By Utilizing Optical Sighting Device Patents (Class 29/833)
  • Publication number: 20100126289
    Abstract: A method of mounting a contactor comprising: a step S10 of recognizing a reference point on a mount base; a step S12 of recognizing the positions of first marks on the mount base to calculate the actual relative position m1 of the first marks with respect to the reference point; a step S13 of calculating a theoretical relative position m0 in design of the first marks with respect to the reference point; a step S14 of calculating the relative amount of deviation ?m of the actual relative position m1 with respect to the theoretical relative position m0; a step S22 of recognizing the positions of first marks in the mounting system; a step S23 of specifying the mounting position of the contactor on the mount base on the basis of the amount of deviation ?m and the position of the first marks; and steps S27 and S28 of mounting the contactor at the mounting position.
    Type: Application
    Filed: March 18, 2008
    Publication date: May 27, 2010
    Applicant: ADVANTEST CORPORATION
    Inventor: Seizo Kinoshita
  • Patent number: 7721424
    Abstract: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: May 25, 2010
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Akira Aoki, Makio Kameda, Yoshiharu Fukushima, Katsuyuki Seto, Hideaki Fukushima
  • Patent number: 7712208
    Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: May 11, 2010
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Akio Watanabe, Akihiro Kawai, Tetsuji Ono, Makio Kameda, Kazuyoshi Oyama, Kazuyoshi Ieizumi
  • Patent number: 7707713
    Abstract: A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of the board, calculating a displacement between the design position of the electronic component and the actual position of the electronic component on the surface of the board, and for holding the displacement as displacement data, and correcting, based on the displacement data, design data to be used for processing the board after the board is covered with the insulating layer.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: May 4, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masatoshi Akagawa, Kazunari Sekigawa, Shinichi Wakabayashi
  • Patent number: 7669317
    Abstract: In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: March 2, 2010
    Assignee: Panasonic Corporation
    Inventors: Yoichi Makino, Akira Kabeshita
  • Patent number: 7657997
    Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: February 9, 2010
    Assignee: Panasonic Corporation
    Inventors: Kentaro Nishiwaki, Yoichiro Ueda, Takayuki Fukae
  • Patent number: 7653990
    Abstract: A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: February 2, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Choon-Keun Lee, Myeong-Ho Hong, Senug-Hyun Ra
  • Patent number: 7656259
    Abstract: A method is proposed to manufacture a precise multi-pole magnetic component for using in magnetic encoders. A special layout of the circuit pattern is designed and formed on a printed circuit board (PCB). Alternate and regular magnetic field is induced according to Ampere's law after a current flowing through the circuit on the PCB. The multi-pole magnetic component with fine magnetic pole pitch is achieved by forming the high-density circuit patterns on a substrate using the PCB technology.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: February 2, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Kuo-Chi Chiu, Der-Ray Huang, Han-Ping Shieh
  • Patent number: 7650688
    Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: January 26, 2010
    Assignee: ChipPAC, Inc.
    Inventors: Hee-Bong Lee, Hyun-Joon Oh
  • Patent number: 7640656
    Abstract: A method for manufacturing a pre-molding leadframe strip with compact components is disclosed. The method forms a leadframe strip with an array of component regions, each component region including two metal parts for using as a chip-attached portion, a wire-bonded portion and two external electrical connection conductors. Next, the leadframe strip is plated with a metal layer having high conductivity and die bonding adhesion. Finally, a pre-molded structure on each of the component regions is formed to surround all the other portions of the leadframe strip with an exception of only the two external electrical connection conductors through a multiplicity of pre-molding processes, each pre-molding process molding the leadframe strip at an interval of one or more than one component regions.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: January 5, 2010
    Assignee: SDI Corporation
    Inventor: Jau-Shyong Chen
  • Patent number: 7624497
    Abstract: A component recognition apparatus for a chip mounter includes a head portion having a frame and at least one nozzle portion installed on the frame, the nozzle portion picking up an electronic component and mounting the electronic component on a substrate, a camera coupled with the frame and comprising an imaging device, and a mirror portion having a mirror support portion installed on the frame and a mirror held by the mirror support portion in a space that does not interfere with the movement path of the electronic component held by the nozzle portion. The camera includes a lens portion, and an image of the electronic component held by the nozzle portion is reflected by the mirror, passes off-axis through the lens portion, and is formed on the imaging device.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: December 1, 2009
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Sang-cheol Kim
  • Patent number: 7617597
    Abstract: A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on the basis of the images.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: November 17, 2009
    Assignee: Panasonic Corporation
    Inventors: Osamu Okuda, Youichi Tanaka, Hiroyoshi Saitoh, Haneo Iwamoto
  • Patent number: 7614144
    Abstract: The present invention is intended to realize a hold posture inspection of a plurality of components sucked by a plurality of nozzle rows provided on a head with a single scanning operation, thereby reducing the time for the hold posture inspection and improving the accuracy thereof. In order to achieve such objections, the present invention includes: a head on which at least two nozzle rows are disposed, each of which includes at least one nozzle; a circuit board holding unit for holding a circuit board on which components conveyed by the head are mounted; and an inspection unit, provided on a moving path of the head from a supplying unit to the circuit board holding unit, for inspecting hold postures of the components held by the nozzles of the head and including sensors for posture inspection independent for the respective nozzle rows.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: November 10, 2009
    Assignee: Panasonic Corporation
    Inventors: Hiroshi Ota, Nobuhiro Nakai, Kensuke Kawasumi, Kimio Iizuka, Hirotsugu Uemori, Yoshinori Mochida, Keizo Izumida
  • Patent number: 7603767
    Abstract: A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: October 20, 2009
    Assignee: DENSO CORPORATION
    Inventors: Norio Goko, Atsushi Sakaida, Toshihisa Taniguchi, Yuji Tuduki
  • Patent number: 7600313
    Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: October 13, 2009
    Assignee: Daisho Denshi Co., Ltd.
    Inventors: Akihiro Kimura, Osamu Deguchi, Koji Annou, Atsushi Ishikawa
  • Patent number: 7600314
    Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: October 13, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Larry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
  • Patent number: 7594319
    Abstract: A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon so as to have an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: September 29, 2009
    Assignee: Sony Corporation
    Inventors: Atsushi Nakamura, Norio Kawatani, Masahisa Hosoi, Kazumasa Osoniwa, Hiroshi Tokunaga
  • Patent number: 7594316
    Abstract: A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: September 29, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoru Noda, Jun Harada
  • Patent number: 7587803
    Abstract: A process for assembling a camera module comprises the following steps:—placing the substrate (10) on a positioning die (70);—irradiating the lens assembly (30) with parallel rays of light (90);—displacing a lens assembly (30) comprising the convex lens (33) in an axial direction;—measuring the light intensity of light passing through a spot hole (75) by means of a light sensor (80) being accommodated in the positioning die (70);—determining an optimal axial position of the lens assembly (30) on the basis of an obtained light intensity curve;—bringing the lens assembly (30) to the optimal axial position;—removing the positioning die (70); and—attaching an image sensor chip to a bottom surface (12) of the substrate (10).
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: September 15, 2009
    Assignee: TPO Displays Corp.
    Inventors: Vincent Johannes Jacobus Montfort, Fransiscus Gerardus Coenradus Verweg
  • Patent number: 7581310
    Abstract: The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: September 1, 2009
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Yoshiharu Fukushima, Takahiro Nagata, Katsuyuki Seto
  • Patent number: 7581313
    Abstract: The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (105); a recognition unit (108) including a shutter camera (111b) and instructing it to start taking an image of a component (103a) when the mounting head (105) arrives at a predetermined position; and a main control unit (160) (i) correcting a position of the component shown in the image taken by the shutter camera (111b), based on a first distance over which the mounting head (105) moves during a time period from when the instruction to start taking the image is given to when camera exposure by the shutter camera (111b) is performed, (ii) correcting the mounting position at which the mounting head (105) is to mount the component (103a), based on the corrected component position, and (iii) controlling the mounting head (105) so that it mounts the component (103a) at the corrected mounting position.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: September 1, 2009
    Assignee: Panasonic Corporation
    Inventors: Eiichi Hachiya, Tamaki Ogura
  • Patent number: 7581305
    Abstract: A method of manufacturing an optical component comprising a substrate and a mounting frame with plural contact portions disposed at predetermined distances from each other is provided. The method comprises providing a measuring frame separate from the mounting frame for mounting the substrate, which measuring frame comprises a number of contact portions equal to a number of the contact portions of the mounting frame, wherein respective distances between the contact portions of the measuring frame are substantially equal to the corresponding distances between those of the mounting frame, measuring a shape of the optical surface of the substrate, while the substrate is mounted on the measuring frame, and mounting the substrate on the mounting frame such that the contact portions of the mounting frame are attached to the substrate at regions which are substantially the same as contact regions at which the substrate was attached to the measuring frame.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: September 1, 2009
    Assignee: Carl Zeiss SMT AG
    Inventors: Bernhard Geuppert, Jens Kugler, Thomas Ittner, Bernd Geh, Rolf Freimann, Guenther Seitz, Bernhard Fellner, Bernd Doerband, Stefan Schulte
  • Patent number: 7568284
    Abstract: In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer chuck so that the device portion is placed at a component insertion position, by which correction of an insertion posture of the component is performed, and the lead wire of the component that has been corrected in terms of its insertion posture is inserted into an insertion hole of a board.
    Type: Grant
    Filed: July 17, 2003
    Date of Patent: August 4, 2009
    Assignee: Panasonic Corporation
    Inventors: Shozo Kadota, Kazuaki Kosaka, Minoru Kitani
  • Patent number: 7555831
    Abstract: A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the feeder exchange. A comparison of the pre-exchange image with the post-exchange image facilitates simple and quick feeder exchange validation. Aspects of the present invention are practicable with different types of pick and place machines, and are able to advantageously use sensors and/or technician supplied information to generate automatic indications of feeder exchange validity.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: July 7, 2009
    Assignee: CyberOptics Corporation
    Inventor: Steven K. Case
  • Patent number: 7552529
    Abstract: A device for assembling electronic circuits comprises a placing station (7) for placing circuit components on a circuit carrier (1) held at a placing location (17), a fixing station (19) for fixing the circuit components to the circuit carrier (1) under the effect of heat, and a belt conveyor means (9) for conveying a circuit carrier from the placing location (17) to a take-over location (29) of the fixing station (19). The fixing station (19) comprises a heatable zone (22) and a manipulator (21) for raising the circuit carrier (1) from the take-over location (29) and placing it in the heatable zone (22). A continuous belt conveyor (9) of the belt conveyor means extends from the placing location (17) up to the take-over location (29).
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: June 30, 2009
    Assignee: Ericsson AB
    Inventors: Willibald Konrath, Helmut Greiner, Klaus Scholl, Werner Horzer
  • Patent number: 7540080
    Abstract: A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: June 2, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Shigeki Fukunaga
  • Patent number: 7533459
    Abstract: The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: May 19, 2009
    Assignee: Hitachi High-Tech Instruments, Co., Ltd.
    Inventors: Yoshinori Kano, Takeshi Tomifuku, Yoshinori Okamoto, Yoshinao Usui, Ikuo Takemura
  • Patent number: 7533457
    Abstract: A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: May 19, 2009
    Assignee: Intel Corporation
    Inventors: Richard B Foehringer, Jason E Snodgress, Steven R. Eskildsen, John G. Meyers
  • Patent number: 7526863
    Abstract: A method for manufacturing a microstructure comprises the steps of forming positive type resist layer (PMMA) on a base plate having heater formed thereon; forming positive type resist layer (PMIPK) on the aforesaid positive type resist layer; exposing the positive type resist layer on the upper layer to ionizing radiation of the wavelength region that gives decomposition reaction to the positive type resist layer (PMIPK) for the formation of a designated pattern by development; exposing the positive type resist layer on the lower layer to ionizing radiation of the wavelength region that givens decomposition reaction to the positive type resist layer (PMMA) for the formation of a designated pattern by development; and coating photosensitive resin film having adhesive property on the resist pattern formed by the positive type resist layer (PMMA) and positive type resist layer (PMIPK); and then, dissolving the resist pattern to be removed after the resin film having adhesive property is hardened.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: May 5, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masashi Miyagawa, Masahiko Kubota
  • Patent number: 7525816
    Abstract: The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the first board includes: a board insertion opening in which the second board is inserted; and a first connection pattern provided inside the board insertion opening and electrically connected to the first wiring pattern, and the second board includes: an inserting portion to be inserted into the board insertion opening of the first board; and a second connection pattern provided at a position opposed to the first connection pattern and electrically connected to the second wiring pattern in the case where the inserting portion of the second board is inserted into the board insertion opening of the first board, and further comprising: solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: April 28, 2009
    Assignee: Fujifilm Corporation
    Inventor: Youichi Sawachi
  • Publication number: 20090100672
    Abstract: In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.
    Type: Application
    Filed: August 16, 2006
    Publication date: April 23, 2009
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Sumi, Takahiro Noda
  • Patent number: 7513035
    Abstract: Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: April 7, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Seah Sun Too, Mohammad Khan, James Hayward, Jacquana Diep
  • Patent number: 7503109
    Abstract: An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the electronic component and wherein the pocket has a protrusion at a bottom and wherein a top of the protrusion contacts with the second surface of the electronic component, and a second film covering the pocket and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: March 17, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Seiichi Kawada
  • Patent number: 7501752
    Abstract: Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an array direction of the light emitting devices into long-sized line-shaped device substrates. The line-shaped device substrates are arrayed on a second substrate such that the line-shaped device substrates are enlargedly spaced from each other. The line-shaped device substrates divided from the second substrate are arrayed on a third substrate such as to be enlargedly spaced from each other.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: March 10, 2009
    Assignee: Sony Corporation
    Inventors: Hisashi Ohba, Kunihiko Hayashi
  • Publication number: 20090056117
    Abstract: In a method of partially attaching an additional attaching material for various types of printed circuit boards, the method attaches an additional attaching material partially onto circuit blocks after circuits of the circuit blocks are made on a flexible, rigid or mixed printed circuit board or an insulating layer is coated. The method sets an attaching material on a shaping material that covers the circuit blocks, uses a depth control tool to cut away areas not corresponding to those requiring to be attached onto the necessary circuit blocks, aligns the corresponding positions of the circuit blocks to perform pseudo attachment and pressing, and tears away the shaping material from the attaching material, so as to attach additional attaching materials properly onto the predetermined positions of the circuit blocks without requiring to attach the circuit blocks one by one, and achieve the effect of saving manufacturing time and avoiding misalignment.
    Type: Application
    Filed: August 28, 2007
    Publication date: March 5, 2009
    Applicant: UNITECH PRINTED CIRCUIT BOARD CORP.
    Inventors: Yu-Jen Chen, Kai-Hsiang Chiang
  • Publication number: 20090049682
    Abstract: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 26, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Shuzo Yagi, Masao Nakane, Noboru Furuta
  • Publication number: 20090049680
    Abstract: The present invention is a method of controlling a component mounter which includes a mobile unit for mounting a component onto a circuit board, and includes judging (S1) on which side of the component mounter a user, who issues an instruction to the component mounter, is present; and performing position control (S2) by shifting the mobile unit to a position which allows a maintenance task to be performed on the component mounter from the side on which the user is judged to be present.
    Type: Application
    Filed: January 30, 2007
    Publication date: February 26, 2009
    Inventor: Keita Morita
  • Publication number: 20090031562
    Abstract: Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.
    Type: Application
    Filed: October 8, 2008
    Publication date: February 5, 2009
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Hyung-soo Choi, Tae-young Lee
  • Patent number: 7484278
    Abstract: A multi-layered piezoelectric device includes a plurality of piezoelectric portions and a plurality of electrodes electrically connected to the piezoelectric portions that are formed in layers on a ceramic substrate. A first piezoelectric portion is made of a piezoelectric ceramic composition containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO), and second and upper piezoelectric portions are made of a piezoelectric ceramic composition of higher Ni content than in the first piezoelectric portion. An electrode is provided at least between the first piezoelectric portion and the second piezoelectric portion.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: February 3, 2009
    Assignee: NGK Insulators, Ltd.
    Inventors: Toshikatsu Kashiwaya, Mutsumi Kitagawa
  • Publication number: 20090007423
    Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.
    Type: Application
    Filed: September 11, 2008
    Publication date: January 8, 2009
    Inventors: Daniel P. Cram, A. Jay Stutzman
  • Publication number: 20090000109
    Abstract: To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier. An electronic component pickup method for picking up a chip 6 adhered and held to a sheet 5 with an adhesive layer 5a by way of a support tool 20 uses an adhesive containing a compound that generates a gas by radiation of light. In the pickup operation, the support tool 20 is brought into contact with the top surface of the chip 6 and a light radiating part 8 is positioned below the chip 6. Then ultraviolet light is radiated from the bottom surface of the sheet 5 onto the adhesive layer 5a positioned on the rear surface of the chip 6. When a nitrogen gas generated from the adhesive layer 5a has formed a gas layer G at the adhesive interface between the rear surface of the chip 6 and the adhesive layer 5a, the support tool 20 is lifted to pick up the chip 6.
    Type: Application
    Filed: October 4, 2005
    Publication date: January 1, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Mitsuru Ozono, Hiroshi Haji, Teruaki Kasai
  • Publication number: 20090000115
    Abstract: An exemplary method for surface mounting an electronic component onto a pad of a printed circuit board is provided. The electronic component and the printed circuit board are located onto a platform. An outline image of the electronic component is captured using a first image sensing device. Coordinates of a geometrical center of the electronic component are determined using a central processing device. An outline image of the pad is captured using a second image sensing device. Coordinates of a geometrical center of the pad are determined using the central processing device. The electronic component is moved onto the pad using a picking-up/placing device according to the coordinate of the geometrical center of the electronic component and the coordinate of the geometrical center of the pad. The electronic component can be registered with the pad exactly using the method.
    Type: Application
    Filed: December 26, 2007
    Publication date: January 1, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: YIN-KUI ZHU, FENG-HUI WANG, CHING-HUNG PI
  • Patent number: 7467448
    Abstract: Disclosed are a piezoelectric ceramic structurally crystal-oriented through the crystallizing control of an amorphous material under an electric field and a method of manufacturing the same. The amorphous material is applied with an electric field to produce the crystal-oriented piezoelectric ceramic. The material is amorphous Li2B4O7 consisting of Li2O and B2O3 in a ratio of 1:2, and is employed in information technology, device technology, mechanical technology and so forth.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: December 23, 2008
    Assignee: Key Sung Metal Co., Ltd.
    Inventors: Yong Suk Yang, Su Jae Kim, Jong Soo Kim
  • Patent number: 7458147
    Abstract: The present invention provides a device and a method for determining whether or not a component holder is good, which enable detecting component holders that are to affect correct component recognition and further enable preventing interferences between constituent devices, a component mounting apparatus with the determining device, and a component mounting method. The determining device has an illuminating device, a CCD camera and a controller to determine whether or not a suction nozzle is good based on luminance at a component hold face of the suction nozzle. The suction nozzle having light reflectance of the component hold face increased to a level whereat a correct recognition of an electronic component held by the suction nozzle is affected, can be detected accordingly. An interference preventing device is also provided, so that interference between the CCD camera and the suction nozzle can be prevented.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: December 2, 2008
    Assignee: Panasonic Corporation
    Inventors: Takeyuki Kawase, Toshiyuki Kino, Takanori Yoshitake, Kimiaki Sano, Yoshiyuki Hattori, Takashi Yazawa, Hiroshi Uchiyama, Youichi Tanaka, Shigeki Imafuku, Iwao Kanetaka, Tamaki Ogura
  • Patent number: 7441329
    Abstract: A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the conductive layer, respectively. At least one passive component material layer is formed on the first surface. A circuit unit including second through holes is provided. Locations of the second through holes are corresponding to the locations of the first through holes, respectively. The conductive layer and the circuit unit are aligned by the first through holes and the second through holes, while the first surface of the conductive layer faces the circuit unit, and the passive component material layer is between the circuit unit and the conductive layer. The conductive layer is laminated to the circuit unit. The conductive layer is patterning to form a circuit layer.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: October 28, 2008
    Assignee: Subtron Technology Co. Ltd.
    Inventor: Shih-Lian Cheng
  • Patent number: 7437038
    Abstract: A method of forming an optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The spacer tool is of a length that corresponds with the predetermined distance between the optical component and the reference point.
    Type: Grant
    Filed: September 30, 2006
    Date of Patent: October 14, 2008
    Assignee: Finisar Corporation
    Inventor: Paul K. Rosenberg
  • Publication number: 20080245472
    Abstract: An aligning device that can reliably correct misalignment between electronic components for increasing the accuracy in aligning the electronic components, a bonding apparatus equipped with the aligning device, and an aligning method. The aligning device comprises a chamber; a flexible bellows configured to define an airtight chamber therein with the chamber; a driving unit configured to move one of a first block member and a second block member relative to the other, the first block member being for holding a first electronic component and being provided in the airtight chamber, and the second block member being for holding a second electronic component and being provided in the airtight chamber; and an image-taking port protruding inward from an outer surface of the chamber so as to define a space, the image-taking port having an observation window through which at least one of the first electronic component and the second electronic component is observed.
    Type: Application
    Filed: June 11, 2008
    Publication date: October 9, 2008
    Inventors: Atsuhiko Hirata, Shigeki Fukunaga, Shigeki Yamane, Mitsuhiro Namura, Arata Suzuki, Tomonari Watanabe
  • Patent number: 7433038
    Abstract: An alignment apparatus for a substrate bonding system is provided with a first optical arm arranged to direct onto a detector radiation from a first alignment mark on a first substrate, and a second optical arm arranged to direct onto the detector radiation from a second alignment mark on a second substrate. The first alignment mark has a known location relative to a functional pattern provided on an opposite side of the first substrate, and the second alignment mark has a known location relative to a functional pattern provided on an opposite side of the second substrate. The substrate bonding system can be further provided with first and second substrate tables arranged to hold the first and second substrates such that they face one another, at least one of the substrate tables being movable in response to a signal output from the detector, thereby allowing the first and second substrates to be aligned with respect to each other for bonding.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: October 7, 2008
    Assignee: ASML Netherlands B.V.
    Inventors: Franciscus Godefridus Casper Bijnen, Roy Werkman
  • Patent number: 7409761
    Abstract: In an electronic component mounting process for mounting electronic components (6) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual heater, and a time taken for the mounting operation is so allotted that a first heating time of a duration from a moment when the suction nozzle comes into contact with the electronic component for picking it up till another moment immediately before it begins a mounting motion to the substrate is longer than a second heating time of a duration from the moment when the suction nozzle begins the mounting motion till another moment when it leaves the electronic component mounted to the substrate.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: August 12, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Haji, Mitsuru Ozono
  • Patent number: 7383621
    Abstract: A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such as a composite perovskite compound, having a higher dielectric constant then the piezoelectric material, the dielectric existing in gaps between the piezoelectric particles. When poling to produce a piezoelectric ceramic, the poling is uniformly performed, and nearly all of the electric field is applied to the piezoelectric particles. Thus, the dispersion of the piezoelectric properties can be reduced, and the piezoelectric properties can be enhanced.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: June 10, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Mitsuru Sube