Assembling To Base An Electrical Component, E.g., Capacitor, Etc. Patents (Class 29/832)
  • Patent number: 12108538
    Abstract: A component type management device includes an association registration section configured to register association data in which individual identification information of a component supply device which is attached to a component mounter and supplies a component is associated with a type of the component held in the component supply device, an association discarding section configured to discard the association data in a case where a predetermined condition is satisfied after the component supply device is detached from the component mounter, a detachment discrimination section configured to discriminate whether the component supply device is detached by an automatic exchanging device; and an association maintaining section configured to invalidate a function of the association discarding section before the predetermined condition is satisfied and maintain the association data in a case of being discriminated that the component supply device is detached by the automatic exchanging device.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: October 1, 2024
    Assignee: FUJI CORPORATION
    Inventor: Mitsuru Sanji
  • Patent number: 12100648
    Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: September 24, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
  • Patent number: 12092533
    Abstract: A sensor includes a film portion deformable by external force, a support body supporting the film portion, and a magnetoresistive element portion on the film portion and including a unit element that includes a first magnetic layer whose magnetization direction changes in accordance with deformation of the film portion, a second magnetic layer whose magnetization direction is fixed, and an intermediate layer between the first and second magnetic layers. The film portion includes a first side portion in a portion of an outer edge of the film portion. A slit portion is provided in the film portion and includes at least a portion along the first side portion, so that the film portion includes a connection portion in which the first side portion is partially connected to the support body. A magnetoresistive element portion is provided in the connection portion.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: September 17, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masashi Kubota, Ville Kaajakari, Masaki Takeuchi
  • Patent number: 12096560
    Abstract: A substrate module includes: a substrate having top and bottom surfaces and comprising, at the top surface, a plurality of first wiring regions and a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions; one or more power receiving devices disposed on the plurality of first wiring regions; a first connection component disposed on the plurality of second wiring regions, wherein the first connection component has opposite ends in a first direction; and a protected component disposed on the top surface of the substrate. In a top plan view, (i) the protected component is located between two straight lines passing through the respective opposite ends of the first connection component and extending in a second direction perpendicular to the first direction, and (ii) the protected component is located between the one or more power receiving devices and the first connection component.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: September 17, 2024
    Assignee: NICHIA CORPORATION
    Inventor: Kazuma Kozuru
  • Patent number: 12075568
    Abstract: An allowable value setting device sets an allowable value of a deviation amount between a target pickup position and an actual pickup position in a component when the component is picked up by a suction nozzle. The allowable value setting device includes a first setting section and a second setting section. The first setting section sets a first allowable value, which is the allowable value for each component type of the component to be mounted on a board. The second setting section sets a second allowable value, which is the allowable value that is set for each mounting coordinate of the component and smaller than the first allowable value of the component of the same component type set by the first setting section, the second allowable value being preferentially adopted over the first allowable value in a suction process of the component.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: August 27, 2024
    Assignee: FUJI CORPORATION
    Inventor: Takanori Takagi
  • Patent number: 12058838
    Abstract: An energy management unit (EMU) is disclosed. The EMU including: a cold plate sandwiched between a first printed circuit board (PCB) and a second PCB, the cold plate comprising one or more magnetics; wherein the cold plate is configured to cool both the first PCB and the second PCB.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: August 6, 2024
    Assignee: Ford Global Technologies LLC
    Inventors: Michael Hibbard, Areg Parlakyan, Gary Randall
  • Patent number: 12051547
    Abstract: A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.
    Type: Grant
    Filed: March 22, 2023
    Date of Patent: July 30, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuichiro Tanaka, Hiroki Awata
  • Patent number: 12035029
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: July 9, 2024
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka
  • Patent number: 11999249
    Abstract: A battery charger for vehicles comprises one outer container, an electronic board housed inside the container, operatively connectable to an electric battery of a vehicle and configured for the recharge of the battery, at least an electric component connected to the electronic board, and at least a support for housing the electric component, in which the support comprises an electric connection device/unit/component between the electric component and the electronic board.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: June 4, 2024
    Assignee: META SYSTEM S.p.A.
    Inventor: Giuseppe Simonazzi
  • Patent number: 11955933
    Abstract: A high-frequency module and a communication device capable of suppressing deterioration of a noise figure of a low-noise amplifier are provided. A high-frequency module (1) includes a mounting substrate (2), a low-noise amplifier (12), an input switch (20), and a matching circuit (30). The input switch (20) is connected to an input terminal of the low-noise amplifier (12). The matching circuit (30) performs impedance matching between the input switch (20) and the low-noise amplifier (12). The matching circuit (30) is disposed on a first main surface (21) in a first direction (Dl) of the mounting substrate (2). The input switch (20) and the low-noise amplifier (12) are disposed on a second main surface (22) opposed to the first main surface (21). When the mounting substrate (2) is viewed in plan, the input switch (20) overlaps at least a part of the matching circuit (30).
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: April 9, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Horita
  • Patent number: 11948899
    Abstract: A semiconductor substrate structure including a first group of circuit structure and a second group of circuit structure is provided. The first group of circuit structure includes multiple first wiring layers and multiple first conductive connectors, and each of the first conductive connectors includes a conductive cap. The second group of circuit structure includes multiple second wiring layers and multiple second conductive connectors. The first group of circuit structure and the second group of circuit structure are electrically connected through bonding of the first conductive connectors and the second conductive connectors to form a multilayer redistribution structure. A manufacturing method of the semiconductor substrate structure is also provided.
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: April 2, 2024
    Inventor: Dyi-Chung Hu
  • Patent number: 11950370
    Abstract: An information processing device is used in a mounting system that performs processing of mounting a component on a mounting target. The information processing device includes: a memory section configured to store multiple pieces of abutting part data including a shape of an abutting part that abuts against the component, multiple pieces of attachment part data including a shape of an attachment part to be attached to an attachment section to which a collection member for collecting the component is attached, and multiple pieces of connection part data including a shape of a connection part that connects the abutting part and the attachment part, in the collection member; and a control section configured to output one or more of the abutting part data, the attachment part data, and the connection part data stored in the memory section.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 2, 2024
    Assignee: FUJI CORPORATION
    Inventors: Hiroko Tokunaga, Mitsuru Sanji
  • Patent number: 11924974
    Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: March 5, 2024
    Assignee: BESI SWITZERLAND AG
    Inventors: Norbert Bilewicz, Andreas Mayr, Hugo Pristauz, Hubert Selhofer
  • Patent number: 11833681
    Abstract: In at least one embodiment, under the control of a robotic control system, a gripper on a robot is positioned to grasp a 3-dimensional object. In at least one embodiment, the relative position of the object and the gripper is determined, at least in part, by using a camera mounted on the gripper.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: December 5, 2023
    Assignee: NVIDIA Corporation
    Inventors: Shariq Iqbal, Jonathan Tremblay, Thang Hong To, Jia Cheng, Erik Leitch, Duncan J. McKay, Stanley Thomas Birchfield
  • Patent number: 11823938
    Abstract: A mounting device comprises a recognition mechanism and a control unit. The recognition mechanism recognizes a chip recognition mark and a substrate recognition mark through a mounting head and from above the mounting head and is movable in an in-plane direction of a substrate surface of a substrate. The control unit is connected to the recognition mechanism, calculates an amount of misalignment between a chip component and the substrate from position information about the chip recognition mark and the substrate recognition mark obtained from the recognition mechanism, and performs positioning by driving the mounting head and/or the substrate stage according to the amount of misalignment. The recognition mechanism has a chip recognition sensor for recognizing the chip recognition mark and a substrate recognition sensor for recognizing the substrate recognition mark provided independently so that focal positions thereof are different via a common optical axis path.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: November 21, 2023
    Assignee: TORAY ENGINEERING CO., LTD.
    Inventor: Yasushi Tamura
  • Patent number: 11798912
    Abstract: A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: October 24, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Taeyoung Park, Jungseon Park, Jun-Hee Lee, Hyunwoo Lee
  • Patent number: 11772964
    Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: October 3, 2023
    Assignee: Xerox Corporation
    Inventors: Anne Plochowietz, Bradley Rupp, Jengping Lu, Julie A. Bert, Lara S. Crawford, Sourobh Raychaudhuri, Eugene M. Chow, Matthew Shreve, Sergey Butylkov
  • Patent number: 11769633
    Abstract: An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc?1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: September 26, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gu Won Ji, Heung Kil Park, Sang Soo Park, Young Ghyu Ahn
  • Patent number: 11751370
    Abstract: A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: September 5, 2023
    Assignee: FUJI CORPORATION
    Inventor: Tomokatsu Kubota
  • Patent number: 11683921
    Abstract: An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: June 20, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Jen-Jia Liou, Jui-Tang Chang
  • Patent number: 11670526
    Abstract: An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 6, 2023
    Assignee: HALLYS CORPORATION
    Inventors: Hiroshi Aoyama, Toru Hayashida
  • Patent number: 11657974
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a stacking direction, and including a first surface and a second surface opposing each other in the stacking direction, a first through electrode penetrating the body and connected to the first internal electrode; a second through electrode penetrating the body and connected to the second internal electrode, first and second external electrodes disposed on the first surface and the second surface, respectively, and connected to the first through electrode, third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through electrode, and an identifier disposed on the first surface or the second surface of the body, and the first and second through electrodes protrude from the first surface of the body.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byeong Chan Kwon, Ji Hong Jo, Min Gon Lee, Jin Kyung Joo, Taek Jung Lee
  • Patent number: 11653521
    Abstract: An OLED display device and a method of fabricating the same are disclosed. The OLED display device includes a substrate including a display area provided with an organic light emitting element and a pad area provided with a plurality of pads, the pad area formed around the display area, an encapsulation layer formed on the substrate such that the encapsulation layer covers the organic light emitting element, and a dam formed between the display area and the pad area, the dam controlling flow of an organic film material constituting the encapsulation layer.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: May 16, 2023
    Assignee: LG Display Co., Ltd.
    Inventors: Sung-Jin Park, Soon-Kwang Hong, Do-Hyung Kim
  • Patent number: 11637075
    Abstract: A semiconductor device having a three-dimensional structure includes a first wafer including a first bonding pad on one surface thereof; a second wafer including a second bonding pad, which is bonded to the first bonding pad, on one surface thereof bonded to the one surface of the first wafer; a plurality of anti-warpage grooves on the one surface of the first wafer, and laid out in a stripe shape; and a plurality of anti-warpage ribs on the one surface of the second wafer and coupled respectively to the plurality of anti-warpage grooves, and laid out in a stripe shape.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: April 25, 2023
    Assignee: SK hynix Inc.
    Inventors: Sung Lae Oh, Sang Woo Park
  • Patent number: 11627666
    Abstract: An electronic device is provided, the electronic device includes a driving substrate (13), the driving substrate includes a plurality of circular grooves and a plurality of rectangular grooves, and a plurality of disc-shaped electronic components, at least one disc-shaped electronic component is disposed in at least one circular groove, an alignment element positioned on a top surface of the at least one disc-shaped electronic component, a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment element is defined as r, a width of at least one rectangular groove among the rectangular grooves is defined as w, and a height of the at least one rectangular groove is defined as H, and the disc-shaped electronic component and the rectangular groove satisfy the condition of (R+r)/2>(w2+H2)1/2.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: April 11, 2023
    Assignee: InnoLux Corporation
    Inventor: Chun-Hsien Lin
  • Patent number: 11596091
    Abstract: There is provided a component mounter including: a plurality of transport lanes for transporting a board sorted by a board sorting device; a congestion index calculator for calculating a congestion index indicating a congestion degree of each of the plurality of transport lanes; a transport lane determiner for determining a transport lane for carrying in the board among the plurality of transport lanes based on the calculated congestion index; and an outputter for outputting a board request signal for requesting to carry the board into the transport lane determined by the transport lane determiner, to the board sorting device.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: February 28, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Junkei Shimizu, Takeyuki Kawase
  • Patent number: 11589463
    Abstract: A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: February 21, 2023
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.
    Inventors: Jia-He Li, Yong-Chao Wei
  • Patent number: 11577669
    Abstract: A vehicle shell assembly, having a plate-like plastic body having an outside and an inside. A lighting unit is provided which is disposed on the inside and is configured to be switched between an active state and a passive state; the inside of the plastic body is provided with an opaque light-impermeable coating which has at least one gap; and the plastic body may have of a translucent material so that the gap is covered by the plastic body to the outside when the lighting unit is in the passive state and defines a light pattern which is visible from the outside when the lighting unit is in the active state.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: February 14, 2023
    Assignee: Webasto SE
    Inventors: Bernhard Schieder, Roman Raschke, Alexander Kilias, Bernd Veihelmann, Philipp Engelhardt, Andreas Knödler-Bunte
  • Patent number: 11582372
    Abstract: A system for securing an infrared camera lens in optical alignment with an infrared camera sensor, including: a computer-controlled robotic arm configured to adjust a relative position of the infrared camera sensor and the infrared camera lens so as to bring the infrared camera lens into an ideal lens position with respect to the infrared camera sensor; and at least one computer-controlled welder, the at least one computer-controlled welder being configured to perform welding together of at least two parts of the infrared camera after the infrared camera lens is positioned by the robotic arm in the ideal lens position with respect to the infrared sensor camera such that the infrared camera lens is permanently maintained in the ideal lens position.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: February 14, 2023
    Assignee: Adasky, Ltd.
    Inventors: Daniel Tobaly, Nir Levi, Eyal Yavets, Vitaly Kuperman
  • Patent number: 11575080
    Abstract: A piezoelectric member including metal electrodes with improved adhesiveness to piezoelectric elements is to be provided. A piezoelectric member 102 includes a piezoelectric element 21, and a pair of electrodes 41, 42 respectively formed on a pair of opposing surfaces 21b, 21c of the piezoelectric element 21. The electrodes 41, 42 includes: a base film 41a that is formed on the opposing surfaces 21b, 21c of the piezoelectric element 21 and contains a thiol group; a metal adhesive film 41b formed on the base film 41a; and an electrode film 41c that is formed on the metal adhesive film 41b and is for applying voltage to the piezoelectric element 21. The metal adhesive film 41b is formed with a different material from the electrode film 41c, and has a thickness of 1 to 10 nm.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: February 7, 2023
    Assignee: KONICA MINOLTA, INC.
    Inventors: Naoki Shimizu, Kazunari Tada
  • Patent number: 11553617
    Abstract: A power convertor has a casing and a power conversion circuit arranged in an internal chamber of the casing. The casing has a first wall member as a specific side wall. A plurality of connector opening parts are formed in the first wall member. At least two of the plurality of connector opening parts formed in the first wall member are arranged at different positions facing a different direction from each other.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: January 10, 2023
    Assignee: DENSO CORPORATION
    Inventors: Kazuhiro Kosaka, Keisuke Yuki
  • Patent number: 11539291
    Abstract: A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: December 27, 2022
    Assignee: Infineon Technologies Austria AG
    Inventors: Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew Sawle, Maciej Wojnowski, Xaver Schloegel, Josef Hoeglauer
  • Patent number: 11530808
    Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: December 20, 2022
    Assignee: TACTOTEK OY
    Inventors: Vinski Bräysy, Ilpo Hänninen, Mikko Heikkinen, Pälvi Apilo, Jarmo Sääski, Tomi Simula, Topi Wuori, Giovanni Ferri, Pasi Korhonen
  • Patent number: 11523553
    Abstract: Provided is a transmission device for feedback-free unidirectional transmission of data from a first network zone into a second network zone for evaluation at a remote application server, containing: —a data export device which is arranged in the first network zone and is to detect the data transmitted in a network data format in the first network zone and to transform the data from the network data format into a transport data format, —a unidirectional data transmission unit, to transmit the data in the transport data format into the second network zone unidirectionally—a data import device which transforms the data from the transport data format back into the network data format and to transmit the data to an application server, wherein the data import device and the application server are arranged in a second network zone remote from the first zone, and to a corresponding method.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: December 6, 2022
    Inventors: Alexander Pfaffinger, Christian Royer
  • Patent number: 11476886
    Abstract: A radio frequency module includes: a power amplifier; an inductor connected to the power amplifier; an external connection terminal that is connected to the power amplifier via the inductor and is configured to receive a power supply voltage from an outside source; a low-noise amplifier; a matching circuit connected to input of the low-noise amplifier; and a module substrate including a first principal surface and a second principal surface on opposite sides of the module substrate. The inductor is disposed on one of the first principal surface and the second principal surface, and the matching circuit is disposed on the other of the first principal surface and the second principal surface.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: October 18, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masaki Tada
  • Patent number: 11470751
    Abstract: Component-mounting system includes multiple component mounting machines disposed along a board conveyance direction; feeder storage container for storing multiples of feeders, which are capable of being attached/detached to and from component mounting machines, in each stage among multiple stages; first feeder moving robot capable of exchanging feeder between the lowest stage among multiple stages of feeder storage container and component mounting machine; and second feeder moving robot capable of exchanging feeder between the lowest stage among multiple stages of feeder storage container and the other stages.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: October 11, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hiroyuki Ao
  • Patent number: 11454660
    Abstract: A measurement device to automatically measure an electrical characteristic of a component is mounted on a mounter for mounting a component on a circuit board. The measurement device includes a main body, a loading stand on which a component is placed, a pair of measuring elements provided in such a manner as to move towards and away from each other, and a loading stand moving device for moving the loading stand. The loading stand moving device includes a guide rail provided on the main body, and the loading stand is held movably onto the guide rail. This configuration enables an electrical charge stored in a component held onto the loading stand and an electrical charge stored in the loading stand to be removed well by way of the guide rail and the main body. As a result, an electrical characteristic held by the component can be measured stably.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: September 27, 2022
    Assignee: FUJI CORPORATION
    Inventors: Toshihiko Sasaki, Toshiyuki Sawada
  • Patent number: 11456275
    Abstract: A semiconductor device includes an insulated circuit board in which a metal layer is formed on one surface of an insulating board and a semiconductor element having a polygonal shape when viewed in a plan view that is bonded to the metal layer via a bonding material. The metal layer of the insulated circuit board has a recess that exposes the insulating board at a position corresponding to at least one corner of the semiconductor element.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: September 27, 2022
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kazuo Enomoto
  • Patent number: 11431080
    Abstract: A radio communication module of the invention includes: a mounting substrate having a first surface and a second surface; an antenna substrate mounted on the first surface; and an IC package that is mounted on the second surface and includes an RFIC. The mounting substrate includes a heat-dissipation via hole penetrating through the mounting substrate and extending between the first surface and the second surface, a heat dissipation pattern formed on the first surface and is connected to the heat-dissipation via hole, and a non-heat-dissipation via hole transmitting an electrical signal or electrical current, which are formed on thereon. In a plan view when viewed from the thickness direction of the mounting substrate, the heat-dissipation via hole is connected to the RFIC at a position at which the heat-dissipation via hole overlaps with the RFIC, and the heat dissipation pattern extends to an outside of the antenna substrate.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: August 30, 2022
    Assignee: FUJIKURA LTD.
    Inventor: Michikazu Tomita
  • Patent number: 11432450
    Abstract: A component determination system for determining, in a case when a first component to be mounted on a board by a first mounting operation and a second component mounted on the board by a second mounting operation have a particular corresponding relationship, whether a combination of the first component and the second component mounted is permissible, the component determination system including: a first characteristic information acquiring section configured to acquire first characteristic information of the first component for which the first mounting operation has been completed; a second characteristic information acquiring section configured to acquire second characteristic information of the second component prepared prior to the second mounting operation; and a combination determining section configured to determine whether to allow the combination of the first component and the second component based on the acquired first characteristic information and the acquired second characteristic information.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: August 30, 2022
    Assignee: FUJI CORPORATION
    Inventor: Teruyuki Ohashi
  • Patent number: 11412651
    Abstract: A control device is used for a mounting device with a mounting head including at least a first holder on which a first pickup member is installed, and a second holder on which a second pickup member is installed, and configured to pick up components supplied from a component supply section and mount the components. The control device includes a control section configured to acquire a first deviation amount of a tip of the first pickup member and a second deviation amount of a tip of the second pickup member and select a combination of the pickup members in which an interval between the tips of the pickup members that is obtained based on the first deviation amount and the second deviation amount falls within a predetermined range.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: August 9, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hideya Kuroda
  • Patent number: 11410897
    Abstract: A semiconductor structure includes a circuit carrier, a dielectric layer, a conductive terminal, a semiconductor die, and an insulating encapsulation. The circuit carrier includes a first surface and a second surface opposite to each other, a sidewall connected to the first and second surfaces, and an edge between the second surface and the sidewall. The dielectric layer is disposed on the second surface of the circuit carrier and extends to at least cover the edge of the circuit carrier. The conductive terminal is disposed on and partially embedded in the dielectric layer to be connected to the circuit carrier. The semiconductor die encapsulated by the insulating encapsulation is disposed on the first surface of the circuit carrier and electrically coupled to the conductive terminal through the circuit carrier.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11412648
    Abstract: A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 9, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hidenori Goto, Ryohei Kamio, Kota Niwa, Kohei Sugihara
  • Patent number: 11395449
    Abstract: The three-dimensional mounting device includes a supporting section capable of fixing a processing target, an application section for applying a viscous fluid to the processing target, a mounting section for arranging a component on the processing target, an imaging section for imaging the processing target, and a control section for controlling the processing section including the supporting section, the application section, the mounting section, and the imaging section. One or more of the supporting section, the application section, the mounting section, and the imaging section has multiple tilt axes and is capable of tilting the processing target and/or the processing section in multiple directions. The control section performs coordinate correction using the circuit pattern on the forming surface as a reference position, and arranges the component on the mounting section.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 19, 2022
    Assignee: FUJI CORPORATION
    Inventor: Noriaki Iwaki
  • Patent number: 11388849
    Abstract: A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: July 12, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Kawai, Jun Iisaka, Hidetoshi Ito
  • Patent number: 11373975
    Abstract: An electronic component mounting device (100) bonds a semiconductor die (150) to a substrate by thermocompression bonding, and seals, using an insulating resin, a gap between the semiconductor die (150) and the substrate. The electronic component mounting device is provided with: a film cutting mechanism (200) for cutting a long film (210) into cut pieces; and a mounting tool (110), which vacuum-sucks the semiconductor die (150), and bonds the die to the substrate by thermocompression bonding. Consequently, in the electronic component mounting device (100) that moves a mounting head in the horizontal direction, adhesion of the insulating resin to the mounting tool can be suppressed.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: June 28, 2022
    Assignee: SHINKAWA LTD.
    Inventor: Kohei Seyama
  • Patent number: 11367626
    Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 21, 2022
    Assignee: TDK CORPORATION
    Inventors: Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Koichi Tsunoda, Kenichi Yoshida
  • Patent number: 11357151
    Abstract: A component mounting machine performs a mounting operation of mounting an electronic component to a board. The component mounting machine includes: multiple related operation devices each including an electrically-operated section configured to perform a related operation that is an operation related to the mounting operation, and an output section configured to output an operation signal representing a state of the electrically-operated section that is operating; and circuitry configured to limit the quantity of the related operation devices for which the electrically-operated section is in an operating state to a specified quantity or fewer based on whether there is presence of the operation signal of the multiple related operation devices.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: June 7, 2022
    Assignee: FUJI CORPORATION
    Inventors: Taro Ito, Akira Hara, Nguyen Hieu Nghia
  • Patent number: 11350550
    Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: May 31, 2022
    Assignee: FUJI CORPORATION
    Inventors: Rie Kito, Hidetoshi Kawai, Norio Hosoi, Mizuho Nozawa, Jun Iisaka, Hidetoshi Ito, Shingo Fujimura, Kenzo Ishikawa, Yusuke Yamakage
  • Patent number: 11337350
    Abstract: A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: May 17, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yukihiro Yamashita, Teruyuki Ohashi