Abstract: In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: Methods and systems for stacking multiple chips with high speed serialiser/deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serialiser/deserialiser blocks, using the TSVs.

Abstract: The invention provides for a dice pick and lift head for an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The dice pick and lift head includes a first translation stage mounted to the die picking assembly, said first translation stage operatively displaceable along a vertical axis relative to the support assembly. The dice pick and lift head also includes a second translation stage mounted to the first translation stage, said second translation stage operatively displaceable along a horizontal axis relative to the support assembly.

Abstract: The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

Abstract: AN SMT nozzle is provided for picking up an SMD. The nozzle includes a suction portion and a supporting arm extending from a side of the suction portion. The suction portion forms an engaging end configured for abutting against the SMD, and defines a suction passage with an opening in the engaging end. The supporting arm form at least one supporting end spaced from the engaging end of the suction portion and configured for abutting against the SMD.

Abstract: The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Abstract: Display panel assembly apparatus for assembling a display panel by bonding a driver substrate onto a glass panel via a connector and bonding material. A panel positioning table retains the glass panel in which the connector is bonded to its edge, and positions the glass panel with respect to a bonder from one side. The substrate to which a bonding tape is applied by a bonding tape applicator is transferred to the bonder from the other side by circulating a substrate holder on which the substrate is placed using a circulatory transport mechanism. The connector prebonded on the glass panel and the substrate are then bonded via the bonding tape. Adoption of this configuration for the display panel assembly apparatus and assembly method reduces the apparatus installation area while achieving high productivity.

Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.

Abstract: A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.

Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: A method and apparatus are provided for assembly of several semiconductor components on a target substrate. At least two semiconductor components are removed from a dispenser by a transfer device and simultaneously mounted in predefined target positions on the target substrate. The apparatus includes positioning units for positioning of the semiconductor components relative to the target substrate. Feed of the target substrate occurs by a first positioning unit into an assembly area where the semiconductor components are mounted on the target substrate in a first X direction, and feed of the transfer device with the semiconductor components occurs by a second positioning unit into the assembly area in a second Y direction. Both directions deviate from each other and the assembly area represents vicinity of the intersection point of the X and Y directions. Removal of the process target substrate from the assembly area continues its feed movement.

Abstract: A method for putting a glass plate to a target position includes (a) putting the glass plate at a preliminary position above an air table that discharges air upwardly, by moving a suction member that supports the glass plate through suction; (b) releasing suction of the suction member, while air is discharged upwardly from the air table, thereby floating the glass plate at the preliminary position above the air table; and (c) moving a pressing member in a horizontal direction, while the pressing member is in abutment with a top surface of the glass plate and while air is discharged upwardly from the air table, thereby moving the glass plate in the horizontal direction from the preliminary position above the air table to the target position above the air table by a frictional force generated between the pressing member and the glass plate.

Abstract: Provided are a chip mounter and a method for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes a plurality of solder balls having n patterns (n?1), a pattern recognition unit which analyzes the image information and outputs information about the BGA package, and a storage unit which stores the information about the BGA package, wherein the pattern recognition unit recognizes the n patterns, selects n seeds respectively corresponding to the n patterns and performs a seed growing operation which groups solder balls which are continuously located adjacent to the seed and have the same pattern as the seed into the same group as the seed, with respect to each of the n seeds.

Abstract: A component placement machine includes: a transport device for transporting PCBs in an X-direction; first and a second feeder areas; at least one Y-slide beam that is drivable in the X-direction; and at least two placement heads on each Y-slide beam, which placement heads are independently drivable in the Y-direction and dependently drivable in the X-direction. Each feeder area includes at least one feeder for storing components. Such a machine enables a number of actions to be performed simultaneously. For example, within a certain period of time, a plurality of placement heads can simultaneously pick up components from a feeder, while other placement heads, which previously picked up components, may be moved to desired X-Y positions of the PCB which the previously picked up components may be placed, thereby resulting in an improved output.

Abstract: A pickup device comprising a pickup surface to which an electronic component retaining liquid is to be applied and capable of adjusting a wet area of the electronic component retaining liquid on the pickup surface is prepared, and the electronic component retaining liquid is applied to the pickup surface in a first step. The electronic component is retained on the pickup surface via the electronic component retaining liquid in a state where the wet area is extended in a second step.

Abstract: A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

Abstract: In this crimping device, a press slide (5) is provided with a crimp-height adjuster (20) for the insulation crimper (9). The crimp-height adjuster (20) arranged on the press slide (5) above an upper tool (7) consists essentially of a rotationally hindered eccentric disk (21), a lever (22), and a magnet (23) with plunger (24). The eccentric disk (21) is mounted rotatably on an axle (25). During production of crimp connections, the plunger (24) is at rest outside an elongated hole (28) of the lever (22). The press slide (5) with the upper tool (7) can be moved up and down without hindrance. With the plunger (24) inserted into the elongated hole (28) and with an upward motion of the press slide (5), after overcoming the friction of a disk-spring assembly the eccentric disk (21) executes rotational motion in clockwise direction. The lever (22) that is rigidly connected to the axle (25) turns the eccentric disk (21) about the axle (25).

Abstract: A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.

Abstract: A method of manufacturing a wiring substrate comprises the steps of attaching a semiconductor chip to a chip positioning plate of a chip tray formed of silicon, executing wiring formation processing using the semiconductor chip attached to the chip positioning plate as a base point, and detaching the wiring-formed wiring substrate from the chip positioning plate. The chip positioning plate comprises a receiving part for receiving the semiconductor chip, and elastic members respectively disposed in two adjacent surfaces of four surfaces constructing an inside surface of the receiving part, and each of these elastic members exerts pressing force toward directions of opposite surfaces, and the semiconductor chip is pinched between each of the opposite surfaces corresponding to each of the elastic members.

Abstract: An integrated circuit packaging method, system and apparatus for maintaining a predetermined temperature between reflow and underfill dispense are disclosed.

Abstract: A component recognition apparatus for a chip mounter includes a head portion having a frame and at least one nozzle portion installed on the frame, the nozzle portion picking up an electronic component and mounting the electronic component on a substrate, a camera coupled with the frame and comprising an imaging device, and a mirror portion having a mirror support portion installed on the frame and a mirror held by the mirror support portion in a space that does not interfere with the movement path of the electronic component held by the nozzle portion. The camera includes a lens portion, and an image of the electronic component held by the nozzle portion is reflected by the mirror, passes off-axis through the lens portion, and is formed on the imaging device.

Abstract: Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component from the component supply unit and for mounting it to the PCB; first and second Y axis transfer mechanisms; an X axis transfer mechanism having a first end of mounted to the first Y axis transfer mechanism and the second end mounted to the second Y axis transfer mechanism; a first driving unit controlling the movement of the first end of the X axis transfer mechanism along Y axis; and a second driving unit controlling the movement of the second end of the X axis transfer mechanism along the Y axis, independently of the first driving unit.

Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Abstract: A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on the basis of the images.

Abstract: The present invention is intended to realize a hold posture inspection of a plurality of components sucked by a plurality of nozzle rows provided on a head with a single scanning operation, thereby reducing the time for the hold posture inspection and improving the accuracy thereof. In order to achieve such objections, the present invention includes: a head on which at least two nozzle rows are disposed, each of which includes at least one nozzle; a circuit board holding unit for holding a circuit board on which components conveyed by the head are mounted; and an inspection unit, provided on a moving path of the head from a supplying unit to the circuit board holding unit, for inspecting hold postures of the components held by the nozzles of the head and including sensors for posture inspection independent for the respective nozzle rows.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: It is intended to allow for readily performing a cover tape setting operation. In the present invention, a tape guide 110 for guiding a component supply tape 35 includes a front guide section 120 provided with an open surface 128 opened on one side thereof in a continuous manner in a tape feed direction, so as to allow a cover tape 37 to be taken in and out relative to the front guide section 120 through the open surface 128. This configuration makes it possible to perform the setting operation for the cover tape 37 through given operational steps, under a condition that the tape guide 110 remains fixed to a component supply unit 40.

Abstract: A method of manufacturing an electronic circuit including employing a pick & place machine-specific component placement sequence, pick & place machine-specific component data for governing the operation of at least one specific pick & place machine in a manufacturing line and operating instructions in computer-readable language for the at least one specific pick & place machine to auto-generate generic component parameters for components used in manufacturing the electronic circuit on the at least one specific pick & place machine and employing the generic component parameters to auto-generate a pick & place machine-specific component placement sequence and pick & place machine-specific component data for governing the operation of at least one other specific pick & place machine in a manufacturing line and operating instructions in computer-readable language for the at least one other specific pick & place machine.

Abstract: The present invention provides a constitution of n-type ohmic electrode suitable for n-type group III nitride semiconductor, and a forming method thereof for providing low contact resistivity. The n-type ohmic electrode is provided to comprise an alloy of aluminum and lanthanum or comprises lanthanum at the junction interface with the n-type group III nitride semiconductor. The method comprising forming a lanthanum-aluminum alloy layer at 300° C. or less to form an n-type ohmic electrode enriched in lanthanum at the junction interface.

Abstract: A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Abstract: A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then transport the boards to the downstream side, and the mounter includes a first stopping unit 135 for stopping the board to place a board edge on the downstream side on a first fixed position which is in the downstream side from a first mountable area A, the first mountable area A being a mountable region where the components can be mounted on the first mounting stage 109 on the upstream side, and a second stopping unit 136 for stopping the board to place a board edge on the upstream side on a second fixed position which is the upstream side from a second mountable area A, the second mountable area A being a mountable region where the components can be mounted on the second mounting stage 110.

Abstract: A pick and place machine for placing components upon a workpiece includes a placement head, a robotic system and at least one detachable nozzle. The robotic system is configured to generate relative movement between the placement head and the workpiece. The detachable nozzle is coupled to the placement head and includes wireless communication circuitry. A detachable nozzle having wireless is communication abilities is also disclosed.

Abstract: A carrier tape package 20 is used in an electronic components placing apparatus for feeding electronic components by a tape feeder, and has a carrier tape 22 housed in a wound state on a tape reel 21. In the carrier tape package 20, a data storage unit 23, in which an IC tag 25 having carrier tape information containing identification information of electronic components P held in the carrier tape 22 is held in a holder 24, is attached to the tape reel 21. At the instant when the carrier tape 22 is mounted in the tape feeder, the carrier tape information is read out by a reader/writer belonging to the tape feeder from the data storage unit 23 mounted on the leading end portion of the tape feeder.

Abstract: A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark-image taking device is expected to coincide with a center of the support surface of the support pin. Another image of the support surface is taken at a second position where the center of the image-take surface is distant from the center of the support surface by a predetermined distance. At the second position, the image of the support surface is formed on the image-take surface at a position corresponding to the height of the support surface. Based on the position corresponding to the height of the support surface, the height of the support surface relative to the mark-image taking device is obtained.

Abstract: The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.

Abstract: An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer bonding device 3 has a press anvil 31 that holds the base circuit sheet 20 on which the interposer 10 is laminated and a bonding head 32 that moves relatively with respect to the press anvil 31. The bonding head 32 has a pressing surface 320 that presses the rear surface of the interposer by abutting against this surface. The pressing surface 320 scans the rear surface of the interposer 10 by the relative movement of the bonding head 32 with respect to the press anvil 31 and presses the whole surface of the interposer-side terminal 12 toward the base circuit sheet 20.

Abstract: In a linear driving mechanism for electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8 in a Y direction using a linear motor, an object to be driven and the linear motor are disposed such that a position P of thrust generated by the linear motor for driving the transfer beam 8 in the Y direction approximately corresponds to a central position D1 of inertial resistance of the object to be driven comprising movable portions such as transfer beam 8, loading head 9, and transfer plate 12. Accordingly, twisting moment applied to the transfer beam 8 due to inertial force is eliminated in acceleration/deceleration, and loading position accuracy is ensured and a component life can be lengthened.

Abstract: A package removal device is for removing a package (5) from a component band (1) to expose a carrier band (2). The package removal device includes a stand (10), a first scrolling unit includes a first gear (52), and a second scrolling unit includes a second gear (85). The stand includes a platform (12) with an import end (14a) and an export end (14b). The export end includes a locating gear (18) mounted thereon, a first exit (24), and a second exit (22). The component band is separated into the package and the carrier band in the export end. The first gear meshes with the second gear to output the package from the first exit. The locating gear engages the carrier band to output the carrier band from the second exit.

Abstract: A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring substrate accommodating trays which can be vertically stacked, wherein: the substrate accommodating trays are to be mounted on an upper surface; and substrate removal tool insertion openings for inserting the substrate removal tools are positioned so as to oppose openings of the mounted substrate accommodating trays.

Abstract: Methods for integrating quartz-based resonators with electronics on a large area wafer through direct pick-and-place and flip-chip bonding or wafer-to-wafer bonding using handle wafers are described. The resulting combination of quartz-based resonators and large area electronics wafer solves the problem of the quartz-electronics substrate diameter mismatch and enables the integration of arrays of quartz devices of different frequencies with the same electronics.

Abstract: A component-holding-tape connecting apparatus for connecting two component holding tapes through a connecting member, by caulking end portions of the respective two component holding tapes and the connecting member in a caulking position. The apparatus includes: (a) a supplying device supplying the connecting members to the caulking position; (b) a holding device holding, in the caulking position, the end portions of the respective two component holding tapes and the connecting member which is supplied by the supplying device; and (c) a caulking device caulking the end portions of the respective two component holding tapes and the connecting member which are held by the holding device, by causing caulking claws of the connecting member, to pierce through each the end portions of the respective two component holding tapes, and deforming the caulking claws. The supplying device includes a rotary body positioning the connecting members one by one in a predetermined position.

Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.

Abstract: A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the feeder exchange. A comparison of the pre-exchange image with the post-exchange image facilitates simple and quick feeder exchange validation. Aspects of the present invention are practicable with different types of pick and place machines, and are able to advantageously use sensors and/or technician supplied information to generate automatic indications of feeder exchange validity.

Abstract: A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point.

Abstract: In an for controlling a feeder or feeder cart used in a pick-and-place electronics assembly machine, non-physical contact transmitters and receivers transfer data, such as feeder trigger signals, feeder ready signals, and component identification and usage information, between the feeder and/or feeder cart and the pick-and-place machine. Wiring or other physical connections between feeder, feeder cart, and pick-and-place machine controls are not required. A common, universal interface between different types of feeders, feeder carts, and pick-and-place machines is possible.

Abstract: A device for assembling electronic circuits comprises a placing station (7) for placing circuit components on a circuit carrier (1) held at a placing location (17), a fixing station (19) for fixing the circuit components to the circuit carrier (1) under the effect of heat, and a belt conveyor means (9) for conveying a circuit carrier from the placing location (17) to a take-over location (29) of the fixing station (19). The fixing station (19) comprises a heatable zone (22) and a manipulator (21) for raising the circuit carrier (1) from the take-over location (29) and placing it in the heatable zone (22). A continuous belt conveyor (9) of the belt conveyor means extends from the placing location (17) up to the take-over location (29).

Abstract: The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2 , and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.