Abstract: A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

Abstract: A component mounting apparatus including: plural spindles respectively including nozzles, each spindle rotating about a first pivot and each nozzle picking up a component; a head body rotating about a second pivot substantially parallel to a first pivot and rotatably supporting the spindles; and a controller controlling the spindles and the head body to perform: a pickup operation in which the spindle rotates about the first pivot from an initial orientation to a pickup orientation, the nozzle picks up the component, and the spindle rotates from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate; and a mounting operation in which the picked-up component is transferred to a mounting position of the substrate during which each spindle is retained at the initial orientation.

Abstract: A component-mounting printed board comprises: a resin base; an electronic component mounted on at least one of surfaces of the resin base; a through-hole electrode formed penetrating the resin base at a position corresponding to an electrode of the electronic component; the electrode of the electronic component and the through-hole electrode being directly joined, and an electrode pad of the through-hole electrode being formed in a surface on an opposite side to a side of a mounting surface on which the electronic component is mounted of the resin base.

Abstract: A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.

Abstract: A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.

Abstract: A soldering fixture is disclosed having a unitary base member configured to maintain a printed circuit board and an electrical connector in a particular orientation during soldering. The unitary base member includes a lateral channel dimensioned to maintain a plurality of wire leads associated with the electrical connector in a spaced relationship with the printed circuit board. The unitary base member further includes a wire alignment tool configured to align the plurality of wire leads in the particular orientation such that the plurality of wire leads are in juxtaposition with a plurality of solder pads affixed to one or more surfaces of the printed circuit board.

Abstract: A method and system for pre-marking a substrate to provide a visual reference enabling repetitive and accurate component placement on one or more substrates. The method for marking includes determining a first location on a substrate for placing a component relative to a cut outline of the substrate. The method includes placing a fiducial at a second location on the substrate to provide a known dimensional reference to the first location, such that the fiducial and the first location are configured to be in a field-of-view of a component placement machine.

Abstract: A method and system for improving alignment precision of a pair of MEMS parts. The method involves stacking the two parts such that at least one rolling element is between facing surfaces of said two parts, and each rolling element has a first diameter and an axis of rotation parallel to the facing surfaces. The first and second of a pair of MEMS parts respectively include a first alignment pad and a second alignment pad and a liquid drop formed in contact with both alignment pads can align the two parts which can then be locked together by solidification of solder while remaining spaced by the first diameter.

Abstract: A switch includes a printed circuit board and a contact piece with first and second contacts. The printed circuit board has a power input contact, a power output contact, a noncontact area, and a plurality of signal contacts that are disposed at a plurality of predetermined positions. The power input contact and the plurality of signal contacts are disposed on the printed circuit board such that, upon movement of the first contact from the noncontact area to a signal contact, the second contact will align with the power input contact prior to the first contact aligning with the signal contact.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the align fixture further having a first elastic unit and a second elastic unit, the first abutting section is flexibly mounted via the first elastic unit, and the second abutting section is flexibly mounted via the second elastic unit, and the first abutting section and the second abutting section are together adapted to floatingly engage the electronic component.

Abstract: In a method for positioning and mounting, on a carrier body (6), an LED assembly (1) preassembled on a circuit board (4), the circuit board (4) having the LED assembly (1) is placed and glued onto the carrier body (6), the LED assembly (1) being brought into the prescribed position relative to the carrier body (6) after being placed on the carrier body (6) by a positioning body (11) having centering elements (17) that contact the LED assembly (1) on one side and the carrier body (6) on the other, wherein the circuit board (4) having the LED assembly (1) is aligned with the carrier body (6). The positioning body (11) has a leg (15, 16) extending from a connecting part (12) and having centering elements (17) for contacting the LED assembly (1) on one side and the carrier body (6) on the other side.

Abstract: The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit.

Abstract: A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.

Abstract: A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.

Abstract: A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.

Abstract: The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.

Abstract: A method for mounting an electronic circuit-constituting member on a substrate. The method includes preparing a substrate having a surface comprising a liquid-attracting first region and a liquid-repelling second region that surrounds the first region. The method also includes bringing water into contact with the surface of the substrate so as to dispose said water only on the said first region. The method further includes subjecting said substrate to a member-containing liquid that includes an organic solvent where an electronic circuit-constituting member are dispersed in the organic solvent to move said electronic circuit-constituting member to said water disposed on the said first region. The surface of the member is chemically modified with a silane coupling agent including a group with a C—Cl bond. Also, the method includes removing the water and the organic solvent from the surface of the substrate to mount said electronic circuit-constituting member on said substrate.

Abstract: A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.

Abstract: A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers.

Abstract: A mounting apparatus which mounts on a substrate, a component having an inclined surface which intersects with a contact surface of the substrate and the component, at an acute angle, includes a first light source having an optical path orthogonal to the contact surface, and a camera which picks up an image of the component and an image of the substrate, a second light source which irradiates light on the inclined surface, and a moving means which moves at least one of the component and the substrate relatively, in a plane parallel to the surface of contact, and reflected light which is irradiated from the second light source, and reflected by the inclined surface is incident on the image pickup section.

Abstract: An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.

Abstract: A manufacturing method of identifiable print circuit board includes a step of “disposing an identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board.

Abstract: Reliability is improved for the mechanical electrical connection formed between a grid array device, such as a pin grid array device (PGA) or a column grid array device (CGA), and a substrate such as a printed circuit board (PCB). Between adjacent PCB pads, a spacing pattern increases toward the periphery of the CGA, creating a misalignment between pads and columns. As part of the assembly method, columns align with the pads, resulting in column tilt that increases from the center to the periphery of the CGA. An advantage of this tilt is that it reduces the amount of contractions and expansions of columns during thermal cycling, thereby increasing the projected life of CGA. Another advantage of the method is that it reduces shear stress, further increasing the projected life of the CGA.

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

Abstract: Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.

Abstract: A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.

Abstract: There is disclosed a collective mounting method of electronic components in which a plurality of electronic components can uniformly be pressed to an insulating layer in a short time in a case where the electronic components and a resin layer are fixed. To manufacture a semiconductor-embedded substrate 200 in which a plurality of semiconductor devices 220 are embedded, after disposing the plurality of semiconductor devices 220 on an unhardened resin layer 212, this is stored in a container 31 of a pressurizing and heating unit 3, the plurality of semiconductor devices 220 are simultaneously, collectively and isotropically pressurized by use of an internal gas in the container 31 as a pressure medium to simultaneously press the plurality of semiconductor devices 220 to the unhardened resin layer 212, and the resin layer 212 is heated and hardened.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: When a component mounting process by mounting heads is executed on substrates which are positioned alternately by two substrate carrying lines, a determination is made on whether or not a mounting turn can be completed every time the mounting heads perform the mounting turn, and when it is determined that one of the mounting turns performed by the mounting head cannot be completed, a component mounting process is executed on the substrate which is positioned by the substrate carrying line which is opposite to the substrate carrying line.

Abstract: An electronic part mounting method including introducing electronic parts in a bulk form into a bulk feeder, transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel, inspecting and aligning the electronic parts, transferring the inspected and aligned electronic parts to a part insertion unit by use of the positioning wheel, inserting the electronic parts, determined as good ones by the inspection unit, into the part insertion unit, and picking up the electronic parts received in the part insertion unit to mount the electronic parts on a board.

Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

Abstract: A method of assembling an in-vivo imaging device with a flexible circuit board. The flexible circuit board may include a plurality of flexible installation units connected to one another through flexible connection units. The flexible installation units may be capable of having electrical components disposed thereon at a size suitable for being included in an in-vivo imaging device which may be inserted into a body lumen, e.g., a capsule endoscope.

Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.

Abstract: A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion.

Abstract: Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first main surface of the printed circuit board. The sensor package also includes a sensor chip adapted to measure a current flowing through the laminar current conductor, wherein the sensor chip comprises a magnetic field sensor. The sensor chip is electrically insulated from the current conductor by the printed circuit board, and is arranged on a second main surface of the printed circuit board opposite to the first main surface. The sensor chip is hermetically sealed between the mold material and the printed circuit board, or is arranged in the printed circuit board and hermetically sealed by the printed circuit board.

Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.

Abstract: A robotic end-effector for high-speed precision alignment and assembly of of a spacer ring onto a motor-hub assembly has a holding device operable for temporarily holding the spacer ring. The spacer ring is to be aligned and assembled to the motor-hub assembly. The robotic end-effector has a course alignment device operable for locating the holding device with respect to a locating feature that is coupled with the motor-hub assembly. The robotic end-effector has a retractor operable for disengaging the course alignment device from the locating feature. The robotic end-effector has a moveable base whereby lateral compliance is provided for the holding device, enabling motion of the spacer ring with respect to the motor-hub assembly, thereby enabling fine alignment of the spacer ring with the motor-hub assembly when the spacer ring touches the motor-hub assembly.

Abstract: A printed circuit board may have patterned traces. Components may be mounted to the printed circuit board using solder. Solder paste may be printed onto the printed circuit board using a stencil. Following reflow operations, the solder paste may form solder bumps that connect component leads to traces on the printed circuit board. Misalignment between the mounted components and printed circuit board traces can be minimized by forming fiducials from solder paste. During the process of printing solder paste patterns on the printed circuit board, solder paste printing equipment may form the solder paste fiducials. Component mounting equipment may use cameras or other imaging equipment to gather information on the location of the solder paste fiducials. The component mounting equipment may then mount the components on the printed circuit using the information on the location of the solder paste fiducials.

Abstract: An RF shield formed of RF opaque material that permits access to components on a printed circuit board is described. The RF shield can include a first portion attached to the PCB and a removable top portion attached to the first portion at an interface. The top portion is removed from the first portion to expose the components on the PCB. In one aspect of the described embodiment, the top portion is peeled away from the first portion. The components are enclosed within the RF shield after the removal of the top portion by attaching and sealing another top portion to the first portion at the interface by, for example, laser attaching the first portion and the other top portion at the interface.

Abstract: In an example, a method includes aligning a pin of a surface mount module with a corresponding first pin of a header pin assembly of a socket assembly of a circuit board. The first pin includes a first portion configured to electrically couple to the circuit board. A second portion includes a retention feature configured to selectively retain the second portion in engagement with the pin of the surface mount module. The surface mount module is moved in a first direction toward the circuit board, wherein the pin of the surface mount module pushes against the second portion to move the second portion to a second position to allow the pin of the surface mount module to pass by the retention feature. The second portion is configured to move back toward a first position once the pin is moved past the retention feature to engage the pin.

Abstract: An electronic multi-component package is assembled by placing multiple electronic components within multiple openings of a package substrate, then depositing and curing adhesive filler in gaps between the components and the inner peripheries of the openings. Circuit features, including conductive interconnects, are formed by thin-film photolithography over both front and back surfaces of the package substrate. Preformed conductive vias through the package substrate provide electrical connection between circuit features on opposite substrate surfaces. Additional electronic components may be attached to conductive lands on at least one side of the package. The circuit features also include contact pads for external package connections, such as in a ball-grid-array or equivalent structure.

Abstract: An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a die attach portion attaching a semiconductor chip on the lead frame supplied to the index rail.

Abstract: Provided is a method for disposing a component on a substrate (100), the method comprising steps of: a step (a) of preparing the substrate (100), a first liquid, and a component-dispersing liquid; a step (b) of applying the first liquid to the substrate (100) along the +X direction continuously to dispose the first liquid on hydrophilic lines (112) and hydrophilic body regions (111) along the +X direction alternately; a step (c) of bringing the component-dispersing liquid in contact with the first liquid disposed on the hydrophilic region (111); and a step (d) of removing the first liquid and the second liquid from the substrate (100) to dispose the component on the hydrophilic region (111).

Abstract: A component mounting condition determination method is used in a component mounter of mounting components onto a board using a mounting head having plural suction nozzles, and includes: a maximum suction component number determination step (Loop A, S11 to S16) of determining the maximum number of components to be suctioned by the mounting head so as to be greater than an upper limit of a suction power within which the suction nozzles do not drop components even when the mounting head moves at a predetermined speed; and a task determination step (S18 to S20) of determining a task which is a group of components to be mounted in one iteration of a series of operations that includes suctioning, transporting, and mounting components by the mounting head, based on the determined maximum number of components.

Abstract: A method of manufacturing a component-built-in wiring substrate which exhibits excellent reliability, through improvement of adhesion between a resin filler and a core substrate, is provided. In some embodiments the method comprises a core substrate preparation step for preparing a core substrate, an accommodation-hole forming step for forming an accommodation hole in the core substrate, and a through-hole forming step for forming through-holes. In a plating-layer forming step, a plating layer is formed on an inner wall surface of the accommodation hole and plating layers are formed on the inner wall surfaces of the through-holes, which become through-hole conductors each having a hollow. In an accommodation step, a component is accommodated in the accommodation hole. In a resin charging step, a resin filler is filled into a gap between component side-surfaces and the inner wall surface of the accommodation hole and into the hollows.

Abstract: A method of positioning at least 2 chips simultaneously on a substrate by parallel stochastic assembly in a first liquid is disclosed. In one aspect, the chips are directed to target sites on the substrate within the first liquid. The target sites are covered with a second liquid. The second liquid and the first liquid are immiscible. The chips are attracting the first liquid. A predetermined surface is chosen or treated on each chip such that it is selectively attracted by the second liquid and attracting the first liquid.

Abstract: In order to increase the probability that the component is disposed on the hydrophilic region, used is a substrate comprises a water-repellant region, a hydrophilic region, and a hydrophilic line, wherein the water-repellant region surrounds the hydrophilic region and the hydrophilic line, the hydrophilic region and the hydrophilic line are disposed along the +X direction in this order, the value of D1/D2 is not less than 0.1 and not more than 1.2, the value of D3 is not less than 5 micrometers, the value of D4 is less than the minimum length of the component.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.