Abstract: A jig for use in measuring an accuracy with which a mounting device mounts at least one proper member on a proper substrate, the jig being set, in place of the proper substrate, on the mounting device, at least one standard chip being mounted on the jig by the mounting device, the jig having at least two reference marks at respective positions which assure that respective images of the reference marks and an image of at least a portion of the standard chip mounted on the jig are simultaneously taken by a single image taking device, so that the accuracy is determined based on the images taken by the image taking device.

Abstract: There is disclosed a novel method for attaching electronic components to an electric circuit printed on a glass substrate. The method comprises depositing a desired quantity of an uncured, ultraviolet radiation-curable, anisotropic conductive adhesive in a desired location on a metallized glass substrate having an electric circuit formed on a surface thereof. An electronic component having electrical contacts formed on a portion thereof is applied to the uncured, deposited adhesive so that the bumps are positioned in the adhesive and in register with desired portions of the electric circuit on the substrate. An amount of pressure sufficient to render the adhesive selectively conductive at locations between the electric circuit and the electrical contact on the electronic component and substantially nonconductive at other locations is applied to the electronic component, such that the electrical contacts make an electrical connection with desired portions of the electric circuit.

Abstract: An electronic component holding head, an electronic component mounting apparatus using same, and a method for mounting an electronic component, are provided for use in mounting an electronic component having a positioning mark formed on a film member.

Abstract: A component mounting method for picking up components with a mounting head having multiple suction nozzles, and mounting these components on a mounting target after recognition. Components picked up integrally move against a component recognizer disposed on a movement route of the head for scanning and recognizing each component. During scanning, the slowest speed in scanning speeds required for recognizing each component is used. This eliminates a approaching time needed for switching speed during scanning of each component, thus reducing the total recognition time to improve mounting efficiency.

Abstract: An electronic component mounting apparatus and an electronic component mounting method are provided which improve the productivity by reducing the cycle time. The electronic component mounting method includes the steps of a) picking up an electronic component from a first supplying section or a second supplying section respectively disposed on each side of a substrate, b) recognizing the electronic component by a recognition section, and c) moving and mounting the electronic component on the substrate. Frequently used electronic components are stored in both of the first and second supplying sections. The electronic components are picked up from the first supplying section and mounted on the substrate in the normal operating conditions. When the electronic components stored in the first supplying section run out, the same kind of components are provided by the second supplying section to continue the mounting operation.

Abstract: A component mounting apparatus have a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzle, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head section performs successive suction, recognition, posture adjustment, and mounting of the components.

Abstract: A method of detecting a position of a rotation axis of a suction nozzle of an electric-component mounting apparatus, the suction nozzle holding, by suction, an electric component, and being rotated about the rotation axis thereof to rotate the electric component held thereby, so that the electric component rotated is mounted on a component-mounting surface of a circuit substrate, the method including the step of detecting, on a position-detecting plane including the component-mounting surface of the circuit substrate, the position of the rotation axis of the suction nozzle.

Abstract: An electronic component, such as a BGA component, and a method of positioning with respect to a mounting head the component. The BGA component is positioned through positional detection of a reference mark and inspection, and the positional correction is executed by checking the holding posture. Through the inspection using the reference mark as a reference position, the dropout, dislocation, shortage of solder amount of the solder bumps of the component are subject to a quality check (S4). If of normal quality, the component is moved closer to the mounting-position of the printed board on a mounting table by a mounting head (S5). A recognition mark in the target mounting position of the printed board is confirmed and recognized (S6). By determining the mounting position through mounting position detection and component inspection result, the mounting position is corrected (S7) and the height of the mounting head is controlled and the component is mounted (S8).

Abstract: A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The recognition processing is performed using the component data of group 1 data, group 2 data, group 3 data, and group 4 data that are stored for the images taken in a random access memory (RAM). The group 1 data is used for lead inspection (for inspecting positioning error and bending of the lead), the group 2 data and the group 3 data are used for calculating amounts of adjustment in the X and Y directions, and the group 4 data is used for calculating the amount of adjustment in the &thgr; direction. This makes it possible to mount accurately components with pins and extrusions extruded from the molding, such as connectors, such that the pins and extrusions are accurately engaged with the holes formed in a print board.

Abstract: According to the present invention, a control device and a circuit board moving device controlled in operation by the control device for holding a circuit board are provided, whereby the circuit board moving device is moved to bring a component mount position on the circuit board closest to a recognition device after the circuit board moving device is moved to bring the component mount position closest to a component feed position. In the state, a circuit board mark formed on the circuit board is detected, thereby recognizing a position of the circuit board. A transfer distance for the component by a component hold device from the recognition device to the component mount position is thus shortened, enabling high-speed mounting with higher accuracy.

Abstract: An electric-component mounting system including a component-holding device for holding an electric component, a board-supporting device for supporting a printed-wiring board on which the electric component is mounted, a first relative-movement device operable to move the component-holding device and the board-supporting device relative to each other in a first direction parallel to a surface of the board supported by the board-supporting device, a second relative-movement device operable to move the component-holding device and the board-supporting device relative to each other in a second direction which intersects the surface of the board; and a control device including a positioning portion operable to select one of a plurality of different control targets which is used for the first relative-movement device to establish a predetermined relative position between the component-holding device and the board-supporting device, and wherein the positioning portion selects one of the different control targets, de

Abstract: A method and apparatus for accurately registering electronic chip bonding pads with substrate leads. Images are developed of different portions of the interface between the electronic chip and the substrate by reflecting collimated, parallel light from the bottom of the chip through transparent areas of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.

Abstract: A substrate comprising at least one optical fiducial hole and a plurality of holes surrounding at least substantially one-half of the at least one optical fiducial hole.

Abstract: There are provided a component suction site-teaching system and method for an electronic component-mounting apparatus including a vacuum nozzle having a nozzle end face for picking up an electronic component thereat by vacuum. The vacuum nozzle is moved in directions of X axis and Y axis. An image of the electronic component set at a pickup position is taken. A graphical image of the nozzle end face of the vacuum nozzle is created from shape data of the vacuum nozzle. The image of the electronic component taken by the image taking means and the graphical image of the nozzle end face created by the image creating means, are displayed on a screen such that the graphical image of the nozzle end face is superimposed on the image of the electronic component.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted.

Abstract: A method of detecting a positioning error of an electric component with respect to a suction nozzle by which the electric component is held by suction under a negative pressure, wherein image data representative of images of the suction nozzle and a dog disposed near the suction nozzle are processed to obtain a relative position between the suction nozzle and the dog, a second image-taking step of taking an image of said electric component held by said suction nozzle and an image of said dog, and the positioning error of the electric component with respect to the suction nozzle is obtained on the basis of image data representative of images of the electric component and the dog, and the obtained relative position between the suction nozzle and the dog. Also disclosed in a method of mounting the electric component on a circuit substrate, on the basis of the obtained positioning error of the electric component.

Abstract: A method of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit, including the steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component and the second portion adjacent to the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

Abstract: A method for direct chip attach of a semiconductor chip to a circuit board by using solder bumps and an underfill layer is disclosed. In the method, a layer of in-situ polymeric mold material is first screen printed on the top surface of the semiconductor chip exposing a multiplicity of bond pads. The in-situ polymeric mold layer is formed with a multiplicity of apertures which are then filled with solder material in a molten solder screening process to form solder bumps. A thin flux-containing underfill material layer is then placed on top of a circuit board over a plurality of conductive pads which are arranged in a mirror image to the bond pads on the semiconductor chip. The semiconductor chip and the circuit board are then pressed together with the underfill layer inbetween and heated to a reflow temperature of higher than the melting temperature of the solder material until electrical communication is established between the bond pads and the conductive pads.

Abstract: A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The method is adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier.

Abstract: It is an object of the invention to suck the central position of an electronic part precisely, and enhance the successful suction rate of electronic parts. To achieve the object, the central position of the suction opening 14 provided in the nozzle tip end 13 for sucking an electronic part is deviated from the central position of rotation of the nozzle tip end 13 by a specified amount, and the rotation amount of the nozzle tip end 13 and the positioning position of the part supply portion are controlled.

Abstract: An apparatus for mounting a flipchip onto a work piece comprises a pick-up station for presentation of the flipchip, a transport mechanism, at least one pick-up tool arranged on the transport mechanism for pick-up and transport of the flipchip from the pick-up station to the work piece and a position acquisitioning device arranged on the transport mechanism for determining the position of the picked up flipchip. The position acquisitioning device comprises a slide and a single line camera secured to the slide, a guide element for guiding the slide, a drive mechanism for driving the slide and a measuring device for determining the position of the slide.

Abstract: A method of verifying a predetermined lead alignment of a component having a physical asymmetry corresponding to an alignment of the leads is provided. The method includes placing the component in a recess in a surface of a nest, wherein the recess corresponds to and mates with the physical asymmetry on the component and detecting whether the physical asymmetry has mated with the recess.

Abstract: In an electronic component mounting method and apparatus, an electronic component is taken out from an electronic component feed position, a posture of the component is detected, and the component is mounted on a board based on a detected result. The method includes acquiring image data with a camera of the component from the feed position, processing acquired image data with a plurality of algorithms for detecting postures of components, and detecting a posture of the component.

Abstract: A method of mounting an electric component on a circuit substrate, including the steps of moving one of a suction nozzle and an electric-component supplying device toward the other of the nozzle and the supplying device, so that the nozzle applies a suction to the component supplied by the supplying device and thereby receives the component, moving one of the nozzle and the substrate toward the other of the nozzle and the substrate, so that the nozzle mounts the component on the substrate, taking an image of at least a portion of the component held by the nozzle, as seen in a direction perpendicular to an axial direction of the nozzle, in a state in which the nozzle takes a known position in the axial direction, determining, based on image data representing the taken image, a position of a mounted surface of the electric component that is opposite to a sucked surface of the component sucked by the nozzle, and controlling, based on the determined position, a movement of the nozzle toward one or each of the sup

Abstract: In a mounting system including a loading station having a transport conveyor for conveying printed circuit boards, a mounting machine for fabricating circuit devices by attaching electronic assemblies on printed circuit boards supplied thereto from said loading station, and a unloading station having a transport conveyor for conveying circuit devices supplied thereto from the mounting machine, the loading station includes a discriminating device for discriminating the kind or type of printed circuit boards and generating a discrimination signal for instructing the kind or type of the printed circuit board. A mounting process in the mounting machine in selectively set by the discrimination signal from the discriminating device. According to this mounting system, even when many kinds of circuit devices are fabricated by many kinds of printed circuit boards, mounting processes can be successively carried out by one mounting line.

Abstract: A method of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit, including the steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component and the second portion adjacent to the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

Abstract: In a flip-chip bonding apparatus, a die inverting device is installed on an optical recognition device so that a vacuum suction chucking nozzle that is provided on the die inverting device can rotate in the direction of a pick-up position and in the direction of a die transfer position in an outside area of an open window of the optical recognition device, so that the bonding apparatus can be compact and has an improved precision of recognition of the amount of positional deviation of the die.

Abstract: The present invention provides an assembly system employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Abstract: Components are arrayed on a component feeder (4) along a direction in which the component feeder moves, in correspondence to respective mounting sequences of the components to be mounted on their respective component mounting positions in a printed board (1). The components arrayed in the array order are successively moved along the mounting sequence by successively moving the component feeder in the feeder moving direction. Thus, the components are mounted to the printed board successively by the component holder.

Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Abstract: In detecting a boundary line between areas different in light reflectance, it has so far been impossible to specify the boundary line at a distance shorter than the arrangement pitch of photodetectors (pixels) arranged in the camera. In the present invention, luminance variations near the boundary line between areas different in light reflectance are derivated. Further, in unit blocks G corresponding to pixels and arranged in a direction (Y direction) in which the boundary line extends, derivated values of luminance for each row of unit blocks are added and then a variation curve of the added values of derivated luminance values in unit block rows is drawn to specify a peak position thereof and also specify the position of the boundary line X0. Thus, it is possible to specify the position of the boundary line with a high accuracy at a distance shorter than the unit block pitch.

Abstract: In detecting a boundary line between areas different in light reflectance, it has so far been impossible to specify the boundary line at a distance shorter than the arrangement pitch of photodetectors (pixels) arranged in the camera. In the present invention, luminance variations near the boundary line between areas different in light reflectance are derivated. Further, in unit blocks G corresponding to pixels and arranged in a direction (Y direction) in which the boundary line extends, derivated values of luminance for each row of unit blocks are added and then a variation curve of the added values of derivated luminance values in unit block rows is drawn to specify a peak position thereof and also specify the position of the boundary line X0. Thus, it is possible to specify the position of the boundary line with a high accuracy at a distance shorter than the unit block pitch.

Abstract: An electric-component transferring apparatus including a component holder which holds an electric component, a shaft member whose lower end portion supports the component holder, a movable member having a support hole which supports the shaft member such that the shaft member is rotatable about an axis line relative to the movable member and is movable relative to the movable member in an axial direction parallel to the axis line, a moving device which moves the movable member in a direction intersecting the axis line of the shaft member, a piston which is supported by the shaft member such that the piston is not movable relative to the shaft member in the axial direction of the shaft member, the support hole including a portion defining a cylinder bore which cooperates with the piston to provide an air-pressure-operated cylinder device, a driven wheel which is substantially integral with the shaft member, and a drive wheel which is supported by the movable member such that the drive wheel is meshed with the

Abstract: Apparatuses and methods are disclosed for determining the alignment of leads on components. Physical and/or superficial fiducial markers on components are used to distinguishes the alignment of leads on the component. The alignment of fiducial markers on the component are detected. A predetermined fiducial alignment is provided that corresponds to a predetermined lead alignment. The detected fiducial alignment is compared to a predetermined fiducial alignment to determine the lead alignment. When used in conjunction with a pick and place machine, the methods and apparatuses provide a means for verifying and correcting the lead alignment of components prior to placement and attachment to a substrate.

Abstract: The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board. The board has a plurality of areas for receiving a component respectively. Each area is marked in the center thereof with a first marker. Adjacent each area, and indicative of the polarity of the component, a second marker is marked on the board. The presence or absence of a component can be evaluated by inspecting the board after it has been populated and determining whether any of the first markers appear, indicating that a component is missing. Verification of the polarity of a component is done by placing a marker on a portion of a component required to be installed in a predetermined position indicative of polarity. Inspection of the board once it has been populated will determine if the component is in the proper orientation by verifying if the second marker and the marker on the component are in alignment.

Abstract: The present invention provides an assembly system employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: The behavior of a nozzle tip is measured with a jig when the suction nozzle moves vertically and rotatively before the start of production. The nozzle tip displacement is formulated from the results with a component thickness and a mounting angle used as parameters, and the parameters are corrected according to the component thickness and the final mounting angle of the electronic component to be mounted in the production stage.

Abstract: An assembly tool for attaching components such as connector plugs or receptacles to a printed circuit board includes a printed circuit board support plate and a sliding member. The sliding member is movable between a first position and a second position relative to the support plate. A holder is pivotally connected to the sliding member and carries a component to be attached to the printed circuit board. A first actuator is connected to a sliding member and moves the sliding member between the first and second positions. A second actuator is connected to the holder and pivots the holder between a receiving position and a mounting position. A component is brought into proximity with the holder and checked for alignment and polarity. Once checked, the component is placed on the holder.

Abstract: The present invention concerns a method and apparatus of automatically mounting electronic components at predetermined positions of an electronic circuit board, which comprise a mounting process of taking out an electronic component 10 from an electronic components holding unit 6 and mounting onto an electronic circuit board 5 and a processing process to trim the electronic component 10 during the mounting process to a preferable characteristic value thereby allowing to reduce the number of types of electronic components 10 to be stored in the electronic components holding unit 6 and reduce the equipment cost and the management cost of the electronic components 10.

Abstract: An electric-component transferring apparatus including a component holder which holds an electric component, a shaft member whose lower end portion supports the component holder, a movable member having a support hole which supports the shaft member such that the shaft member is rotatable about an axis line relative to the movable member and is movable relative to the movable member in an axial direction parallel to the axis line, a moving device which moves the movable member in a direction intersecting the axis line of the shaft member, a piston which is supported by the shaft member such that the piston is not movable relative to the shaft member in the axial direction of the shaft member, the support hole including a portion defining a cylinder bore which cooperates with the piston to provide an air-pressure-operated cylinder device, a driven wheel which is substantially integral with the shaft member, and a drive wheel which is supported by the movable member such that the drive wheel is meshed with the

Abstract: A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die.

Abstract: The shapes of openings of a solder resist defining exposed portions of electrode pads and the shapes of openings of the solder resist defining the shapes of positioning signs are simultaneously formed by photolithography using the same mask pattern. As a result, the signs for registration can be easily formed on a main board or circuit boards. Also, it is possible to increase the positional accuracy of the signs relative to the positions of the electrode pads.

Abstract: In a method of mounting electronic components on a surface, where an electronic component is picked up by a moving head and is mounted onto a printed circuit board, a board recognition camera moves together with a mounting head and recognizes a recognition point set on a first board block of a board which is divided into a plurality of sections. After mounting an electronic component onto the first board block, a judgement is made whether or not a recognition point exists along the travelling path of the mounting head from a mounting position to the place for the next action. When it is judged that there is a recognition point, the board recognition camera is moved to the recognition point during the travelling and causes the camera to recognize the recognition point. As a result, useless travelling of the mounting head is eliminated and a tact time is shortened.

Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.

Abstract: A system for handling semiconductor workpieces, by aligning a movable pick and place device and a movable optical control device, is disclosed. The system and method provide for the formation of an imprint by the pick and place device. The optical control device can then be aligned to that imprint, creating alignment between the pick and place device and the optical control device. Once alignment is complete the imprinted material may be replaced with one or more semiconductor workpieces. The system provides precise, repeatable alignment between the pickup point for the pick and place device and the optical control device.

Abstract: A placement apparatus for co-planar placement of a tool on a component carrier using a rotational placement arm in which the tool is moved between the base or loading position of the placement arm and the near-placement position substantially on a circular path, and in which the tool is moved linearly between the near-placement position and the placement position.

Abstract: In an electronic component installation device for manufacturing an electronic circuit substrate, wherein components are picked up from a parts supply device and placed on a circuit substrate, the height of the installing surface s of an electronic component 10 from a reference surface is detected with the use of a three-dimensional imaging device 2, and the distance the suction nozzle 9 of the mounting head 1 is lowered is accurately determined with respect to each of electronic components that vary in thickness.

Abstract: The method consists in aligning a printed-circuit board 2 with respect to an insertion die 4 containing grooves 8, and an anvil 3 containing grooves 6 of a manually operated press, in order for at least one electronic component 1, which is provided with projecting contact pins 7 with elastic attachment zones, to be inserted into a selected insertion zone in the PCB 2, the insertion die 4 and the anvil 3 always being aligned with respect to one another along an insertion center line c, and the printed-circuit board being attached to a manually displaceable X-Y table, the position of the center point p of the selected insertion zone being respectively defined by means of a Y-coordinate and an X-coordinate with respect to the insertion center line c, the table being moveable within a first tracking zone, the area of which extends over a great distance with respect to the insertion center line c, and within a second tracking zone, the area of which extends over a limited distance with respect to the insertion cen

Abstract: A jig for mounting fine metal balls to a semiconductor chip substrate or a circuit board is disclosed. A tray storing the metal balls is accommodated in a frame and constantly biased upward by springs. Head stops are provided on the frame such that when a suction head mates with the tray for sucking the metal balls, the tray stops at a position slightly sunken into the frame. A clearance is formed between the tray and the frame in the horizontal direction in order to absorb errors in dimensional accuracy when the tray and head are positioned by positioning pins.