Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: An apparatus for assembling electronics is provided, comprising a support frame, at least one pick-and-place mechanism, at least one device-engaging component, a feed device, and a programmer or tester. The pick-and-place mechanism is secured to the support frame. The device-engaging component is secured to the pick-and-place mechanism. The feed device has a slender body secured to the frame to feed a plurality of electronic devices to a feed location. The programmer or tester has a slender body secured to the support frame in a side-by-side relationship relative to the feed device. The programmer or tester has a socket located at an intermediate location. The devices are movable by the device-engaging component from the feed location to the socket at the intermediate location.

Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Abstract: A component mounting apparatus has an intermittently rotated rotary mounting section which has a driver at an upper part for driving motors of mounting heads arranged on periphery of the rotary mounting section. A controller in a stationary part of the apparatus inputs power and control signals to the rotating driver which is formed in an annular shape, and includes motor driver mounting plates with motor drivers for controlling power supplied to each motor. The motor driver mounting plates are arranged radially around a rotation axis of the rotating driver with planar surfaces in parallel to the rotation axis.

Abstract: A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: A supply module for feeding electrical components to an automatic component-mounting machine has a locking element which is a piezoceramic bending transducer that extends in the longitudinal direction of the supply module along a supply path for the components. A free end of the locking element projects into a window of the supply module to an extent such that the locking element is located slightly above the component which has been conveyed there and is ready for removal. By applying an operating voltage to the locking element, the locking element can be deflected laterally to an extent such that it is moved out of the coverage region over the component transversely with respect to the component advancing direction.

Abstract: Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.

Abstract: This invention relates to an electronic component mounting apparatus. In the apparatus, a rotary body for changing the direction of a component mounting section is fixed to a hollow rotary shaft with a flange. The hollow rotary shaft is provided in a hollow motor and rotated integrally with the rotary body by driving of the hollow motor. A wire extending from an electric component, which is provided in the rotary body for changing the direction of the component mounting section, is arranged in the hollow rotary shaft of the hollow motor. An end of the wire is fixed to the rotary body, and the wire is arranged with looseness or into a spiral in the hollow rotary shaft. Further a lateral surface of inside the hollow rotary shaft and a surface of a coupling shaft are coated with protective materials.

Abstract: An offset measuring mechanism and method used in a bonding apparatus, in which the object plane of a position detection camera is set on a hypothetical bonding working plane, and the image of imaging elements within the imaging plane is projected onto a bonding working plane. Furthermore, the tip end of a bonding tool is aligned with the bonding working plane. The object plane of the offset measuring camera is set on the bonding working plane, and the image on the bonding working plane is projected onto the imaging elements of the imaging plane of the offset measuring camera. The imaging elements detect the projected image of the imaging elements of the position detection camera or the image of the tip end of the bonding tool and output this data to the image position measuring part or tool position measuring section of the control block.

Abstract: A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.

Abstract: An electric-component handling device includes a suction nozzle, fiducial mark, an image-taking device, a relative-movement device and an image data processing device. The electric-component handling device is operable to handle an electric component.

Abstract: A position control apparatus of a feeder stage is disclosed, at which a tape reel for feeding parts to be mounted on a PCB is mounted in a surface mount device (SMD). The position control apparatus includes a feeder stage disposed inside a base frame of a SMD, a height/rotation power transmission device for controlling a height (Z) and a rotation angle (?) of the feeder stage, a first power transmission device for controlling the X-axis position of the feeder stage, and a second power transmission device for controlling the Y-axis position of the feeder stage. Therefore, the apparatus can be easily controlled the mounting position of the tape reel by controlling the position of the feeder stage at which the tape reel is mounted in the SMD.

Abstract: A chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the ape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized and the center line of the inner lead is recognized. The inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S. the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

Abstract: An underfill system for filling gaps between semiconductor chips and substrates is provided. The underfill system comprises a blower for blowing air, an air duct coupled to the blower, the air duct comprising a main duct coupled to the blower and a plurality of sub-ducts each having an outlet being connected to the main duct and an inlet to be located along one side of the semiconductor chip. A filling material from a dispenser fills the gaps by suction due to the pressure difference between the main duct and the sub-duct. Thus, the present invention shortens the filling time of the underfill process and prevents voids or air bubbles of the filling material from forming within the gap.

Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

Abstract: A component transfer apparatus is provided. The component transfer apparatus comprises a pick and place machine having a component feed source and a movable pick head having access to the component feed source. A component alignment detector is directed toward the component feed source and a controller is coupled to the component alignment detector. The controller contains instructions which, when executed by the controller, cause the controller to compare the detected component alignment with a known component alignment.

Abstract: A method accurately calibrating a movement control system of mark recognition in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

Abstract: The surface mounting method includes: transferring the PCB to one conveyer among multiple conveyers capable of moving from a first transfer; transferring the PCB to another conveyer; transferring the PCB to one conveyer, while electronic parts from a parts feeder are mounted onto the transferred PCB; mounting the electronic parts from the parts feeder again onto the transferred PCB, while the PCB onto which the parts have been mounted is transferred to the second transfer; and transferring the PCB onto which the parts have been mounted again to the second transfer, while a new PCB is transferred to one conveyer of the conveyers from the first transfer.

Abstract: A turret-like insertion head having at least one twisting device for mounting electrical components. The insertion head has a stator, a rotor and an optical measuring device. A plurality of circularly distributed grippers are mounted on the rotor such that the grippers can rotate about a mounting axis. The optical measuring device detects the position of the components held on the grippers, and as a result, a component can be twisted into its approximate mounting position during forward movement of the gripper before making a final position measurement, thereby saving time.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: An apparatus for handling electrical components is provided with a head. The head may include at least one gripper and a storage element which can be filled with the electrical components. The head may move over the substrate, and the gripper may remove components from the storage element and place them onto the substrate.

Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).

Abstract: In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

Abstract: A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk hole is drilled in the bottom of the pallet to accommodate the pin. The pin is inserted into the countersunk hole and secured with a high-temperature epoxy resin. The epoxy holds the pin securely in place and keeps the pin from moving up or down. The present invention also comprises at least one arm affixed at one end to a swivel joint. The swivel joint allows the arm to rotate about a vertical axis. The upper portion of the swivel joint is hinged such that the arm can rotate about a horizontal axis. The combination of movement about the horizontal and vertical axis allows the arm to be positioned at any point over the pallet.

Abstract: A printed-board holding device for holding a printed board in a work system in which the printed board and a working head are moved relative to each other in a direction parallel with a top surface of the printed board so that the working head executes a desired operation in each of a plurality of predetermined portions of the top surface of the printed board. The printed-board holding device includes (a) a supporting member which is to be brought into contact with a central portion of a bottom surface of the printed board and is capable of supporting the central portion, and (b) a pressing member which is to be brought into contact with a central portion of the top surface and is capable of forcing the printed board toward the supporting member.

Abstract: A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.

Abstract: A wiring board provided with a first terminal, a connector provided with a second terminal, and a camera module provided with a third terminal are provided. The first terminal and the second terminal are soldered to mount the connector on the wiring board. The camera module is mounted on the connector to electrically connect the second terminal with the third terminal.

Abstract: A parts mounting method employing a suction section having a plurality of suction nozzles is provided. The suction section is moved to a parts supply section in which a plurality of parts are suctioned by the suction nozzles at the same time. The parts are then mounted onto a board. The suction nozzles are divided into groups: a first group having a shift amount within an allowable range in which simultaneous suction is possible; and a second group having a shift amount outside the allowable range in which simultaneous suction is possible. The parts are then sucked at the same time for each of the groups.

Abstract: A heat sink base (10) includes a rectangular body (11) made of aluminum and a circular core (12) made of copper. The body defines a circular through opening (111). A diameter of the opening is slightly less than a diameter of the core. The core is attached within the body according to the following steps: a) pressing the core into the through opening of the body; b) stamping the core to cause it to plastically deform in radial directions and thereby become firmly combined with the body; and c) removing any burring of the core flowing out from the opening such that surfaces of the core and the body are coplanarly smooth.

Abstract: When both first and second preferred nozzles are set up as valid, and both nozzles are stored in a nozzle stocker, the replacement with the recommended nozzle stored in the stocker is made and a CPU controls the operation based on control data. When both are set up as valid, but only the second preferred nozzle, not the first preferred nozzle, is stored in the stocker, the CPU 20 recognizes which nozzle is available by using nozzle positioning data stored in a RAM, and then the replacement with an alternative nozzle is made, and the CPU controls the operation according to the control data of the alternative nozzle.

Abstract: A method of fabricating a printed circuit board efficiently within a short time is disclosed. Two areas R1 and R2 to fabricate two printed circuit boards are assigned to a single original board 5 from which a plurality of boards are available. A first automatic mounting area 1 where the chip parts are mounted to obtain one printed circuit board is set in the area R1. A second automatic mounting area 2 where the chip parts are mounted to obtain another printed circuit board is set in the area R2. An automatic mounting range 3, including the two automatic mounting areas 1 and 2, is set in a predetermined range of the original board 5 in such a manner as to correspond to the range where the chip parts mounter carries out the work of mounting the chip parts.

Abstract: A mounting system for mounting an electronic component on a substrate includes a component identifying apparatus that identifies an electronic component to be mounted on the substrate. The component identifying apparatus includes a holding mechanism that holds the electronic component, a color-perceptive sensor that perceives a color of a predetermined region on the electronic component, and a data processor that identifies the electronic component on the basis of the color perceived by the color-perceptive sensor. The mounting system also includes a controller that controls an electronic component mounting operation on the basis of a result of identification obtained by the component identifying apparatus.

Abstract: A component-placing apparatus for driving a nozzle in the rotational and vertical directions for applying suction to a component includes a rotary actuator and a linear actuator having a stator connected to a stator of the rotary actuator such that these stators are immovable relative to each other. A spline shaft is connected to a rotating shaft of the rotary actuator, and a nozzle connecting shaft having a suction nozzle disposed at the bottom thereof is engaged with the spline shaft and is allowed to move only rectilinearly. A hollow holder encircling the nozzle connecting shaft with rotary bearings being interposed therebetween is connected to a mover of the linear actuator, and the hollow holder is engaged with the stator of the linear actuator with a linear guide being interposed therebetween.

Abstract: A method of picking a component having an alignment indicating fiducial marker according to a predetermined alignment is provided. The method includes detecting the alignment of the fiducial marker of the component, comparing the detected fiducial alignment with a predetermined fiducial alignment, determining an alignment offset and picking the component in accordance with the alignment offset.

Abstract: The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).

Abstract: An electronic component mounting method for placing electronic components successively to component placing positions on a board by component holding devices equipped with a plurality of removable suction nozzles which is operable to hold the electronic components. The method, as an example of its various manners, includes: in placing the electronic components onto a multiple board composed of a plurality of sub-boards, applying a placement step to all the sub-boards, the placement step being a step of placing onto the board all of electronic components that are holdable by an identical suction nozzle; and after completion of the placement step, changing the suction nozzle to another and moving to a next placement step, whereby electronic-component mounting for the individual sub-boards is carried out.

Abstract: There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel.

Abstract: An apparatus for the mounting of semiconductor chips comprises a bondhead with a pick-up tool with a longitudinal drill hole to which vacuum can be applied for the gripping and transport of a semiconductor chip. To detect whether the pick-up tool has gripped the semiconductor chip, a body with a reflecting surface is arranged in the longitudinal drill hole of the pick-up tool which, when passing over the light source on absence of the semiconductor chip deflects light shining from underneath into the longitudinal drill hole of the pick-up tool into a horizontal plane. The pick-up tool has locations which are pervious to the deflected light of the light source. At least one optical element is arranged on the bondhead which concentrates at least part of the deflected light emerging laterally from the pick-up tool onto a photosensor.

Abstract: A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.

Abstract: The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: A method, system, and apparatus for transfer of dies using a die plate is described herein. The die plate has a planar body. The body has a plurality of holes therethrough. A support structure and the die plate can be positioned to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure adheres to a first surface of the die plate. The dies can subsequently be transferred from the die plate to one or more destination substrates or other surfaces, by a punching mechanism.

Abstract: There is provided a plurality of mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: An apparatus and method for force mounting semiconductor packages onto printed circuit boards without the use of solder. The apparatus includes a substrate, a first integrated circuit die mounted onto the substrate, a housing configured to house the first integrated circuit die mounted onto the substrate, and a force mechanism configured to force mount the housing including the integrated circuit die and substrate onto a printed circuit board. The method includes mounting a first integrated circuit die onto a first surface of a substrate, housing the first integrated circuit die mounted onto the substrate in a housing, and using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit board. According to various embodiments, the force mechanism includes one of the following types of force mechanisms clamps, screws, bolts, adhesives, epoxy, or Instrument housings or heat stakes.

Abstract: An intermediate product manufacturing apparatus for carrying intermediate products and processing the intermediate products with a plurality of processing apparatuses is provided, the apparatus comprising: a plurality of carrying means for carrying the intermediate products to the processing apparatuses; a common processing apparatus provided between the plurality of carrying means, for carrying out a common process on the intermediate products carried by the carrying means; and intermediate product transfer sections provided between the plurality of carrying means, for transferring the intermediate products between the common processing apparatus and the carrying means.

Abstract: A spindle assembly for a component pick and place machine includes a housing containing a spindle for movement therein along a longitudinal axis of the spindle; the housing accommodating a valve for controlling the flow of air to an inner bore of the spindle; the inner bore of the spindle having an opening at one end for communicating the flow of air for picking and placing the components; and the flow of air from the valve to the inner bore of the spindle is internal to the housing through passageways.

Abstract: A system of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit including a system for performing the following steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

Abstract: Electric-component mounting system includes a member fixedly disposed on one of a main body and a movable portion, an image-taking device fixedly disposed on the other of the main body and movable portion to take an image of the member. The member and the image-taking device are positioned relative to each other such that an error of relative positioning therebetween detected on the basis of the image of the member substantially represents a positioning error of the member due to thermal expansion of the system. A controller determines a drive signal to operate a drive device, on the basis of the image of the member, so as to reduce an amount of influence of the positioning error of the member on the actual position of the movable portion.

Abstract: A circuit board manufacturing system is provided which includes a production assembly line with a carrier handling system for a plurality of feeder/programming/buffer systems. The feeder/programming/buffer system has a flexible feeder mechanism for receiving unprogrammed device in a number of different manners, a programming mechanism for performing a programming operation on the unprogrammed devices at a high rate of speed, and a buffer mechanism for providing the programmed micro devices to the carrier handling system. The carrier handling system has its own buffer section and is integrated with an assembly handling system of the production assembly line to populate the programmed devices on to the circuit boards.