Abstract: This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.

Abstract: Various embodiments include a camera with folded optics and lens shifting capabilities. In some examples, a folded optics arrangement of the camera may include one or more lens elements and one or more light path folding elements (e.g., a prism). Some embodiments include voice coil motor (VCM) actuator arrangements, carrier arrangements, and/or suspension arrangements to provide autofocus (AF) and/or optical image stabilization (OIS) movement. Furthermore, some embodiments include position sensor arrangements for position sensing with respect to AF and/or OIS movement.

Abstract: A measurement and reconstruction method for a turbine blade strain field of with integrates an imaging technology and an infrared photoelectric measurement technology. The imaging technology is mainly responsible for the measurement of the strain field on a target blade surface, so as to use a digital image processing technology to obtain blade strain field data. The infrared photoelectric measurement technology is mainly aimed at the strain at blade edges, which uses temperature difference between the blade edges and blade gaps to perform strain measurement. Measurement results of the two modes are finally converted into blade strain parameters, thereby reconstructing the target blade strain field based on host computer software.

Abstract: A lamp head for a Christmas light including: a lamp head shell, defining a mounting hole for an external wire to pass through; a light-emitting inner-core assembly, including a light-transmitting lampshade, a patch lamp board, and a fixing seat; wherein an end of the light-transmitting lampshade is connected to the fixing seat, and the patch lamp board is arranged inside the light-transmitting lampshade; the light-transmitting lampshade is filled with a potting adhesive; the patch lamp board is arranged with two leads, and the two leads pass through the potting adhesive and are threaded out from the fixing seat; the fixing seat is inserted and connected in the mounting hole, and the two leads are electrically connected to the external wire.

Abstract: A circuit can include a galvanic coupling of a coupler to a qubit by a segment of kinetic inductance material. The circuit can include a galvanic kinetic inductance coupler having multiple windings. The circuit can include a partially-galvanic coupler having multiple windings. The partially-galvanic coupler can include a magnetic coupling and a galvanic coupling. The circuit can include an asymmetric partially-galvanic coupler having a galvanic coupling and a first magnetic coupling to one qubit and a second magnetic coupling to a second qubit. The circuit can include a compact kinetic inductance qubit having a qubit body loop comprising a kinetic inductance material. A multilayer integrated circuit including a kinetic inductance layer can form a galvanic kinetic inductance coupling. A multilayer integrated circuit including a kinetic inductance layer can form at least a portion of a compact kinetic inductance qubit body loop.

Abstract: Josephson junction based memory devices and methods for their use are described herein. An example Josephson junction based memory device includes a plurality of superconducting loops. Each superconducting loop includes at least one Josephson junction. The plurality of superconducting loops are electrically coupled. The plurality of superconducting loops include a plurality of input loops, a plurality of readout loops, and at least one shared loop. The plurality of superconducting loops are configured to store or annihilate magnetic flux quanta in one or more of the superconducting loops in response to a combination of control signals and single flux quantum (SFQ) pulses.

Abstract: The disclosure provides a touch module, a touch display panel and a display device. Each touch electrode includes a plurality of electrode blocks arranged along an extending direction, and electrode blocks belonging to other touch electrodes are distributed in an area where at least part of all the electrode blocks are located, which makes full use of an interior area of a traditional touch pattern and increases a coupling area between the touch electrodes. When touch occurs, an amount of change in a mutual capacitance value between the touch electrodes will be significantly increased, thereby increasing touch sensitivity.

Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.

Abstract: A flex circuit that may accommodate movement of an image sensor within a camera. The flex circuit generally includes a plurality of planar segments between a first end that is fixed relative to the image sensor and a second end that is fixed relative to one or more camera components. One or more of the planar segments twists when the image sensor is moved within the camera.

Abstract: In accordance with an embodiment of the application a method of forming an integrated magnetic device is described. A prepreg or core is mounted on a carrier. A winding layer is plated and patterned on the prepreg or core. Vias are plated. The silicon is placed on a die attach pad, ensuring sufficient clearance of die to vias and d/a char. The assembly is laminated and grinded to expose the vias. A 2nd layer of vias is provided by sputtering or plating followed by laminating assembly; and grinding assembly to expose vias. The windings are plated and patterned. A solder mask (SMSK) is applied and assembly finished.

Abstract: Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a “yard,” or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.

Abstract: A display device includes: a flexible substrate; a plurality of conductive lines on the flexible substrate; a thin film transistor connected to the plurality of conductive lines; and an organic light emitting element connected to the thin film transistor. As a curvature of an area of the flexible substrate increases, a width or a thickness of each of the conductive lines increases.

Abstract: A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.

Abstract: A package structure is provided. The package structure includes a redistribution structure over a substrate, a semiconductor die over the redistribution structure and electrically coupled to the substrate, and an underfill material over the substrate and encapsulating the redistribution structure and the semiconductor die. The underfill material includes an extension portion overlapping a corner of the semiconductor die and extending into the substrate.

Abstract: A medical instrument includes a shaft, multiple flexible spines and multiple electrodes. The shaft is configured for insertion into a body of a patient. The multiple flexible spines have respective first ends that are connected to a distal end of the shaft and respective second ends that are free-standing and unanchored. The spines are bent proximally such that the second ends are more proximal than the first ends. Each of the flexible spines includes a tensile layer configured to cause the flexible spine to bend proximally. The multiple electrodes are disposed over the flexible spines.

Abstract: Embodiments include packages and methods for forming packages which include interposers having a substrate made of a dielectric material. The interposers may also include a redistribution structure over the substrate which includes metallization patterns which are stitched together in a patterning process which includes multiple lateral overlapping patterning exposures.

Abstract: A system for calculating. A scratch memory is connected to a plurality of configurable processing elements by a communication fabric including a plurality of configurable nodes. The scratch memory sends out a plurality of streams of data words. Each data word is either a configuration word used to set the configuration of a node or of a processing element, or a data word carrying an operand or a result of a calculation. Each processing element performs operations according to its current configuration and returns the results to the communication fabric, which conveys them back to the scratch memory.

Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

Abstract: Embodiments described herein relate generally to methods for forming a conductive feature in a dielectric layer in semiconductor processing and structures formed thereby. In some embodiments, a structure includes a dielectric layer over a substrate, a surface modification layer, and a conductive feature. The dielectric layer has a sidewall. The surface modification layer is along the sidewall, and the surface modification layer includes phosphorous and carbon. The conductive feature is along the surface modification layer.

Abstract: Disclosed herein are embodiments including electrical structures that includes a first cell, a first inductor, a first resistor, and a first shunted Josephson junction. The first inductor is connected in series with the first shunted Josephson junction at a first terminal end of the first inductor and a second terminal end of the first inductor is connected to a feed point of the first cell being powered. A first end of the first resistor having connected to ground and a second end being connected to the first shunted Josephson junction at a terminal of the first shunted Josephson junction that is not connected to the first inductor. A source of an electrical current source that is external to the first cell is connected to the first shunted junction and the first resistor at a common point.

Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Abstract: An EMI resistant electronics enclosure (200) is provided having a first compartment (206) and a second compartment (207), each defined by a body (205), being separated by a septum (208). A first aperture (209) in the septum (208) connects the first compartment (206) and the second compartment (207). A feed-through element (210) is provided having a first interface region (211) and a second interface region (212), wherein one or more primary conductors (217) extend between the first interface region (211) and the second interface region (212), and wherein the first interface region (211) resides in the first compartment (206), and the second interface region (212) resides in the second compartment (207). A conductive bar (232) circumscribes at least a portion of the feed-through element (210), and a conductive gasket (220) extends from the body (205) to the conductive bar (232), wherein a ground path is formed between the body (205) and the conductive bar (232) with the conductive gasket (220).

Abstract: A circuit board is mounted on a camera module with a shake correction function. The circuit board includes a first reference portion extending from a first side in a first direction to a second side in the first direction, a first coupled portion extending from the second side in the first direction to the first side in the first direction, a first direction first bent portion connected to each of an end portion on the second side in the first direction of the first reference portion and an end portion on the second side in the first direction of the first coupled portion, and a second direction extending first portion extending in a second direction orthogonal to the first direction from the first coupled portion.

Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a chip structure including a substrate and a wiring structure over a first surface of the substrate. The method includes removing a first portion of the wiring structure adjacent to the hole to widen a second portion of the hole in the wiring structure. The second portion has a first width increasing in a first direction away from the substrate. The method includes forming a first seed layer over the wiring structure and in the hole. The method includes thinning the substrate from a second surface of the substrate until the first seed layer in the hole is exposed. The method includes forming a second seed layer over the second surface of the substrate and the first seed layer in the hole.

Abstract: An example system includes a first circuit board having first conductive traces, where a first conductive trace is for conducting an alternating current (AC) digital signal having an edge; a second circuit board having second conductive traces, where a second conductive trace is within a predefined distance of the first conductive trace to produce a contactless coupling with the first conductive trace, and where the contactless coupling enables electrical energy on the first conductive trace to manifest on the second conductive trace as a transient response that is based on the edge; and circuitry to reconstruct the edge based on the transient response from the second conductive trace.

Abstract: A capacitor component includes a body including a capacitance formation portion including a plurality of unit devices including a first internal electrode, a first dielectric film surrounding the first internal electrode, and a second internal electrode surrounding the first dielectric film, and a molded portion surrounding the capacitance formation portion, first and second external electrodes respectively disposed on a first surface and a second surface of the body opposing each other in a first direction to be respectively connected to the first and second internal electrodes. Cross-sections perpendicular to the first direction of at least two of the plurality of unit devices have a polygonal shape.

Abstract: The present application provides a display panel and a display device. The display panel includes sub-pixels with multiple colors and upper polarizing units with various structures. The upper polarizing units with the various structures are disposed one-to-one correspondence with the sub-pixels with the multiple colors to increase transmittance of transmitted light of each color through the upper polarizing units corresponding to the sub-pixels whose color is the same as the color of the upper polarizing units.

Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on the substrate, a cover over the substrate and IDT electrode, and hollow spaces between the IDT electrode and the cover. The hollow spaces are defined by partition supports between the substrate and the cover. The partition supports include a first and second partition supports extending in a first direction without contacting each other. The first and second partition supports each include first and second ends along the first direction. The first and second direction perpendicular to the first direction. The first end of the first partition support is closer to an outer periphery of the substrate than is the second end, and the first end of the second partition support is farther away from the outer periphery than is the second end.

Abstract: A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.

Abstract: A spur measurement system uses a first device with a spur cancellation circuit that cancel spurs responsive to a frequency control word identifying a spurious tone of interest. A device under test generates a clock signal and supplies the clock signal to the first device through an optional divider. The spur cancellation circuit in the first device generates sine and cosine weights at the spurious tone of interest as part of the spur cancellation process. A first magnitude of the spurious tone in a phase-locked loop in the first device is determined according to the sine and cosine weights and a second magnitude of the spurious tone in the clock signal is determined by the first magnitude divided by gains associated with the first device.

Abstract: An electrochromic article includes a first substrate having a first surface and an opposite second surface and a second substrate having a third surface and an opposite fourth surface separated from the first substrate. The second surface of the first substrate faces the third surface of the second substrate and a first electrode is positioned over at least a portion of the second surface of the first substrate. A second electrode is positioned over at least a portion of the third surface of the second substrate. A sealant material is positioned between the first electrode and second electrode. An electrochromic composition is positioned in direct contact with at least a portion of the first electrode and at least a portion of the second electrode. The sealant material is formed from an organic polymer material having an oxygen transmission rate (OTR) of less than or equal to 2 cc/m2·day·atm.

Abstract: An implantable electrode arrangement provides spatially-selective detection of neuronal electrical signals, which propagate along at least one nerve fiber contained in a nerve fascicle, and for selective electrical stimulation of the at least one nerve fiber, comprising a biocompatible carrier substrate, which has at least one carrier substrate region that can be placed around the nerve fascicle in a cuff and has a straight cylinder-shaped carrier substrate surface which faces the nerve fascicle in the implanted state. The carrier substrate surface has an axial extension and an extension oriented circumferentially in a direction and a first electrode arrangement attached thereto.

Abstract: A display apparatus according to an embodiment of the present invention includes a display unit having flexibility, at least one roller extending in a first direction to wind or unwind the display unit, a plurality of joints extending along an edge region of the display unit, and a housing in which the display unit, the roller, and the joints are accommodated and into/from which the display unit and the joints are inserted and withdrawn, wherein the display unit includes a display panel having flexibility and in which a display area displaying an image is changed as the display unit is wound around or unwound from the roller, a protective film disposed above the display panel, and a support panel disposed below the display panel.

Abstract: The present invention is to provide a touch sensor with a fingerprint sensor capable of making brightness uniform by removing a difference in brightness in a portion to which a touch sensor and the fingerprint sensor are applied, in which an output of a touch display device of uniform brightness may be obtained by applying dummy electrodes to a portion constituting the touch sensor to change a structure so that light transmittances of the fingerprint sensor and the touch sensor are the same as or similar to each other or controlling a portion at which the finger sensor is positioned in an entire region of a light emitting layer to be brighter than the rest portion by a control unit of touch display devices to which the fingerprint sensor according to various embodiments of the present invention is applied.

Abstract: A disk device according to one embodiment includes a magnetic disk, a magnetic head, and a flexible printed circuit board. The flexible printed circuit board is electrically connected to the magnetic head. The flexible printed circuit board includes a first layer, a second layer having conductive property, and a third layer having insulation property. The first layer includes a first surface having insulation property. The second layer overlays the first surface, and includes a first conductor and a second conductor spaced from the first conductor. The third layer covers at least a part of the first surface and at least a part of the second layer. The flexible printed circuit board is provided with a first hole that is located between the first conductor and the second conductor with spacing from the second layer and penetrates the third layer.

Abstract: Provided is a cable device having an improved electromagnetic interference (EMI) shielding performance. The cable device includes: a cable including an optical fiber; a connector including a printed circuit board connected to the cable and including a ground electrode, and a conductive case; a connecting member provided around a connection between the cable and the connector; and a metal shell surrounding the cable inside of the connecting member, the metal shell being configured to shield electromagnetic interference of the cable and the connector.

Abstract: A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via melting the solder paste at the solder pads.

Abstract: In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 ?m or less, or about 35 ?m or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.

Abstract: Methods for generating one or more atmospheric pressure plasma jets that can be used to deposit various types of conductive traces, coatings, and micro/nano-sized particles/structures on two or three dimensional body surfaces. The method includes generating atmospheric pressure plasma, nebulizing a precursor to generate an aerosol; receiving the aerosol from the nebulizer in a chamber; mixing the atmospheric pressure plasma with the aerosol from the chamber at a nozzle; and printing the plasma-exposed aerosol onto the surface of a substrate.

Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.

Abstract: A method for producing vaporizer units as a component of inhalers includes the steps: a) providing a flexible circuit board material with sites for individual vaporizer units, the material optionally prestructured with conductor paths and/or pre-punched areas predetermined in terms of position/course for each site; b) providing and placing a heating element which may be electrically connected to the conductor paths; and c) at least partial covering each site with a sealing material for the formation of a partial sheathing for each vaporizer unit. The sealing material is applied such that the sheathing covers an edge region of the heating element while keeping open a heating surface on an upper side of the circuit board material. At least the outer surfaces of the sheathing pointing away from the circuit board material form sealing surfaces. Vaporizer units, vaporizer assemblies, vaporizer cartridges and inhalers with such vaporizer units are also provided.

Abstract: A lighting apparatus is provided having one or more light emitting diodes arranged in a row. The light emitting diodes may be supported by an elongated body. The elongated body may comprise an optical element formed from an at least partially optically transmissive material. The lighting apparatus has two ends and may have electrical connectors at the ends.

Abstract: A flexible circuit board includes a plurality of first wires that have a first connection area and a first insulating layer that covers the first wires such that the first connection area is exposed. A printed circuit board includes a plurality of second wires that have a second connection area, a second insulating layer that covers the second wires such that the second connection area is exposed, and a plurality of island conductors adjacent to the second wires across a gap. The second connection area is covered with an anisotropic conductive layer. Each of the second wires in the second connection area at least partially faces a corresponding one of the wires in the first connection area across the anisotropic conductive layer. The plurality of island conductors include an island conductor that is in contact with the anisotropic conductive layer and partially exposed from the anisotropic conductive layer.

Abstract: Systems and methods are provided for assembling an RFID device mounted to a fabric substrate via a “flip chip” approach. The system includes a pin thermode with a tip configured to penetrate the fabric substrate. The pin thermode may include or omit a heating element, with the tip being variously configured. The tip may have a variable cross-sectional area or include a plurality of projections that separately penetrate the fabric substrate, for example. If the pin thermode includes a heating element, a body of the pin thermode may be formed of a low thermal conductivity material to allow the temperature of the tip to increase without increasing the temperature of the body to the same degree. The body may define a lumen, with the tip and/or body defining an aperture for flowing a liquid out of the pin thermode and into the region surrounding the pin thermode.

Abstract: A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.

Abstract: A drill string tool comprising a mud motor comprising a driveshaft assembly rotatably disposed within a driveshaft housing, the mud motor comprising sensors and an adjustable bend setting. A bearing mandrel in communication with a drill bit rotatably disposed within a bearing housing. The driveshaft assembly includes a drive shaft adapter having a rotating portion and a stationary portion. The rotating portion comprising a centrifugal brake assembly in communication with an electronics package. The electronics package rotates with the driveshaft assembly at an RPM relative to the driveshaft housing. The electronics package is in communication with the motor, the sensors, the adjustable bend setting, and a collection of wired drill pipe making up the drill string by means of connections and coils. The connections comprise coaxial cables comprising an outer conductor and annular dielectric segments mounted on a center conductor wire. The segments may comprise an embedded mesh structure.

Abstract: Layouts for pads and conductive lines of memory devices are disclosed. A memory device may include memory cells and conductive lines arranged above memory cells. The conductive lines may extend from substantially a first side of the memory device to substantially a second side of the memory device. Each of the conductive lines may be electrically coupled to a bond pad, a first probe pad and a second probe pad. The bond pad may be positioned at or near the first side and be configured to receive power. The first probe pad may be positioned at or near the first side and be configured to be electrically coupled to a probe. The second probe pad may be positioned at or near the second side. Associated systems and methods are also disclosed.

Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.

Abstract: An apparatus which includes a first solid state drive (SSD) located on an SSD card having a fixed capacity and a first form factor. The apparatus can further include an adapter located on the SSD card to accommodate a second SSD. The second SSD has a second form factor that is different than the first form factor and is removeable from the SSD card. The apparatus can further include a controller located on the SSD card and configured to access the first SSD and the second SSD.