Assembling To Base An Electrical Component, E.g., Capacitor, Etc. Patents (Class 29/832)
  • Patent number: 10784226
    Abstract: A semiconductor device includes an insulative substrate, a wiring pattern, a bonding portion, and a semiconductor element. The wiring pattern is formed on an upper surface of the insulative substrate. The bonding portion is formed on an upper surface of the wiring pattern. The semiconductor element includes an electrode pad connected to an upper surface of the bonding portion. The bonding portion includes first sintered layers distributed in the bonding portion and a second sintered layer having a density differing from each of the first sintered layers and surrounding the first sintered layer.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: September 22, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kei Murayama
  • Patent number: 10764992
    Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: September 1, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Yong-Chao Wei, Lin-Jie Gao, Han-Pei Huang
  • Patent number: 10765051
    Abstract: When performing inspection of a tip of a suction nozzle, the tip of the suction nozzle is imaged, and an opening of the tip of the suction nozzle is identified based on the image data. With the image based on the image data, locations with less than a set brightness level inside a location with the set brightness level and greater is identified as the opening. The identified opening is divided into four regions by boundary lines, and the area of the opening is calculated for each of the regions. Based on the areas calculated for each region, it is determined whether the suction nozzle is good. By determining whether the suction nozzle is good based on the area of the opening for each region, it is possible to reliably determine whether the suction nozzle is good.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: September 1, 2020
    Assignee: FUJI CORPORATION
    Inventors: Hideki Hosaka, Kazumi Hoshikawa
  • Patent number: 10745805
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may comprise a solid solution of Y2O3—ZrO2 and may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Patent number: 10744750
    Abstract: A selective transfer roll stamp is provided which rotates on a source substrate to selectively transfer elements arranged on the source substrate. The selective transfer roller stamp includes: a roller unit rotating about an axis of rotation and including projecting portions protruding in a radial direction and recessed portions formed between neighboring projecting portions; and an adhesive layer formed on the outer circumferential surface of the roller unit and coming into contact with the elements, wherein the outer circumferential surface of the adhesive layer is made flat in a circumferential direction.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: August 18, 2020
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Kwangseop Kim, Chan Kim, Bongkyun Jang, Jae-Hyun Kim, Seung-Mo Lee, Yun Hwangbo
  • Patent number: 10721847
    Abstract: A nozzle management device includes a plurality of pallets, each of the pallets configured to house a plurality of nozzles; a pallet storage device configured to store the pallets; and a pallet moving device configured to move the pallets.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: July 21, 2020
    Assignee: FUJI CORPORATION
    Inventors: Kazumi Hoshikawa, Kenji Shimosaka, Tadakatsu Ibe
  • Patent number: 10716250
    Abstract: A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: July 14, 2020
    Assignee: FUJI CORPORATION
    Inventors: Takeshi Fujishiro, Koji Kawaguchi, Mitsuru Sanji, Kohei Sugihara
  • Patent number: 10667448
    Abstract: An electronic component mounting method for mounting a first board and a second board including, mounting a first set of electronic components on the first board allocated to first mounting heads; and mounting a second set of electronic components on the second board allocated to the second mounting heads and to the first mounting heads and the second mounting heads of the second lane dedicated mounters. By this, the mounting load is spread evenly across all the mounting heads, thus the idle time of mounting heads is reduced, improving the operating rate, meaning that panels are produced efficiently by the electronic component mounting method.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: May 26, 2020
    Assignee: FUJI CORPORATION
    Inventors: Yoshihiro Yasui, Marie Terazawa
  • Patent number: 10661641
    Abstract: A cover for a vehicle roof, which may have a pane, an anti-splinter layer arranged on the inside face of the pane, and a lighting device having a luminous layer, wherein the luminous and anti-splinter layer forms both the anti-splinter layer and the luminous layer in this one layer and in particular the lighting device contains at least one luminous unit, which is designed to radiate light into the luminous and anti-splinter layer at a lateral edge region of the luminous and anti-splinter layer.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: May 26, 2020
    Assignee: WEBASTO SE
    Inventors: Johannes Thannheimer, Steffen Lorenz, Hubert Böhm, Thomas Schütt
  • Patent number: 10651604
    Abstract: A connector is equipped with a housing capable of being fitted in a mating connector which houses a plurality of mating terminals connected to each other electrically and a holder which is attached to the housing. The housing has a plurality of terminal housing rooms which house a plurality of terminals. The holder has a plurality of noise reduction member holding rooms which hold a plurality of noise reduction members each of which reduces noise occurring in a corresponding one of the plurality of terminals housed in the plurality of terminal housing rooms, in such a manner that the plurality of noise reduction members are disposed adjacent to front end surfaces of corresponding ones of the plurality of terminals in a state that attachment of the holder to the housing is completed.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: May 12, 2020
    Assignee: YAZAKI CORPORATION
    Inventor: Masashi Tsukamoto
  • Patent number: 10629545
    Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 21, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Pai-Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang
  • Patent number: 10630027
    Abstract: A connector is equipped with a housing capable of being fitted in a mating housing of a mating connector, a plurality of terminals which are held by the housing and electrically connected to each other, and a noise reduction member which is held in the housing so as to reduce noise occurring in the terminals. The noise reduction member is disposed at at least one of the plurality of terminals, and is not disposed at at least one of the remaining terminals of the plurality of terminals. The noise reduction member is made of a material containing ferrite.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: April 21, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Masashi Tsukamoto, Takashi Odajima, Yasuyuki Saito, Hiroaki Ito
  • Patent number: 10594092
    Abstract: A connector module adapted for a set-top box including a shielding case, a first connector disposed outside of the shielding case, an annular capacitor disposed between the first connector and the shielding case, and at least one ferrite core disposed in the shielding case and generating mutual inductance by coupling the shielding case is provided. The first connector being connected to a peripheral cable has a transmission cable penetrating into the shielding case. The annular capacitor is electrically connected between a grounding layer of the transmission cable and a grounding of a first circuit board of the set-top box. The transmission cable is connected to a second connector of the first circuit board after entering the shielding case and penetrating the ferrite core. A high frequency signal from the peripheral cable is transmitted to the first circuit board via the first connector, the transmission cable, and the second connector.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: March 17, 2020
    Assignee: Kinpo Electronics, Inc.
    Inventor: Ming-Tsung Hsu
  • Patent number: 10568219
    Abstract: The present invention provides an electronic control device including: a housing which has an opening portion formed at one side thereof; printed circuit boards which are inserted into the housing; and a connector unit which includes connector pins coupled to the printed circuit boards and closes the opening portion of the housing, in which the printed circuit boards include a first printed circuit board, and a second printed circuit board which is connected to one side of the first printed circuit board through a substrate connecting portion and provided below the first printed circuit board, the connector unit includes a first connector pin connected to the first printed circuit board and a second connector pin connected to the second printed circuit board, and an outer connector cover of the connector unit is disposed to be directed upward.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: February 18, 2020
    Assignee: HYUNDAI AUTRON CO., LTD.
    Inventor: Man Ho Seok
  • Patent number: 10566837
    Abstract: An electric power supply device for supplying electric power from a supply side device to a receiver side device including a mechanism section that operates intermittently with a drive voltage and a receiver side control section that controls an operation of the mechanism section with a control voltage that is lower than the drive voltage, the electric power supply device including: a regulator section, which is provided on the receiver side device, that converts a received voltage received via an electric power supply into the control voltage; a supply voltage adjusting section, which is provided on the supply side device, that adjustably supplies the received voltage; and a supply side control section, which is provided on the supply side device, that controls the received voltage by controlling the supply voltage adjusting section.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: February 18, 2020
    Assignee: FUJI CORPORATION
    Inventors: Shinji Takikawa, Masaru Saito
  • Patent number: 10555450
    Abstract: In rotary head type component mounter, provided at two locations around rotary head are Z1-axis drive mechanism and Z2-axis drive mechanism that lower suction nozzles, and in a case in which the interval between two suction nozzles is a multiple two times or greater than the arrangement pitch of components in tray, component mounter performs consecutive simultaneous pickup operation repeatedly for a quantity corresponding to the quantity of component arrangement pitches between the two suction nozzles, the consecutive simultaneous pickup operation being that of lowering the two suction nozzles simultaneously such that two of the components on tray are picked up simultaneously, then rotating rotary head by one nozzle pitch, moving rotary head in the arrangement direction of the components on tray by one component arrangement pitch, and then lowering the next two suction nozzles simultaneously such that another two of the components on tray are picked up simultaneously.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: February 4, 2020
    Assignee: FUJI CORPORATION
    Inventors: Jun Iisaka, Hidetoshi Ito
  • Patent number: 10555023
    Abstract: Techniques are described that enable personalized recap clip sequences.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: February 4, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Shaun Patrick McCarthy, Yaron Sole, Trevor James Walker, Arun Velayudhan Pillai, Venkatraman Prabhu
  • Patent number: 10522484
    Abstract: A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post. The thin film capacitor includes a reference hole extending through the thin film capacitor in a thickness-wise direction. The post is inserted through the reference hole.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: December 31, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Keigo Sato
  • Patent number: 10477749
    Abstract: An electronic component mounting machine includes: a mounting head that mounts electronic components onto a circuit board; a tape feeder which feeds a first tape material that accommodates a plurality of electronic components to the mounting head; a counting device which counts the number of electronic components remaining in the first tape material by subtracting the number of consumed electronic components which corresponds to an operating amount of the electronic component mounting machine from an initial value of the number of the electronic components accommodated in the first tape material; a detection device which detects a splice portion that joins a starting end of a second tape material to a tail end of the first tape material; and a determining device which determines whether or not a count value obtained by the counting device is within a predetermined normal range when the detection device detects the splice portion.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: November 12, 2019
    Assignee: FUJI CORPORATION
    Inventor: Daisuke Kato
  • Patent number: 10462913
    Abstract: A method for manufacturing an electronic device and the electronic device therefor are provided. The electronic device includes a substantially enclosed window including a front surface, a rear surface and a side surface surrounding at least a portion of a space between the front surface and the rear surface, a display disposed inside the window, and a display bracket, to which the display is coupled and disposed inside the window. The display is coupled to the window by curing a bonding member inserted between the window and the display.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: October 29, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Su Jung, Yong Seok Lee
  • Patent number: 10462921
    Abstract: One aspect relates to a method for producing an electronic module assembly. According to the method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly has at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature. Embodiments of the electronic module assembly are also described.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: October 29, 2019
    Assignee: Infineon Technologies AG
    Inventor: Reinhold Bayerer
  • Patent number: 10448549
    Abstract: A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state, each of the plurality of stick cases being capable of accommodating a plurality of electronic components, each of the plurality of stick cases having an opening in an end portion in a longitudinal direction; a component transporter moving one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; and a stick case detector detecting presence or absence of one or more stick cases in the loader.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: October 15, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryouji Eguchi, Shuuichi Kubota, Takashi Tamura, Seiichi Matsuo
  • Patent number: 10440844
    Abstract: A circuit board assembly for a control unit of a motor vehicle has a multi-layer circuit board and a plug connector with a housing faceplate. The circuit board, which includes conductor paths for conducting signals, has a first section, a second section, and a flexible third section with a lower stiffness between the first and second sections. The first section encloses an angle ? with the second section. The plug connector has a multiplicity of connection elements, each with an attachment part and a contact pin. The housing faceplate has first and second side panels each enclosing an angle ? with the first panel central plane and an angle ? with the second panel central plane. A first detent element prevents a change in the angle ? in a first direction of rotation. A second detent element prevents a change in the angle ? in a second direction of rotation.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: October 8, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Detlev Bagung, Christian Pump
  • Patent number: 10420262
    Abstract: Provided is a feeder management device that appropriately controls editing of management information related to feeders so as to prevent electronic components of an incorrect type being supplied. The feeder management device includes: a data management section including management data in which a component type of an electronic component loaded on each of the feeders is linked to an identification code that specifies each of the multiple feeders; and an editing control section configured to determine whether editing is allowable based on a loading state of the electronic component on the feeder in a case in which editing of the management information is attempted to be performed in accordance with a change to the component type linked to the identification code of the feeder.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: September 17, 2019
    Assignee: FUJI CORPORATION
    Inventors: Kazuhito Horaguchi, Jo Ikeyama, Yuki Fujimura, Koushi Kuno
  • Patent number: 10375870
    Abstract: A board work system which optimizes amounting order of components on a circuit board. In a case where an error rate which shows the number of defective dies included in the wafer provided in the wafer-type supply device is input by a user, an integrated control device uses the input value in processing. In addition, in a case where the error rate is not input by the user, the integrated control device decides a value obtained by averaging the number of defective dies of the same type of wafer in production information as the error rate. In addition, the system decides the mounting order of mounting the components of the tape-type supply device or the wafer-type supply device on the circuit board based on the decided error rate, or changes the mounting order after the decision.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: August 6, 2019
    Assignee: FUJI CORPORATION
    Inventor: Shigeto Oyama
  • Patent number: 10373302
    Abstract: A three-dimensional image processing apparatus includes: an image capturing part for acquiring reflected light to capture a plurality of pattern projected images; a distance image generating part capable of generating a distance image based on the plurality of pattern projected images; a tone conversion part for tone-converting the distance image generated in the distance image generating part to a low-tone distance image that has a lower number of tones than the number of tones of the distance image and is obtained by replacing height information in the distance image with a shade value of the image; and a tone conversion condition automatic setting part for automatically setting, based on the height information in the distance image, a tone conversion parameter for prescribing a tone conversion condition at the time of tone-converting the distance image to the low-tone distance image in the tone conversion part.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: August 6, 2019
    Assignee: Keyence Corporation
    Inventor: Kazuhito Saeki
  • Patent number: 10367436
    Abstract: A linear motion system utilizing one or more printed circuit boards embedded within a stage wherein the system components, including the controller, drive, and controller, may be mounted to a printed circuit board (PCB), and the electrical communications between the system components and the power to the system components are supplied through traces or etchings on the printed circuit board, thereby omitting the need for additional power and communication cables.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: July 30, 2019
    Assignee: Invetech, Inc.
    Inventors: Kevin McCarthy, David Thomas
  • Patent number: 10355113
    Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: July 16, 2019
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang, Ralph G. Nuzzo, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang
  • Patent number: 10321620
    Abstract: A component supplying device of the disclosure includes a main body, a carrier tape transport unit which transports a component to a component pick-up position, a detector which detects presence or absence of a carrier tape in the transport path, a designation unit which designates a transport mode of the carrier tape using a flag based on a change in the presence or absence of the carrier tape which is detected, a storage unit which stores the presence or absence of the carrier tape, the flag which is designated, and information of the component which is stored by the carrier tape which is mounted in the component supplying device, and a determination unit which determines a processing operation to be performed when power which is supplied to the component supplying device is reintroduced based on the presence or absence of the carrier tape and the flag which is designated.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: June 11, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryouji Eguchi, Tatsuo Yamamura
  • Patent number: 10285317
    Abstract: A board held by a board holding plate is heated by a heater, and after performing mounting processing of components in a region of the mounting regions of the board, a pressing process of using a pressing head to apply pressure to all the components mounted in the region at once while heating the board is performed, and a next mounting process of mounting components in a next region is performed while performing the pressing process. By performing the pressing process and the mounting process in parallel, waiting time for each process in the cycle of the mounting process and the pressing process is reduced, such that overall work time is reduced.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: May 7, 2019
    Assignee: FUJI CORPORATION
    Inventors: Masaki Murai, Toshihiko Yamasaki, Toshinori Shimizu
  • Patent number: 10284055
    Abstract: A Hall IC of an actuator calculates a relative angle by using magnetic flux densities in two directions, and corrects a linearity error in the relative angle by using correction values at correction points and a function to calculating an interpolated correction value between correction points, the correction values and the function being stored in a storage. The storage stores, as correction values at outermost correction points in a relative angle range, correction values L? and L? causing linearity errors which are outermost ones of plural extremums to be equal to or less than linearity errors which are other ones of the plural extremums each of which is located inwardly next to the outermost extremum, the plural extremums being exhibited by the linearity error in the relative angle which is corrected by using an interpolated correction value calculated from the function which uses the correction values as parameters.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: May 7, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Takashi Goto
  • Patent number: 10262885
    Abstract: A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame.
    Type: Grant
    Filed: September 2, 2013
    Date of Patent: April 16, 2019
    Assignee: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD
    Inventors: Jian Ping Jin, Leng Kheam Lee
  • Patent number: 10217637
    Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: February 26, 2019
    Assignee: International Business Machines Corporation
    Inventors: Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-wen Hung, John U. Knickerbocker
  • Patent number: 10205857
    Abstract: An image pickup device which ensures reliability of soldering without reinforcement using any additional special members or fixing with an adhesive agent or the like. The image pickup device outputs an image signal corresponding to an optical image. Signal terminals are placed on one surface of the image pick device and soldered to a mounting board on which the image pickup device is to be mounted. Reinforcing terminals provided on the one surface, on which the signal terminal is placed, reinforce the image pickup device. A holding fixing unit holds the image pickup device on the mounting board. When the image pickup device is mounted on the mounting board, the reinforcing terminals are located between the signal terminals and the holding fixing unit.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: February 12, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yohei Sato, Yutaka Kojima
  • Patent number: 10206320
    Abstract: A component mounter is provided with a characteristic value measuring device that measures a characteristic value of first component, and head that mounts each of first component and second component on board. Second component is a digital potentiometer provided with receiver section that receives information from head, variable resistance section for which the resistance is variable, and control section that controls the resistance value of variable resistance section. Head is provided with receiver section that receives information from characteristic value measuring device, sender section that sends information to second component, power source that supplies electric current to variable resistance section, memory section that memorizes the resistance value of second component according to the characteristic value of first component, and control section.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: February 12, 2019
    Assignee: FUJI CORPORATION
    Inventor: Mitsuhiro Hashimoto
  • Patent number: 10068824
    Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: September 4, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Thomas A Kim, Kyu Bum Han, Chang Moo Jung, Kyung In Kang, Sang Kyu Lee
  • Patent number: 10045442
    Abstract: An electronic circuit component mounter including a component supply device which supplies electronic circuit components to a component holding tool; and a mounting device including a component holding tool and a movable device to move the tool relative to a substrate. If a moving type component supply mounting supply mode is set, a passage-equipped component case is checked for, passage-equipped component case is attached to head main body, moved together with suction nozzle, and supplies components. When component mounting by performing main body side component supply mounting supply mode is set, components supplied from tape feeders provided on the module main body are mounted, thus passage-equipped component case is not required, the presence of passage-equipped component case is checked for, and if it is attached to head main body, it is removed.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: August 7, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventor: Mizuho Nozawa
  • Patent number: 10043127
    Abstract: Briefly, a new network processing system is provided that collects and coordinates key indicators regarding a product's quality as that product moves from supplier to end user. By doing so, the processing system provides robust, authentic, and trustworthy data that (1) reports the time period when any custodian had the product, (2) identifies what timing or environmental condition caused the product to go bad, and (3) verifies which custodian acted to make the product defective. In use, an intelligent label is attached to a product, and the intelligent label has a timer as well as one or more sensors for monitoring environmental conditions. Upon exceeding timing or environmental rules, a visual alarm indicator is activated on the label. Since the label has electronically retrievable data, electronically scannable data, and human readable date, the network process can collected key data regarding the product along the entire distribution chain.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: August 7, 2018
    Assignee: Chromera, Inc.
    Inventor: Paul Atkinson
  • Patent number: 9997502
    Abstract: There is provided a component arrangement determination method, in a component mounting apparatus including a plurality of component supply units for supplying components, for determining arrangement of the component supply units used for production of a plurality of types of component mounted boards. The method includes specifying a production frequency of each of the plurality of types of component mounted boards for a predetermined period of time, grouping the plurality of types of component mounted boards into a plurality of groups capable of being produced without changing the arrangement of the component supply units based on the production frequency, and determining arrangement, in the component mounting apparatus, of the component supply units for supplying components necessary for production of types of component mounted boards that belong to each group of the plurality of groups.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: June 12, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroki Sagara, Takuya Yamazaki, Hirokazu Takehara, Isato Iwata
  • Patent number: 9976709
    Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: May 22, 2018
    Assignee: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Sheng-Hung Yi, I-Lin Tseng, Po-Cheng Huang, Hui-Ju Yang
  • Patent number: 9974220
    Abstract: A fitting system includes a plurality of fitting lines for fitting printed circuit boards with electronic components. A method for allocating printed circuit boards to the fitting lines includes determining requirements for fitting each of a plurality of printed circuit boards with components with which the plurality of printed circuit boards are to be fitted, determining an amount of printed circuit boards of which the component variances exceed a predetermined value, each component variance representing the number of different components with which a printed circuit board is to be fitted, and allocating the printed circuit boards to the fitting lines under the predetermined conditions via integral linear programming, such that the printed circuit boards of the amount are distributed as uniformly as possible over the fitting lines.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: May 15, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventors: Daniel Craiovan, Norbert Herold, Thorsten Kemper, Alexander Pfaffinger, Christian Royer
  • Patent number: 9966247
    Abstract: A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: May 8, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yukinori Nakayama, Hideyasu Takamiya
  • Patent number: 9966319
    Abstract: A method for assembling a packaged integrated circuit for operating reliably at elevated temperatures is provided. The method includes providing an extended bond pad over an original die pad of an extracted die to create a modified extracted die. The extracted die is a fully functional semiconductor die that has been removed from a finished packaged integrated circuit. The method also includes placing the modified extracted die into a cavity of a package base and bonding a new bond wire between the extended bond pad and a lead of the package base or a downbond, and sealing a package lid to the package base and the cavity of the package.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: May 8, 2018
    Assignee: Global Circuit Innovations Incorporated
    Inventor: Erick Merle Spory
  • Patent number: 9953910
    Abstract: An electronic component includes a base insulative layer having first and second surfaces; an electronic device having first and second surfaces; at least one I/O contact located on the first surface of the electronic device; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; a first metal layer disposed on the I/O contact; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer, and located adjacent to the first metal layer. The base insulative layer secures to the electronic device through the first metal layer and removable layer. The first metal layer and removable layer can release the base insulative layer from the electronic device when the first metal layer and removable layer are exposed to a temperature higher than their softening points or melting points.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: April 24, 2018
    Assignee: General Electric Company
    Inventors: Charles Gerard Woychik, Raymond Albert Fillion
  • Patent number: 9943020
    Abstract: A component mounting apparatus includes transport mechanisms that transport boards, component supply sections, mounting heads, and a control unit that controls them based on mounting data. Each transport mechanism includes an upstream side operation area and a downstream side operation area. When the mounting data corresponds to an independent mounting mode in which each of the mounting heads is used to mount a component only onto a board on a corresponding mechanism, the control unit performs a control so that the upstream side operation area is used as a mounting area. When the mounting data corresponds to an alternating mounting mode in which both mounting heads are used to mount the components sequentially onto a board that is first carried into the downstream side operation area, the control unit performs a control so that the upstream side operation area is used as a standby area.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: April 10, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Michiaki Mawatari
  • Patent number: 9935028
    Abstract: A method for assembling a packaged integrated circuit is provided. The method includes placing a die into a cavity of a package base, securing the die to the package base with a die attach adhesive, printing a bond connection between a die pad of the die and a lead of the package base or a downbond, and sealing a package lid to the package base.
    Type: Grant
    Filed: December 28, 2013
    Date of Patent: April 3, 2018
    Assignee: Global Circuit Innovations Incorporated
    Inventor: Erick Merle Spory
  • Patent number: 9935053
    Abstract: An electronic component integrated substrate includes a first substrate including a first pad, a first solder resist layer provided with a first open portion that selectively exposes the first pad, and a connection pad formed on the first solder resist layer, and electrically connected to the first pad; a second substrate, stacked on the first substrate, including a second pad, and a second solder resist layer formed on the second pad and provided with a second open portion that selectively exposes the second pad; an electronic component mounted on the first substrate and sandwiched between the first substrate and the second substrate; and a substrate connection member that electrically connects the connection pad and the second pad with each other, the diameter of the connection pad being larger than each of the diameter of the first pad and the diameter of the second open portion.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: April 3, 2018
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Satoshi Shiraki, Koichi Tanaka
  • Patent number: 9908775
    Abstract: A transfer method, manufacturing method, device and electronic apparatus of MEMS. The method for MEMS transfer, comprising: depositing a laser-absorbing layer on a first surface of a laser-transparent carrier; forming a MEMS structure on the laser-absorbing layer; attaching the MEMS structure to a receiver; and performing a laser lift-off from the side of the carrier, to remove the carrier. A transfer of high-quality MEMS structure can be achieved in a simple, low cost manner.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: March 6, 2018
    Assignee: Goertek Inc.
    Inventors: Quanbo Zou, Zhe Wang
  • Patent number: 9882275
    Abstract: A handheld device can include an encasing, one or more appurtenances associated with the encasing, communications circuitry contained within the encasing, and antenna elements. The antenna elements can be electrically coupled to the communications circuitry and integrated with the encasing and the one or more appurtenances. The appurtenances can include any of a touch-sensitive display screen, a button, a joystick, a click wheel, a scrolling wheel, a touchpad, a keypad, a keyboard, a microphone, a speaker, a camera, a sensor, a light-emitting diode, a data port, or a power port.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: January 30, 2018
    Assignee: ESSENTIAL PRODUCTS, INC.
    Inventors: Andrew E. Rubin, Matthew Hershenson, David John Evans, V, Xiaoyu Miao, Xinrui Jiang, Joseph Anthony Tate, Jason Sean Gagne-Keats
  • Patent number: 9872393
    Abstract: A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: January 16, 2018
    Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.
    Inventor: Tzu-Chien Yeh