By Utilizing Optical Sighting Device Patents (Class 29/833)
  • Patent number: 10356969
    Abstract: A recognition mark which is formed on a tape retaining cover which retains a carrier tape, which holds components in pockets, in relation to a sprocket with which the tape feeder is provided, and the component or the pocket which is positioned at a suction position through an opening which is formed in the tape retaining cover are recognized. Based on recognition results, tape feed positional correction for positioning the suction target component at the suction position is performed such that the component, which is adjacent on an upstream side in a tape feed direction to the component which is positioned at the suction position, is not exposed by greater than or equal to a predetermined amount from the opening.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 16, 2019
    Inventors: Koji Watanabe, Hiroyuki Fujiwara, Shinji Yamamoto
  • Patent number: 10349570
    Abstract: Control device 80 of component mounter 11 performs control such that after a component supplied by reel unit 56 is picked up by nozzle 40 of mounting head 24 and before the component is mounted on board 12, the component is temporarily placed at a specified position of temporary placement surface 71. Also, control device 80, after performing control such that the component is temporarily placed at the specified position, determines whether the component has actually been temporarily placed at the specified position based on the pressure state at a hole provided at the specified position of temporary placement surface 71 to which negative pressure is being supplied, and performs processing according to the determination result.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: July 9, 2019
    Inventor: Kenji Hara
  • Patent number: 9863976
    Abstract: A test system includes a test socket assembly for capturing low energy electromagnetic emissions from radio frequency (RF) integrated circuits (ICs). The test socket assembly is structured to direct electromagnetic radiation from the device under test (DUT) to a socket port coupled to one end of a waveguide for transmission to a tester. The combination of the materials comprising the socket assembly is selected to more efficiently couple electromagnetic emissions from the DUT into the waveguide. For example, a reflective plane with an adjustable position may be located below the DUT in order to increase coupling of electromagnetic radiation from the DUT into the waveguide.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: January 9, 2018
    Assignee: Keyssa Systems, Inc.
    Inventors: Bhupendra Sakerlal Sarhad, Christopher Scott Sansom
  • Patent number: 9815203
    Abstract: An example method includes determining an expected sound profile corresponding to a given task for a robotic device. The method further includes detecting a sound profile during execution of the given task by the robotic device. The method also includes determining one or more differences in amplitude for at least one frequency range between the detected sound profile and the expected sound profile corresponding to the given task for the robotic device. In response to determining the one or more differences in amplitude for the at least one frequency range between the detected sound profile and the expected sound profile, the method additionally includes identifying at least one component of the robotic device associated with the detected sound profile during execution of the given task. The method further includes adjusting control data for the at least one component of the robotic device.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: November 14, 2017
    Assignee: X Development LLC
    Inventors: Laura Stoia, Craig Latimer, Matthieu Guilbert
  • Patent number: 9791266
    Abstract: A shape measurement apparatus includes a work stage supporting a target substrate, a pattern-projecting section including a light source, a grating part partially transmitting and blocking light generated by the light source to generate a grating image and a projecting lens part making the grating image on a measurement target of the target substrate, an image-capturing section capturing the grating image reflected by the measurement target of the target substrate, and a control section controlling the work stage, the pattern-projecting section and the image-capturing section, calculating a reliability index of the grating image and phases of the grating image, which is corresponding to the measurement target, and inspecting the measurement target by using the reliability index and the phases. Thus, the accuracy of measurement may be enhanced.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: October 17, 2017
    Inventors: Joong-Ki Jeong, Min-Young Kim, Seung-Jun Lee
  • Patent number: 9778647
    Abstract: In a work machine which includes a working head including a lifting and lowering unit including a working device and a first lifting and lowering device which lifts and lowers the working device, and a second lifting and lowering device which lifts and lowers the lifting and lowering unit, a positional deviation (?x, ?y) of the working device in a direction which is perpendicular to a lifting and lowering direction is eliminated. Since the positional deviation is caused by both an inclination of a lifting and lowering axis line L1 of the working device by the first lifting and lowering device and an inclination of a lifting and lowering axis line L2 of the lifting and lowering unit by the second lifting and lowering device, based on positional deviation data a target moving position is corrected.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: October 3, 2017
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yasuhiro Teshima, Takashi Taneike, Takashi Nakane, Masaki Kato
  • Patent number: 9750169
    Abstract: A method for mounting an electronic component onto a circuit board. The method may include preparing a mounting device including a rotatable mounting head, a holding means to hold the electronic component, a component recognition camera, a memory device, and a microcomputer, the electronic component being mounted onto the circuit board based on a result of performing recognition processing with respect to an acquired image, determining a mid-operation instruction action mode at start of a production operation, executing an instruction of obtaining an offset value relative to a rotation center of the rotatable mounting head and storing the offset value in the memory device at a time interval according to the determined mid-operation instruction action mode, and executing the instruction at a longer time interval when the instruction has continuously met a required accuracy more than once.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: August 29, 2017
    Inventors: Takuya Imoto, Tetsuji Ono, Yoshinori Okamoto
  • Patent number: 9435946
    Abstract: An interlayer light wave coupling device includes a substrate; a first core disposed on the substrate and having a first acute structure; a third core spatially set apart from the first core and having a second acute structure; and a second core disposed between the first core and the third core and having a smaller index of refraction than the first core and the third core. The acute structures of the first core and the third core are disposed so as to have no overlap as viewed from above.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: September 6, 2016
    Inventors: Youichi Sakakibara, Ryohei Takei, Masahiko Mori, Toshihiro Kamei
  • Patent number: 9426844
    Abstract: An electrical raft 200 is provided that has electrical conductors 252 embedded in a rigid material 220. The electrical raft 200 may have other embedded components, such as embedded fluid pipes 210. The electrical raft 200 is provided with a raft map 400 that indicates the location and/or path of components embedded in the electrical raft 200. The raft map 400 can be used to identify the positions of the embedded components, and may also be provided with active elements, such as LEDs, which may be used to indicate an operating state of the systems/components embedded in the electrical raft 200. The raft map 400 may be useful in assembly, repair and fault diagnosis, for example.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: August 23, 2016
    Assignee: ROLLS-ROYCE PLC
    Inventors: Paul Broughton, Richard Peace, Gary Alan Skinner, Robin Charles Kennea, Michael Christopher Willmot, Philip Summerfield
  • Patent number: 9184149
    Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: November 10, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
  • Patent number: 9142459
    Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves applying an adhesive layer to a front side of the semiconductor wafer. A mask layer is laminated onto the front side of the semiconductor wafer, the mask layer covering and protecting the integrated circuits. The adhesive layer adheres the mask layer to the front side of the semiconductor wafer. The mask layer is patterned with a laser scribing process to provide gaps in the mask layer, the gaps exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is plasma etched through the gaps in the mask layer to singulate the integrated circuits.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: September 22, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Prabhat Kumar, Wei-Sheng Lei, Brad Eaton, Ajay Kumar
  • Patent number: 9027237
    Abstract: A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent to picking up the optical components, mounting the optical components directly on a first wafer by means of the robot arm; wherein the first wafer has optoelectronic components attached, and the optical components being positioned individually or in groups relative to the position of the optoelectronic components of the first wafer using the robot arm; and utilizing, as the first wafer, a glass wafer having i) spectrally filtering glass being an infrared filter glass and ii) an infrared filter coating, the glass wafer having a thickness in the range of 50 to 500 micrometers.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: May 12, 2015
    Assignee: Schott AG
    Inventors: Edgar Pawlowski, Ralf Biertuempfel, Bernd Woelfing, Frank Fleissner, Petra Auchter-Krummel, Ulf Brauneck, Joseph S. Hayden, Ulrich Fotheringham
  • Patent number: 9009957
    Abstract: A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: April 21, 2015
    Assignee: Assembleon B.V.
    Inventor: Johannes Hubertus Antonius Van de Rijdt
  • Patent number: 9003652
    Abstract: The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: April 14, 2015
    Assignee: Dell Products L.P.
    Inventors: Joel R. Goergen, Greg Hunt, Peter Tomaszewski, Joseph Pankow, Michael Laudon
  • Patent number: 8978237
    Abstract: A method to align an optical device optically with an interference device is disclosed. The method includes steps of: selecting one of arm waveguides, biasing rest of arm waveguides to cause optical absorption thereat, and aligning the optical device optically with the selected arm waveguide.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: March 17, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Tohru Watanabe
  • Patent number: 8950066
    Abstract: A method for manufacturing an LED module includes following steps: providing a SMT apparatus having a CCD image sensor, providing a PCB having an LED mounted on, and fixing the PCB in the SMT apparatus; providing a lens, the CCD image sensor imaging the lens, and then the SMT apparatus obtaining a location of the lens relative to the LED, and the SMT apparatus positioning the lens on the PCB to cover the LED; providing an optical diffusing board located above the lens, and electrifying the LED for emitting light towards the optical diffusing board; providing a luminance colorimeter to measure luminance and chroma of light exited from the optical diffusing board, and obtaining a light-emitting data; calculating the light-emitting data, and the SMT apparatus adjusting a position of the lens relative to the LED; and fixing the lens on the PCB.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: February 10, 2015
    Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
    Inventor: Chih-Chen Lai
  • Patent number: 8948900
    Abstract: A component mounting apparatus includes: an operational sequence supervision unit which is created in compiler language determining an operational sequence specifying a series of sequence operations of suctioning, recognizing and mounting a component; and a second memory unit which stores a custom program, created in interpreter language and specifying an operation different from the series of sequence operations, and custom program designation information that designates execution of the custom program. The operational sequence supervision unit controls a switching process for switching from the series of sequence operations to an interpreter language processing execution routine for executing the custom program, during, or before or after, the series of sequence operations in accordance with the custom program designation information.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: February 3, 2015
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventor: Yasushi Miyake
  • Publication number: 20150026974
    Abstract: A control unit of an electronic component mounting apparatus controls a component imaging unit so as to image an electronic component that is held by the holding unit when the holding unit is subjected to an acceleration movement or a deceleration movement by a movement mechanism unit.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 29, 2015
    Applicant: Panasonic Corporation
    Inventors: Eiichi Hachiya, Andres Tamez, Jose Camara
  • Publication number: 20150013154
    Abstract: A mid-operation instruction action mode is set when an operation for producing a printed circuit board starts, an offset value with respect to the center of rotation of a mounting head is determined in an interval according to the set mid-operation instruction action mode, and an instruction for saving the offset value in a memory of a control microcomputer is made. If the requisite accuracy is delivered as a result of the instructions being performed a plurality of times in continuation, the control microcomputer performs a control so that the instructions are performed over a greater interval than the interval according to the mid-operation instruction action mode. If the requisite accuracy is not delivered even if the instructions are performed over an interval greater than the interval, the control microcomputer performs a control so that the instructions are performed over an interval according to the set mid-operation instruction action mode.
    Type: Application
    Filed: February 27, 2013
    Publication date: January 15, 2015
    Inventors: Takuya Imoto, Tetsuji Ono, Yoshinori Okamoto
  • Patent number: 8925188
    Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: January 6, 2015
    Assignee: Fujitsu Limited
    Inventors: Toru Nishino, Kazuyuki Ikura
  • Patent number: 8918989
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: December 30, 2014
    Assignee: EV Group GmbH
    Inventors: Jürgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller
  • Patent number: 8898893
    Abstract: Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: December 2, 2014
    Assignee: Universal Instruments Corporation
    Inventor: Koenraad Gieskes
  • Patent number: 8903541
    Abstract: A method for positioning electronic devices into compartments of an input medium is disclosed. At least one electronic device is packable in a single compartment of the input medium. Known positions on an upper side of the input medium are imaged by an inspection device. Actual position data of the compartments of the input medium are calculated on the basis of images of the known positions, given target position data of the known positions, and given target position data of the compartments of the input medium. A pick and place device for the electronic devices is controlled on the basis of the calculated actual position data of the compartments of the input medium. A method for determining the actual positions of compartments of an output medium is disclosed with analogous steps, whereby the electronic devices are picked-up from compartments of the input medium, transferred to compartments of the output medium, and placed into the compartments of the output medium.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: December 2, 2014
    Assignee: KLA—Tencor Corporation
    Inventors: Bert Vangilbergen, Jimmy Vermeulen, Carl Truyens, Erik De Block, Bruno Accou
  • Patent number: 8844124
    Abstract: An electronic component mounting system and method is disclosed that can provide accurate operation instruction to a machine operator. The electronic component mounting system comprises a plurality of machines interlinked in series. A main screen, making up an operation instruction screen, is displayed on a display panel belonging to an operation target machine to be operated by the machine operator while a first sub-screen and a second sub-screen of the operation instruction screen are respectively displayed on display panels belonging to two adjacent machines placed adjacently on both sides of the operation target machine among the plurality of machines. Thus, even when a unit device has a small width such that a size restriction is imposed a display panel, accurate operation instruction, with a sufficient amount of information, can be provided by displaying the operation instruction screen on multiple display panels.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: September 30, 2014
    Assignee: Panasonic Corporation
    Inventors: Kazuhiko Itose, Kenichiro Ishimoto, Yoshiaki Awata, Hideki Sumi
  • Publication number: 20140283380
    Abstract: A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.
    Type: Application
    Filed: January 29, 2014
    Publication date: September 25, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Yoshiyuki HIROSHIMA, Naoki NAKAMURA, Akiko MATSUI, Tetsuro YAMADA, Takahiro OOI, Kohei CHORAKU
  • Patent number: 8839502
    Abstract: A production method of an electronic component includes: forming a sheet having a resin layer and a metal layer formed under the resin layer; bonding the sheet to a substrate so that the metal layer is arranged on a functional portion of an acoustic wave element formed on the substrate, a frame portion surrounding the functional portion is formed between the metal layer and the substrate, a cavity is formed on the functional portion by the metal layer and the frame portion, and the resin layer covers the metal layer and the frame portion.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: September 23, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Tsuyoshi Yokoyama, Kazunori Inoue, Kazuhiro Matsumoto
  • Patent number: 8800139
    Abstract: A method of chip mounting uses a manipulator to mount an electronic component in a vertically upward direction onto a downwardly-facing mounting surface of a printed circuit board held by a holding bed. The holding bed is located above the manipulator or sidewise relative to the manipulator for mounting by the manipulator onto the downwardly-facing mounting surface of the printed circuit board.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: August 12, 2014
    Assignee: Trinc.Org
    Inventor: Makoto Takayanagi
  • Patent number: 8782879
    Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: July 22, 2014
    Assignee: TDK Corporation
    Inventors: Toru Mizuno, Osamu Shindo, Hitoshi Nakayama
  • Patent number: 8769809
    Abstract: A component mounting apparatus including: plural spindles respectively including nozzles, each spindle rotating about a first pivot and each nozzle picking up a component; a head body rotating about a second pivot substantially parallel to a first pivot and rotatably supporting the spindles; and a controller controlling the spindles and the head body to perform: a pickup operation in which the spindle rotates about the first pivot from an initial orientation to a pickup orientation, the nozzle picks up the component, and the spindle rotates from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate; and a mounting operation in which the picked-up component is transferred to a mounting position of the substrate during which each spindle is retained at the initial orientation.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: July 8, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Tanizaki Masahiro
  • Publication number: 20140160794
    Abstract: The present invention provides a backlight source and an assembly method of the backlight source. The backlight source includes at least one light source, a printed circuit board, and a light guide plate on which a second alignment mark is arranged. The light source is arranged on the printed circuit board on which a first alignment mark is arranged. When the first alignment mark is aligned with the second alignment mark, the light source is arranged at an edge of the light guide plate and a light emitted from the light source is guided into the light guide plate. In the backlight source and the assembly method of the backlight source, the alignment marks are arranged on the light guide plate and the printed circuit board having the light source so that the light guide plate and the light source are properly positioned.
    Type: Application
    Filed: December 9, 2013
    Publication date: June 12, 2014
    Inventor: Deyu MENG
  • Publication number: 20140130348
    Abstract: A component mounter includes: a nozzle having a nozzle main body and a reflecting part provided behind the main nozzle body and reflecting light from front, the nozzle main body including a greatest outer periphery section provided to a front section of the main nozzle body, and the greatest outer periphery section of an outer periphery of the nozzle main body provided in front on the reflecting part; a first illuminating unit provided in front of the reflecting part and illuminating the reflecting part from front with light; and an imaging unit provided in front of the nozzle and capturing the greatest outer periphery section positioned in front of the nozzle main body, using the light from the first illuminating light and reflected off the reflecting part.
    Type: Application
    Filed: May 11, 2012
    Publication date: May 15, 2014
    Inventors: Osamu Okuda, Hiroharu Tokunaga, Hideaki Katou, Tomio Tanaka
  • Patent number: 8701275
    Abstract: A surface mounting apparatus includes a mounting head which is movable in X and Y directions and which mounts an electronic component on a positioned board, and a board recognizing camera is fixed to a base and which moves integrally with the mounting head. A correction jig includes a correction mark which is imaged by the board recognizing camera, and an imaging result is used to correct temporal change in an interior portion of the camera including an optical system, and is fixed to the base.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: April 22, 2014
    Assignee: Juki Corporation
    Inventor: Hiroyuki Kagaya
  • Patent number: 8677614
    Abstract: Provided are a chip mounting method and device. The chip mounting device comprises: a bonding head on which a device is loaded; and a controller which places the bonding head at a preparation height above a board, determines a search height at which a mounting position on the board, on which the device is to be mounted, is searched for by the controller, and lowers the bonding head from the preparation height to a bonding height via the search height and mounts the device on the mounting position on the board, by controlling movements of the bonding head, wherein the controller determines that the device touches the board if at least one of a plurality of conditions is satisfied.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: March 25, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Bong-Joon Kim
  • Patent number: 8653846
    Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: February 18, 2014
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Yasuhide Takeda
  • Patent number: 8646174
    Abstract: An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: February 11, 2014
    Assignee: Panasonic Corporation
    Inventors: Kenichi Kaida, Hideki Sumi, Masahiro Kihara, Kenichirou Ishimoto, Noboru Higashi
  • Patent number: 8627949
    Abstract: A transmission mechanism includes a feeder, a belt furling module, a tension maintaining module, and a carrier belt. The tension maintaining module and the belt furling module are positioned on the feeder, and the carrier belt runs along the feeder, the tension maintaining module, and the belt furling module in that order. The tension maintaining module includes a base, a pivot shaft slidably positioned on the base, and an elastic member sleeved on the pivot shaft. When the carrier belt relaxes, the elastic member releases its compression force to drive the pivot shaft to move away relative to the base, thereby maintaining the tension force of the carrier belt. The disclosure also provides a surface mount device using the transmission mechanism, which reduces the likelihood of the carrier belt breaking or jamming, thereby promoting improved precision and yield rate of the surface mounted equipment.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: January 14, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Tsung-Chih Tsai, Chao-An Kang, Shang-Yu Lin
  • Patent number: 8601677
    Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: December 10, 2013
    Assignee: International Business Machines Corporation
    Inventors: Fuad E. Doany, Andrew D. Perez, Niranjana Ruiz, Lavanya Turlapati
  • Patent number: 8553080
    Abstract: To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: October 8, 2013
    Assignee: Panasonic Corporation
    Inventors: Tadashi Endo, Akira Noudo, Kazuhide Nagao
  • Patent number: 8549735
    Abstract: A challenge to be met by the present invention is to provide a component mounting device, a component mounting system, and a component mounting method that make it possible to correctly position a substrate at a working location and mount components on the substrate even when components mounted on the substrate project outside from an end of the substrate in a direction parallel to a substrate conveyance path. When a front end portion (PbT) of a substrate (Pb) conveyed by a substrate conveyance path (13) is detected to have reached inspection light (L), operation of the substrate conveyance path (13) is immediately halted.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: October 8, 2013
    Assignee: Panasonic Corporation
    Inventors: Hideki Sumi, Yoshiaki Awata
  • Patent number: 8544168
    Abstract: It is an objective to provide a part-mounting method that, even when parts are extremely small, makes it possible to mount the parts at a repair-requiring location without fail, to thus enhance a percentage of a non-defective substrate. In a part-mounting method, inspection is made as to whether or not a parts-missing location exists on a substrate Pb reloaded between a solder printer 2 and a first part-mounting machine 4A after having undergone manual repair by an operator OP, or the like, in connection with a repair-requiring location found through inspection performed after mounting of parts Pt, by use of an inspection camera 15A of a first part-mounting machine 4A. When a parts-missing location on the substrate Pb is found, the parts-missing location is identified. Subsequently, a mounting head 14A of the first part-mounting machine 4A and a mounting head 14B of a second part-mounting machine 4B mount a part Pt at the parts-missing location on the thus-identified substrate Pb.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: October 1, 2013
    Assignee: Panasonic Corporation
    Inventors: Kenichi Kaida, Kenichiro Ishimoto
  • Patent number: 8528198
    Abstract: When a component mounting process by mounting heads is executed on substrates which are positioned alternately by two substrate carrying lines, a determination is made on whether or not a mounting turn can be completed every time the mounting heads perform the mounting turn, and when it is determined that one of the mounting turns performed by the mounting head cannot be completed, a component mounting process is executed on the substrate which is positioned by the substrate carrying line which is opposite to the substrate carrying line.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: September 10, 2013
    Assignee: Panasonic Corporation
    Inventor: Kenichiro Ishimoto
  • Patent number: 8487189
    Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: July 16, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Patent number: 8448332
    Abstract: Electronic modules are transported with respect to equipment for manipulating and testing electronic modules. The transport is formed from a thin support having openings for receiving electronic modules. A locating mechanism associated with the thin support serves to locate the support relative to transport and testing equipment. A mechanism is further provided for holding the received electronic modules within the openings during transport and testing.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: May 28, 2013
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Philippe Planelle, Rene Monnet
  • Patent number: 8438725
    Abstract: A mounting apparatus mounts a component (A) on a board (W). The mounting apparatus is provided with a head unit (40) wherein a plurality of heads (41) for picking up components (A) are arranged in a prescribed direction, a head unit transfer device (4) for moving the head unit (40), a board imaging camera (21) (board imaging device) disposed on the head unit (40) for capturing an image of the board (W), and a camera moving device (25) (imaging device moving device) which moves the board imaging camera (21) relative to the head unit (40) in the arrangement direction of the heads (41).
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: May 14, 2013
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventor: Tomoyoshi Utsumi
  • Patent number: 8429809
    Abstract: A method for manufacturing a mirror device is presented. The method includes forming a mirror from a first substrate and forming a hinge/support structure from a second substrate. The hinge/support structure is formed with a recessed region and a torsional hinge region. The mirror is attached to the hinge/support structure at the recessed region. Further, a driver system is employed to cause the mirror to pivot about the torsional hinge region.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: April 30, 2013
    Assignee: Texas Instruments Incorporated
    Inventor: John W. Orcutt
  • Patent number: 8414976
    Abstract: Provided is a method for disposing a component on a substrate (100), the method comprising steps of: a step (a) of preparing the substrate (100), a first liquid, and a component-dispersing liquid; a step (b) of applying the first liquid to the substrate (100) along the +X direction continuously to dispose the first liquid on hydrophilic lines (112) and hydrophilic body regions (111) along the +X direction alternately; a step (c) of bringing the component-dispersing liquid in contact with the first liquid disposed on the hydrophilic region (111); and a step (d) of removing the first liquid and the second liquid from the substrate (100) to dispose the component on the hydrophilic region (111).
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: April 9, 2013
    Assignee: Panasonic Corporation
    Inventor: Hidekazu Arase
  • Patent number: 8402647
    Abstract: Methods of manufacturing light panels having at least one re-entrant turning feature. In one embodiment, a method of manufacturing a light panel includes providing a base layer, providing a cover layer, and coupling the cover layer to the base layer to form at least one re-entrant turning feature between the base layer and the cover layer. In another embodiment, a method of manufacturing a light panel includes providing a base layer, forming at least one receiving space in the base layer, providing at least one prismatic block, and coupling at least a portion of the prismatic block into the receiving space such that re-entrant turning features are formed between the prismatic block and the base layer.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: March 26, 2013
    Assignee: Qualcomm Mems Technologies Inc.
    Inventors: Clarence Chui, Gaurav Sethi, Jonathan Charles Griffiths, Manish Kothari
  • Patent number: 8399986
    Abstract: A method of positioning at least 2 chips simultaneously on a substrate by parallel stochastic assembly in a first liquid is disclosed. In one aspect, the chips are directed to target sites on the substrate within the first liquid. The target sites are covered with a second liquid. The second liquid and the first liquid are immiscible. The chips are attracting the first liquid. A predetermined surface is chosen or treated on each chip such that it is selectively attracted by the second liquid and attracting the first liquid.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: March 19, 2013
    Assignees: IMEC, Katholieke Universiteit Leuven
    Inventors: Massimo Mastrangeli, Caroline Whelan, Wouter Ruythooren
  • Patent number: 8393076
    Abstract: A component is electrically connected to an electrical circuit by a method that comprises forming an intermediate product in which the component (3) is disposed on one side of an electrically conducting sheet (1) so that at least one pair of contacts (4) of the component are electrically connected by the sheet and in which a patterned etch resist layer (2) is disposed on the other side of the sheet in registration with the component on said one side of the sheet, and then exposing the other side of the sheet to an etching agent and thereby removing areas of the sheet to leave the electrical circuit and also to remove the electrical interconnection between the contacts.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: March 12, 2013
    Assignee: Conductive Inkjet Technology Limited
    Inventor: Philip Gareth Bentley
  • Patent number: RE44384
    Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: July 23, 2013
    Assignee: Panasonic Corporation
    Inventors: Masato Hirano, Yoshinori Sakai, Tateo Nakashima