On Flat Or Curved Insulated Base, E.g., Printed Circuit, Etc. Patents (Class 29/829)
  • Patent number: 10274452
    Abstract: The present invention relates to a method for fabricating a semiconductor device for stimulation and/or data recording of biological material to a such semiconductor device. The method comprises providing a semiconductor substrate comprising a first insulating layer; providing a patterned conductive layer on top of the first insulating layer; depositing and patterning a second insulating layer atop the patterned conductive layer; growing carbon nano-sheets atop the second insulating layer; and defining carbon nano-sheet electrode areas on the second insulating layer by etching away the carbon nano-sheets outside of the carbon nano-sheet electrode areas.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: April 30, 2019
    Assignees: IMEC, KATHOLIEKE UNIVERSITEIT LEUVEN, K.U. LEUVEN R&D
    Inventors: Nadine Collaert, Daire J. Cott, Michael De Volder
  • Patent number: 10204736
    Abstract: A method for manufacturing a wireless charging device is disclosed. The method includes: providing a substrate, a first metal plate, and a second metal plate; forming a plurality of circles of slots, each of the circles of slots including at least one first slot and at least one second slot, the at least one first slot having a first depth, and the at least one second slot having a second depth; forming a first coil and a second coil by performing a metal forming process on the first metal plate and the second metal plate; and placing the first coil in the at least one first slot, and placing the second coil in the at least one second slot. In the method, the first coil and the second coil have good fixity and are easily to be assembled.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: February 12, 2019
    Assignee: JJPLUS CORP.
    Inventors: Ching-Hsing Huang, Cheng-Chung Lee
  • Patent number: 10204297
    Abstract: A smart tag assembly is designed for mounting on an object to be tracked. The smart tag assembly comprises a multiple layer RFID laminate adapted for electronically storing and processing data, and wireless communicating data when interrogated by an RFID reader. The laminate comprises an RFID inlay including a microchip and antenna formed with a substrate, and laminated between an outside label cover and backing. A low-profile tag carrier defines a recessed pocket designed for receiving and holding the RFID laminate, and has a generally concave outside surface adapted for residing against a generally convex surface of the object to be tracked.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: February 12, 2019
    Assignee: ITIRE, LLC
    Inventors: Alan C. Lesesky, Samuel Duke Drinkard
  • Patent number: 10115651
    Abstract: An electronic component includes a substrate that has a first principal surface and a second principal surface, a chip that includes a mounting surface on which a plurality of terminal electrodes are formed and a non-mounting surface positioned on a side opposite to the mounting surface and that is arranged at the first principal surface of the substrate in a posture in which the mounting surface faces the first principal surface of the substrate, and a sealing resin that seals the chip at the first principal surface of the substrate so as to expose the non-mounting surface of the chip.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: October 30, 2018
    Assignee: ROHM CO., LTD.
    Inventor: Isamu Nishimura
  • Patent number: 10073232
    Abstract: An opto-electric hybrid board is provided, which includes an electric circuit board including an electric wiring provided on a front surface of an insulation layer, an optical waveguide provided on a back side of the electric circuit board, and an outline processing alignment mark positioned adjacent to an outline processing portion on the front surface of the insulation layer on the same basis as the electric wiring, and has an outline formed by performing an outline processing operation with reference to the outline processing alignment mark. The opto-electric hybrid board has an accurate outline and, therefore, can be attached to other component without an engagement failure or a connection failure.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: September 11, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Tsujita, Naoyuki Tanaka
  • Patent number: 9922836
    Abstract: A semiconductor device manufacturing method of present application includes a catalytic step of depositing catalytic metal on a surface of a semiconductor substrate, an oxide removing step of removing oxide formed on the surface of the semiconductor substrate in the catalytic step, an additional catalytic step of depositing catalytic metal on the surface of the semiconductor substrate exposed in the oxide removing step, and a plating step of forming a metal film on the surface of the semiconductor substrate by means of an electroless plating method after the additional catalytic step.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: March 20, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koichiro Nishizawa, Akira Kiyoi
  • Patent number: 9907187
    Abstract: A PCB with two rows of solder pads including both SMT-based and DIP-based structures is configured to be mounted with a USB Type-C connector by soldering, has two rows of solder pads on its top side, and is characterized in that at least one solder pad in one of the rows is a DIP-based structure while the remaining solder pads in the same row are SMT-based structures, and that all the solder pads in each row that are used to transmit high-frequency signals are SMT-based structures. Once the connector is mounted to the PCB, an inspector can directly examine the soldering quality of the DIP-based-structure solder pad and of the corresponding connection terminal simply by inspecting the bottom side of the PCB. Moreover, since all the solder pads configured for transmitting high-frequency signals are SMT-based structures, better transmission will be provided to the connector, accordingly.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: February 27, 2018
    Assignee: SIMULA TECHNOLOGY INC.
    Inventor: Te-Chih Tseng
  • Patent number: 9763332
    Abstract: A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: September 12, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kazuhiro Kobayashi
  • Patent number: 9737247
    Abstract: Methods, structures, and systems are disclosed for biosensing and drug delivery techniques. In one aspect, a^ device for detecting an analyte and/or releasing a biochemical into a biological fluid can include an array of hollowed needles, in which each needle includes a protruded needle structure including an exterior wall forming a hollow interior and an opening at a terminal end of the protruded needle structure that exposes the hollow interior, and a probe inside the exterior wall to interact with one or more chemical or biological substances that come in contact with the probe via the opening to produce a probe sensing signal, and an array of wires that are coupled to probes of the array of hollowed needles, respectively, each wire being electrically conductive to transmit the probe sensing signal produced by a respective probe.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: August 22, 2017
    Assignees: The Regents of the University of California, North Carolina State University, National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Joseph Wang, Joshua Ray Windmiller, Roger Narayan, Philip Miller, Ronen Polsky, Thayne L. Edwards
  • Patent number: 9700221
    Abstract: Implementations disclosed herein provide for a microneedle electrode system comprising a microneedle electrode patch connected to external electronics. The microneedle electrode patch comprises a first flexible substrate having a plurality of conductive pads disposed thereon, a plurality of three-dimensional, individually addressable microneedle electrode arrays where each array has a plurality of microneedles extending from an upper surface thereof and a lower surface adapted to contact a corresponding one of the plurality of conductive pads disposed on the first substrate, and a second flexible substrate having a plurality of openings defined therein dimensioned to accommodate at least a portion of the upper surface of the microneedle electrode array from which the microneedles extend.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: July 11, 2017
    Assignee: Axion BioSystems, Inc.
    Inventors: Swaminathan Rajaraman, Julian A. Bragg, James D. Ross, Amanda Preyer
  • Patent number: 9700262
    Abstract: Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: July 11, 2017
    Assignee: STRYKER CORPORATION
    Inventors: John Janik, Robert Brindley, Edward Chia-Ning Tang
  • Patent number: 9663352
    Abstract: A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafer plate comprises at least two dies and bonding material that bonds the at least two dies alongside each other to the longitudinal extent of the wafer plate, wherein at least one of the dies is a microelectromechanical die. The electrical distribution layer covers the wafer plate and includes a layer of dielectric material and a layer of conductive material, wherein the layer of conductive material is patterned within the layer of dielectric material for electrical interconnection of the dies and the wafer connector elements. With the new configuration, significantly reduced MEMS device thicknesses are achieved.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: May 30, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Heikki Kuisma, Sami Nurmi
  • Patent number: 9579858
    Abstract: A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: February 28, 2017
    Assignee: KYOCERA CRYSTAL DEVICE CORPORATION
    Inventors: Yukiko Furukata, Kotaro Wakabayashi, Shingo Ishiuchi, Akinori Ito
  • Patent number: 9528667
    Abstract: A method of manufacturing a lamp comprising forming a first sheet segment (48) into a first shell portion (110) after forming a first electrically conductive trace (70) on the first sheet segment (48) and after placing a first plurality of LEDs (90) on the first sheet segment (48); forming a second sheet segment (50) into a second shell portion (120) after forming a second electrically conductive trace (80) on the second plastic segment (50) and after placing a second plurality of LEDs (90) on the second sheet segment (50); and joining the first shell portion (110) and the second shell portion (120) into a bulb enclosure (40) defining an interior region (42) therein. The first and second sheet segments (48, 50) are preferably thermoformed and may be connected by a web (60).
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: December 27, 2016
    Assignee: OSRAM SYLVANIA Inc.
    Inventor: Rodrigo M. Pereyra
  • Patent number: 9431740
    Abstract: A method of assembling an electrical terminal having a base and a spring member. The base is provided with a plurality of base beams. The spring member is provided with a plurality of spring beams. The spring member defines an axis such that the plurality of spring beams is spaced radially apart from the axis. The spring beams deflected radially outwardly. The base is inserted in the spring member to position the base beams adjacent to the spring beams. The spring beams are released such that the spring beams retract radially inwardly against the base beams.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: August 30, 2016
    Assignee: Lear Corporation
    Inventors: Michael Glick, Slobodan Pavlovic, Tulasi Sadras-Ravindra
  • Patent number: 9409011
    Abstract: An implantable electrode array assembly configured to apply electrical stimulation to the spinal cord. A substantially electrically nonconductive layer of the device has a first portion positionable alongside the spinal cord that includes a plurality of first openings. The layer has a second portion that includes a plurality of second openings. Electrodes and traces are positioned inside a peripheral portion of a body portion of the device and alongside the layer. At least one of the first openings is adjacent each of the electrodes to provide a pathway through which the electrode may provide electrical stimulation to the spinal cord. At least one of the second openings is adjacent each of the traces to provide a pathway through which the trace may receive electrical stimulation. At least one trace is connected to each electrode and configured to conduct electrical stimulation received by the trace(s) to the electrode.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: August 9, 2016
    Assignees: California Institute of Technology, University of Louisville Research Foundation, Inc., The Regents of the University of California
    Inventors: Yu-Chong Tai, Mandheerej S. Nandra, Joel W. Burdick, Damien Craig Rodger, Andy Fong, Victor Reggie Edgerton, Roland R. Roy, Yury Gerasimenko, Igor Lavrov, Susan J. Harkema, Claudia A. Angeli
  • Patent number: 9368274
    Abstract: A wireless power transfer system including a driver coil array, a hexagonally-packed transmitter mat, a receiver coil, and a load coil for powering a medical implant. The magnetically coupled resonance between two isolated parts is established by an array of primary coils and a single small secondary coil to create a transcutaneous power link for implanted devices as moving targets. The primary isolated part includes a driver coil array magnetically coupled to a mat of hexagonally packed primary coils. Power is injected by the driver coils into the transmitter coils in the transmitter mat to maintain resonance in the presence of losses and power drawn by the receiver coil from the magnetic field. The implanted secondary isolated part includes a receiver coil magnetically coupled to a load coil. A rectification/filter system is connected to the load coil supplying DC power to the electronic circuits of the implant.
    Type: Grant
    Filed: March 16, 2013
    Date of Patent: June 14, 2016
    Assignees: Huazhong University of Science and Technology, UNIVERSITY OF PITTSBURGH
    Inventors: Qi Xu, Mingui Sun, Hao Wang, Zhihong Mao, Jiping He
  • Patent number: 9330952
    Abstract: In one embodiment, there is provided a carrier comprising a top semiconductor layer having isolated positive electrode regions and isolated negative electrode regions separated by a frontside trench through the top semiconductor layer extending at least to an underlying insulating layer positioned between the top semiconductor layer and a bottom semiconductor layer. A dielectric layer covers the top exposed surfaces of the carrier. Backside trenches through the bottom semiconductor layer extending at least to the insulating layer form isolated backside regions corresponding to the frontside positive and negative electrode regions. Backside contacts positioned on the bottom semiconductor layer and coupled to the positive and negative electrode regions allow for the electric charging of the frontside electrode regions.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: May 3, 2016
    Assignee: Solexel, Inc.
    Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang
  • Patent number: 9174038
    Abstract: The invention relates to a neural electrode. It relates in particular to such an electrode which is able to withstand high mechanical forces, and to a method of fabrication of the same. The invention discloses an elastic neural electrode, having at least one planar metal layer which comprises conductive material and which is bilaterally covered by an protective elastomer layer, wherein, for reinforcement of the electrode, an additional reinforcement layer comprising reinforcement material is present between the outermost protective elastomer layers.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: November 3, 2015
    Assignee: Cortec GmbH
    Inventors: Martin Schüttler, Christopher W.D. Dodds, Gregg J. Suaning
  • Patent number: 9099458
    Abstract: A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes an etched pattern.
    Type: Grant
    Filed: July 1, 2012
    Date of Patent: August 4, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Karan Kacker, Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha
  • Patent number: 9032615
    Abstract: A method forms an electrical connection between a first metal layer and a second metal layer. The second metal layer is above the first metal layer. A first via is formed between the first metal layer and the second metal layer. A first measure of a number of vacancies expected to reach the first via is obtained. A second via in at least one of the first metal layer and the second metal layer is formed if the measure of vacancies exceeds a first predetermined number.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: May 19, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Edward O. Travis, Douglas M. Reber, Mehul D. Shroff
  • Publication number: 20150131290
    Abstract: Techniques are disclosed for designing light fixtures for flexible LED circuit boards. The flexible LED circuit boards include an array of LED packages and the surface of the flexible circuit boards is highly reflective. A flexible LED circuit board may be shaped to conform to a rigid preform and the preform may be concave, convex, corrugated, or have any other custom shape. The shape of the preform, as well as the location of the LEDs within the flexible LED circuit may determine the light distribution of the light fixture. Alternatively, the lighting fixture may have multiple rods held in place with side plates and a flexible LED circuit board may be woven between the rods. A set of hole patterns in the side plates determine the location of the rods and the rods will determine the shape of the flexible LED circuit.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: OSRAM SYLVANIA INC.
    Inventors: Richard Speer, David Hamby, Ken Grossman
  • Publication number: 20150129292
    Abstract: A process is provided for producing a printed circuit board comprising at least two elementary circuit boards drilled with metallized holes the mouth of which is covered with a first metal, and at least one first intermediate layer, made of a compressible material, drilled with holes facing the elementary circuit boards and the mouth of which is covered with a second metal, which layer is placed between the two elementary circuit boards and soldered to each of the circuits by thermodiffusion of two metals forming an alloy at a formation temperature of the alloy. At least two second intermediate layers, the second layers not covering the first and second metal, being thermoplastics and having a melting point above the formation temperature of the alloy, are placed between the first intermediate layer and the elementary circuit boards.
    Type: Application
    Filed: December 11, 2012
    Publication date: May 14, 2015
    Inventors: Bernard Ledain, Dominique Henriot, Philippe Kertesz
  • Publication number: 20150131289
    Abstract: Techniques are disclosed for designing light fixtures for flexible LED circuit boards. The flexible LED circuit boards include an array of LED packages and the surface of the flexible circuit boards is highly reflective. A flexible LED circuit board may be shaped to conform to a rigid preform and the preform may be concave, convex, corrugated, or have any other custom shape. The shape of the preform, as well as the location of the LEDs within the flexible LED circuit may determine the light distribution of the light fixture. Alternatively, the lighting fixture may have multiple rods held in place with side plates and a flexible LED circuit board may be woven between the rods. A set of hole patterns in the side plates determine the location of the rods and the rods will determine the shape of the flexible LED circuit.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: OSRAM SYLVANIA INC.
    Inventors: Richard Speer, David Hamby, Ken Grossman
  • Publication number: 20150129300
    Abstract: A flameproof feed-through (200) includes a feed-through element (210) comprising a substantially planar shape, a first interface region (211), and a second interface region (212), wherein one or more conductors (217) extend between the first interface region (211) and the second interface region (212). The flameproof feed-through (200) further includes one or more body portions (220) assembled to the feed-through element (210), with the one or more body portions (220) holding the feed-through element (210) in position with respect to the aperture. The first interface region (211) of the feed-through element (210) extends at least partially to a first side (201) of the flameproof feed-through (200) and wherein the second interface region (212) of the feed-through element (210) extends at least partially to a second side (202) of the flameproof feed-through (200).
    Type: Application
    Filed: May 17, 2012
    Publication date: May 14, 2015
    Applicant: Micro Motion, Inc.
    Inventors: William M. Mansfield, Craig B. McAnally, Shaun E. Shanahan, Richard L. Woolf
  • Publication number: 20150128409
    Abstract: A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel.
    Type: Application
    Filed: June 7, 2013
    Publication date: May 14, 2015
    Inventors: Kai Chen, Jianming Huang, Huali Lu
  • Patent number: 9027227
    Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: May 12, 2015
    Assignee: Féinics Amatech Teoranta
    Inventor: David Finn
  • Publication number: 20150123911
    Abstract: Provided are multilayered touch panel stacks and methods for forming thereof. The stacks include refractive index matching layers to minimize light losses. Specifically, the stacks may comprise a substrate, one, two, three, or four refractive index matching layers deposited on the substrate, and one or two transparent conductive layers such as indium tin oxide electrode layers. The stack may be attached to a light emitting element or be a part of an LCD or OLED displays. The refractive index matching interlayers may be based on a polymer solution having about 0.1%-30% by weight of specific rigid rod-like polymer molecules. The molecules may include various cores, spacers, and side groups to ensure their solubility, viscosity, and cross-linking ability. The refractive index matching interlayer may have a refractive index in between of about 1.60-1.80.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 7, 2015
    Applicant: Light Polymers Holding
    Inventors: Evgeni Poliakov, Samuel Miller, Evgeny Morozov
  • Patent number: 9022602
    Abstract: Modular multichannel light sources connector systems and methods are provided. A lighting assembly includes substrates, each with a respective plurality of ports and conductive path configurations. Each path configuration includes a plurality of conductive paths between the respective plurality of ports. At least two conductive path configurations are the same. A connector couples one of a plurality of first ports on a first substrate to one of a plurality of second ports on a second substrate. A multichannel power supply's outputs are each coupled to an associated conductive path on the first substrate. A first light source is coupled to two conductive paths on the first substrate, and to a first output. A second light source is coupled to two conductive paths on the second substrate, corresponding to the conductive paths on the first substrate, and to a second output, different from the first output.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: May 5, 2015
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Nicholas Lekatsas, Biju Antony, David Lidrbauch
  • Publication number: 20150116967
    Abstract: Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board. The solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region.
    Type: Application
    Filed: October 20, 2014
    Publication date: April 30, 2015
    Applicant: KYOCERA CIRCUIT SOLUTIONS, INC.
    Inventor: Mitsuzo YOKOYAMA
  • Publication number: 20150113802
    Abstract: A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut.
    Type: Application
    Filed: January 9, 2015
    Publication date: April 30, 2015
    Inventors: Takuya KOTSUBO, Shunsuke CHISAKA
  • Publication number: 20150116245
    Abstract: The present disclosure provides a touch panel, including: a substrate having a visible region and a non-visible region adjacent to at least one side of the visible region; a composite layer disposed over the non-visible region, wherein the composite layer includes a color layer and a light-shielding layer, and the color layer is disposed between the substrate and the light-shielding layer, wherein a side of the color layer adjacent to the visible region has a first inclined surface, and a side of the light-shielding layer adjacent to the visible region has a second inclined surface, wherein the first inclined surface and the second inclined surface are form a continuous surface; a sensing layer disposed over the visible region and extending to a portion of the non-visible region, wherein the sensing layer directly contacts the visible region of the substrate; and a signal wire disposed over the composite layer.
    Type: Application
    Filed: October 27, 2014
    Publication date: April 30, 2015
    Inventors: Chan-Hao Tseng, Sheng-Pin Su, Cheng-Hao Huang, Yung-Pei Chen, Zhirong Yang
  • Patent number: 9015934
    Abstract: A method for manufacturing a probe card prepares a plurality of probes, each having a metal layer on an attaching portion, and hot-melt material covering the metal layer. Each probe is attached to a probe substrate by inserting its attaching portion into a different through hole of the probe substrate so that at least a part of the metal layer is located in the through hole. The hot-melt material of each attaching portion is melted and thereafter solidified such that the hot-melt material contacts the metal layer and a part of a wall surface of the through hole, to fix each probe to the probe substrate.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: April 28, 2015
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventor: Toshinaga Takeya
  • Patent number: 9015933
    Abstract: A micro device may comprise a substrate, a first micro structure coupled to the substrate, a second micro structure coupled to the substrate, and port configured to receive an input. The first micro structure is configured to move into engagement with the second micro structure in response to the input.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: April 28, 2015
    Assignee: MicroZeus, LLC
    Inventor: Harold L. Stalford
  • Patent number: 9015935
    Abstract: A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: April 28, 2015
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventor: Toshinaga Takeya
  • Patent number: 9009955
    Abstract: A method of making articles from electrically active textiles. First and second fabric pieces include conductors therein. A seam is established between the first and second fabric pieces. A determination is made, at the seam, based on one or more predetermined factors, which conductors of the first fabric piece intersect or overlap with which conductors of the second fabric piece. At the seam, an electrical and mechanical connection is formed between select conductors of the first fabric piece and select conductors of the second fabric piece.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: April 21, 2015
    Assignee: Infoscitex Corporation
    Inventors: Jeremiah Slade, Andrew Houde, Patricia Wilson
  • Patent number: 9013882
    Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: April 21, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Naoki Gouchi, Takahiro Baba
  • Patent number: 9009950
    Abstract: Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: April 21, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Moon Lee, Young Seuck Yoo, Jong Yun Lee, Young Do Kweon, Sung Kwon Wi
  • Patent number: 9003648
    Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: April 14, 2015
    Assignee: Ormet Circuits, Inc.
    Inventor: Ken Holcomb
  • Patent number: 9007149
    Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: April 14, 2015
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Yu Chia Chang, Chi Long Lin, Cheng Yi Wang, Shin Min Tai
  • Publication number: 20150098196
    Abstract: Printed circuit board apparatus with electromagnetic interference shields and methods of making the same.
    Type: Application
    Filed: May 18, 2012
    Publication date: April 9, 2015
    Applicant: Advanced Bionics AG
    Inventor: Logan Peter Palmer
  • Publication number: 20150090480
    Abstract: An electronic component package includes a substrate and dielectric structure. The dielectric structure includes a top surface having a protrusion portion and a lower portion. The protrusion portion is located at first height that is greater than a second height of the lower portion. A conductive bond pad is located over the dielectric structure. A ball bond electrically couples the bond pad and a bond wire. An intermetallic compound located between the ball bond and bond pad is formed of material of the ball bond and bond pad and electrically couples the bond pad to the ball bond. A portion of the bond pad is vertically located between a portion of the lower portion of the top surface of the dielectric structure and the intermetallic compound. No portion of the bond pad is vertically located between at least a portion of the protrusion portion and the intermetallic compound.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Inventors: TU-ANH N. TRAN, Chu-Chung Lee
  • Publication number: 20150089804
    Abstract: Electrified access-control technology devices for a door, particularly electrified locks for a door, having embedded circuitry therein, and methods of making the same. One or more printed circuit boards (PCBs) having various electronic circuitry are secured inside a housing that encases an access-control device, particularly a lock, for a door. The one or more PCB(s) may be embedded on an internal surface of the housing such that the embedded PCB resides inside the housing along with the lock itself. The embedded PCB(s) avoid interference of both any working components of the lock inside the housing and any openings residing in the housing.
    Type: Application
    Filed: December 10, 2014
    Publication date: April 2, 2015
    Inventors: Daniel J. Picard, Robert C. Hunt, Scott B. Lowder
  • Patent number: 8991040
    Abstract: A reusable electronic circuit assembling system facilitates assembly and testing of electronic circuits. The system has at least one baseboard and one or more assembling blocks magnetically or mechanically attached to the baseboard. Each assembling block has at least two electrically connected conductive clips located separately in the opening holes of the assembly block. Discrete electronic components are connected by selectively inserting the electrodes of the to-be-connected electronic components into the clips of the assembling blocks. A complete circuit is constructed by attaching the above block-component assemblies on the baseboard and connecting them in accordance with the desired circuit diagram.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: March 31, 2015
    Assignee: 5eTek, LLC
    Inventor: Erli Chen
  • Publication number: 20150085504
    Abstract: In one aspect, a circuit board includes a base board and a layer of an elastic material comprising a first surface and a second surface. The layer of elastic material is adhered to the base board via the first surface. The circuit board further includes an electrical trace disposed on the second surface of the layer of elastic material. At least a portion of the layer of elastic material stretches or shrinks when the base board expands or contracts. A method of manufacturing a circuit includes obtaining an aluminum board, obtaining a layer of an elastic material, and applying a layer of adhering material to a surface of the aluminum board. The method further includes disposing the layer of the elastic material onto the layer of adhering material, and adhering the layer of the elastic material onto the aluminum board via the layer of adhering material.
    Type: Application
    Filed: September 23, 2014
    Publication date: March 26, 2015
    Inventor: Ellis W. Patrick
  • Publication number: 20150084481
    Abstract: In an electronic component, an outer electrode includes a sintered layer containing a sintered metal, an insulation layer containing an electric insulation material, and a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof so as to cover each of the end surfaces of the element assembly. The insulation layer is directly provided on the sintered layer at each of the end surfaces of the element assembly so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.
    Type: Application
    Filed: September 16, 2014
    Publication date: March 26, 2015
    Inventors: Haruhiko MORI, Hiroyuki OTSUNA
  • Patent number: 8981234
    Abstract: Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: March 17, 2015
    Assignees: National University Corporation Tohoku University, Daisho Denshi Co., Ltd.
    Inventors: Tadahiro Ohmi, Tetsuya Goto
  • Patent number: 8981233
    Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: March 17, 2015
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Seiichi Ishikawa, Kenji Kubota, Takashi Tamagawa
  • Patent number: 8978216
    Abstract: A method for forming an acoustical stack for an ultrasound probe comprises partly dicing a single crystal piezoelectric material to form single crystal pieces that are partly separated by a plurality of kerfs. The single crystal piezoelectric material comprises a carrier layer. The kerfs are filled with a kerf filling material to form a single crystal composite and the carrier layer is removed. At least one matching layer is attached to the single crystal composite, and dicing within the kerfs is accomplished to form separate acoustical stacks from the single crystal composite.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: March 17, 2015
    Assignee: General Electric Company
    Inventors: Serge Gerard Calisti, Frederic Lanteri, Alan Tai, Charles Baumgartner, Jean-Francois Gelly
  • Publication number: 20150072474
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, forming a stiffening mold on a backside of the coreless substrate strip adjacent to sites where solder balls are to be attached, and attaching solder balls to the backside of the coreless substrate strip amongst the stiffening mold. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 12, 2015
    Inventors: Huay Huay Sim, Choong Kooi Chee, Kein Fee Liew