Abstract: A device for aligning a PC board (2) on a manual press (50) for insertion of an electronic component (1) into an insertion zone (z). The device comprises a manually operated X-Y table, to which the PC-board (2) is secured. The X-Y table comprises an X carriage (40) movable along an X-axis and a Y carriage (11) movable along a Y-axis. Respective correction carriages (21,25) are movably mounted to each of the X and Y carriages. Respective correction carriages have corresponding correction motors for moving each of the correction carriages relative to the X and Y carriages. Encoders (17,18) are respectively connected to the X and Y carriages for detecting a position of the X and Y carriages. The encoders are connected to control units for operating correction motors of the correction carriages in response to a signal from the encoders indicating the position of the X and Y carriages.

Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Abstract: An apparatus for moving an operative suction nozzle which holds an electric component. The apparatus mounts the electric component held by the operative suction nozzle on a circuit board. The apparatus includes a device which supplies the electric component to the operative suction nozzle; a device which supports the circuit substrate; a nozzle storing device which stores normal suction nozzles; and a nozzle moving device. A nozzle-defect detecting device which detects a defeat of the operative suction nozzle is provided. Also provided is a nozzle exchanging device which automatically operates the nozzle moving device to move the defective suction nozzle having the detected defect, to the nozzle storing device so that the defective suction nozzle is exchanged with the normal suction nozzle stored by the nozzle storing device.

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract: To measure positions of a plurality of thin film magnetic head elements formed in a line on a bar, the quantity of positions of samples in the bar is estimated from the magnetic head elements the amount of deviation in position of the next element, and the distance between the elements are obtained, and the amount of deviation and distance are estimated by a primary approximate linear or several-order approximate curve. The estimated amount and the distance between the elements are moved simultaneously, and an image formed by a lens optical system is photo-converted to an image signal, and dimensions are computed. The conversion step is carried out immediately after movement of the next element and is continuously repeated, and the computing step is processed in parallel with the conversation step.

Abstract: A device and appertaining method for picking up devices in a component placement device permits even very small components and even a first component of a new belt to be picked up by scanning the structural features of the belt directly in the proximity of the components. The positional tolerances can be disregarded so that even the first component of a new belt can be reliably detected by the pick-up tool.

Abstract: A method of attaching a component having a fiducial marker to a substrate is provided. The method includes detecting alignment of the fiducial marker, aligning the component such that the fiducial marker matches a predetermined fiducial alignment, and attaching the component to a substrate.

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: A component installing device comprises: a tray component supply section (8) having a plurality of conjointly provided tray component supply mechanisms (7) for moving selected trays (4) from a storage position (5) to a component supply position (6), according to need, thereby providing the components (2) accommodated therein for use; and a cassette component supply section (13) having a plurality of mutually aligned component supply cassettes (12) for carrying components in a tape cassette or a bulk cassette, and transporting said components to a component supply position (11), one at a time, thereby providing said components for use.

Abstract: An electronic parts-mounting method for mounting parts on a board in which at least two electronic parts can be picked up by a plurality of nozzles including a plurality of first nozzles arranged substantially parallel to the direction of movement of the board and a plurality of second nozzles arranged substantially perpendicular to the direction of movement of the board such that the positions of the parts picked up by the second nozzles can be recognized by a line sensor and corrected.

Abstract: A surface mounting device is provided on which work can be performed more efficiently and correctly by providing one or more moving means movable together or independently to a predetermined portion of a X-Y gantry. The surface mounting device includes one or more X frames configured to be driven in a predetermined direction together or independently; main driving means for driving the one or more X frames; one or more moving means disposed on a selected portion of the X frames and having one or more manipulators movable in a predetermined direction together or independently; sub driving means configured to drive the one or more manipulators together or independently; one or more head and vision portions disposed on the one or more moving means; and a component supplying portion configured to supply a component to the head.

Abstract: A method of picking a component having an alignment indicating fiducial marker according to a predetermined alignment is provided. The method includes detecting the alignment of the fiducial marker of the component, comparing the detected fiducial alignment with a predetermined fiducial alignment, determining an alignment offset and picking the component in a manner that corrects the alignment offset when the offset has a predetermined value.

Abstract: A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.

Abstract: In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

Abstract: In a part-mounting system formed by linking plural part-mounting devices which carry out respective process steps of part-mounting, when a production tact-time of one of the devices varies beyond a given variation range, a tact-time change signal is sent to other devices located at upstream and/or downstream of the device via a communicating section. The other devices receive the tact-time change signal and changes their own work tact-times from the ones corresponding to a productivity-oriented mode to a slower tact-pattern corresponding to a quality-oriented mode. Thus every device constituting the system can accommodate a tact-time variation due to a tact-time delay of any part-mounting device. As a result, the quality appropriate to the tact-time can be secured.

Abstract: A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die.

Abstract: A chip-mounting device comprises a chip-holding tool and a substrate-holding stage. At least one of the chip-holding tool and the substrate-holding stage is placed on a coarse adjustment table for coarse positioning of a chip or a substrate. Brake means for fixing the positioned coarse adjustment table is provided on the coarse adjustment table. Fine adjustment means for fine positioning of a chip or a substrate is provided on the coarse adjustment table. The chip-mounting device allows alignment with submicorn accuracy to be performed quickly, shortening tact time in chip mounting remarkably.

Abstract: An electric-component mounting system including component-mounting devices arranged in an array and each having a component-holding head for holding an electric component, and a head-moving device to move the head, and a substrate-transferring device to move at least one substrate on which electric components are to be mounted, and wherein the substrate-transferring device stops each substrate at at least one stop position which corresponds to at least one of the component-mounting devices and at which operations of the component-mounting devices are concurrently performed on the at least one substrate.

Abstract: The invention relates to a marking device (1, 11) for the identification of objects with a coding of regions (4, 5, 13) with different magnetic properties. The marking device is characterized in that magnetic regions (4, 5, 13) are so magnetically biased that their hysteresis loops (7, 8, 15) are shifted on the field strength axis (H) relative to the magnetization axis (M).

Abstract: Two or more parts feeding sections are provided, and in each of the parts feeding sections, identical combinations of parts cassettes aligned in the same arrangement are prepared. If one or more type of components that are to be picked up at one time by a plurality of suction nozzles is exhausted, the mounting head moves to the other parts feeding section, which provides the same combination of components for all the suction nozzles to pick up the components at one time, so that the mounting operation can be continued without stopping the apparatus for replenishment of components.

Abstract: An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not.

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

Abstract: A component placement apparatus including a head mount having at least one pick and place head; component carrier; and component receiver, the at least one pick and place head being arranged to pick up a component from the component carrier and place it on the component receiver, wherein the head mount is movable to move the at least one pick and place head in a single plane; the component carrier is movable in a plane transverse to the at least one pick and place head at a pick up position; and the component receiver is movable in a plane transverse to the at least one pick and place head at a placement position.

Abstract: A semiautomatic method for digital feature separation uses a trained sample selected by an operator using a software “eye dropper” tool or a similar region-of-interest tool to sample features of interest on a stored digital image of, for example, an electronic component such as pads, bumps or leads of the component. Pixels from the sampled features are analyzed and plotted based on their color hue and saturation values or gray scale intensity values. The range of such values is chosen by a user. A second digital image is then compared to the sampled feature data gathered by the “eye dropper” tool. If the color and intensity values of the pixels from the second digital image fall within a user defined acceptable absolute value range, then the locations and values of those pixels in the image are saved.

Abstract: A method for assembling a multi-chip module does not necessitate more than one pass through a die attach machine. The method involves attaching a smaller die to a larger die without using a die attach machine. The larger die may be attached to a support structure using a die attach machine.

Abstract: An electric-component transferring apparatus including a component holder which holds an electric component, a shaft member whose lower end portion supports the component holder, a movable member having a support hole which supports the shaft member such that the shaft member is rotatable about an axis line relative to the movable member and is movable relative to the movable member in an axial direction parallel to the axis line, a moving device which moves the movable member in a direction intersecting the axis line of the shaft member, a piston which is supported by the shaft member such that the piston is not movable relative to the shaft member in the axial direction of the shaft member, the support hole including a portion defining a cylinder bore which cooperates with the piston to provide an air-pressure-operated cylinder device, a driven wheel which is substantially integral with the shaft member, and a drive wheel which is supported by the movable member such that the drive wheel is meshed with the

Abstract: When plural board blocks formed in one board undergo sequential part-mountings at plural mounting stages, particular recognition points and recognition points in the board blocks target of a downstream mounting stage are recognized at an upstream mounting stage. Relative positional data of each recognition point of the board block with respect to the particular recognition points are thus obtained at the upstream mounting stage. At the mounting stage on downstream side, only the particular recognition points are recognized thereby detecting a whole position of the board. Based on the whole position and the relative positional data, a positional deviation of the board block at the mounting stage can be detected, so that repeated recognition of the same recognition points is avoided thereby shortening a total time of position recognition.

Abstract: Mounting parts is performed by recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking up a part on the part feeder, moving an image sensor installed to be capable of moving to a position close to the particular part feeder, picking up a part from the particular part feeder with a suction nozzle installed at the head unit, moving the head unit to a position above the image sensor, detecting an image of the part held by the suction nozzle, moving the suction nozzle to a printed circuit board from the image sensor, and aligning the part with the printed circuit board while determining and compensating for an error generated when the part is picked up, and mounting the aligned part on the printed circuit board.

Abstract: A die bonder, to which semiconductor pellets 4 are supplied in an arranged state, comprises a substrate feeding mechanism for feeding a substrate 1 including a plurality of pellet islands to successively set the pellet island at a bonding position BP, a defective substrate detecting means 3 for detecting defective pellet island, and a pellet transfer mechanism. The pellet transfer mechanism successively picks up and carries a defective pellet to the bonding position BP for mounting when a pellet island of the substrate set at the bonding position is non-defective, and mounts a defective pellet 4a when a pellet island is defective. In this arrangement, when the defective substrate detecting means determines that a pellet island is defective, a defective pellet is mounted.

Abstract: A mounting device (1) including a plurality of heads (3), each holding a chip (2), arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads (3) with calibration marks, first recognition means (10) fixed in a chip mounting position (A), and second recognition means (16) fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads (3) In mounting operation, the first recognition means (10) recognizes the positions of a substrate (4) and the calibration marks of the heads (3), whereas the second recognition means (16) recognizes the positions of chips (2) attracted on the heads (3). The heads are moved vertically to adjust plane to be recognized. The chip (2) and the substrate (4) are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

Abstract: An apparatus for mounting a flipchip onto a work piece comprises a pick-up station for presentation of the flipchip, a transport mechanism, at least one pick-up tool arranged on the transport mechanism for pick-up and transport of the flipchip from the pick-up station to the work piece and a position acquisitioning device arranged on the transport mechanism for determining the position of the picked up flipchip. The position acquisitioning device comprises a slide and a single line camera secured to the slide, a guide element for guiding the slide, a drive mechanism for driving the slide and a measuring device for determining the position of the slide.

Abstract: A component pick and place head includes a frame; a pick-up head mounted on the frame; the pick-up head being movable from a first position in which a component is picked-up by the pick-up head to a second position in which a position of the component that has been picked up by the pick-up head is ascertained; the pick-up head being actuatable from a retracted configuration to an extended configuration for picking up the component; a first actuator for actuating the pick-up head at the first position from the retracted configuration to the extended configuration; and a second actuator at the second position for actuating the pick-up head at the second position from the retracted configuration to the extended configuration.

Abstract: The invention is directed to techniques for inspecting a circuit board having a surface that includes at least one circuit board component. The apparatus includes a base, and a set of reflective members that includes at least one reflective member. Each reflective member of the set of reflective members is (i) supported by the base and (ii) movable relative to the base to enable that reflective member to move to an angle that reflects light from a respective portion of a circuit board component (e.g., a solder region between the component and the circuit board) in a direction away from the surface of the circuit board when the base rests on the surface of the circuit board. Since the base can rest on the surface of the circuit board, a technician does not need to hold the apparatus.

Abstract: A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards.

Abstract: A cavity-type chip module. The module is formed with an adhesive joining layer of photoimageable material interposed between a metal stiffener and a laminate top layer with a central aperture defined in the top layer. The photoimageable material is exposed to actinic radiation, except for an area corresponding to the aperture in the top layer. The unexposed area of photoimageable material is developed away to form a window in the joining layer. The top layer, joining layer, and stiffener are laminated together with the window and aperture aligned, and with a portion of the stiffener spanning the aperture to define a cavity in the resulting substrate. The removal of the unexposed photoimageable material, and the selective exposure of the joining layer to actinic radiation, keep the cavity free of photoimageable material and inhibit bleeding of the photoimageable material into the cavity from its inner edge.

Abstract: An apparatus for mounting semiconductor chips on a substrate with which the semiconductor chips are presented on a foil clamped in a frame at a first location A comprises a chip gripper for the transport of the semiconductor chip presented at the first location A to a second location located on the substrate, a movable table for accepting the frame, a chip ejector arranged underneath the foil at the first location A the upper surface of which facing towards the foil has holes connected to a vacuum source, as well as a measuring camera directed at the first location A for establishing the position of the presented semiconductor chip. Correction of a possible position deviation of the presented semiconductor chip from its set position takes place in accordance with the invention in that the foil is secured by the chip ejector by means of vacuum and then at least the upper surface of the chip ejector facing towards the foil is moved in the plane running parallel to the under side of the foil.

Abstract: An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.

Abstract: An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3 by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract: A method for mounting or equipping components onto substrates that utilizes a number of component mounting process areas. Each of the process areas includes a component mounting head member or equipping head for mounting the components, a number of supply units for supplying the components to the component mounting head member and a transport member for moving the components between the process areas. The method utilizes a single or a multiple stage or a combined single and multiple stage component mounting process for mounting the components, whichever is determined to be optimally utilized. The single stage process is optimally utilized for a small number of components to be mounted. The single stage process includes completely mounting the components at one of the process areas as compared to the multiple stage process which includes mounting or equipping the components at a combination of successive process areas.

Abstract: A method of mounting an electric component on a circuit substrate, including the steps of moving one of a suction nozzle and an electric-component supplying device toward the other of the nozzle and the supplying device, so that the nozzle applies a suction to the component supplied by the supplying device and thereby receives the component, moving one of the nozzle and the substrate toward the other of the nozzle and the substrate, so that the nozzle mounts the component on the substrate, taking an image of at least a portion of the component held by the nozzle, as seen in a direction perpendicular to an axial direction of the nozzle, in a state in which the nozzle takes a known position in the axial direction, determining, based on image data representing the taken image, a position of a mounted surface of the electric component that is opposite to a sucked surface of the component sucked by the nozzle, and controlling, based on the determined position, a movement of the nozzle toward one or each of the sup

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: A method of detecting a relative positioning error between a fiducial-mark imaging device and a substrate-holding device in an electric-component mounting system wherein the fiducial-mark imaging device is arranged to take an image of at least one substrate fiducial mark provided on a circuit substrate, and a positioning error of the circuit substrate as held by the substrate-holding device is detected on the basis of the image of the at least one substrate fiducial mark, so that an electric component is mounted by a mounting head onto the circuit substrate, so as to eliminate the positioning error of the circuit substrate, wherein the fiducial-mark imaging device is operated to take an image of at least one holding-device fiducial mark provided on the substrate-holding device, and the relative positioning error between the fiducial-mark imaging device and the substrate-holding device is detected on the basis of a positioning error of the image of the holding-device fiducial mark within an imaging area of the

Abstract: An automatic electronic component-mounting apparatus is provided. A nut member is slidably arranged between a pair of rails. A head-lifting/lowering member is lowered and lifted with respect to the main block via the pair of rails and the nut member. A mounting head is attached to the head-lifting/lowering member. The head-lifting/lowering member is lowered and lifted to cause the mounting head to pick up an electronic chip component and then mount the electronic chip component on a printed circuit board. The head-lifting/lowering member is formed of a metal-ceramic composite material produced by combining a ceramic reinforcing material with a metal.

Abstract: A method and an apparatus for aligning and supplying an electrical component capable of aligning a first electrical component to be mounted on a second electrical component relative to a suction head without using a pre-alignment stage. On supplying an IC chip being the first electrical component to a position at which the IC chip is mounted on a liquid crystal panel being the second electrical component with the suction head sucking the IC chip, after the suction head sucks the IC chip in a recessed portion in a container, the suction head is moved in an X direction and the container is moved in a Y direction to thereby cause the IC chip abut a wall of the recessed portion, and thereafter the movements in the X and Y direction are still carried out to thereby displace the suction position of the IC chip relative to the suction head to achieve the alignment thereof.

Abstract: The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board. The board has a plurality of areas for receiving a component respectively. Each area is marked in the center thereof with a first marker. Adjacent each area, and indicative of the polarity of the component, a second marker is marked on the board. The presence or absence of a component can be evaluated by inspecting the board after it has been populated and determining whether any of the first markers appear, indicating that a component is missing. Verification of the polarity of a component is done by placing a marker on a portion of a component required to be installed in a predetermined position indicative of polarity. Inspection of the board once it has been populated will determine if the component is in the proper orientation by verifying if the second marker and the marker on the component are in alignment.

Abstract: A component feeder including a rotary mechanism 31 which is mounted on a turning mechanism 17 for turning the suction nozzle 3 and causes the suction nozzle 3 to rotate around its axis line A, a detector 7 for detecting an amount of displacement the component 2 in rotating direction around the axis line A of the suction nozzle 3, and a controller 32 which controls the suction nozzle 3 such as to rotate at a necessary angle around its axis line A before picking up the component 2 in accordance with displacement of the component 2 in rotating direction around the axis line A.

Abstract: A printed circuit board includes a first mark 2 formed by a thin conductor, a second mark 3 formed by a resist 8, a land 6 which is partially coated by the resist 8 and a land 7 which is not coated by the resist 8. The second mark 3 is formed when the land 6 is partially coated by the resist 8. A device 4, which corresponds to the land 6, is mounted at a position apart from a center 02 of the second mark 3 by a predetermined distance L1. A device 5, which corresponds to the land 7, is mounted at a position apart from a center 01 of the first mark 2 by a predetermined distance L2. Therefor, the devices 4, 5 can be properly mounted on the printed circuit board 1 in spite of a positional error of the resist 8.

Abstract: An electronic component pick and place machine is provided. The pick and place machine comprises a pick station, first and second pick heads, a component alignment detector and a controller. The pick station is connected to a component feed source. The first pick head has access to the pick station and a component transfer area and the second pick head has access to the component transfer area and a component mounting position. The component alignment detector is furthermore directed toward the component transfer area. The controller is coupled to the feed source, the first pick head, the second pick head and the detector, the controller containing instructions which, when executed, cause the controller to compare the detected component alignment with a known component alignment and control the feed source, the first pick head, and the second pick head in response to the comparison.

Abstract: In an image taking system including an illuminating device including a light source which emits a light for illuminating an object, a camera which takes an image of the object, and a processing and controlling device which includes a data processing portion that processes image data representing the image of the object taken by the camera, at least one of the camera and the illuminating device includes a brightness controlling device which controls a brightness of an image taken by the camera, and the processing and controlling device includes a brightness detecting portion which detects a brightness of at least a portion of the image of the object taken by the camera, and a control-parameter varying portion which varies, based on the brightness detected by the brightness detecting portion, at least one control parameter of the brightness controlling device so that a brightness of at least a portion of an image taken by the camera is equal to a preset brightness.