Abstract: According to a method and in a device for placing a component on a substrate, a component is moved in a supply direction until it abuts against a stop. The component is then moved at least in a vertically extending pick-up direction and subsequently positioned on the substrate. The component is pivoted near said stop, about a pivot axis that extends transversely to the supply direction and the pick-up direction.

Abstract: In an electronic component mounting process for mounting electronic components (6) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual heater, and a time taken for the mounting operation is so allotted that a first heating time of a duration from a moment when the suction nozzle comes into contact with the electronic component for picking it up till another moment immediately before it begins a mounting motion to the substrate is longer than a second heating time of a duration from the moment when the suction nozzle begins the mounting motion till another moment when it leaves the electronic component mounted to the substrate.

Abstract: The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed according to component library data stored in a RAM. According to “normal” data as a check condition in the component library data, a recognition processing device checks whether leads indicated by group numbers “1” and “2” exist or not in the electronic component, on command of a CPU. When all the leads are detected, the CPU commands the recognition processing device to calculate an amount of shifting from a proper position based on an image taken by a component recognition camera, and a position and an angle of the electronic component are calculated. Next, the recognition processing device performs an absence check of leads which must not exist in the electronic component.

Abstract: A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzles, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head sections performs successive suction, recognition, posture adjustment, and mounting of the components.

Abstract: An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: A method for manufacturing a printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes loading an insulation substrate in which an align mark is formed, loading an imprinting mold in which a first align hole is perforated in correspondence with the align mark, aligning the insulation substrate and the imprinting mold by perceiving the align mark through the first align hole, and compressing the imprinting mold and the insulation substrate together such that the intaglio pattern is formed in correspondence with the raised pattern, it is possible is to use an existing optical system for an imprinting process in aligning an opaque imprinting mold and an insulation substrate, without installing expensive alignment instruments, and to manufacture several insulation substrates having circuit patterns by sequentially loading and aligning several imprinting molds and insulation substrates and compressing simultaneously.

Abstract: A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land not covered with the resist. The board recognition mark is defined by an area of the conductive foil exposed from a resist opening having the same shape and size as the conductive foil.

Abstract: Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a step of identifying absolute positions of the recognition marks by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition device. A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition device, and significantly reduce the alignment time and mounting tact.

Abstract: An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the to which the component (6) is attached.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not.

Abstract: A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

Abstract: The present invention provides a measurement apparatus for obtaining a suitable position on a suspension where a more miniature magnetic head slider is to be mounted to the suspension, the apparatus including a front camera having a photographing optical axis within a plane parallel to a plane of extension of a suspension and directed to the suspension, and a side camera having a photographing optical axis within the parallel plane and which is different from that of the front camera. Coordinates of a top portion of a convex surface of a dimple formed in the suspension are obtained with these cameras. The resultant coordinates and coordinates of the deepest portion of a recess surface of the dimple are correlated with each other, whereby in actual mounting of the magnetic head slider, the deepest portion of the recess surface of the dimple which is readily recognized is measured.

Abstract: A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorbing the electronic components by descending at least one nozzle spindle; rotating at least one rotation housing and rotating nozzle spindles to which the electronic components are absorbed, thereby correcting positions of the electronic components absorbed to the nozzle spindles depending on an inclination angle of specified positions for mounting the electronic components to a printed circuit board; moving the absorbed electronic components over the printed circuit board; and mounting the absorbed electronic components to the specified mounting positions of the printed circuit board.

Abstract: In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10, an image of a supply portion reference mark provided at a mark post 18 of the component supply portion 2 is taken by a second camera 35 moved by a camera moving mechanism, a camera coordinates system is calibrated based on a result of taking the image, thereafter, a position of the chip 6 is recognized by the second camera 35 and the chip 6 is picked up by a mounting head based on a result of the recognition. Thereby, stable pick up accuracy can be ensured by calibrating an aging variation of the coordinates system owing to thermal elongation or contraction of the camera moving mechanism.

Abstract: A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Abstract: In an image processing device capable of collectively estimating an object based upon results of plural times of inspection, regions (1(1)) and (1(2)) to be photographed are defined on opposite end portions of an object (w). When an image of the left end portion of the object (w) is captured in response to a first trigger, the image processing device acquires corresponding image data, and the length (x1) of a projection extending in the x-direction at the left end of the object (w). When an image of the right end portion of the object (2) is next captured in response to a second trigger, the image processing device captures corresponding image data and measures the length (x2) of a projection extending in the x-direction at the right end of the work (w). Thereafter, the device finds the sum (x1+x2) of the lengths (x1, x2) inside, and outputs a result externally.

Abstract: A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality of first dies, each one comprising at least one of the active areas; mounting the plurality of first dies, which are already equipped with the adhesive layer, on a support; and mounting a plurality of second dies on the adhesive layer.

Abstract: A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and reprocessing. The semiconductor device holder holds each individual die in a separate processing cavity configured to hold each individual die in a predetermined processing position. In one embodiment, a vacuum force is used to hold one or more dies in respective processing cavities with a predetermined level of force even if other adjacent die processing cavities are unoccupied by other individual dies.

Abstract: A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon at an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.

Abstract: In an electronic component mounting method, a camera transporting mechanism transports a camera to a component supplying unit to take an image of a component. Thereafter the camera is evacuated from an upper area of the component. The image taken by the camera is processed by a recognition processing unit to acquire a position of the component. A mounting head transporting mechanism positions the mounting head to the component based upon the recognition processing unit, and the component is picked up by the mounting head. Another camera transporting mechanism transports another camera over a board to take an image of the board. Thereafter, the camera is evacuated from an upper area of the board. The image taken of the board is processed by another recognition processing unit to determine a mounting position. The mounting head then positions the component on the board based upon the determined mounting position.

Abstract: A contact of a component is electrically connected to an associated contact of an electrical circuit, typically formed on a substrate, by depositing material between the contacts, the material forming or being processed to form an electrical connection between the contacts. The invention also provides apparatus for this purpose and a resulting circuit.

Abstract: A method and system for maximizing process capability in a progressive forming operation. The method compensates for deviations introduced by unformed components, and uses closed loop feedback to compensate for deviations introduced by forming tools. Fiducial features are detected on an incoming component, and a first compensation value is calculated from displacement of the fiducial features from an ideal forming location on the component. Component position with respect to a theoretical forming position is adjusted according to the first compensation value. Placement of a feature formed on the component at the adjusted position is detected and compared to the ideal forming location to obtain a difference value. A second compensation value is derived from a plurality of difference values. Forming positions for subsequent incoming components are adjusted with respect to the theoretical forming position according to first and second compensation values.

Abstract: A system for transferring electrical components. The system may comprise a plurality of electrical components. Each of the components may include leads and a physically asymmetric fiducial marker that structurally alters a physical appearance of the components. The system may also comprise a nest having a nest surface that defines a recess shaped to receive any one of the plurality of components only when the component is oriented such that the component's fiducial marker is received by a corresponding asymmetric portion of the nest surface. In addition, the system may comprise a component feed assembly for feeding the plurality of components to the nest, a component alignment detector, and a pick and place machine having a movable pick head. The movable pick head may have access to the component feed assembly and the recess of the nest.

Abstract: A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the component is situated on the electrodes. The printing positions of the solders are stored. Mounting position data for where the component is to be mounted on the solders is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Abstract: A suction head is inserted between first and second cameras relatively disposed facing one another with aligned optical axes, so that the first camera takes images of a head reference mark on the suction head, and the second camera of a first part suctioned to the suction head. Next, a stage is inserted between the first and second cameras so that the first camera takes images of a second part held on the stage, and the second camera of a stage reference mark thereupon. The relative positions between the first part and the suction head, and between the second part and the stage, are calculated based upon image information from the cameras, and the suction head and the stage are positioned, the first and second parts being relatively positioned based upon positional information and relative positional information from the first and second cameras, and mounting is performed.

Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Abstract: The present invention features a method wherein a component in a multi-head component placement machine is rejected during the placement cycle. A component is imaged and the image processed using an automated vision system. The image processing determines whether the component is placeable based upon a comparison of the component image to preprogrammed mechanical parameters for the component. A non-placeable component is rejected into a reject station, which is contiguous with the head. Because a component can be rejected during the placement cycle, there is no slowdown of the placement machine cycle rate.

Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

Abstract: Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Abstract: An apparatus and method for force mounting semiconductor packages onto printed circuit boards without the use of solder. The apparatus includes a substrate, a first integrated circuit die mounted onto the substrate, a housing configured to house the first integrated circuit die mounted onto the substrate, and a force mechanism configured to force mount the housing including the integrated circuit die and substrate onto a printed circuit board. The method includes mounting a first integrated circuit die onto a first surface of a substrate, housing the first integrated circuit die mounted onto the substrate in a housing, and using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit board. According to various embodiments, the force mechanism includes one of the following types of force mechanisms clamps, screws, bolts, adhesives, epoxy, or Instrument housings or heat stakes.

Abstract: A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: A method for obtaining confidence measure of a ball grid array (BGA) model having a plurality of balls in semiconductor surface mounted devices is provided. The method comprises the steps of extracting BGA images from a real surface mounted device, generating a BGA ball model and a BGA body model, generating a first confidence measure of the BGA ball model wherein the first confidence measure includes a first standard deviation of the BGA ball model and a first local image contrast of each BGA ball, and generating a second confidence measure of the BGA body model wherein the second confidence measure includes a second standard deviation of the BGA body model and a second local image contrast of the BGA body.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.

Abstract: A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is to be transferred, adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on one of the substrates (a reference substrate) and alignment marks formed on other two of the substrates are aligned with each other, and transferring the object to be transferred from the first substrate to the second substrate, the transferring step including irradiating the object to be transferred from the first substrate with light transmitted through the mask substrate.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: A formation surface of electrodes and a formation surface of leads are imaged along an axis which intersects an XY plane at right angles. A projected image of the formation surface of the electrodes and the formation surface of the leads is obtained, the projected image being projected onto a plane which intersects the Z axis at right angles. A difference between an image of one of the electrodes and an image of one of the leads in the projected image is calculated. A deformation value of at least one of a substrate and a semiconductor chip due to expansion or shrinkage is calculated, the deformation value being necessary for eliminating the difference. A change in temperature of at least one of the substrate and the semiconductor chip is calculated the change in temperature being necessary for obtaining the deformation value. The temperature of at least one of the substrate and the semiconductor chip is changed based on the change in temperature.

Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and receives discs and spacers to be stacked, disc pushers which are slidably provided outside the hub unit and include corresponding pressure members which center the discs by pushing circumferences of the discs, a driving unit which slides the disc pushers, and biasing units which are slidably provided outside the hub unit and push circumferences of the spacers. Accordingly, by performing a spacer biasing along with a disc centering, the accuracy of a centering is increased, thereby providing the discs having data recorded thereon with a uniform quality. Additionally, vibration of a rotation body can be minimized due to the simple configuration of the disc centering device. Furthermore, the productivity and manufacturability of HDDs are improved in view of the simplified maintenance and repair of the same.

Abstract: An electronic component holding head, an electronic component mounting apparatus using same, and a method for mounting an electronic component, are provided for use in mounting an electronic component having a positioning mark formed on a film member.

Abstract: Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not only mounted component inspection for determining a mounted state of a chip component mounted in the preceding step but also component fly inspection for determining whether a chip component is flown to a position where a odd-shaped component is mounted in the next step C. It is possible to execute the component fly inspection in accordance with a condition corresponding to the situation of an actual spot such as a case in which it is detected that a component is missing in mounted component inspection or a case in which the replacement date of an attracting nozzle in a high-speed mounter is approaching.

Abstract: In an electronic component mounting apparatus capable of replacing a component placing device with any of plural other component placing devices different in performance, the distance between the center line of a component pick-up portion of a replaced component placing device and the optical axis of a board recognizing camera is calibrated easily and precisely. A movable table is positioned so that a reference mark provided on a base frame to reside in the visual field of a component recognizing camera comes in the visual field of a board recognizing camera and that at the same time, the end of the component pick-up portion of the replaced component placing device comes in the visual filed of the component recognizing camera.

Abstract: A circuit board with an asymmetrical structure and a method for fabricating the same are proposed. A core circuit board is provided, with a build-up structure being formed on a side of the core circuit board, and a laminated structure being formed on an opposite side of the core circuit board, such that the build-up structure and laminated structure on two sides of the core circuit board can be mutually balanced. Then, the build-up process and the laminated process can be repeated on the two sides of the core circuit board to form more build-up structures and at least one more laminated structure having preferable rigidity to counteract warpage of the core circuit board caused by fabrication of the build-up structures, wherein the number of the build-up structures can be larger than the number of the laminated structures thereby forming a circuit board with an asymmetrical structure.

Abstract: A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.

Abstract: A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.