Abstract: An integrated circuit packaging method and an integrated packaging circuit, the integrated circuit packaging method including: circuit layers are provided on the top surface of a substrate, the bottom surface of the substrate or the interior of the substrate, the circuit layers having circuit pins; the substrate is provided with connection through holes, and the connection through holes are joined up with the circuit pins; a device is placed on the substrate, and the device is provided with device pins on a surface facing the substrate, which makes the device pins join up with a first opening of the connection through holes; conductive layers are fabricated in the connection through holes by means of a second opening of the connection through holes; and the conductive layers electrically connect the device pins to the circuit pins.

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.

Abstract: A system including: an automatic exchanging device configured to move along the multiple component mounters arranged in a line and automatically exchange automatically exchangeable units of the component mounters; an operation monitoring device configured to monitor an operation state of the automatically exchangeable units of the component mounters and monitor whether it is necessary to exchange the automatically exchangeable units due to maintenance or a breakdown; and a management device configured to, when the operation monitoring device determines that exchange of one of the automatically exchangeable units of the component mounters is necessary due to maintenance or a breakdown, move the automatic exchanging device to the component mounter in question and cause the automatic exchanging device to perform automatic exchange of the automatically exchangeable unit of the component mounter with an exchange-use unit.

Abstract: An image processing device capable of reducing the load of image processing while shortening the time required for the image processing which uses super-resolution processing. The image processing device includes a process determination section which determines an execution necessity of the super-resolution processing in relation to image data during execution of a production process for every type of target object, a super-resolution processing section which executes the super-resolution processing which uses a plurality of items of the image data according to determination results of the process determination section to generate high resolution data, and a state recognition section which recognizes a state of the target object based on, of the image data and the high resolution data, the one corresponding to the determination results of the process determination section.

Abstract: A CPU of a management computer, when a work allocation processing routine is started, first, acquires a specified accuracy of each mounter, then acquires required accuracies of component types for components from a first to a last component to be mounted on a single board. Next, the CPU of the management computer performs allocation of mounting work of components from the first to the last component, and then ends the routine. Specifically, the CPU, for each component, allocates the mounting work of a given component to a mounter with a specified accuracy that satisfies the required accuracy for that component type.

Abstract: A component mounter comprises a mounting head that holds a plurality of nozzles. Two imaging positions are provided for the circumferential orbit along which the nozzles of the mounting head are arranged. While the nozzles are rotated continuously about the rotation axis, an operation of imaging the nozzles located at the imaging positions is performed for each of the imaging positions. Therefore, in a period when the nozzles rotate by an angle not larger than a predetermined angle around the rotation axis formed by the interval between the two imaging positions adjacent to each other along the circumferential orbit, imaging of the nozzles can be completed by locating each of the nozzles at one of the two imaging positions. As a result, it becomes possible to image the plurality of nozzles of the mounting head efficiently.

Abstract: A CPU of a management computer sets an nth component in a mounting operation order of the current sequence as a target component, calculates nearby state data of the target component, sets the required accuracy of the target component based on the nearby state data and memorizes the required accuracy of HDD. Because the required accuracy is automatically set based on the nearby state data in this manner, the set required accuracy matches actual circumstances better compared to than with conventional technology. Therefore, it is possible to automatically set appropriate required accuracy of a target component.

Abstract: An integrated circuit packaging method, including: a top surface of a substrate, a bottom surface of the substrate, or the interior of the substrate is provided with circuit layers, and the circuit layers are provided with circuit pins; a component element is mounted on the substrate, and a surface of the component element facing the substrate is provided with component pins; connection through holes are formed on the substrate, the connection through holes are made to abut on the circuit pins, and a first opening of the connection through holes is abutted on the component pins; conductive layers are fabricated inside of the connection through holes by means of a second opening of the connection through holes, and the conductive layers electrically connect the component pins with the circuit pins.

Abstract: An operational parameter setting supporting system for setting an operational parameter that specifies an operation of a component mounting apparatus is configured to include in an input unit into which a setting value of a component parameter and a setting value of the operational parameter that corresponds to the component parameter are input, a storage in which a correlation table in which the component parameter and the operational parameter that corresponds to the component parameter are associated with other is stored, and a rule table creation processor that creates a rule table from the setting value of the component parameter and the setting value of the operational parameter that are input into the input unit, and from the correlation table that is stored in the storage.

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

Abstract: Systems and methods for processing RFID element or chip components allow for the use of relatively common and inexpensive vibratory feeder handling equipment that require a much lower capital cost than systems incorporating technology such as flip chipping or direct punching down approaches. Instead, vibratory feeders provide feed handling equipment for the RFID element or chip components, which are subsequently fed and combined with RFID antennas in forming RFID devices such as RFID tags. The RFID chips are formed on or of non-silicon substrates such as printed parts. These substrates are relatively flexible, of materials such as polymeric sheets or other plastics. A stream of the RFID components is presented at a transfer station to an ordered series of RFID antennas, with the RFID components and antennas being combined in forming RFID devices.

Abstract: A method for marking electrical components, in particular a plurality of series terminals situated one next to another, includes the following steps: attaching at least one unlabeled marking material at a predefined position to at least one component; introducing at least one component into a marking position in a marking device including a laser head; and labeling a marking material using the laser head.

Abstract: A transfer printing method provides a first wafer having a receiving surface, and removes a second die from a second wafer using a die moving member. Next, the method positions the second die on the receiving surface of the first wafer. Specifically, to position the second die on the receiving surface, the first wafer has alignment structure for at least in part controlling movement of the die moving member.

Abstract: A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.

Abstract: A transfer apparatus and a transfer method are provided. The transfer apparatus includes a transfer substrate; and a plurality of gripping members arranged in an array and disposed on the transfer substrate. Each gripping member includes at least two gripping arms each of which has a first end disposed on the transfer substrate, and gripping legs connected with second ends of the gripping arms and configured to switch between a gripping position and a released position.

Abstract: A wiring board includes an electronic component; an insulating layer containing the electronic component therein, and including a via hole that is open at one surface of the insulating layer to expose an electrode of the electronic component; a first wiring layer embedded in the insulating layer, one surface of the first wiring layer being exposed at the one surface of the insulating layer; a second wiring layer including a wiring pattern formed on the one surface of the first wiring layer, and a via wiring extended from the wiring pattern to be extended in the via hole and directly connected to an electrode of the electronic component.

Abstract: The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.

Abstract: A multi-shaft linear motor formed by a plurality of linear motors each provided with a magnetic body and an armature and adapted to produce a force causing the magnetic body and the armature to be relatively displaced along a given linear moving direction by interaction of magnetic fluxes generated between the magnetic body and the armature during an operation of supplying electric power to the armature. Each of the single-shaft linear motors includes a base plate. Base plate has a base surface defining the moving direction, wherein the stator is fixed onto the base surface along the moving direction, and the mover is attached onto the base surface in a movable manner reciprocating along the moving direction and in opposed relation to the stator. Single-shaft linear motors are stacked in a stacking direction perpendicular to the base surface such that the single-shaft linear motors are individually detachable as a unit.

Abstract: A semiconductor manufacturing device has a conveyor configured to convey a tray having an unshielded semiconductor device mounted thereon to go through electromagnetic shielding, and a controller configured to control the conveyor. The controller performs control to take out the tray from a tray supply storage storing trays each having an unshielded semiconductor device mounted thereon to go through the electromagnetic shielding, place the tray on a carrier, and convey this carrier to a sputtering device which coats the unshielded semiconductor device with a sputtering material for the electromagnetic shielding, and the controller performs control to take out, from the sputtering device, the carrier having the tray placed thereon with an electromagnetically shielded semiconductor device being mounted on the tray, convey the tray, pick up the tray having the electromagnetically shielded semiconductor device mounted thereon from the carrier, and store the tray in the tray supply storage.

Abstract: A semiconductor integrated circuit includes a first transmission circuit generating and outputting a first transmission signal reflecting a first data signal supplied from outside, a first reception circuit reproducing the first data signal based on a first reception signal, a first isolation element isolating the first transmission circuit from the first reception circuit and transmitting the first transmission signal as the first reception signal, a second transmission circuit generating and outputting a second transmission signal reflecting a second data signal supplied from outside, a second reception circuit reproducing the second data signal based on a second reception signal, a second isolation element isolating the second transmission circuit from the second reception circuit and transmitting the second transmission signal as the second reception signal, and a third transmission circuit generating and outputting a third transmission signal reflecting the second data signal.

Abstract: A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern.

Abstract: A method of processing semiconductor chips includes measuring locations of semiconductor dies placed on a carrier with a scanner to generate die location information. The method includes applying a dielectric layer over the semiconductor dies and communicating the die location information to a laser assembly. The method includes aligning the laser assembly with the carrier and laser structuring the dielectric layer with the laser assembly based on the die location information generated by the scanner.

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract: A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste.

Abstract: A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent to picking up the optical components, mounting the optical components directly on a first wafer by means of the robot arm; wherein the first wafer has optoelectronic components attached, and the optical components being positioned individually or in groups relative to the position of the optoelectronic components of the first wafer using the robot arm; and utilizing, as the first wafer, a glass wafer having i) spectrally filtering glass being an infrared filter glass and ii) an infrared filter coating, the glass wafer having a thickness in the range of 50 to 500 micrometers.

Abstract: Provided are a living body stimulating electrode, a living body stimulating electrode apparatus, and a method for producing a living body stimulating electrode. The living body stimulating electrode has a flexible circuit board (FPC) between a living body stimulating electrode and a resin part. The resin part and the FPC are fixed with the living body stimulating electrode. Specifically, the flexible circuit board is disposed between the living body stimulating electrode and the resin part, and one or both of a stimulating electrode and a contact electrode constituting the living body stimulating electrode have an engaging part having a pressing part and a fixing part. The pressing part presses the flexible circuit board onto the resin part. Simultaneously, the fixing part is penetrated through a through hole formed in the flexible circuit board and pressed into a hole formed in the resin part, thereby fixed to and held by the resin part.

Abstract: A micro device may comprise a substrate, a first micro structure coupled to the substrate, a second micro structure coupled to the substrate, and port configured to receive an input. The first micro structure is configured to move into engagement with the second micro structure in response to the input.

Abstract: A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.

Abstract: Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.

Abstract: A flexible circuit board is described that includes a flexible substrate, at least one ridge defining a flexion zone and a component mounting area. The flexion zone acting to dissipate at least a portion of a force applied to the substrate, so as to insulate the component mounting area from the force. Light sources using such flexible circuit boards and methods for making such circuit boards are also described.

Abstract: A magnetic connector system (100) having a cable-end connector (110) and a printed circuit board connector (115). The cable-end connector has a ferro-magnetic strike plate (155). The printed circuit board connector has plugs or bosses (120A, 120B) which mate with corresponding sockets in the cable-end connector and are configured to properly align or orient the connectors. The plugs may include electrical contacts (120A1 , 120A2, 120B1) which mate with corresponding electrical contacts in the cable-end connector. The printed circuit board connector has a magnet assembly (122) which is inserted or installed into a receiving area, and secured by retainers, after the printed circuit board connector has been wave- or reflow-soldered to a printed circuit board. The magnet assembly and the strike plate hold the cable-end connector and the printed circuit board connector together.

Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: A method for manufacturing an LED module includes following steps: providing a SMT apparatus having a CCD image sensor, providing a PCB having an LED mounted on, and fixing the PCB in the SMT apparatus; providing a lens, the CCD image sensor imaging the lens, and then the SMT apparatus obtaining a location of the lens relative to the LED, and the SMT apparatus positioning the lens on the PCB to cover the LED; providing an optical diffusing board located above the lens, and electrifying the LED for emitting light towards the optical diffusing board; providing a luminance colorimeter to measure luminance and chroma of light exited from the optical diffusing board, and obtaining a light-emitting data; calculating the light-emitting data, and the SMT apparatus adjusting a position of the lens relative to the LED; and fixing the lens on the PCB.

Abstract: The invention relates to a method for aligning at least two image recording elements of two camera modules of a stereo camera system, in particular with respect to their roll angle relative to one another, as well as to a stereo camera system whose camera modules or image recording elements are aligned in accordance with such method.

Abstract: Disclosed are optical transceiver modules for use with electronic devices. In one embodiment, an optical transceiver module has a circuit board assembly for receiving and transmitting optical signals with a connector shell that is attached to the circuit board so that the circuit board is disposed outside the shell. The optical transceiver module also includes a faceplate that may have one or more attachment features for securing the faceplate and/or optical transceiver module to a device. By arranging the circuit board outside the shell of the optical transceiver module the footprint of the module is greatly reduced, thereby providing an advantageous arrangement for fitting into electronic devices having a relatively thin profile. Further, the optical transceiver module may optionally include one or more electrical contacts.

Abstract: A system and method for connecting an advanced electronic module to a legacy chassis is presented. A method includes removing a legacy module from the legacy chassis. The legacy module is an older module that communicates with legacy chassis through at least two legacy module connectors on the legacy module and at least two chassis connectors on the legacy chassis. Next, a connector plate with a front side and a back side is attached to the improved electronic module that communicates to the font side of the connector plate with fewer that the at least two legacy module connectors. The method attaches the connector plate and the improved electronic module to legacy chassis so that an equal a number of connectors on the back side of the connector plate communicate with an equal number of legacy chassis connectors on the legacy chassis.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: Apparatus, systems, and methods for signal referencing for memory are described. In one embodiment, connector for a memory device comprises a housing having a first panel and a second panel opposite the first panel to be positioned adjacent a circuit board, the first panel and second panel defining a slot to receive a portion of the memory device, a first plurality of electrically conductive pins disposed in the slot and proximate the first panel to establish electrical connections with a plurality of electrical connectors on the memory device, wherein at least one of the first plurality of pins is a ground pin and a layer of conductive material disposed proximate the second surface. The ground pin is electrically coupled to the layer of conductive material. Other embodiments are also disclosed and claimed.

Abstract: A method for retrofitting a billboard system illuminated by an arc lamp which includes a reflector with reflector features and an output lens includes the steps of removing the lens from the arc lamp housing, mapping the light pattern output of the arc lamp, and then removing the arc lamp and reflector from the housing. Next, a plurality of LEDs is mounted on an LED circuit board in a pattern so that light output by the LEDs replicates the light pattern of the arc lamp, including the reflected light. The circuit board is then installed inside the housing, and the lens is reattached. Preferably, the LEDs include a central LED cluster of densely packed LEDs to replicate the original output of the arc and a pair of LED groups of less densely packed LEDs, located on either side of the LED cluster, to replicate the output from the reflector.

Abstract: An apparatus for the placement of a semiconductor chip on a substrate is provided.

Abstract: Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.

Abstract: A welding system component includes a circuit board for the welding system component. An interface has a main riser portion with a fastener passageway formed therethrough. The interface has an extension portion with a terminal passageway formed therethrough. The extension portion is electrically connected to the circuit board with a terminal disposed in the terminal passageway. The extension portion is spaced away from a surface of the circuit board. A capacitor is electrically connected to the main riser portion with a fastener disposed in the fastener passageway.

Abstract: Representative implementations of devices and techniques provide a printed circuit board (PCB) arranged to at least partly surround an electrical component having a plurality of non-coplanar outer surfaces. The PCB is arranged to fold at one or more predetermined boundaries.

Abstract: An automatic or semiautomatic method of assembly of radiation digital imaging tiles to form a one or two dimensional imaging panel whereby the imaging tiles are provided with alignment mark(s), inherent or specific, and a mother board or substrate is also provide with alignment mark(s) and the imaging tiles are mounted on the mother board by means of mechanical pick and place mechanism, whereby the distances of corresponding alignment mark are set to predetermined values, programmed in the automatic machine.

Abstract: An electronic component mounting system and method is disclosed that can provide accurate operation instruction to a machine operator. The electronic component mounting system comprises a plurality of machines interlinked in series. A main screen, making up an operation instruction screen, is displayed on a display panel belonging to an operation target machine to be operated by the machine operator while a first sub-screen and a second sub-screen of the operation instruction screen are respectively displayed on display panels belonging to two adjacent machines placed adjacently on both sides of the operation target machine among the plurality of machines. Thus, even when a unit device has a small width such that a size restriction is imposed a display panel, accurate operation instruction, with a sufficient amount of information, can be provided by displaying the operation instruction screen on multiple display panels.

Abstract: An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.

Abstract: Methods and apparatus for coupling a stiffener frame to a circuit board are disclosed. In one aspect, an apparatus for engaging a stiffener frame and a circuit board positioned in a fixture is provided. The stiffener frame includes an edge. The apparatus includes an alignment plate that has a shoulder to engage the edge of the stiffener frame. The alignment plate includes a first opening with a peripheral wall to restrain movement of a circuit board relative to the stiffener frame.

Abstract: A method of chip mounting uses a manipulator to mount an electronic component in a vertically upward direction onto a downwardly-facing mounting surface of a printed circuit board held by a holding bed. The holding bed is located above the manipulator or sidewise relative to the manipulator for mounting by the manipulator onto the downwardly-facing mounting surface of the printed circuit board.

Abstract: A method for implementing an electrical system architecture capable of providing fixed or modular components, for example, interface connectors, is provided. Fixed components allow product cost to be minimized. Modular components provide flexible configurability of products. In accordance with at least one embodiment of the present invention, an electrical system architecture capable of providing fixed or modular components minimizes costs such as design, production, and customer support costs while being able to provide a range of product variants.