Abstract: A floating carrier device is configured to support at least one solar element floating on a water body, in particular an inland water body, with at least one floating body and with a carrier structure which is coupled with the floating body and is configured to transfer a support force of the at least one solar element to the at least one floating body.

Abstract: The present disclosure is directed to semiconductor dies and methods that provide a glass substrate, a pulsed laser tool to produce a line-shaped modification to the glass substrate for forming a plurality of structures in the glass substrate. The pulse laser tool may be provided with a predetermined pattern for its movement. The predetermined pattern moves the pulsed laser tool in a series of single steps in a first axial direction and in a series of plural lateral steps in a second axial direction that is perpendicular to the first axial direction, in particular, the single step is followed by the plural lateral steps in a repeating sequence. The series of plural lateral steps form an assembly of line-shaped modifications in parallel rows on the glass substrate, and thereafter the plurality of structures may be formed from the parallel rows of line-shaped modifications in the glass substrate.

Abstract: A component mounter includes a component supply device equipped with a bulk feeder for supplying multiple components in a bulk state to a supply region for the components, a camera configured to image the supply region, an image processing section configured to execute image processing for distinguishing a region of at least a part of the component from a region of a background in image data acquired through imaging by the camera based on brightness, and a state recognition section configured to recognize a supply state of the component based on at least one of an area and a shape of a component region occupied by at least the part of the component in the image data on which the image processing has been executed.

Abstract: A component mounter includes a camera configured to image the supply region, an image processing section configured to execute image processing on image data acquired by imaging of the camera to recognize an accommodation state of the component for each of the multiple cavities and acquire accommodation information in which the accommodation state of the component is associated with a unique address for each of the multiple cavities, and an operation control section configured to execute a collection operation of the component accommodated in the cavity based on the accommodation information.

Abstract: A method for forming a semiconductor structure includes receiving a die; forming a dielectric layer to surround the die; removing a portion of the dielectric layer to form a first recess; disposing a first light blocking layer within the first recess; applying a dielectric paste over the first light blocking layer; removing a portion of the dielectric paste to form a second recess; disposing a second light blocking layer within the second recess; disposing a photoelectric device over the first light blocking layer and the second light blocking layer; forming a redistribution layer over the die, the dielectric layer and the photoelectric device; removing a portion of the redistribution layer to form a third recess over the photoelectric device; and coupling a light-conducting member to the photoelectric device through the third recess; wherein the second light blocking layer is separated from the first light blocking layer and the photoelectric device.

Abstract: A light-emitting substrate and a manufacturing method thereof are disclosed. In the embodiment of the present disclosure, by providing a groove on a base plate in the manufacturing method of the light-emitting substrate, the accuracy of coating the solder resist ink layer can be improved so as to reduce a distance between the solder resist ink layer and the pad assembly and avoid poor soldering or soldering failure caused by the overflow of the solder resist ink onto the pad.

Abstract: The component mounter includes a mounting control section that controls a mounting operation for a component by the mounting head based on a control program to execute a mounting process. In a recovery process of attempting to mount a component anew with a mounting position related to the mounting operation as a target position in a case where an error has occurred in the mounting operation, the mounting control section executes the mounting operation for the component by using a designated holder that is one of the multiple holders allocated to the target position in the mounting process as the designated holder.

Abstract: A positioning method includes detecting coordinates (X11, Y11) of a rotation center on a surface of a holding table with a first image capturing unit and stores the detected coordinates as a new first reference position, detecting coordinates (X21, Y21) of a rotation center on another surface of the holding table with a second image capturing unit and stores the detected coordinates as a new second reference position, calculating a first deviation between a previous rotation center on the surface of the holding table and the coordinates (X11, Y11), calculating a second deviation between a previous rotation center on the other surface of the holding table and the coordinates (X21, Y21), correcting a coordinate system of images captured by the first image capturing unit to eliminate the first deviation, and correcting a coordinate system of images captured by the second image capturing unit to eliminate the second deviation.

Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. A tape is disposed over the semiconductor die. An encapsulant is deposited over the substrate, semiconductor die, and tape. The tape is removed to leave a cavity in the encapsulant over the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. A heat spreader is disposed over the shielding layer. The heat spreader includes a protrusion extending into the cavity of the encapsulant.

Abstract: A dual-aperture zoom camera comprising a Wide camera with a respective Wide lens and a Tele camera with a respective Tele lens, the Wide and Tele cameras mounted directly on a single printed circuit board, wherein the Wide and Tele lenses have respective effective focal lengths EFLw and EFLT and respective total track lengths TTLw and TTLT and wherein TTLw/EFLw>1.1 and TTLT/EFLT<1.0. Optionally, the dual-aperture zoom camera may further comprise an optical OIS controller configured to provide a compensation lens movement according to a user-defined zoom factor (ZF) and a camera tilt (CT) through LMV=CT*EFLZF, where EFLZF is a zoom-factor dependent effective focal length.

Abstract: A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.

Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.

Abstract: A circuit board according to an embodiment includes an insulating layer; a second outer circuit pattern disposed on an upper surface of the insulating layer; and a via disposed in the insulating layer and connected to the second outer circuit pattern; wherein the second outer circuit pattern includes: a first pattern embedded in the insulating layer and having a first width; and a second pattern protruding on the upper surface of the insulating layer, having a second width greater than the first width, and connected to the first pattern through the via.

Abstract: A light fixture, including: a printed circuit board (PCB) extending in a first direction, the PCB includes bends along one or more sides extending in the first direction for rigidity; the PCB configured to transfer thermal heat directly to ambient air; and one or more groups of light emitting diodes (LEDs) operatively coupled to a component-side of the PCB and between the bends.

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a first circuit pattern buried in a lower region of the first insulating layer and including a first via pad; a second circuit pattern disposed between the first insulating layer and the second insulating layer and including a second via pad; a third circuit pattern buried in an upper region of the second insulating layer and including a third via pad; a first via disposed in the first insulating layer and connecting the first via pad and the second via pad; and a second via disposed in the second insulating layer and connecting the second via pad and the third via pad, and wherein at least one of an upper surface and a lower surface of the second via includes a convex portion in an upward or downward direction.

Abstract: Disclosed is a lighting control method and a lighting control device for a light source having LEDs, and a lighting device and includes acquiring the number of LEDs and a control curve for controlling changes in brightness and color of the light emitted from each LED over time, the control curve defines the same brightness cycle and color cycle for each LED, the brightness cycle indicates a brightness period and a brightness curve of the change in brightness over time within each period, determining a time offset on the control curve according to the number of LEDs and the brightness change period, determining the starting timings of the remaining LEDs on the control curve according to the starting timing of the first LED and the time offset, and controlling each LED from the starting timing on the control curve, to emit light according to the brightness and color determined.

Abstract: A work system includes a mounting system which mounts a component on a board and an unmanned conveyance system having an unmanned conveyance vehicle. The unmanned conveyance system includes a first notifier which notifies the mounting system of an arrival notification indicating that the unmanned conveyance vehicle transfers the feeder carriage to a position where an operation of connecting the feeder carriage to the base starts, and a first processor which causes the unmanned conveyance vehicle to travel in a direction away from the base upon receiving, from the mounting system, a connection completion indicating that a connection of the feeder carriage is completed. The mounting system includes a second processor which causes the connection mechanism to connect the feeder carriage upon receiving the arrival notification, and a second notifier which notifies the unmanned conveyance system of the connection completion upon being informed of completion of the connection.

Abstract: The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.

Abstract: A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

Abstract: A semiconductor substrate structure including a first group of circuit structure, a second group of circuit structure, and a first device is provided. The first group of circuit structure includes multiple first wiring layers and multiple first conductive connectors, and each of the first conductive connectors includes a conductive cap. The second group of circuit structure includes multiple second wiring layers and multiple second conductive connectors. The first group of circuit structure and the second group of circuit structure are electrically connected through bonding of the first conductive connectors and the second conductive connectors to form a multilayer redistribution structure. The first device is disposed on the first group of circuit structure and electrically connected to portion of the first conductive connectors or the first device is disposed on the second group of circuit structure and electrically connected to portion of the second conductive connectors.

Abstract: A method (100) of manufacturing a lead for an implantable medical device. The method includes: depositing (110) a base layer (3) of biocompatible, electrically non-conductive material; depositing (120) one or more complementary layers (5) of biocompatible, electrically non-conductive material to the base layer (3), wherein the base layer (3) and complementary layer (5) form at least one slot (7); and depositing (130) biocompatible, electrically conductive material (9) into the slot (7). There is also disclosed a lead for an implantable medical device and an apparatus (41) to manufacture the lead.

Abstract: An antenna substrate includes a body in which a plurality of insulating layers are stacked, a first antenna layer including a plurality of first pattern layers disposed on the plurality of insulating layers and a plurality of first conductive via layer penetrating through the plurality of insulating layers to connect the plurality of first pattern layers in a stacking direction of the plurality of insulating layers and having a bar shape, and a second antenna layer extending from at least one of an uppermost portion or a lowermost portion of the first antenna layer on the insulating layer of the body.

Abstract: A management apparatus for an accommodation member that accommodates components to be mounted on a board includes a memory to reserve identification information on the accommodation member required for a production of the board to each arrangement position of the accommodation member in the mounting device, and to store reservation information defining an order of use of multiple accommodation members for each production at the same arrangement position according to the number of components required for the production; and a management section configured to set the accommodation member scheduled to be finally used at each arrangement position in each production of the board based on the reservation information as a final accommodation member, and to manage the final accommodation member and other accommodation members other than the final accommodation member based on the identification information on the accommodation members in a distinguishable manner for an operator.

Abstract: A component type management device includes an association registration section configured to register association data in which individual identification information of a component supply device which is attached to a component mounter and supplies a component is associated with a type of the component held in the component supply device, an association discarding section configured to discard the association data in a case where a predetermined condition is satisfied after the component supply device is detached from the component mounter, a detachment discrimination section configured to discriminate whether the component supply device is detached by an automatic exchanging device; and an association maintaining section configured to invalidate a function of the association discarding section before the predetermined condition is satisfied and maintain the association data in a case of being discriminated that the component supply device is detached by the automatic exchanging device.

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

Abstract: A sensor includes a film portion deformable by external force, a support body supporting the film portion, and a magnetoresistive element portion on the film portion and including a unit element that includes a first magnetic layer whose magnetization direction changes in accordance with deformation of the film portion, a second magnetic layer whose magnetization direction is fixed, and an intermediate layer between the first and second magnetic layers. The film portion includes a first side portion in a portion of an outer edge of the film portion. A slit portion is provided in the film portion and includes at least a portion along the first side portion, so that the film portion includes a connection portion in which the first side portion is partially connected to the support body. A magnetoresistive element portion is provided in the connection portion.

Abstract: A substrate module includes: a substrate having top and bottom surfaces and comprising, at the top surface, a plurality of first wiring regions and a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions; one or more power receiving devices disposed on the plurality of first wiring regions; a first connection component disposed on the plurality of second wiring regions, wherein the first connection component has opposite ends in a first direction; and a protected component disposed on the top surface of the substrate. In a top plan view, (i) the protected component is located between two straight lines passing through the respective opposite ends of the first connection component and extending in a second direction perpendicular to the first direction, and (ii) the protected component is located between the one or more power receiving devices and the first connection component.

Abstract: An allowable value setting device sets an allowable value of a deviation amount between a target pickup position and an actual pickup position in a component when the component is picked up by a suction nozzle. The allowable value setting device includes a first setting section and a second setting section. The first setting section sets a first allowable value, which is the allowable value for each component type of the component to be mounted on a board. The second setting section sets a second allowable value, which is the allowable value that is set for each mounting coordinate of the component and smaller than the first allowable value of the component of the same component type set by the first setting section, the second allowable value being preferentially adopted over the first allowable value in a suction process of the component.

Abstract: An energy management unit (EMU) is disclosed. The EMU including: a cold plate sandwiched between a first printed circuit board (PCB) and a second PCB, the cold plate comprising one or more magnetics; wherein the cold plate is configured to cool both the first PCB and the second PCB.

Abstract: A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

Abstract: A battery charger for vehicles comprises one outer container, an electronic board housed inside the container, operatively connectable to an electric battery of a vehicle and configured for the recharge of the battery, at least an electric component connected to the electronic board, and at least a support for housing the electric component, in which the support comprises an electric connection device/unit/component between the electric component and the electronic board.

Abstract: A high-frequency module and a communication device capable of suppressing deterioration of a noise figure of a low-noise amplifier are provided. A high-frequency module (1) includes a mounting substrate (2), a low-noise amplifier (12), an input switch (20), and a matching circuit (30). The input switch (20) is connected to an input terminal of the low-noise amplifier (12). The matching circuit (30) performs impedance matching between the input switch (20) and the low-noise amplifier (12). The matching circuit (30) is disposed on a first main surface (21) in a first direction (Dl) of the mounting substrate (2). The input switch (20) and the low-noise amplifier (12) are disposed on a second main surface (22) opposed to the first main surface (21). When the mounting substrate (2) is viewed in plan, the input switch (20) overlaps at least a part of the matching circuit (30).

Abstract: An information processing device is used in a mounting system that performs processing of mounting a component on a mounting target. The information processing device includes: a memory section configured to store multiple pieces of abutting part data including a shape of an abutting part that abuts against the component, multiple pieces of attachment part data including a shape of an attachment part to be attached to an attachment section to which a collection member for collecting the component is attached, and multiple pieces of connection part data including a shape of a connection part that connects the abutting part and the attachment part, in the collection member; and a control section configured to output one or more of the abutting part data, the attachment part data, and the connection part data stored in the memory section.

Abstract: A semiconductor substrate structure including a first group of circuit structure and a second group of circuit structure is provided. The first group of circuit structure includes multiple first wiring layers and multiple first conductive connectors, and each of the first conductive connectors includes a conductive cap. The second group of circuit structure includes multiple second wiring layers and multiple second conductive connectors. The first group of circuit structure and the second group of circuit structure are electrically connected through bonding of the first conductive connectors and the second conductive connectors to form a multilayer redistribution structure. A manufacturing method of the semiconductor substrate structure is also provided.

Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.

Abstract: In at least one embodiment, under the control of a robotic control system, a gripper on a robot is positioned to grasp a 3-dimensional object. In at least one embodiment, the relative position of the object and the gripper is determined, at least in part, by using a camera mounted on the gripper.

Abstract: A mounting device comprises a recognition mechanism and a control unit. The recognition mechanism recognizes a chip recognition mark and a substrate recognition mark through a mounting head and from above the mounting head and is movable in an in-plane direction of a substrate surface of a substrate. The control unit is connected to the recognition mechanism, calculates an amount of misalignment between a chip component and the substrate from position information about the chip recognition mark and the substrate recognition mark obtained from the recognition mechanism, and performs positioning by driving the mounting head and/or the substrate stage according to the amount of misalignment. The recognition mechanism has a chip recognition sensor for recognizing the chip recognition mark and a substrate recognition sensor for recognizing the substrate recognition mark provided independently so that focal positions thereof are different via a common optical axis path.

Abstract: A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

Abstract: An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc?1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.

Abstract: A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

Abstract: An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head.

Abstract: An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a stacking direction, and including a first surface and a second surface opposing each other in the stacking direction, a first through electrode penetrating the body and connected to the first internal electrode; a second through electrode penetrating the body and connected to the second internal electrode, first and second external electrodes disposed on the first surface and the second surface, respectively, and connected to the first through electrode, third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through electrode, and an identifier disposed on the first surface or the second surface of the body, and the first and second through electrodes protrude from the first surface of the body.

Abstract: An OLED display device and a method of fabricating the same are disclosed. The OLED display device includes a substrate including a display area provided with an organic light emitting element and a pad area provided with a plurality of pads, the pad area formed around the display area, an encapsulation layer formed on the substrate such that the encapsulation layer covers the organic light emitting element, and a dam formed between the display area and the pad area, the dam controlling flow of an organic film material constituting the encapsulation layer.

Abstract: A semiconductor device having a three-dimensional structure includes a first wafer including a first bonding pad on one surface thereof; a second wafer including a second bonding pad, which is bonded to the first bonding pad, on one surface thereof bonded to the one surface of the first wafer; a plurality of anti-warpage grooves on the one surface of the first wafer, and laid out in a stripe shape; and a plurality of anti-warpage ribs on the one surface of the second wafer and coupled respectively to the plurality of anti-warpage grooves, and laid out in a stripe shape.

Abstract: An electronic device is provided, the electronic device includes a driving substrate (13), the driving substrate includes a plurality of circular grooves and a plurality of rectangular grooves, and a plurality of disc-shaped electronic components, at least one disc-shaped electronic component is disposed in at least one circular groove, an alignment element positioned on a top surface of the at least one disc-shaped electronic component, a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment element is defined as r, a width of at least one rectangular groove among the rectangular grooves is defined as w, and a height of the at least one rectangular groove is defined as H, and the disc-shaped electronic component and the rectangular groove satisfy the condition of (R+r)/2>(w2+H2)1/2.

Abstract: There is provided a component mounter including: a plurality of transport lanes for transporting a board sorted by a board sorting device; a congestion index calculator for calculating a congestion index indicating a congestion degree of each of the plurality of transport lanes; a transport lane determiner for determining a transport lane for carrying in the board among the plurality of transport lanes based on the calculated congestion index; and an outputter for outputting a board request signal for requesting to carry the board into the transport lane determined by the transport lane determiner, to the board sorting device.

Abstract: A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.