Abstract: A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information.

Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: Methods and apparatus for curing an adhesive on a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes isolating a first portion of a surface of a circuit board from a second portion of the surface with a flexible gasket. An adhesive is applied to the first portion of the surface. The adhesive is thermally cured. The flexible gasket prevents constituents outgassed from the adhesive from contaminating the second portion of the surface.

Abstract: Provided are a semiconductor chip attaching apparatus and a semiconductor chip attaching method. The semiconductor chip attaching apparatus includes a collet body comprising a pick-up pad and a pad support and a collet plate on the collet body, the collet plate having a central portion. A lower surface of the edge portion contacts an upper surface of the pad support. An edge portion of the lower surface is spaced apart from the upper surface of the pad support. The apparatus further includes a first pipe extending through the collet plate and the collet body. The collet plate includes a second pipe in the edge portion.

Abstract: An apparatus for mounting electronic parts includes a bulk feeder into which electronic parts in a bulk form are introduced, at least one inspection unit to inspect and align the electronic parts directed from the bulk feeder, an electronic part insertion unit to receive the electronic parts which have been completely inspected in the inspection unit, a positioning wheel installed to rotate along the bulk feeder, the inspection unit, and the electronic part inspection unit and serving to transfer the electronic parts, and a part supply unit to pick up the electronic parts received in the part insertion unit.

Abstract: A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in each of the mounting machines, the mounting head sucking a component supplied from the feeder for mounting on the circuit board; a moving mechanism in each of the mounting machines, the moving mechanism configured to removably mount and move the mounting head; an inspection camera unit configured to image an inspection target part of the circuit board; and an inspection image processing unit mounted, replaceably with the feeder, on the feeder mount base where the inspection camera unit is mounted, the inspection image processing unit processing an image signal output from the inspection camera unit to inspect the inspection target part.

Abstract: A mounting component includes a fixed frame to be fixed to a board and a sliding frame. The fixed frame includes first and second fixed side plates having through holes formed in positions corresponding to engaging holes of an electronic component, and first and second fixed arms connecting the first and second fixed side plates. The sliding frame includes first and second sliding side plates including engaging pins to be inserted via the through holes into the engaging holes of the electronic component, first and second sliding arms extending from the front and back ends of the first sliding side plate, and third and fourth sliding arms extending from the front and back ends of the second sliding side plate. The first, second, third, and fourth sliding arms are configured to slide the first and second sliding plates away from the first and second fixed side plates.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component, the receptacle having a first abutting section and a second abutting section, the align fixture further having an elastic unit, one of the first abutting section and the second abutting section is flexibly mounted via the elastic unit, and the other one of the first abutting section and the second abutting section is fixedly mounted; the first abutting section and the second abutting section each form a stiff member and are adapted to engage the electronic component, the elastic unit is adapted to exert two force components on one of the first abutting section and the second abutting section, the force components being angled relatively to one another.

Abstract: A component mounting device which is provided with a transport unit which has a transport region and transports a substrate in the transport region; a plurality of supply regions which are lined up along the transport direction of the substrate due to the transport unit and are able to supply each component; a control unit which sets a mounting region which is a region where the component is mounted in the transport region of the transport unit according to the disposing of the supply region of the component which is necessary for the substrate out of the plurality of supply regions; and a mounting unit which takes out the component which is necessary for the substrate from at least one supply region out of the plurality of supply regions and performs mounting the component on the substrate in the mounting region which has been set.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L1 and L2) including a plurality of nozzle shafts arranged in rows and at a predetermined nozzle arrangement pitch, a ? rotary drive mechanism that rotates the nozzle shafts around their axes is configured so as to include driven pulleys (28) coupled to the respective nozzle shafts; a plurality of idlers (30) interposed between the two rows of nozzles (L1 and L2); and endless drive belts (29A and 29B) that transmit rotation of the ?-axis motors (27A and 27B) to the driven pulleys (28).

Abstract: Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.

Abstract: There is a need for providing an electronic component mounting apparatus, a component supply apparatus, and an electronic component mounting method capable of reducing inadvertent insertion of component supply tape and ensuring high reliability or capable of reducing wrong insertion of component supply tape, supplying new electronic component tape, and ensuring a high operation rate. Supply tape is inserted into an insertion entry of a component supply apparatus. An electronic component mounted on the supply tape is absorbed and is mounted on a printed board. Information about the electronic component mounted on the supply tape is read. Based on the read information, the component supply apparatus for inserting the supply tape is selected. The insertion entry is opened while it is closed when no supply tape is mounted.

Abstract: A pneumatically actuated area vacuum gripper for gripping and, if necessary, separating workpieces is provided by the present disclosure. In particular, the vacuum gripper is used with thin, flexible workpieces, and has a suction chamber, which has a suction wall with perforations, to be placed on the workpiece. An ejector nozzle has a connection and an outlet, the ejection nozzle being connected to the suction chamber via its connection, and the outlet of the ejector nozzle opening to the outside or into an exhaust air duct, and the suction inlet of the ejector nozzle empties into the suction chamber, whereby the direction of the air stream in the connection coming from the suction chamber corresponds to the direction of the main air conveyance in the ejector nozzle.

Abstract: A device for inspecting and rotating electronic components, particularly flip chips, includes a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. Also a method for inspecting and rotating electronic components, particularly flip chips.

Abstract: A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path.

Abstract: A component tube holding arrangement for holding one or more component tubes and for vibratory feeding of components in a picking position in a component mounting machine, as well as a combination of such a component tube holding arrangement and a vibratory feed magazine. The arrangement comprises a support surface for supporting component tubes, a reception portion for receiving component tubes, and at least one component stop at the reception portion defining a picking position for fed components. The arrangement also comprises identification means holding information of the identity of the arrangement. The arrangement is further arranged to be releasably mountable in a component mounting machine or in a vibratory feed magazine arranged to be loaded into the component mounting machine. The component tube holding arrangement lacks component feeding means and is arranged for allowing vibratory feeding means provided in the magazine.

Abstract: A carrier adapted to receive and align multiple electronic components, the carrier having receptacles each being adapted to receive an assigned one of the multiple electronic components, a first plate comprising a plurality of first abutting sections, the first abutting sections form one of boundaries of the respective assigned receptacles, a second plate comprising a plurality of second abutting sections, the second abutting sections form another of the boundaries of the respective assigned receptacles, and the first plate and the second plate are arranged slidably relative to each other.

Abstract: There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip.

Abstract: It is intended to allow for efficiently performing a feeder replacement operation. A feeder 50 is formed in a shape elongated in one direction to allow a replacement operation therefor to be performed in such a manner that it is inserted and pulled out relative to a feeder installation section 150, along a longitudinal direction thereof. A rear end 111 which is a trailing one of longitudinally opposite ends of each of a plurality of feeders 50A, 50B, - - - , in an insertion direction, is provided with a guide portion for guiding one 50C of the feeders to be installed in adjacent relation to ones of the remaining feeders. For example, the guide portion can be formed by rounding corners of the rear end 111 of the feeder 50.

Abstract: A wiring design method for a wiring board comprises, if design rule errors are found in the wiring design, selecting one of the design rule errors as a selected design rule error, specifying a predetermined number of the second connection terminals as selected second connection terminals that correspond to the selected design rule error, and moving the selected second connection terminals to predetermined coordinate positions. Each time when the selected second connection terminals are moved to the post-movement coordinate positions, the method comprises connecting the second connection terminals and the first connection terminals, conducting the design rule check, and determining whether no design rule errors are detected newly and the selected design rule error is not detected either.

Abstract: A chip mounting system in which a whole system can be compact including a transfer stage and a tool holding member between a chip feeding section and a substrate holding section. In the chip mounting system, a transfer stage is disposed between a chip feeding stage and a substrate holding stage. A pick-up head and a mounting head are provided movably in a Y-axis direction in which the chip feeding stage and the substrate holding stage are aligned. A movable table which is movable in an X-axis direction, which intersects the Y-axis direction at right angles, is provided in a overwrapping movable region of the chip feeding stage and the substrate holding stage. The transfer stage and a tool holding member, which holds at least one of replacement tools for a pick-up tool and a mounting tool, are provided on the movable table.

Abstract: An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.

Abstract: A pick-up jig is adapted to be dismountably mounted to an electronic component which has two buckling blocks. The pick-up jig includes a pick-up board and two buckling arms. The pick-up board is against a top of the electronic component. The pick-up board has a flat top surface for the convenience of the pick-up jig being picked up by a SMT machine. The two buckling arms perpendicularly extend downward from two opposite ends of a bottom surface of the pick-up board. An inside of each of the buckling arms protrude inward to form two blocking pillars spaced from each other to define a fastening groove therebetween. A buckling hook is protruded at a bottom of the buckling arm. The buckling blocks slide over the corresponding buckling hooks to be buckled in the corresponding fastening grooves and the buckling hook grappling a bottom of the corresponding buckling block.

Abstract: The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component.

Abstract: An electronic component installation apparatus 4 which constructs an electronic component mounting line 1 and installs an electronic component on a substrate is configured to include substrate conveyance lanes L1, L3 as two conveyance paths for feed which respectively feed the substrate carried from the upstream side to the downstream side, the conveyance paths for feed in which substrate positioning parts for positioning and holding the substrate in installation work positions are disposed between two component installation parts 22A, 22B for taking the electronic components out of component supply parts 23A, 23B and transferring and installing the electronic components to the substrate, and a substrate conveyance lane L2 as a return conveyance path which returns the substrate carried from the downstream side to the upstream side and is disposed in a state of being sandwiched between the substrate conveyance lanes L1, L3.

Abstract: A component suction method including feeding components accommodated in component storage spaces of a tape base to a predetermined position, lowering a nozzle capable of sucking the components supplied to the predetermined position, stopping the nozzle at a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center position or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center position or at the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element being alignable with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligning with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

Abstract: Apparatus and methods for mounting of a processor coupled to a circuit board include use of a frame disposed around the processor. The frame decreases flexibility of the circuit board around the processor. Further, the frame may act as a mechanical stop limiting tilting of a heat sink coupled to the processor.

Abstract: A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.

Abstract: A mounter is operable to sequentially detect feed amounts of a motor at respective times when respective electronic components held by a tape reach a pickup position, while rotating a sprocket 52 of a tape feeder 50 360 degrees or more, and store the feed amounts in correspondence with respective pins 54 drivingly feeding the tape. This makes it possible to reliably duplicate a state when each electronic component reaches the pickup position, based on a feed amount itself of the motor at a time when each electronic component truly reaches a pickup position.

Abstract: An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.

Abstract: In a construction in which the intermediate stage 5 is interposed between the substrate positioning stage 4 and the electronic component supply stage 3; and in which it is possible to select either a mode of the bonding head 10A transferring to the substrate positioning stage 4 the electronic component P taken out of the electronic component supply stage 3 by the pickup head 6 and mounted on the intermediate stage 5 or a mode for transporting the electronic components, which has been taken directly out of the electronic component supply stage 3, to the substrate positioning stage 4 by means of the bonding head 10A, the pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of the beam member 8b of the gantry 8 positioned at the end of the base 2, and a space S that allows entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7.

Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.

Abstract: Methods and apparatus, including computer program products, for product based configuration and control of manufacturing equipment. The present invention provides a method for manufacturing. The method includes identifying components to be mounted on a printed circuit board of a product and generating information that specifies the components. The method includes determining, for each of the identified components, the location on the printed circuit board where the component is to be mounted and generating coordinates that indicate the location. The coordinates are of a coordinate system having a frame of reference that is independent from any master printed circuit board. The method includes associating the generated information with the product.

Abstract: A positioning apparatus for transferring at least one electronic component, in particular a chip, from a first flat support to at least one predetermined location on a second flat support which extends parallel to the first support, comprising an ejection device for removing the component from the first support by means of an ejection movement, wherein a camera device is provided for detecting position data of the predetermined location, of the component to be removed from the first support and optionally of the ejection device, which together with the camera device are arranged essentially on an imaginary common straight line. A positioning method is also described.

Abstract: A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conveyor, a pass conveyor and a reject conveyor. The infeed conveyor extends from a point outside of the electronic apparatus manufacturing cell envelope on the first side to a point inside of the envelope. The pass conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the second side. The reject conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the first side.

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate.

Abstract: The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than ?, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than ?, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.

Abstract: Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.

Abstract: When a component (X) is fed to a pickup position (53) but no suction action is carried out due to a variety of reasons, a reverse feeding action is carried out to return the component (X), which has been fed to the pickup position (53), to a position upstream of the pickup position (53) in the tape feeding direction. The same component (X) is thus not wasted but is resupplied to the pickup position (53) in the following pickup action, whereby the amount of waste of components is reduced.

Abstract: An electric parts mounting apparatus includes rotary type multi-nozzle mounting heads. Each of the mounting heads has a plurality of suction nozzles disposed in a radial manner on a rotor mechanism, which rotates around a rotation shaft. A parts mount mechanism is configured such that the axial direction of the rotation shaft coincides with an arrangement direction of tape feeders. A shaft-to-shaft distance of the suction nozzles is set to be plural times as large as a pitch of the feeder arrangement. In a pick up process, a plurality of electronic parts can be simultaneously picked up from the tape feeders. In a parts mounting process, while one of the mounting heads mounts the part, the other mounting head can complete a nozzle changeover operation such that the suction nozzle holding an electronic part to be mounted next is moved to an operation position.

Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Abstract: Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography.

Abstract: A service providing method for monitoring a mounting tact of a component mounting apparatus includes collecting, from the service receiver, mounting tact information including a mounting tact result value of the component mounting apparatus from the service receiver by use of a service provider via a communication system. The method additionally includes judging whether a mounting operation of the component mounting apparatus has a tact loss corresponding to an amount by which a mounting tact is greater than a standard mounting tact as a result of analysis of the collected mounting tact information and determining and feeding back, to the service receiver via the communication system, NC data for allowing the component mounting apparatus to be operated.

Abstract: A control system includes at least one part mounter installing parts on a printed circuit board and a control device integrally controlling the operation of the at least one part mounter. The control device controls the part mounter using information about the printed circuit board and information on a production process flow of the printed circuit board. The control device integrally controls the operations of the part mounters, including receiving and storing information on parts that the part mounters install, information on a feeder that supplies the parts, and information on arrangement of the parts on the printed circuit board, receiving and displaying operation information and operation situations from the part mounters, and controlling operations of the part mounters using the stored information and displayed information.