Abstract: In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.

Abstract: Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.

Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

Abstract: A production program creating system creates a production program having a module in which a processing for producing a board is described. The board is produced by mounting an electronic component supplied from a component feeding device onto the board by means of a component mounting device. The component mounting device is described in model form, and a configuration information of the component mounting device is stored in a database. The module is created such that the module works with respect to the component mounting device that is described in model form, and such that the module performs a generalized processing by acquiring the configuration information of the component mounting device from the database.

Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa, as well as a global measuring system for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate, which local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.

Abstract: A carrier tape package 20 is used in an electronic components placing apparatus for feeding electronic components by a tape feeder, and has a carrier tape 22 housed in a wound state on a tape reel 21. In the carrier tape package 20, a data storage unit 23, in which an IC tag 25 having carrier tape information containing identification information of electronic components P held in the carrier tape 22 is held in a holder 24, is attached to the tape reel 21. At the instant when the carrier tape 22 is mounted in the tape feeder, the carrier tape information is read out by a reader/writer belonging to the tape feeder from the data storage unit 23 mounted on the leading end portion of the tape feeder.

Abstract: The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Abstract: A tape feeder feeds electronic components by advancing a tape intermittently. The tape feeder includes a motor controller for controlling a motor, which rotatively drives a sprocket to advance the tape, and a communication unit for receiving a control signal from a control unit of an electronic component mounting apparatus and transmitting a control parameter such as a rotating speed, an amount of rotation, and acceleration and deceleration pattern to the motor controller. The tape feeder has such a structure that a tape advancing speed and an amount of tape advancement are easily changeable according to a type of the electronic components by changing the control parameter of the rotating speed and the amount of rotation of the motor.

Abstract: Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: An electronic component mounting method of thermo-compressing and mounting electronic components onto a plurality of unit boards segmented in a multi-piece board which avoids the occurrence of adverse thermal influences on the thermosetting bonding material which is placed on the unit boards before mounting the electronic components. The thermo-compression tool used in the method is removably fitted on a thermo-compression head in an electronic component mounting apparatus; the thermo-compression tool includes a base member and a suck-up member which is smaller than a lower surface of the base member and which is fixed on the lower surface of the base member at a position displaced from a center thereof.

Abstract: A mounter for a manufacturing management method suppresses an occurrence of inventory shortage or excess inventory as much as possible, and provides energy savings when manufacturing is not performed at full capacity. A throughput determining step acquires manufacturing information included in a manufacturing plan while manufacturing equipment is manufacturing mounted boards and determines a throughput of the manufacturing equipment for the mounted boards based on the manufacturing information while the manufacturing equipment is manufacturing a sequence of the mounted boards. A manufacturing condition determining step determines a manufacturing condition for decreasing power consumption of the manufacturing equipment within a range of throughput not lower than the determined throughput in the case where the throughput determined in the throughput determining step is equal to or lower than a current throughput of the manufacturing equipment.

Abstract: The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

Abstract: In a tape feeder to feed electronic parts with a carrier tape, a lower support member 23 with magnet supporting the carrier tape from its lower side and stabilizing positions of the electronic parts contained in part pockets on the carrier tape by a magnetic force is constituted by a horizontal base 24 mounted on the frame member, an elongated leaf spring member 25 having an upward convex shape in a middle part thereof so as to be supported by the base 24 at opposite ends thereof, and a magnet member 26 attached on an upper face of the middle part of the leaf spring member 25. A fitting hole 24b to which the magnet member 26 can be fitted is formed in the base 24.

Abstract: To provide a method of producing an electronic apparatus that is inexpensive, contributes to high productivity, and can achieve good communication characteristics. A method of producing an electronic apparatus composed of an IC chip (100) having an external electrode formed on each of a set of opposing surfaces of the IC chip; an antenna circuit (201) having a slit formed in it; and a short circuit plate (300) for electrically connecting the IC chip (100) and the antenna circuit (201). In the method, a disc-like conveyor (703) has hands (704) on its outer periphery, and each hand (704) is capable of holding a single IC chip (100). The hands (704) hold IC chips (100) individually, and the IC chips (100) are conveyed by rotation of the disc-like conveyor (703). As a result, a plurality of IC chips (100) whose maximum number is equal to the number of the hands (704) can be simultaneously conveyed.

Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Abstract: A component placement device includes: (a) an elongated transport device by means of which substrates to be provided with components can be moved in a transport direction parallel to the transport device; (b) at least one component feeder that is located along a longitudinal side of the transport device; (c) at least one component pick-and-place unit by means of which in operation a component can be picked-up from the component feeder and placed on a substrate; and (d) a substrate support, which is located along a longitudinal side of the transport opposite to the component feeder.

Abstract: An assembling apparatus for assembling an electronic component to a printed circuit board (PCB) includes a base, a fixing member fixed to the base, a sliding member slidably mounted to the base, and a driving device mounted to the base. The fixing member is configured for fixing the PCB. The sliding member is configured for supporting the electronic component. The driving device is capable of driving the sliding member to move relative to the fixing member to assemble the electronic component to the PCB.

Abstract: An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.

Abstract: An improved vacuum box assembly for use in printed circuit board manufacturing where the printed circuit board is supported during manufacturing operations on the second side of the board. The vacuum box uses a unique and improved side plate that securely retains commercially available substrate support devices within the vacuum box. The side plate has a retention cavity configured to receive one or more substrate support devices therein. The side plate retains the substrate support device in a desired position. Open or unoccupied regions of the retention cavity may be sealed by use of specifically configured vacuum blocking plates.

Abstract: A bonding head includes a pressure plate to press a component (e.g., a semiconductor chip) onto a substrate. The pressure plate includes a holding surface configured to hold the component and to allow the component to be pressed uniformly onto the substrate, thus allowing a particularly reliable connection. The bonding head can further include an apparatus configured to vary the curvature of the holding surface of the pressure plate.

Abstract: A magnetically-assisted chip assembly unit for assembling at least one chip having a mounting surface and an attachment surface, wherein the attachment surface supports a magnetisable layer thereon and opposes said mounting surface, onto a substrate that has a corresponding chip mounting surface. The unit comprises a template wafer having at least one recess adapted to accommodate therein said chip; and a master wafer having at least one magnetisable element; wherein the template wafer is mounted on the master wafer and said magnetisable element is located at least proximate to the at least one recess such that the magnetisable element is capable of manipulating the chip into the recess, via its magnetisable layer when the magnetisable element is magnetized and generates a magnetic field. Once in the recess, the attachment surface of the chip faces at least a portion of the recess and the mounting surface of the chip faces an opening of the recess.

Abstract: An appearance inspection apparatus for inspecting a board is provided with multiple imaging units for capturing respective images of the board. Multiple slave personal computers respectively provided for the multiple imaging units inspect the board by referring to data of images of the board captured by the respective imaging units. Each of the multiple slave personal computers transmits, to other slave personal computers, shared data that are necessary for inspection by other slave personal computers. The shared data is acquired by each of the slave personal computers from data of an image of the inspection piece captured by an associated imaging unit. Each of the slave personal computers inspects an appearance of the board by referring to the shared data received from another slave personal computer.

Abstract: A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48.

Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.

Abstract: A component mounting method for mounting a component on a substrate is used by a component mounter including: a mounting head mounting the component on the substrate; and an inspection head inspecting a surface status of the substrate. The component mounting method includes: repeatedly mounting a component to be mounted on a predetermined substrate by the mounting head; determining whether or not the component to be mounted is a predetermined component; and when the determination is made that the component to be mounted is the predetermined component, performing at least one of (i) inspecting a mounting status of the predetermined component after mounting the predetermined component and (ii) inspecting a status of a mounting surface on which the predetermined component is to be mounted, before mounting the predetermined component.

Abstract: Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

Abstract: For purposes of assembling contact pins (12) disposed in a row onto a circuit board (16), the pins (12) are grasped via a force fit in an insulating body (20) at their ends facing away from the circuit board (16)and are supported to prevent tilting. The body (20) has a suction surface (26) for an automated assembly device. After insertion of the pins (12) into the circuit board (16) and after the soldering process, the body (20) is pulled off the pins (12), so that they sit freely in the circuit board (16).

Abstract: A method determines a mounting condition of a mounter mounting a component onto a board, which includes the steps of: obtaining an operational sate parameter; and determining, in the case where a value of the obtained operational state parameter is not within a predetermined range, a mounting condition so that the value of the operational state parameter falls within the predetermined range.

Abstract: In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.

Abstract: A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion. The positioning device comprises a first rotatable roller member having a sloped side surface with which the component comes into contact; and the horizontal movement speed of the holding device substantially agrees with the horizontal component of the peripheral velocity of the first roller member, with which the component comes into contact.

Abstract: An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.

Abstract: A component mounting apparatus 1 for mounting a semiconductor chip 6a picked from a component feeding stage 3 to a substrate 7 is configured so as to have a second head 12 for subjecting the substrate 7 or the semiconductor chip 6a loaded on the substrate 7 by a first head 11 to predetermined operation in addition to having the first head 11 equipped with a loading unit 19 that loads the semiconductor chip 6a on the substrate 7. The second head 12 is configured in such a way that the second head 12 can selectively be equipped with, in addition to a coating unit 20 for squiring paste for component bonding purpose from a coating nozzle, a work unit having at least one of a paste transfer function for transferring paste by means of a transfer tool, to thus supply paste to the substrate and a heating-press function for pressing the component loaded on the substrate against the substrate while heating the component.

Abstract: A method and placement device are provided for moving at least two elements in and opposite to a predetermined direction. The second element is simultaneously moved by means of the first element. The first element is moved in the predetermined direction, whereas the second element is moved relative to the first element in a direction opposite to the predetermined direction and vice versa.

Abstract: A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.

Abstract: Device for turning over electronic components, comprising a turntable (1) for driving the electronic components to be turned over in succession between the following stationary locations: a location (A) for loading them onto the turntable; a start of turning over location (B); an end of turning over location (C); and a location (D) for unloading the turntable. A turning-over device (2) actuated by a fixed rotating motor (21), not linked to said turntable, allows the electronic components to be turned over between the start of turning over position and the end of turning over position.

Abstract: A module apparatus includes a first unit and a second unit adjacent to the first unit. The first unit includes a chip transfer unit mounting semiconductor chips on a printed circuit board and a heat unit applying heat on a solder ball of the semiconductor chip. The second unit includes a tester testing an electrical connection state between the printed circuit board and the semiconductor chip, a bad board storage storing the printed circuit board on which a semiconductor chip determined as bad in the tester is mounted, and a board moving member moving the printed circuit board stored in the bad board storage into the first unit.

Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Abstract: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.

Abstract: A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The pin is guided through the path-like opening of each of the plates. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path.

Abstract: A method for manufacturing antenna elements for use with wireless communication devices comprises a number of cutting techniques that allow the size of the antenna elements to be adjusted. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: A luminaire has an aluminium body with an opening extending longitudinally therethrough from a front face from which, in use, light is emitted, and a rear face to which, in use, a power coupler is connectable. A circuit board is mounted in the body proximate to the front face, which circuit board carries a plurality of LEDs. A power board carrying an RJ45 socket is mounted on the rear face of the body, the power board being electrically connected to the circuit board by a pair of wires. The wires are clipped into wire guides mounted in the body. A lens shroud mounts in the opening in the body in front of the circuit board and is secured in position by screws, the lens shroud having a plurality of cylindrical apertures formed therein corresponding in number and pattern to the number and pattern of LEDs on the circuit board such that each aperture aligns with one of said LEDs, shrouding its associated LED such that the light emitted therefrom is collimated.

Abstract: Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and scalably embedding or seating IC elements onto/into a receiving substrate, such as a chip substrate. Preparing of the chip substrate can be performed by depositing or patterning an activatable thermal barrier material on a surface of the substrate. The IC chips are secured on the prepared substrate by activating the thermal barrier material between the chip substrate and IC chips. Securing can include softening of the chip substrate with the activated thermal barrier material to an amount suitable for embedding the IC chips. Securing can also include adhesively bonding the IC chips to the substrate with the activated thermal barrier material in the case of a non-pliable substrate.

Abstract: A method is disclosed that can be used to interconnect an integrated circuit (IC) multiple die assembly to conductors on a substrate such that signals can be conveyed between the dies and the conductors on the substrate. The multiple die assembly can include a first IC die and at least one secondary IC die, which can be mounted on a surface of the first IC die. Signal paths can be provided between the first IC die and the secondary IC die. The method can include providing conductive contacts on the surface of the first IC die. Each such conductive contact can have a free end extending outward from the surface beyond the secondary IC die. The method can also include mounting the multiple die assembly on the substrate such that the free end of each contact is brought into contact with the conductors on the substrate. The secondary IC die can reside between the surface of the first IC die and the substrate, and the contacts can convey signals between the first IC die and the conductors on the substrate.

Abstract: An offset measuring mechanism and method used in a bonding apparatus, in which the object plane of a position detection camera is set on a hypothetical bonding working plane, and the image of imaging elements within the imaging plane is projected onto a bonding working plane. Furthermore, the tip end of a bonding tool is aligned with the bonding working plane. The object plane of the offset measuring camera is set on the bonding working plane, and the image on the bonding working plane is projected onto the imaging elements of the imaging plane of the offset measuring camera. The imaging elements detect the projected image of the imaging elements of the position detection camera or the image of the tip end of the bonding tool and output this data to the image position measuring part or tool position measuring section of the control block.