Abstract: A soldering method wherein a high-energy beam such as a laser beam is projected onto different lead terminal arrays of electronic components, the beam being projected in a scanning manner a plurality of times two-dimensionally and continuously is described.

Abstract: Apparatus for performing a non-contact three-dimensional inspection of a surface-mount component prior to placement on a printed circuit board. Specifically, an arrangement to ensure acceptable alignment (i.e. coplanarity) of all component heads in the XZ or YZ plane, where XY is the plane of the component. The apparatus is embodied within a conventional pick and place machine and performs critical, in-process, lead coplanarity inspection.

Abstract: An electronic parts automatic mounting apparatus wherein a plurality of removing nozzles are disposed on a removing head portion, and a tipped electronic part held on the suitable removing nozzle is recognized by a recognizing means to correct a deviation in position thereof, whereby mounting accuracy of the part on a print substrate is enhanced and the recognition of the tipped electronic part held by the removing nozzle by the recognizing means can be positively carried out.

Abstract: A method for inspecting the placement and alignment of surface mounted components on printed circuit boards during assembly. After the component is placed on the board, an infrared camera provides an image of leads on the component and corresponding soldering pads, to which the leads are to be soldered, on the board in a single exposure. The image is then processed by a computer and the position and orientations of the leads of the component with respect to the soldering pads are determined. As a result, any unsatisfactory misalignment of the component can be detected and defective printed circuit boards identified.

Abstract: A plurality of semiconductor chips are first attached to a transparent mask by placing indica marks on the mask and then viewing the chips through the mask and aligning them to the indica marks. The chips, which are held on a vacuum pedestal, are then brought into contact with the mask and a temporary adhesive layer holds the chips to the mask. The vacuum is then released. The mask with the chips attached thereto is then aligned to a printed circuit (wiring) board having indica marks thereon by viewing through the mask and moving the chips and printed circuit board together until they contact each other. A permanent adhesive layer holds the chips to the printed circuit board. The temporary adhesive layer is then dissolved and removed from the chips.

Abstract: A method for placing reverse mounted semiconductor bars on a lead frame wherein the semiconductor bar is placed in the target area and accurately position by an alignment system including a video camera which views the semiconductor bar, through a transparent stage for positioning the bar for mounting, during the time of placement of the bar, and optionally a second video camera is used to monitor the position of the lead frame during mounting.

Abstract: The present invention constitutes an apparatus for assembling multiple electrical contacts and filler elements into an electrical connector. The apparatus includes a filler assembly for automatically installing filler elements into the holes within the electrical connector which are to be unoccupied by electrical contacts, and a guide assembly which is functional for assisting the operator in manually inserting the electrical contacts into the correct holes within the connector by providing a visual indication of the holes into which the contacts should be inserted. The filler and guide assemblies operate on connectors held into position on a turntable-like indexing plate which allows the connectors to be rotated alternatively into position with respect to each of the assemblies. The filler assembly includes one or more filler element inserter tools which are adapted for inserting filler material from strands of such material into the holes within the connectors so as to form installed filler elements.

Abstract: A method of constructing a semiconductor laser includes producing a lead frame having a central lead which is used as a die pad at its central portion and two outside leads connected to the central lead by tie bars, mounting a semiconductor laser chip and a light receiving chip on the central lead of the lead frame, connecting the semiconductor laser chip and the light receiving chip to respective outside leads with wires, sealing portions of the leads, the wires, and both chips in a transparent package, and cutting the tie bars to disconnect the outside leads from the central lead.

Abstract: An assembly station (10) is used to align termini or leads of components (16) with attachment pads on circuit boards (20) to enable the component and circuit board pads to be precisely aligned and coupled together. A dual port probe (22), which is secured to an x-y table, is provided with upper and lower viewing ports (30, 32) which respectively view the component and the circuit board. Images from the two are directed to video cameras (34, 36) and the signals therefrom are processed by a vision system (38) which compares the alignment of the pads and provides error correction signals (x, y, .theta.) to a robotic arm (12) to move component (16) and its pad or termini into alignment with the pads on the circuit board. Thereafter, the robotic arm brings the component into contact with the circuit board for soldering of the respective leads together.

Abstract: A light table work station is provided for use in combination with a transparent prototype circuit board. At least a portion of each circuit trace on a circuit board is viewable when the board is populated with components, and back lit when the board is positioned on the work table, and each trace is also accessible from each side of the circuit board for examination, testing and/or modification. A work station is provided with a second upstanding light table for retaining transparent artwork sheets, each sheet bearing a copy of the circuit traces for each respective circuit plane on the circuit board.

Abstract: An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.

Abstract: An optical video system for the inspection and repair of TAB lifted leads. Three distinct light sources are aligned at different angles to illuminate the side of a lead-solder-pad joint. Each of the surfaces of the joint are readily distinguished.

Abstract: Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to be bound is held in a second plane which is below and substantially parallel to the first plane. A die eject head located above the sawn wafer cooperates with a die bond head located between the wafer and the substrate to remove an individual die from the sawn wafer. The die bond head then rotates about an axis which is parallel to both planes and places the die on the lead frame. Also included is a transducer means which is responsive to electrical stimulus for actuating the die eject head and the die bond head such that the interactive force between the heads and the component may be precisely controlled.

Abstract: A method and apparatus for detecting and enabling correction of a failure in the mounting of electronic parts on substrates, capable of automatically and efficiently accomplishing the detection of a failure in the mounting of electronic parts on substrates, and classification between failed substrates and acceptable substrates to improve the overall operation efficiency of an electronic parts mounting line. The method is adapted to apply a code mark to each substrate on which electronic parts are to be mounted, detect a failure the mounting after, read and store the code marks and failure data of failed substrates, and classify the failed substrates from acceptable substrates and transfer the failed substrates on the basis of the code marks and failure data stored.

Abstract: This invention provides for a method and apparatus for assembly of complex systems by human operators with the assistance of automatic machinery. The machinery employes a lighted probe to direct the operator to insert a part of the lighted location and the machinery tests for proper seating of the part. The machinery is integrated into a larger automated system which enhances its automatic part location indicating function by allowing and correcting for mislocation of real world coordinates from ideal coordinates. Also taught is a method for integration fo the assembly operation from the design stage through the production phase.

Abstract: A watertight and leak-proof junction box for use, for example, in vehicles such as automobiles, and a process of assembling such a junction box are provided. The wiring board assembly comprising a plurality of insulating plates, wiring conductors strips and electric contacts formed by raising the free ends of the strips so as to project from the outer surface of the wiring plate pile which is embedded in an insulating resin through molding to form a resin-embedded wiring board assembly prior to assembling the junction box, and then the resin-embedded wiring board assembly joined with a connector support board having connector bodies for receiving the terminals of electrical units and/or wire harnesses is contained in a watertight case.

Abstract: A workpiece carrier and positioning system determines the particular orientation of each workpiece upon an individually identifiable carrier or frame to which it has been affixed. The carriers themselves are precisely registered at each workstation where an operation is to be performed upon the workpiece. Once registered at a workstation the carrier's identification is determined and the carrier or the operational tool of the workstation is offset and/or rotated as needed, according to the determined particular orientation of the workpiece, to allow precise alignment of the workpiece with the operation to be performed. The offset and/or rotation needed is individually determined for each workpiece at each workstation on the basis of the original particular orientation of each workpiece upon its individual carrier. A table is maintained that associates with each carrier the particular orientation of the workpiece carried thereon.

Abstract: A procedure and apparatus for preparing an electronic baseboard are disclosed. The baseboard is marked such that each side shows the specific location for various circuit elements and their corresponding connections. The components are inserted into holes in the base board and are connected by means of a wiring device. The wiring device includes a tubular hollow body which houses an electrical conductor wire. A reel is rotatably attached to one end of the hollow body. The electrical conductor wire is wound on the rotatable reel, runs axially through the hollow body and emanates through a nozzle at a second end of the device. The device is optionally provided with a blade for cutting the electrical conductor wire.

Abstract: A optical system for stand alone use or for use with a device for attaching modular electronic components to or removing them from a substrate, including a microscope which is horizontally rotatable through 0.degree., +90.degree.. and -90.degree. positions relative to a component to permit viewing of three sides of the component and thus facilitate alignment of the component terminals with leads on the substrate together with inspection of soldered joints. A unit for vertically rotating the microscope through 90.degree. with respect to the component is also disclosed which includes means for quickly positioning and locking the microscope at a preset vertical orientation such as 45.degree. to further facilitate the alignment and inspection functions. Mirrors are also disclosed which enable viewing of three or four sides of a component in the 0.degree. horizontal position of the microscope whereby the above rotation of the microscope to the +90.degree. and -90.degree. positions may be avoided.

Abstract: Automated positioning apparatus for positioning multi-contact components on a circuit board utilizes automated members having a high degree of repetitive movement but not in themselves accurate, such member being relatively inexpensive. A positioning member picks up a component and moves it over a first viewing head. The component is viewed and its orientation determined. A viewing head on the positioning member is then positioned over a target on a circuit board and its position and orientation determined. The results enable the positioning member to position the component on the circuit board in the correct position and orientation. The viewing heads are calibrated for aspect ratio and pixel dimension. Also, the field of view of the viewing heads are calibrated for orientation relative to the positioning member. The position and orientation of the viewing head on the positioning member relative to a pick-up member on the positioning member is also obtained.

Abstract: An automatic circuit element mounting apparatus includes a lead wire detection mechanism for detecting lead wires of a circuit element held on a mounting head by suction and a substrate mark detection mechanism for detecting a mounting reference mark of a printed circuit board on which the circuit element is mounted by means of the mounting head, so that the amount of movement of the mounting head may be corrected depending on a result of detection by each of the detection mechanisms to precisely mount the circuit element on the printed circuit board. Also, a method for mounting a circuit element on a printed circuit board is disclosed.

Abstract: A contact which is attached to a wire is fitted in a hole of a connector by first identifying the wire to which the contact is attached. The location of the hole that is to receive the contact is determined automatically from an electronic data lookup table, and a signal is provided which positions an end portion of a fiber optic rod in line with the correct hole of the connector. The opposite end of the fiber optic rod is optically coupled to a source of light. The fiber optic rod is advanced so that it enters the hole and projects from the opposite side of the connector identifying the correct hole. Light emitted from the fiber optic rod facilitates visual identification of the hole from which the rod is projecting. Therafter, the fiber optic rod is retracted, and the contact is inserted into the hole.

Abstract: Repair of defects in a printed circuit board, the defects including a break in a strip conductor and a short between two strip conductors, is accomplished by use of a milling machine cutter which is operated in a direction normal to a surface of the board to bring the cutter to a repair site at the defective conductor. The cutter is then advanced partway into the conductor and translated along the conductor in preparation for soldering of braze repairing a break or, alternatively, the cutter is advanced beyond the depth of shorting material after which translation along the surface serves to rout out shorting material. Transverse movement of the cutter also removes any coating which may be present on the circuit board, which coating need be removed prior to soldering or braze repair, and may be replaced after soldering or braze repair. A microscope and pellicule are positioned for aligning the cutter with the repair site.

Abstract: A system for automatically inserting the leads of electrical components into circuit boards is disclosed. In the preferred embodiment, an electrical component is acquired by the robot. The leads of the component have been trimmed and preformed such that they are substantially parallel with respect to each other with the leads differing in length. The robot positions the component at a fixed location relative to the axis of the robot and within the view of an optical sensor such as a TV camera. The sensor determines the location of each of the leads relative to a fixed location. A first rotary motion rotates the component about a selected axis of the robot through a predetermined angle and a second measurement is made. A second rotation positions the component 180.degree. from the original position and a third measurement is made.

Abstract: Device for the alignment of a part 12 and of a substrate 10 designed to receive it. The device contains a plate 2, on the horizontal flat upper surface 3 of which an XY table 5 can slide, a blocking device 16 for temporarily interrupting any translation of the XY table 5, but leaving it free to rotate on a given vertical axis 4, a gripping device 11 and an optical viewing device 15. The blocking device 16 preferably consists of an electromagnet mounted for rotation in a bore of the plate 2.

Abstract: Equipment to visually identify insertion points to an operator of a pre-programmed, semi-automatic electronic assembly station. This equipment includes a pair of illuminators disposed at opposite ends of a cut-clinch mechanism and arranged to shine on the underside of the circuit board. The illuminators are carried by the cut-clinch mechanism and are free to move transversely and rotate axially, as the mechanism rotates and moves during the assembly steps.

Abstract: A device for assembling printed circuit boards with an optical illuminating system for illumination of the holes in the printed circuit board into which components are to be installed. The optical system, or a mirror forming a portion thereof, is arranged, on a pantograph linkage for example, so as to be maneuverable above and parallel to the circuit board. The optical system is provided with specially mounted shutters which can be moved specified amounts to direct the light to precise selected locations on the circuit board.

Abstract: The construction of complex electrical circuits is simplified by performing all interconnections on one side of a component-receiving board, using slotted beam insulation-piercing connectors. Boards with or without metallization patterns are adaptable to the basic approach. Using boards with an X-Y pattern of holes arranged in columns, slotted beam connector elements are readily pressed into one side; and corresponding circuit elements such as dual-in-line packs plugged from the other side into the connector elements. The system is enhanced by a tool which feeds insulated conductor from a source and into selected slotted beams. The tool includes a retractable knife or a retractable cutter with which a given wire run may be terminated. For the manual mode, a sequence of wiring is indicated to an operator by stepping of a laser beam which illuminates successive slotted beams to be connected.

Abstract: The mounting locations for .[.separable.]. insertion of components on a printed circuit board are indicated by a projected luminous .[.spot which is moved sequentially and repeatedly between the several mounting spots for each component. The direction of movement of the luminous dot is changed in each mounting spot..]. dot which moves from one mounting spot to the next to indicate the array of mounting spots forming the mounting location. The movement is cyclically repeated in the same sequence to indicate to the installer the mounting location. Thereafter the luminous dot is moved to the next mounting location and the same cyclical and sequential scanning is repeated. The spot travels over the board in response to an element of the optical system in the projector being moved in a plane parallel to the board surface under control of a programmed unit.