Assembling To Base An Electrical Component, E.g., Capacitor, Etc. Patents (Class 29/832)
  • Patent number: 11135690
    Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by coupling a base of the cartridge to a carriage that is transported via a track. The track transports the carriages between various substations at which one or more parts are added to the base. The carriage may be lifted from the track by a lifter mechanism at each substation in order to perform assembly operations on the base. An inspection system may inspect the cartridges at various stages of completion at or between the various substations.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: October 5, 2021
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Quentin Paul Guenther, Jr., Johnny Keith Cagigas, William Robert Collett, Lawrence P. Balash, Scott Lee Brady, Ronnie Dean Dover, John Scott Gerow, Don Edward Green, John Matthew Odel, Christopher M. Spencer, Vernon L. Steiner, David James Thierauf, Louis Wade Wacker, Byron Joseph Williams
  • Patent number: 11127710
    Abstract: A transfer method includes steps of a) supplying a support layer having a first face, structures being assembled by their front face on the first face, and c) transferring the structures onto a host face of a host substrate. The support layer includes folding regions, between the structures, adapted to pass from a folded state to an unfolded state under the action of an external excitation. Between steps a) and c), a step b) is included of executing the external action in such a way as to make the folding regions pass from the folded state to the unfolded state such that the spacing between the structures varies.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: September 21, 2021
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Lamine Benaissa, Ismail Degirmencioglu
  • Patent number: 11116121
    Abstract: A mounting target working device includes a head unit, a first mounting target work area in which the head unit mounts a component on a first mounting target having a flat plate shape, and a second mounting target work area in which the head unit mounts the component on a second mounting target having a three-dimensional shape as compared with the first mounting target.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: September 7, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Akira Kishida, Tomoyuki Nozue
  • Patent number: 11109521
    Abstract: A production management system of a component mounting line that includes component mounters that identify a board ID of a circuit board conveyed during production, send the board ID to a production management computer of the production management system, measure actual data for early-stage-discovery of a mounting defect at a specified interval during production, and send the measurement results to the production management computer. The production management computer saves the board IDs sent from each of the component mounters with a time stamp, monitors whether there is a possibility of a mounting defect based on the measurement result, extracts board IDs of circuit boards on which components were mounted at the component mounters since the previous time measurement was performed if there is the possibility of a mounting defect, and displays a list of the circuit boards with a possible mounting defect.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: August 31, 2021
    Assignee: FUJI CORPORATION
    Inventor: Hideyuki Yamaguchi
  • Patent number: 11099606
    Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Ho Shin, Ju Ho Kim
  • Patent number: 11075132
    Abstract: An integrated fan-out package includes a first redistribution structure, a die, an encapsulant, a plurality of conductive structures, and a second redistribution structure. The first redistribution structure has a first surface and a second surface opposite to the first surface. The die is disposed over the first surface of the first redistribution structure and is electrically connected to the first redistribution structure. The encapsulant encapsulates the die. The conductive structures are disposed on the first surface of the first redistribution structure and penetrates the encapsulant. The conductive structures surround the die. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 27, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang
  • Patent number: 11070171
    Abstract: Apparatus and methods for biasing power amplifiers are provided herein. In certain embodiments, a power amplifier includes a bipolar transistor having a base biased by a bias network having a reactance that controls an impedance at the transistor base to achieve substantially flat phase response over large dynamic power levels. For example, the bias network can have a frequency response, such as a high-pass or band-pass response, that reduces the impact of power level on phase distortion (AM/PM).
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: July 20, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Kunal Datta, Khaled A. Fayed, Edward James Anthony, Srivatsan Jayaraman, Jinghang Feng
  • Patent number: 11054695
    Abstract: A chip-mounted board including: micro light-emitting chips arranged in a matrix pattern in a light-emitting region; and a conductive line electrically connected to the micro light-emitting chips, the light-emitting region including a first region having a first luminance, a second region having a second luminance lower than the first luminance, and a third region having a third luminance lower than the first luminance and higher than the second luminance, the luminances being values determined with the same magnitude of current supplied to the micro light-emitting chips, the third region being positioned between the first region and the second region and satisfying the following formulas (1) and (2): (1+k)/(1?k)?63.895×tan(0.5°)×500/W+6.0525??(1) L2=k×L1??(2) wherein L1 represents the first luminance, L2 represents the second luminance, and W represents a width (unit: mm) of the third region.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: July 6, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Taimi Oketani, Atsushi Ban, Yasuhisa Itoh, Takeshi Ishida
  • Patent number: 11056089
    Abstract: A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact is connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 ?m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 6, 2021
    Assignee: Sparton DeLeon Springs, LLC
    Inventor: Lendon L. Bendix
  • Patent number: 11044841
    Abstract: A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: June 22, 2021
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventors: Charles Andrew Coots, Michael Joseph Kane
  • Patent number: 10999935
    Abstract: A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: May 4, 2021
    Assignee: Unimicron Technology Corp.
    Inventor: Shih-Lian Cheng
  • Patent number: 10975469
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 13, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Patent number: 10966360
    Abstract: An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Shin Choi, Seul-Ki Han, Myoun-Kyu Kang, Ki-Bong Mun, Du-San Baek
  • Patent number: 10959361
    Abstract: Movable section of a cut and clinch unit includes exchange section in which is formed second insertion hole for cutting and bending a lead, and main body section to which exchange section is removably attached. An opening position of the second insertion hole is calculated as an attachment position of the exchange section on the main body section based on image data. It is determined whether a difference between the calculated opening position and a standard position of the second insertion hole that is set in advance exceeds a threshold value. If the difference between the calculated opening position and the standard position exceeds the threshold value, calibration is performed based on the assumption that the exchange section has been exchanged.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: March 23, 2021
    Assignee: FUJI CORPORATION
    Inventor: Yusuke Nakanishi
  • Patent number: 10919211
    Abstract: A method of manufacturing a display device includes bending a first film member of a processing object such that a part of one side of the first film member surrounds a part of an outer side of a bending area of a second film member of the processing object while the first film member is laminated on the second film member.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: February 16, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Myung Gil Choi, Jung Min Lee, Sang Moo Lee, Sae Sam Jang
  • Patent number: 10912468
    Abstract: A pulse measuring device of the disclosure includes a housing, a light-emitting device, a light-receiving device, and a light guide body having a first end surface facing the light-emitting device, a second end surface facing the first end surface and facing the light-receiving device, one or a plurality of first side surfaces covered by the housing, and one or a plurality of second side surfaces exposed from the housing.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: February 9, 2021
    Assignee: SONY CORPORATION
    Inventors: Tomoya Ikuta, Atsushi Ito
  • Patent number: 10900859
    Abstract: A conductive fluid sensor cable capable of manufacture in long lengths comprising a flexible substrate, a pair of conductors, and a cover material arranged to allow a conductive fluid path between the conductors when conductive fluid contacts the cable.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: January 26, 2021
    Assignee: PICA Product Development, LLC
    Inventors: Richard Shevelow, Scott Stapleford, Patrick Walsh
  • Patent number: 10886231
    Abstract: A method includes encapsulating a device die in an encapsulating material, planarizing the device die and the encapsulating material, and forming a first plurality of conductive features electrically coupling to the device die. The step of forming the first plurality of conductive features includes a deposition-and-etching process, which includes depositing a blanket copper-containing layer, forming a patterned photo resist over the blanket copper-containing layer, and etching the blanket copper-containing layer to transfer patterns of the patterned photo resist into the blanket copper-containing layer.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: January 5, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jui Kuo, Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu
  • Patent number: 10883006
    Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: January 5, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Keiko Chiba, Toshiki Ito, Timothy Brian Stachowiak, Niyaz Khusnatdinov, Weijun Liu
  • Patent number: 10882147
    Abstract: Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: January 5, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Andrew Potter, Daniel W Tower, James Schulze, John Grady, Sunil Ganta, Chong Tan
  • Patent number: 10874041
    Abstract: A power supply control device that controls consumption currents that are supplied from power supply devices in a component supply device in which multiple tape feeders are replaceably installed, the device including: a total consumption current measuring section that obtains, based on measurement, a total consumption current by adding actual consumption currents which are supplied to a plurality of tape feeders; and an overcurrent protection section that causes a specific tape feeder, which is in an operation state, to transition to a stop state or a standby state, in a case of an overcurrent state where the total consumption current exceeds an output current capacity of the power supply device. Accordingly, even though the overcurrent state occurs during setup changing work in which the multiple tape feeders can operate, the overcurrent state is rapidly canceled, and thus a protecting function is improved.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: December 22, 2020
    Assignee: FUJI CORPORATION
    Inventors: Kazuya Matsuyama, Yoshiyuki Fukaya, Hisato Sawanami
  • Patent number: 10863903
    Abstract: A system and method for remotely monitoring Inter Ocular Pressure (IOP) is disclosed. The system and method verify proper operation of glaucoma drainage, measure and potentially affect Intra-Ocular Pressure (IOP), and facilitate remote disease management of e.g. glaucoma, among other ocular diseases.
    Type: Grant
    Filed: June 17, 2018
    Date of Patent: December 15, 2020
    Assignee: ADVANCED OPHTHALMICS LLC
    Inventors: John Naber, Doug Jackson, Rich Eiferman
  • Patent number: 10851954
    Abstract: A process for manufacturing a silica gel extruded soft lamp strip, comprises the following steps: a. pasting LED beads and other components on an FPC soft board, and performing reflow soldering; b. soldering the FPC soft board into a lengthened FPC soft board in a lead-free manual soldering manner; c. performing aging impact on the lengthened FPC soft board; d. performing pre-extrusion processing on the FPC soft board which is qualified after aging impact; e: extruding the FPC board using a solid silica gel mixture in combination with an extrusion mold, and then curing using a baking oven; and f. clipping from a connection plate position of a semi-finished product from the step e, and installing a plug so as to complete processing. The process can effectively ensure water-proof and moisture-proof properties, luminance uniformity and color temperature consistency of the LED soft lamp strip, and has a high practical value.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: December 1, 2020
    Inventor: Zhongxun Li
  • Patent number: 10855146
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: December 1, 2020
    Assignee: ITT Manufacturing Enterprises LLC
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J. F. Tighe
  • Patent number: 10849261
    Abstract: A surface mounter for mounting an electronic component on a printed circuit board includes a stage, a mounter, a camera, a mark, and a controller. The mounter is movable in a plane direction of the stage and mounts the electronic component on the printed circuit board. The camera is on the stage or mounter, and the mark is on the other of the stage or mounter. The controller executes processing to capture images of the mark at multiple positions in a field of view of the camera and perform image recognition; calculate correction values for correcting recognition errors at the recognition positions based on recognition of the mark; capture an image of the printed circuit board or the electronic component by the camera and perform image recognition; and correct results of the recognition of the printed circuit board or the electronic component based on the correction values.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: November 24, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Yasuhiro Suzuki, Junji Yamaguchi
  • Patent number: 10820437
    Abstract: The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: October 27, 2020
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne, Albert S. Lopez, Joshua D. Heppner, Srinivas V. Pietambaram, Shawna M. Liff, Nadine L. Dabby
  • Patent number: 10784226
    Abstract: A semiconductor device includes an insulative substrate, a wiring pattern, a bonding portion, and a semiconductor element. The wiring pattern is formed on an upper surface of the insulative substrate. The bonding portion is formed on an upper surface of the wiring pattern. The semiconductor element includes an electrode pad connected to an upper surface of the bonding portion. The bonding portion includes first sintered layers distributed in the bonding portion and a second sintered layer having a density differing from each of the first sintered layers and surrounding the first sintered layer.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: September 22, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kei Murayama
  • Patent number: 10764992
    Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: September 1, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Yong-Chao Wei, Lin-Jie Gao, Han-Pei Huang
  • Patent number: 10765051
    Abstract: When performing inspection of a tip of a suction nozzle, the tip of the suction nozzle is imaged, and an opening of the tip of the suction nozzle is identified based on the image data. With the image based on the image data, locations with less than a set brightness level inside a location with the set brightness level and greater is identified as the opening. The identified opening is divided into four regions by boundary lines, and the area of the opening is calculated for each of the regions. Based on the areas calculated for each region, it is determined whether the suction nozzle is good. By determining whether the suction nozzle is good based on the area of the opening for each region, it is possible to reliably determine whether the suction nozzle is good.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: September 1, 2020
    Assignee: FUJI CORPORATION
    Inventors: Hideki Hosaka, Kazumi Hoshikawa
  • Patent number: 10745805
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may comprise a solid solution of Y2O3—ZrO2 and may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Patent number: 10744750
    Abstract: A selective transfer roll stamp is provided which rotates on a source substrate to selectively transfer elements arranged on the source substrate. The selective transfer roller stamp includes: a roller unit rotating about an axis of rotation and including projecting portions protruding in a radial direction and recessed portions formed between neighboring projecting portions; and an adhesive layer formed on the outer circumferential surface of the roller unit and coming into contact with the elements, wherein the outer circumferential surface of the adhesive layer is made flat in a circumferential direction.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: August 18, 2020
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Kwangseop Kim, Chan Kim, Bongkyun Jang, Jae-Hyun Kim, Seung-Mo Lee, Yun Hwangbo
  • Patent number: 10721847
    Abstract: A nozzle management device includes a plurality of pallets, each of the pallets configured to house a plurality of nozzles; a pallet storage device configured to store the pallets; and a pallet moving device configured to move the pallets.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: July 21, 2020
    Assignee: FUJI CORPORATION
    Inventors: Kazumi Hoshikawa, Kenji Shimosaka, Tadakatsu Ibe
  • Patent number: 10716250
    Abstract: A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: July 14, 2020
    Assignee: FUJI CORPORATION
    Inventors: Takeshi Fujishiro, Koji Kawaguchi, Mitsuru Sanji, Kohei Sugihara
  • Patent number: 10667448
    Abstract: An electronic component mounting method for mounting a first board and a second board including, mounting a first set of electronic components on the first board allocated to first mounting heads; and mounting a second set of electronic components on the second board allocated to the second mounting heads and to the first mounting heads and the second mounting heads of the second lane dedicated mounters. By this, the mounting load is spread evenly across all the mounting heads, thus the idle time of mounting heads is reduced, improving the operating rate, meaning that panels are produced efficiently by the electronic component mounting method.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: May 26, 2020
    Assignee: FUJI CORPORATION
    Inventors: Yoshihiro Yasui, Marie Terazawa
  • Patent number: 10661641
    Abstract: A cover for a vehicle roof, which may have a pane, an anti-splinter layer arranged on the inside face of the pane, and a lighting device having a luminous layer, wherein the luminous and anti-splinter layer forms both the anti-splinter layer and the luminous layer in this one layer and in particular the lighting device contains at least one luminous unit, which is designed to radiate light into the luminous and anti-splinter layer at a lateral edge region of the luminous and anti-splinter layer.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: May 26, 2020
    Assignee: WEBASTO SE
    Inventors: Johannes Thannheimer, Steffen Lorenz, Hubert Böhm, Thomas Schütt
  • Patent number: 10651604
    Abstract: A connector is equipped with a housing capable of being fitted in a mating connector which houses a plurality of mating terminals connected to each other electrically and a holder which is attached to the housing. The housing has a plurality of terminal housing rooms which house a plurality of terminals. The holder has a plurality of noise reduction member holding rooms which hold a plurality of noise reduction members each of which reduces noise occurring in a corresponding one of the plurality of terminals housed in the plurality of terminal housing rooms, in such a manner that the plurality of noise reduction members are disposed adjacent to front end surfaces of corresponding ones of the plurality of terminals in a state that attachment of the holder to the housing is completed.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: May 12, 2020
    Assignee: YAZAKI CORPORATION
    Inventor: Masashi Tsukamoto
  • Patent number: 10629545
    Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 21, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Pai-Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang
  • Patent number: 10630027
    Abstract: A connector is equipped with a housing capable of being fitted in a mating housing of a mating connector, a plurality of terminals which are held by the housing and electrically connected to each other, and a noise reduction member which is held in the housing so as to reduce noise occurring in the terminals. The noise reduction member is disposed at at least one of the plurality of terminals, and is not disposed at at least one of the remaining terminals of the plurality of terminals. The noise reduction member is made of a material containing ferrite.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: April 21, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Masashi Tsukamoto, Takashi Odajima, Yasuyuki Saito, Hiroaki Ito
  • Patent number: 10594092
    Abstract: A connector module adapted for a set-top box including a shielding case, a first connector disposed outside of the shielding case, an annular capacitor disposed between the first connector and the shielding case, and at least one ferrite core disposed in the shielding case and generating mutual inductance by coupling the shielding case is provided. The first connector being connected to a peripheral cable has a transmission cable penetrating into the shielding case. The annular capacitor is electrically connected between a grounding layer of the transmission cable and a grounding of a first circuit board of the set-top box. The transmission cable is connected to a second connector of the first circuit board after entering the shielding case and penetrating the ferrite core. A high frequency signal from the peripheral cable is transmitted to the first circuit board via the first connector, the transmission cable, and the second connector.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: March 17, 2020
    Assignee: Kinpo Electronics, Inc.
    Inventor: Ming-Tsung Hsu
  • Patent number: 10566837
    Abstract: An electric power supply device for supplying electric power from a supply side device to a receiver side device including a mechanism section that operates intermittently with a drive voltage and a receiver side control section that controls an operation of the mechanism section with a control voltage that is lower than the drive voltage, the electric power supply device including: a regulator section, which is provided on the receiver side device, that converts a received voltage received via an electric power supply into the control voltage; a supply voltage adjusting section, which is provided on the supply side device, that adjustably supplies the received voltage; and a supply side control section, which is provided on the supply side device, that controls the received voltage by controlling the supply voltage adjusting section.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: February 18, 2020
    Assignee: FUJI CORPORATION
    Inventors: Shinji Takikawa, Masaru Saito
  • Patent number: 10568219
    Abstract: The present invention provides an electronic control device including: a housing which has an opening portion formed at one side thereof; printed circuit boards which are inserted into the housing; and a connector unit which includes connector pins coupled to the printed circuit boards and closes the opening portion of the housing, in which the printed circuit boards include a first printed circuit board, and a second printed circuit board which is connected to one side of the first printed circuit board through a substrate connecting portion and provided below the first printed circuit board, the connector unit includes a first connector pin connected to the first printed circuit board and a second connector pin connected to the second printed circuit board, and an outer connector cover of the connector unit is disposed to be directed upward.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: February 18, 2020
    Assignee: HYUNDAI AUTRON CO., LTD.
    Inventor: Man Ho Seok
  • Patent number: 10555450
    Abstract: In rotary head type component mounter, provided at two locations around rotary head are Z1-axis drive mechanism and Z2-axis drive mechanism that lower suction nozzles, and in a case in which the interval between two suction nozzles is a multiple two times or greater than the arrangement pitch of components in tray, component mounter performs consecutive simultaneous pickup operation repeatedly for a quantity corresponding to the quantity of component arrangement pitches between the two suction nozzles, the consecutive simultaneous pickup operation being that of lowering the two suction nozzles simultaneously such that two of the components on tray are picked up simultaneously, then rotating rotary head by one nozzle pitch, moving rotary head in the arrangement direction of the components on tray by one component arrangement pitch, and then lowering the next two suction nozzles simultaneously such that another two of the components on tray are picked up simultaneously.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: February 4, 2020
    Assignee: FUJI CORPORATION
    Inventors: Jun Iisaka, Hidetoshi Ito
  • Patent number: 10555023
    Abstract: Techniques are described that enable personalized recap clip sequences.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: February 4, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Shaun Patrick McCarthy, Yaron Sole, Trevor James Walker, Arun Velayudhan Pillai, Venkatraman Prabhu
  • Patent number: 10522484
    Abstract: A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post. The thin film capacitor includes a reference hole extending through the thin film capacitor in a thickness-wise direction. The post is inserted through the reference hole.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: December 31, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Keigo Sato
  • Patent number: 10477749
    Abstract: An electronic component mounting machine includes: a mounting head that mounts electronic components onto a circuit board; a tape feeder which feeds a first tape material that accommodates a plurality of electronic components to the mounting head; a counting device which counts the number of electronic components remaining in the first tape material by subtracting the number of consumed electronic components which corresponds to an operating amount of the electronic component mounting machine from an initial value of the number of the electronic components accommodated in the first tape material; a detection device which detects a splice portion that joins a starting end of a second tape material to a tail end of the first tape material; and a determining device which determines whether or not a count value obtained by the counting device is within a predetermined normal range when the detection device detects the splice portion.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: November 12, 2019
    Assignee: FUJI CORPORATION
    Inventor: Daisuke Kato
  • Patent number: 10462921
    Abstract: One aspect relates to a method for producing an electronic module assembly. According to the method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly has at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature. Embodiments of the electronic module assembly are also described.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: October 29, 2019
    Assignee: Infineon Technologies AG
    Inventor: Reinhold Bayerer
  • Patent number: 10462913
    Abstract: A method for manufacturing an electronic device and the electronic device therefor are provided. The electronic device includes a substantially enclosed window including a front surface, a rear surface and a side surface surrounding at least a portion of a space between the front surface and the rear surface, a display disposed inside the window, and a display bracket, to which the display is coupled and disposed inside the window. The display is coupled to the window by curing a bonding member inserted between the window and the display.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: October 29, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Su Jung, Yong Seok Lee
  • Patent number: 10448549
    Abstract: A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state, each of the plurality of stick cases being capable of accommodating a plurality of electronic components, each of the plurality of stick cases having an opening in an end portion in a longitudinal direction; a component transporter moving one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; and a stick case detector detecting presence or absence of one or more stick cases in the loader.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: October 15, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryouji Eguchi, Shuuichi Kubota, Takashi Tamura, Seiichi Matsuo
  • Patent number: 10440844
    Abstract: A circuit board assembly for a control unit of a motor vehicle has a multi-layer circuit board and a plug connector with a housing faceplate. The circuit board, which includes conductor paths for conducting signals, has a first section, a second section, and a flexible third section with a lower stiffness between the first and second sections. The first section encloses an angle ? with the second section. The plug connector has a multiplicity of connection elements, each with an attachment part and a contact pin. The housing faceplate has first and second side panels each enclosing an angle ? with the first panel central plane and an angle ? with the second panel central plane. A first detent element prevents a change in the angle ? in a first direction of rotation. A second detent element prevents a change in the angle ? in a second direction of rotation.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: October 8, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Detlev Bagung, Christian Pump
  • Patent number: 10420262
    Abstract: Provided is a feeder management device that appropriately controls editing of management information related to feeders so as to prevent electronic components of an incorrect type being supplied. The feeder management device includes: a data management section including management data in which a component type of an electronic component loaded on each of the feeders is linked to an identification code that specifies each of the multiple feeders; and an editing control section configured to determine whether editing is allowable based on a loading state of the electronic component on the feeder in a case in which editing of the management information is attempted to be performed in accordance with a change to the component type linked to the identification code of the feeder.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: September 17, 2019
    Assignee: FUJI CORPORATION
    Inventors: Kazuhito Horaguchi, Jo Ikeyama, Yuki Fujimura, Koushi Kuno