold member detector for detecting the presence/absence of replacement hold members at a hold member change part is installed at a placement head. The presence/absence is detected by moving an XY-robot so as to scan the hold member change part equipped with the replacement hold member detector. At the same time, type information attached to the replacement hold members is rendered readable by the replacement hold member detector. One replacement hold member detector is enough according to the apparatus and method of the present invention. The presence/absence information of the hold members can be obtained inexpensively and easily.

Abstract: A suction head for a mounting apparatus includes: a socket having a first through hole in an inner direction and a fixing member inside the first through hole, one end of the inside of the first through hole being mounted to a hollow shaft by using the fixing member, a nozzle having a second through hole for forming an air passage when sucking parts in the inner direction, a coupling member having a third through hole in the inner direction and plate spring members installed inside the third through hole for supporting the nozzle and for alleviating impact when the nozzle sucks parts, and a holder for fixing the nozzle so that it is not removed from the coupling member.

Abstract: A component mounter for picking up a component and mounting it on a board using a transfer head. A position of solder paste printed on an electrode on a board is previously measured and a measurement result is stored. Mounting coordinates for mounting the component using the transfer head is calculated based on this measurement result. In the mounting operation, the transfer head is controlled using mounting coordinates determined based on the solder printing position so as to mount the component on each electrode on the board. This prevents the occurrence of positional deviation between the mounted component and printed solder paste. Defective mounting, which may occur in a reflow process due to positional deviation, is thus preventable.

Abstract: Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-hold by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Abstract: A component mounter has two or more feeder carriages and two or more mounting heads corresponding to the feeder carriages. The mounting heads pick up components from each feeder carriage. A transfer device is able to pass components requiring transfer between the mounting heads. The transfer of components enables the mounter to be used efficiently by transferring components to a different mounting head when the operation of one of the mounting heads stops.

Abstract: A method of installing signalization spheres on energized transmission lines. A supporting structure, consisting of two bases equidistant, parallel to each other, linked to each other by axial segments, the axial segments acting as supports for activation engines, respectively, a grounding and idler tension system including a structure formed by two parallel rods that move along the vertical direction linked to two bases equidistant and parallel to each other in its intermediate portion through an axis. In its superior extremity through an axis and presenting in its inferior extremity slots for the introduction of an axis of a wheel. A first axial segment being equipped in its intermediate portion with a threaded rod which is linked it its inferior extremity to the axial segment of the bases superiorly equipped with a crank and spring. A fork is articulated over a pivot to the external part of the bases whereto are projected the feeding system.

Abstract: A plurality of self-propelled system heads (5) are made to independently travel along a closed-loop travel track (6) in a manner that the heads do not interfere with each other by controlling respective drive devices (4). Components (2) from a component supply device (8) are held by component holding members (3) of the heads, and thereafter, the components held by the component holding members are mounted on boards (1) positioned by board positioning devices (7).

Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate.

Abstract: An apparatus for detecting a positioning error of an electric component with respect to a suction nozzle by which the electric component is held by suction under a negative pressure, wherein image data representative of images of the suction nozzle and a dog disposed near the suction nozzle are processed to obtain a relative position between the suction nozzle and the dog, a second image-taking step of taking an image of the electric component held by the suction nozzle and an image of the dog, and the positioning error of the electric component with respect to the suction nozzle is obtained on the basis of image data representative of images of the electric component and the dog, and the obtained relative position between the suction nozzle and the dog. Also disclosed is a method and apparatus for mounting the electric component on a circuit substrate, on the basis of the obtained positioning error of the electric component.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: A mounting method for an electronic device element, includes the steps of providing an electronic device element having metal bumps formed on a surface thereof, providing a bonding tool having a pressing surface, providing a mounting substrate, keeping the pressing surface of the bonding tool in contact with a reverse surface of the electronic device element and applying an ultrasonic wave to the bonding tool, thereby mounting the electronic device element on the mounting substrate. The maximum length of the pressing surface of the bonding tool in the ultrasonic-wave-oscillation direction is greater than about 0.5 times the maximum length of the reverse surface of the electronic device element in the ultrasonic-wave-oscillation direction.

Abstract: The system of the present invention provides a pair of assembly modules for assembling electronic components to a series of printed circuit boards or like substrates. The pair of assembly modules are operatively connected in series, and each module includes a pair of assembly stations operating in parallel within the module. Means are provided to bypass the first assembly module and deliver unpopulated substrates to the second module for processing, while simultaneously bypassing the second assembly module with substrates populated by the first assembly module. In the event that one of the assembly stations of either assembly module is inoperative, it may be bypassed and the assembly of its electronic components redistributed to the remaining, operative assembly stations to optimize the productivity of the system.

Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: During the process of transporting an electronic component (18) to a substrate (10) after a suction nozzle (7) has picked up the component (18), the component (18) being supplied from a component supply unit (1), the amount of offset of the component (18) with respect to the suction nozzle (7) is calculated. The feasibility of mounting the component (18) held by the suction nozzle (7) onto the substrate (10) without hindrance is determined from the amount of offset. If the result of the determination is positive, the component (18) is mounted onto the substrate (10).