Assembling To Base An Electrical Component, E.g., Capacitor, Etc. Patents (Class 29/832)
  • Patent number: 11456275
    Abstract: A semiconductor device includes an insulated circuit board in which a metal layer is formed on one surface of an insulating board and a semiconductor element having a polygonal shape when viewed in a plan view that is bonded to the metal layer via a bonding material. The metal layer of the insulated circuit board has a recess that exposes the insulating board at a position corresponding to at least one corner of the semiconductor element.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: September 27, 2022
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kazuo Enomoto
  • Patent number: 11454660
    Abstract: A measurement device to automatically measure an electrical characteristic of a component is mounted on a mounter for mounting a component on a circuit board. The measurement device includes a main body, a loading stand on which a component is placed, a pair of measuring elements provided in such a manner as to move towards and away from each other, and a loading stand moving device for moving the loading stand. The loading stand moving device includes a guide rail provided on the main body, and the loading stand is held movably onto the guide rail. This configuration enables an electrical charge stored in a component held onto the loading stand and an electrical charge stored in the loading stand to be removed well by way of the guide rail and the main body. As a result, an electrical characteristic held by the component can be measured stably.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: September 27, 2022
    Assignee: FUJI CORPORATION
    Inventors: Toshihiko Sasaki, Toshiyuki Sawada
  • Patent number: 11432450
    Abstract: A component determination system for determining, in a case when a first component to be mounted on a board by a first mounting operation and a second component mounted on the board by a second mounting operation have a particular corresponding relationship, whether a combination of the first component and the second component mounted is permissible, the component determination system including: a first characteristic information acquiring section configured to acquire first characteristic information of the first component for which the first mounting operation has been completed; a second characteristic information acquiring section configured to acquire second characteristic information of the second component prepared prior to the second mounting operation; and a combination determining section configured to determine whether to allow the combination of the first component and the second component based on the acquired first characteristic information and the acquired second characteristic information.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: August 30, 2022
    Assignee: FUJI CORPORATION
    Inventor: Teruyuki Ohashi
  • Patent number: 11431080
    Abstract: A radio communication module of the invention includes: a mounting substrate having a first surface and a second surface; an antenna substrate mounted on the first surface; and an IC package that is mounted on the second surface and includes an RFIC. The mounting substrate includes a heat-dissipation via hole penetrating through the mounting substrate and extending between the first surface and the second surface, a heat dissipation pattern formed on the first surface and is connected to the heat-dissipation via hole, and a non-heat-dissipation via hole transmitting an electrical signal or electrical current, which are formed on thereon. In a plan view when viewed from the thickness direction of the mounting substrate, the heat-dissipation via hole is connected to the RFIC at a position at which the heat-dissipation via hole overlaps with the RFIC, and the heat dissipation pattern extends to an outside of the antenna substrate.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: August 30, 2022
    Assignee: FUJIKURA LTD.
    Inventor: Michikazu Tomita
  • Patent number: 11412648
    Abstract: A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 9, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hidenori Goto, Ryohei Kamio, Kota Niwa, Kohei Sugihara
  • Patent number: 11412651
    Abstract: A control device is used for a mounting device with a mounting head including at least a first holder on which a first pickup member is installed, and a second holder on which a second pickup member is installed, and configured to pick up components supplied from a component supply section and mount the components. The control device includes a control section configured to acquire a first deviation amount of a tip of the first pickup member and a second deviation amount of a tip of the second pickup member and select a combination of the pickup members in which an interval between the tips of the pickup members that is obtained based on the first deviation amount and the second deviation amount falls within a predetermined range.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: August 9, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hideya Kuroda
  • Patent number: 11410897
    Abstract: A semiconductor structure includes a circuit carrier, a dielectric layer, a conductive terminal, a semiconductor die, and an insulating encapsulation. The circuit carrier includes a first surface and a second surface opposite to each other, a sidewall connected to the first and second surfaces, and an edge between the second surface and the sidewall. The dielectric layer is disposed on the second surface of the circuit carrier and extends to at least cover the edge of the circuit carrier. The conductive terminal is disposed on and partially embedded in the dielectric layer to be connected to the circuit carrier. The semiconductor die encapsulated by the insulating encapsulation is disposed on the first surface of the circuit carrier and electrically coupled to the conductive terminal through the circuit carrier.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11395449
    Abstract: The three-dimensional mounting device includes a supporting section capable of fixing a processing target, an application section for applying a viscous fluid to the processing target, a mounting section for arranging a component on the processing target, an imaging section for imaging the processing target, and a control section for controlling the processing section including the supporting section, the application section, the mounting section, and the imaging section. One or more of the supporting section, the application section, the mounting section, and the imaging section has multiple tilt axes and is capable of tilting the processing target and/or the processing section in multiple directions. The control section performs coordinate correction using the circuit pattern on the forming surface as a reference position, and arranges the component on the mounting section.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 19, 2022
    Assignee: FUJI CORPORATION
    Inventor: Noriaki Iwaki
  • Patent number: 11388849
    Abstract: A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: July 12, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Kawai, Jun Iisaka, Hidetoshi Ito
  • Patent number: 11373975
    Abstract: An electronic component mounting device (100) bonds a semiconductor die (150) to a substrate by thermocompression bonding, and seals, using an insulating resin, a gap between the semiconductor die (150) and the substrate. The electronic component mounting device is provided with: a film cutting mechanism (200) for cutting a long film (210) into cut pieces; and a mounting tool (110), which vacuum-sucks the semiconductor die (150), and bonds the die to the substrate by thermocompression bonding. Consequently, in the electronic component mounting device (100) that moves a mounting head in the horizontal direction, adhesion of the insulating resin to the mounting tool can be suppressed.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: June 28, 2022
    Assignee: SHINKAWA LTD.
    Inventor: Kohei Seyama
  • Patent number: 11367626
    Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 21, 2022
    Assignee: TDK CORPORATION
    Inventors: Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Koichi Tsunoda, Kenichi Yoshida
  • Patent number: 11357151
    Abstract: A component mounting machine performs a mounting operation of mounting an electronic component to a board. The component mounting machine includes: multiple related operation devices each including an electrically-operated section configured to perform a related operation that is an operation related to the mounting operation, and an output section configured to output an operation signal representing a state of the electrically-operated section that is operating; and circuitry configured to limit the quantity of the related operation devices for which the electrically-operated section is in an operating state to a specified quantity or fewer based on whether there is presence of the operation signal of the multiple related operation devices.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: June 7, 2022
    Assignee: FUJI CORPORATION
    Inventors: Taro Ito, Akira Hara, Nguyen Hieu Nghia
  • Patent number: 11350550
    Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: May 31, 2022
    Assignee: FUJI CORPORATION
    Inventors: Rie Kito, Hidetoshi Kawai, Norio Hosoi, Mizuho Nozawa, Jun Iisaka, Hidetoshi Ito, Shingo Fujimura, Kenzo Ishikawa, Yusuke Yamakage
  • Patent number: 11335582
    Abstract: The present disclosure relates to a method for manufacturing a micro LED display substrate. The method may include forming an array of micro LEDs on an epitaxial wafer; transferring the array of micro LEDs on the epitaxial wafer to an adhesive layer on a surface of a transfer substrate assembly; and transferring the array of micro LEDs on the surface of the transfer substrate assembly onto corresponding pads on a driving substrate respectively.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: May 17, 2022
    Assignees: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bo Han, Jianwei Qin, Lei Lv, Dongmei Xie
  • Patent number: 11337350
    Abstract: A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: May 17, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yukihiro Yamashita, Teruyuki Ohashi
  • Patent number: 11327544
    Abstract: A memory system may include: a memory device suitable for storing data; a controller suitable for controlling the memory device; a power manager suitable for receiving external power, and supplying operation power to the memory device and the controller; and a plurality of auxiliary power circuits suitable for receiving the operation power from the power manager, storing the received power, and supplying auxiliary power to the power manager when the external power is removed. The power manager may group and manage selected auxiliary power circuits among the plurality of auxiliary power circuits as a test group, and perform a full discharge test on the selected auxiliary power circuits.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: May 10, 2022
    Assignee: SK hynix Inc.
    Inventors: Jeong-Ho Jeon, Dal-Gon Kim
  • Patent number: 11316086
    Abstract: A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: April 26, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Ronald S. Cok
  • Patent number: 11306885
    Abstract: The disclosure relates to methods for connecting encapsulated linear lighting to power, including the use of through-hole mounting into flexible encapsulated linear lighting, and the creation of overmolds to protect electrical connections. The disclosure also relates to linear luminaires having channels that accommodate overmolds and allow electrical cables to exit the encapsulated linear lighting in desired, and controllable, directions.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: April 19, 2022
    Assignee: Elemental LED, Inc.
    Inventors: Gilberto Lopez-Martinez, Brian McKay, Bernard Barcega, Robert Green
  • Patent number: 11291147
    Abstract: A component mounting system including multiple component mounting devices to collect components from feeders set at multiple feeder holding sections and mount the components on a board, the multiple feeder holding sections being provided on each of the multiple component mounting devices to removably hold the feeders; and a feeder exchanging device to move along a line along which the multiple component mounting devices are arranged and exchange feeders with respect to each of the component mounting devices. The component mounting system acquires a type and arrangement of each of the feeders set on the multiple component mounting devices, determines whether each of the feeders is set at a predetermined appropriate position, and upon determining that there is a feeder that is not set at the appropriate position, uses the feeder exchanging device to reset the feeder that is not set at the appropriate position.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: March 29, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai
  • Patent number: 11284550
    Abstract: A method and a placement machine for equipping a carrier with components.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: March 22, 2022
    Inventors: Martin Pruefer, Sylvester Demmel
  • Patent number: 11251096
    Abstract: A method for measuring overlay between an interest level and a reference level of a wafer includes applying a magnetic field to a wafer, detecting at least one residual magnetic field emitted from at least one registration marker of a first set of registration markers within the wafer, responsive to the detected one or more residual magnetic fields, determining a location of the at least one registration marker of the first set registration markers, determining a location of at least one registration marker of a second set of registration markers, and responsive to the respective determined locations of the at least one registration marker of the first set of registration markers and the at least one registration marker of the second set of registration markers, calculating a positional offset between an interest level of the wafer and a reference level of the wafer. Related methods and systems are also disclosed.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: February 15, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Nikolay A. Mirin, Robert Dembi, Richard T. Housley, Xiaosong Zhang, Jonathan D. Harms, Stephen J. Kramer
  • Patent number: 11239588
    Abstract: A card edge connector includes an elongated housing comprising opposite long walls and defining a card slot between the long walls, two rows of contacts retained in the long walls respectively and a ground member including two long plates retained in the long walls respectively. Each row of contacts includes ground contacts and signal contacts, the ground contacts comprises retaining sections retained in the housing, elastic sections extending upward from the retained sections with mating portions exposed to the card slot and leg sections extending downward from the retaining sections. Each of the ground contacts further comprises an engaging portion curved from the elastic section and touching corresponding long plate.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: February 1, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Kui Wu, Xiao-Hu Yin, Guo-Xiang Niu, Wen-Jun Tang
  • Patent number: 11229125
    Abstract: A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: January 18, 2022
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Jeffrey Spencer Pulskamp
  • Patent number: 11224151
    Abstract: A filter removal method for removing a filter held in a filter holding space provided in a tip part of a nozzle shaft in a component suction head, in which a suction nozzle is detachably attached to the tip part of the nozzle shaft, from the component suction head. The method comprises a deforming step of compressing and deforming the filter in the filter holding space, and a discharging step of discharging the compressed and deformed filter from the filter holding space.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: January 11, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yukinari Awano
  • Patent number: 11211687
    Abstract: The present disclosure provides a method making a semiconductor structure with an antenna module. The semiconductor structure includes an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module is disposed on the first surface of the antenna substrate; and a redistribution layer is disposed on the second surface of the antenna substrate. The method of making the semiconductor structure with the antenna includes fabricating the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: December 28, 2021
    Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
    Inventors: Yenheng Chen, Chengtar Wu, Jangshen Lin, Chengchung Lin
  • Patent number: 11195788
    Abstract: A method includes forming a first redistribution line, forming a polymer layer including a first portion encircling the first redistribution line and a second portion overlapping the first redistribution line, forming a pair of differential transmission lines over and contacting the polymer layer, and molding the pair of differential transmission lines in a molding compound. The molding compound includes a first portion encircling the pair of differential transmission lines, and a second portion overlapping the pair of differential transmission lines. An electrical connector is formed over and electrically coupling to the pair of differential transmission lines.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: December 7, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsun Chen, Jiun Yi Wu, Chen-Hua Yu
  • Patent number: 11177249
    Abstract: The semiconductor memory device includes: a first substrate including a peripheral circuit, first conductive contact patterns connected to the peripheral circuit, and a first upper insulating layer having grooves exposing the first conductive contact patterns; a second substrate including a memory cell array, a second upper insulating layer disposed on the memory cell array, the second upper insulating layer formed between the memory cell array and the first upper insulating layer, second conductive contact patterns protruding through the second upper insulating layer into an opening of the grooves; and conductive adhesive patterns filling the grooves to connect the second conductive contact patterns to the first conductive contact patterns.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: November 16, 2021
    Assignee: SK hynix Inc.
    Inventors: Kun Young Lee, Tae Kyung Kim
  • Patent number: 11164984
    Abstract: An interconnecting member of a solar cell panel for connecting a plurality of solar cells, can include a core layer and a solder layer formed on a surface of the core layer, in which the core layer includes a protruding portion having a peak portion extending along a longitudinal direction of the core layer, and a reflection surface having an inclined surface or a rounded portion disposed at opposite sides of the peak portion, and a width of the protruding portion increases from the peak portion towards a center of the core layer.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: November 2, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Woojoong Kang, Dongju Kang, Jangho Kim, Juseok Kim, Hyunjin Kim, Kwangkyu Song, Yihwan Jung, Yunhui Cho, Minseok Choi, Hyeonbum Jin
  • Patent number: 11160201
    Abstract: A component mounting system includes a component mounting apparatus, a data creating apparatus and a component arranging operation supporting apparatus. The component mounting apparatus mounts components on a substrate. The data creating apparatus creates component data for each component. The component arranging operation supporting apparatus includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks a component to be disposed in a position based on the component identification information. The control unit of the component arranging operation supporting apparatus performs a request for a creation of component data regarding an alternative component, and the data creating apparatus receives the request and creates the component data regarding the alternative component.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: October 26, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hideo Matsuoka
  • Patent number: 11152230
    Abstract: An apparatus and method for bonding alignment are provided. The apparatus for bonding alignment includes a press assembly and an objective lens group (105) disposed on one side of the press assembly. The press assembly includes a first chuck (103) and a rotatable second chuck (104). When support surfaces of the first and second chucks are not parallel to each other, the second chuck is rotated to make the two support surfaces parallel. A first substrate (301) is then loaded on the first chuck, and alignment marks (302) on the first substrate are observed using the objective lens group disposed on one side of the press assembly. A second substrate (501) is loaded on the second chuck, and alignment marks (502) on the second substrate are also observed with the objective lens group. Based on an observation result by the objective lens group, the two substrates are moved so that the alignment marks thereon are aligned and hence the two substrates themselves are aligned.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: October 19, 2021
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Zhi Zhu, Jianjun Zhao, Zhijun Huo
  • Patent number: 11135690
    Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by coupling a base of the cartridge to a carriage that is transported via a track. The track transports the carriages between various substations at which one or more parts are added to the base. The carriage may be lifted from the track by a lifter mechanism at each substation in order to perform assembly operations on the base. An inspection system may inspect the cartridges at various stages of completion at or between the various substations.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: October 5, 2021
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Quentin Paul Guenther, Jr., Johnny Keith Cagigas, William Robert Collett, Lawrence P. Balash, Scott Lee Brady, Ronnie Dean Dover, John Scott Gerow, Don Edward Green, John Matthew Odel, Christopher M. Spencer, Vernon L. Steiner, David James Thierauf, Louis Wade Wacker, Byron Joseph Williams
  • Patent number: 11127710
    Abstract: A transfer method includes steps of a) supplying a support layer having a first face, structures being assembled by their front face on the first face, and c) transferring the structures onto a host face of a host substrate. The support layer includes folding regions, between the structures, adapted to pass from a folded state to an unfolded state under the action of an external excitation. Between steps a) and c), a step b) is included of executing the external action in such a way as to make the folding regions pass from the folded state to the unfolded state such that the spacing between the structures varies.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: September 21, 2021
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Lamine Benaissa, Ismail Degirmencioglu
  • Patent number: 11116121
    Abstract: A mounting target working device includes a head unit, a first mounting target work area in which the head unit mounts a component on a first mounting target having a flat plate shape, and a second mounting target work area in which the head unit mounts the component on a second mounting target having a three-dimensional shape as compared with the first mounting target.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: September 7, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Akira Kishida, Tomoyuki Nozue
  • Patent number: 11109521
    Abstract: A production management system of a component mounting line that includes component mounters that identify a board ID of a circuit board conveyed during production, send the board ID to a production management computer of the production management system, measure actual data for early-stage-discovery of a mounting defect at a specified interval during production, and send the measurement results to the production management computer. The production management computer saves the board IDs sent from each of the component mounters with a time stamp, monitors whether there is a possibility of a mounting defect based on the measurement result, extracts board IDs of circuit boards on which components were mounted at the component mounters since the previous time measurement was performed if there is the possibility of a mounting defect, and displays a list of the circuit boards with a possible mounting defect.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: August 31, 2021
    Assignee: FUJI CORPORATION
    Inventor: Hideyuki Yamaguchi
  • Patent number: 11099606
    Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Ho Shin, Ju Ho Kim
  • Patent number: 11075132
    Abstract: An integrated fan-out package includes a first redistribution structure, a die, an encapsulant, a plurality of conductive structures, and a second redistribution structure. The first redistribution structure has a first surface and a second surface opposite to the first surface. The die is disposed over the first surface of the first redistribution structure and is electrically connected to the first redistribution structure. The encapsulant encapsulates the die. The conductive structures are disposed on the first surface of the first redistribution structure and penetrates the encapsulant. The conductive structures surround the die. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 27, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang
  • Patent number: 11070171
    Abstract: Apparatus and methods for biasing power amplifiers are provided herein. In certain embodiments, a power amplifier includes a bipolar transistor having a base biased by a bias network having a reactance that controls an impedance at the transistor base to achieve substantially flat phase response over large dynamic power levels. For example, the bias network can have a frequency response, such as a high-pass or band-pass response, that reduces the impact of power level on phase distortion (AM/PM).
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: July 20, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Kunal Datta, Khaled A. Fayed, Edward James Anthony, Srivatsan Jayaraman, Jinghang Feng
  • Patent number: 11054695
    Abstract: A chip-mounted board including: micro light-emitting chips arranged in a matrix pattern in a light-emitting region; and a conductive line electrically connected to the micro light-emitting chips, the light-emitting region including a first region having a first luminance, a second region having a second luminance lower than the first luminance, and a third region having a third luminance lower than the first luminance and higher than the second luminance, the luminances being values determined with the same magnitude of current supplied to the micro light-emitting chips, the third region being positioned between the first region and the second region and satisfying the following formulas (1) and (2): (1+k)/(1?k)?63.895×tan(0.5°)×500/W+6.0525??(1) L2=k×L1??(2) wherein L1 represents the first luminance, L2 represents the second luminance, and W represents a width (unit: mm) of the third region.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: July 6, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Taimi Oketani, Atsushi Ban, Yasuhisa Itoh, Takeshi Ishida
  • Patent number: 11056089
    Abstract: A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact is connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 ?m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 6, 2021
    Assignee: Sparton DeLeon Springs, LLC
    Inventor: Lendon L. Bendix
  • Patent number: 11044841
    Abstract: A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: June 22, 2021
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventors: Charles Andrew Coots, Michael Joseph Kane
  • Patent number: 10999935
    Abstract: A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: May 4, 2021
    Assignee: Unimicron Technology Corp.
    Inventor: Shih-Lian Cheng
  • Patent number: 10975469
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 13, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Patent number: 10966360
    Abstract: An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Shin Choi, Seul-Ki Han, Myoun-Kyu Kang, Ki-Bong Mun, Du-San Baek
  • Patent number: 10959361
    Abstract: Movable section of a cut and clinch unit includes exchange section in which is formed second insertion hole for cutting and bending a lead, and main body section to which exchange section is removably attached. An opening position of the second insertion hole is calculated as an attachment position of the exchange section on the main body section based on image data. It is determined whether a difference between the calculated opening position and a standard position of the second insertion hole that is set in advance exceeds a threshold value. If the difference between the calculated opening position and the standard position exceeds the threshold value, calibration is performed based on the assumption that the exchange section has been exchanged.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: March 23, 2021
    Assignee: FUJI CORPORATION
    Inventor: Yusuke Nakanishi
  • Patent number: 10919211
    Abstract: A method of manufacturing a display device includes bending a first film member of a processing object such that a part of one side of the first film member surrounds a part of an outer side of a bending area of a second film member of the processing object while the first film member is laminated on the second film member.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: February 16, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Myung Gil Choi, Jung Min Lee, Sang Moo Lee, Sae Sam Jang
  • Patent number: 10912468
    Abstract: A pulse measuring device of the disclosure includes a housing, a light-emitting device, a light-receiving device, and a light guide body having a first end surface facing the light-emitting device, a second end surface facing the first end surface and facing the light-receiving device, one or a plurality of first side surfaces covered by the housing, and one or a plurality of second side surfaces exposed from the housing.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: February 9, 2021
    Assignee: SONY CORPORATION
    Inventors: Tomoya Ikuta, Atsushi Ito
  • Patent number: 10900859
    Abstract: A conductive fluid sensor cable capable of manufacture in long lengths comprising a flexible substrate, a pair of conductors, and a cover material arranged to allow a conductive fluid path between the conductors when conductive fluid contacts the cable.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: January 26, 2021
    Assignee: PICA Product Development, LLC
    Inventors: Richard Shevelow, Scott Stapleford, Patrick Walsh
  • Patent number: 10886231
    Abstract: A method includes encapsulating a device die in an encapsulating material, planarizing the device die and the encapsulating material, and forming a first plurality of conductive features electrically coupling to the device die. The step of forming the first plurality of conductive features includes a deposition-and-etching process, which includes depositing a blanket copper-containing layer, forming a patterned photo resist over the blanket copper-containing layer, and etching the blanket copper-containing layer to transfer patterns of the patterned photo resist into the blanket copper-containing layer.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: January 5, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jui Kuo, Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu
  • Patent number: 10883006
    Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: January 5, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Keiko Chiba, Toshiki Ito, Timothy Brian Stachowiak, Niyaz Khusnatdinov, Weijun Liu
  • Patent number: 10882147
    Abstract: Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: January 5, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Andrew Potter, Daniel W Tower, James Schulze, John Grady, Sunil Ganta, Chong Tan