Abstract: A disk drive recording device comprises at least two platters for storing magnetic recording data and a spindle motor rotating at high speed for mounting the platters. The disk drive is assembled by using pushing devices to push the platters toward the center of the spindle motor in respective directions to bring a portion of an inside circumference of a concentric center hole of each of the platters in contact with an outer circumference of the spindle motor so that the center of gravity of each platter coincides with a center axis of the spindle motor.

Abstract: An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.

Abstract: An apparatus for moving an operative suction nozzle which holds an electric component. The apparatus mounts the electric component held by the operative suction nozzle on a circuit board. The apparatus includes a device which supplies the electric component to the operative suction nozzle; a device which supports the circuit substrate; a nozzle storing device which stores normal suction nozzles; and a nozzle moving device. A nozzle-defect detecting device which detects a defeat of the operative suction nozzle is provided. Also provided is a nozzle exchanging device which automatically operates the nozzle moving device to move the defective suction nozzle having the detected defect, to the nozzle storing device so that the defective suction nozzle is exchanged with the normal suction nozzle stored by the nozzle storing device.

Abstract: A method of manufacturing an edge reflection type surface acoustic wave device includes the step of preparing a surface acoustic wave mother substrate having a plurality of interdigital transducers formed on one main surface thereof. A cut groove is formed in the substrate by cutting the surface acoustic wave mother substrate beginning from the one main surface side thereof. This step of forming a cut groove is repeated so as to produce a plurality of cut grooves so that the first reflection edge of the respective surface acoustic wave devices are sequentially formed. Next, similarly, cut grooves are sequentially formed on the surface acoustic wave mother substrate from the one main-face side thereof so as not to reach the other main surface thereof, whereby the second reflection edges of the respective surface acoustic wave devices are sequentially formed.

Abstract: A method and apparatus reduces undesirable glints in an optical position alignment sensor designed to orient components. Collimated light is provided onto the component. A filter is positioned behind the components and is used to block glint generated by the components. The filter is tunable by rotating it about an axis in the plane of the component.

Abstract: A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved using electrostatic forces which lift the components from the surface of the substrate. The components may then be moved further by providing electrostatic forces between components. Two or more components may engage with one another to provide a three-dimensional structure.

Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: A fixture to couple an integrated circuit to a circuit board is disclosed and claimed. The fixture includes a base member and a holder to retain the circuit board in a selected position relative to the base member. A clamp assembly is included to hold a package containing the integrated circuit in a predetermined position on the circuit board and to cause electrical contact between the integrated circuit and the circuit board.

Abstract: A method of supplying circuit components to a component mounting device from a feeder. The component mounting device removes the components from the feeder and transfers them to and mounts them on a circuit substrate. The method includes providing a plurality of feeders which each include a main portion, a feeding mechanism, a component supply portion and a component holding portion. The component holding portions hold the circuit components. The main portions of the feeders are mounted on a movable table such that the component holding portions of the feeders are arranged along a line. The main portions support the feeding mechanisms, which feed the circuit components one by one from the component holding portions to component supply portions. The movable table is moved along the line.

Abstract: A system for forming bumps on pads which are provided on a target at low cost and with high productivity. The target is a semiconductor wafer or a semiconductor chip. The system has an attracting and compressing device for attracting bump materials for bumps, and compressing and bonding the bump materials onto the pads. The attracting and compressing device may have an attracting and compressing plate in which hollow portions for attracting and holding the bump materials are formed, the hollow portions being one of holes, concave portions, and grooves. The attracting and compressing plate can collectively attract the bump materials to be compressed onto a predetermined area which corresponds to one of a wafer, a chip, and a block. The attracting and compressing device may have a finishing plate which has a flat surface for pressing and bonding the bump materials, and an ultrasonic wave generating device.

Abstract: An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.

Abstract: A component recognizing method, and an apparatus for executing the method, for applying light to leads on a mounting surface of an electronic component and executing positional detection of the leads by a height detecting section, comprising a 3-D sensor, on the basis of light reflected from the leads. The method includes limiting a region to be measured by the height detection section so that light reflected from objects behind or near the leads is excluded from the region and processing light reflected from the region, thereby removing the reflected light from objects behind or near the lead.

Abstract: A method of attaching a component having a fiducial marker to a substrate is provided. The method includes detecting alignment of the fiducial marker, aligning the component such that the fiducial marker matches a predetermined fiducial alignment, and attaching the component to a substrate.

Abstract: A pick and place device, a pick and place system and a method of fitting substrates with components are provided, in which feed devices having a plurality of feed modules and a corresponding plurality of collection points on opposite sides of the feed devices in each case have at least one pick and place area, pick and place heads being assigned to the pick and place areas, by way of which components can be removed alternatingly and/or simultaneously from the collection points of the feed devices in order to be positioned on substrates which are arranged in the pick and place areas.

Abstract: An electronic parts-mounting method for mounting parts on a board in which at least two electronic parts can be picked up by a plurality of nozzles including a plurality of first nozzles arranged substantially parallel to the direction of movement of the board and a plurality of second nozzles arranged substantially perpendicular to the direction of movement of the board such that the positions of the parts picked up by the second nozzles can be recognized by a line sensor and corrected.

Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.

Abstract: In an electronic component mounting method and apparatus, an electronic component is taken out from an electronic component feed position, a posture of the component is detected, and the component is mounted on a board based on a detected result. The method includes acquiring image data with a camera of the component from the feed position, processing acquired image data with a plurality of algorithms for detecting postures of components, and detecting a posture of the component.

Abstract: A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.

Abstract: A method of picking a component having an alignment indicating fiducial marker according to a predetermined alignment is provided. The method includes detecting the alignment of the fiducial marker of the component, comparing the detected fiducial alignment with a predetermined fiducial alignment, determining an alignment offset and picking the component in a manner that corrects the alignment offset when the offset has a predetermined value.

Abstract: The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided.

Abstract: A chip-mounting device comprises a chip-holding tool and a substrate-holding stage. At least one of the chip-holding tool and the substrate-holding stage is placed on a coarse adjustment table for coarse positioning of a chip or a substrate. Brake means for fixing the positioned coarse adjustment table is provided on the coarse adjustment table. Fine adjustment means for fine positioning of a chip or a substrate is provided on the coarse adjustment table. The chip-mounting device allows alignment with submicorn accuracy to be performed quickly, shortening tact time in chip mounting remarkably.

Abstract: The invention relates to a marking device (1, 11) for the identification of objects with a coding of regions (4, 5, 13) with different magnetic properties. The marking device is characterized in that magnetic regions (4, 5, 13) are so magnetically biased that their hysteresis loops (7, 8, 15) are shifted on the field strength axis (H) relative to the magnetization axis (M).

Abstract: A system and method have been provided for removing high lead content solder balls from the surface of a circuit package for the purpose of rework. The invention is applicable to ball grid array (BGA), C4 balls, chip scale balls, and flip chip bumps. Advantageously, the room temperature solder ball rework procedure minimizes damage to the circuit package. Specifically, a thin-film stainless steel mask with openings to expose the solder balls, is formed over the circuit package, and the solder balls are removed in a shearing or grinding operation, leaving a solder ball residue. Then, a conventional thick mask film is formed and a solder paste is deposited to fill the apertures. The solder ball residue forms a wettable surface for the low temperature attachment of new solder balls.

Abstract: An apparatus includes a component storage device, a transfer head, a component alignment section, and a mounting head. The component storage device houses a plurality of lattice-shaped trays on which electronic components are stored, and can select and eject one of the trays along an ejection direction. The transfer head can move an electronic component from the tray along a first transfer path, while the component alignment section can move the electronic component along a second transfer path. The mounting head can then mount the electronic component on a circuit board.

Abstract: A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.

Abstract: The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided.

Abstract: A system for positioning components of different thicknesses on a component platform, comprising: a frame; a tool head connected to the frame, the tool head being vertically movable; a retractable vacuum tube receivable within the tool head; and a grasping assembly which can be actuated to securely hold the vacuum tube in a fixed position relative to the tool head after the vacuum tube has been at least partially received within the tool head.

Abstract: Each of a plurality of suction nozzle sections 20 provided about the outer circumference of an intermittently rotating head section 21 comprises a plurality of nozzle tip sections 10 for picking up electronic components 22 by suction, these nozzle tip sections 10 being connected to a rod section 4, which is driven to rotate by a motor 1. A cylindrical cam section 8having a cam surface 8a and being able to rotate relative to the rod section 4 is provided such as to encase the nozzle tip sections 10, and one ends of the nozzle tip sections 10 engage with the cam surface 8a of the cam section 8 via rollers 6, whereby the nozzle tip sections 10 are movable in a vertical direction. On the outer side of the cylindrical cam section 8, a stopper section 12 is provided for halting temporarily the rotation of only the cylindrical cam surface 8.

Abstract: An electronic components mounting device has a plurality of feeder bases attached with tape feeders thereon, and a guide rail and a cylinder for drawing each of the feeder bases independently to a position for replenishing electronic components. When an electronic component runs out of the storage, only the feeder base that is carrying the relevant tape feeder gone out of the stock is drawn to a place for parts replenishment; in the mean time, the mounting actions keep on going by making use of tape feeders attached on other feeder base. Machine stop times can be decreased with the mounting device.

Abstract: A method for forming a head gimbal assembly in which the head gimbal assembly and a frame are formed from a continuous piece of laminated material comprised of a first layer, a second layer and a third layer. A plurality of electrical lines are formed in the third layer of the head gimbal assembly and a plurality of electrical line extensions are formed in the third layer of the frame. The slider is positioned at an angle to the frame and a plurality of termination pads on the slider are bonded to the electrical lines. The frame is partially separated from the head gimbal assembly and the relative position of the slider to the head gimbal assembly is changed by an amount sufficient to separate the plurality of electrical lines from the plurality of electrical line extensions.

Abstract: This invention is directed toward a process of manufacturing, including a technique of assembling parts of an apparatus. The technique includes forming electrode structures on a substrate, suspending the apparatus part or parts in a dielectric medium between electrodes of the electrode structure, and using near-field (that is, short range) electric field forces to align the part or parts in pre-determined positions in accordance with the desired apparatus topography. The part or parts may include semiconductor die, nanometer wires for making connections to devices, or other components requiring precision alignment.

Abstract: An apparatus for mounting a flipchip onto a work piece comprises a pick-up station for presentation of the flipchip, a transport mechanism, at least one pick-up tool arranged on the transport mechanism for pick-up and transport of the flipchip from the pick-up station to the work piece and a position acquisitioning device arranged on the transport mechanism for determining the position of the picked up flipchip. The position acquisitioning device comprises a slide and a single line camera secured to the slide, a guide element for guiding the slide, a drive mechanism for driving the slide and a measuring device for determining the position of the slide.

Abstract: Method and system for assembling a multisensor device that includes at least two sensors operable to provide a respective stream of pulses indicative of angular information of a rotating object are provided. The sensors are assembled so that the streams of pulses have an accurate phasing relationship relative to one another. The method allows to provide a sensor carrier. The method further allows to locate the sensor carrier to have a predefined spatial relationship relative to a target wheel. The sensor carrier includes a passageway for receiving each of the sensors. The passageway allows slidable movement to selected ones of the sensors along a phasing axis. As relative movement between the target wheel and the sensor carrier occurs, each of the sensors is energized to provide a respective stream of pulses. A determining action allows to determine the phasing relationship of each stream of pulses relative to one another.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: An apparatus for mounting semiconductor chips on a substrate with which the semiconductor chips are presented on a foil clamped in a frame at a first location A comprises a chip gripper for the transport of the semiconductor chip presented at the first location A to a second location located on the substrate, a movable table for accepting the frame, a chip ejector arranged underneath the foil at the first location A the upper surface of which facing towards the foil has holes connected to a vacuum source, as well as a measuring camera directed at the first location A for establishing the position of the presented semiconductor chip. Correction of a possible position deviation of the presented semiconductor chip from its set position takes place in accordance with the invention in that the foil is secured by the chip ejector by means of vacuum and then at least the upper surface of the chip ejector facing towards the foil is moved in the plane running parallel to the under side of the foil.

Abstract: Method of mounting an electric component on a component-mounting surface such that the electric component held by a suction nozzle under a negative pressure is forced onto the component-mounting surface, with termination of application of the negative pressure to the suction nozzle, and the suction nozzle is then moved away from the component-mounting surface, the method comprising the steps of: initiating application of a positive pressure to a passage communicating with the suction nozzle, before the electric component is forced onto the component-mounting surface; maintaining the application of the positive pressure to the passage, until the suction nozzle is spaced apart from the electric component by at least 0.4 mm; and then exposing the passage to the atmosphere. Also disclosed is an electric-component mounting system arranged to practice the method.

Abstract: Arranged along a path of movement of a gripper are friction blocks on which a slewing ring of the gripper rolls, whereby the gripper with the component is rotated. This allows the component to be rotated into its approximate placement position in a time-saving manner before the position is measured, during the forward movement of the gripper.

Abstract: A method of positioning an electronic component, such as a BGA component, with respect to a mounting head. The BGA component is positioned through positional detection of a reference mark and inspection, and the positional correction is executed by checking the holding posture. Through inspection using the reference mark as a reference position, the dropout, dislocation, shortage of solder amount of the solder bumps of the component are subjected to a quality check (S4). If of normal quality, the component is moved closer to the mounting position of the printed board on a mounting table by a mounting head (S5). A recognition mark in the target mounting position of the printed board is confirmed and recognized (S6). By determining the mounting position through mounting position detection and component inspection result, the mounting position is corrected (S7) and the height of the mounting head is controlled and mounted (S8).

Abstract: An electronic component taken out from a component storage section by a transfer head is held by suction, transferred and inspected as to whether it is good or defective by a good/defective component inspecting device. Thereafter, the electronic component is delivered to an alignment suction nozzle on a component alignment section. The sequence of the above-operations is then repeated, whereby the electronic components inspected and then aligned in the order of mounting can be supplied to a mounting head. Therefore, a mount time for the electronic components in a mount process is greatly shortened, so that productivity is expected to be improved. The electronic components can also be inspected before being aligned in the order of mounting, which further enhances mount efficiency.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Abstract: A method of detecting a relative positioning error between a fiducial-mark imaging device and a substrate-holding device in an electric-component mounting system wherein the fiducial-mark imaging device is arranged to take an image of at least one substrate fiducial mark provided on a circuit substrate, and a positioning error of the circuit substrate as held by the substrate-holding device is detected on the basis of the image of the at least one substrate fiducial mark, so that an electric component is mounted by a mounting head onto the circuit substrate, so as to eliminate the positioning error of the circuit substrate, wherein the fiducial-mark imaging device is operated to take an image of at least one holding-device fiducial mark provided on the substrate-holding device, and the relative positioning error between the fiducial-mark imaging device and the substrate-holding device is detected on the basis of a positioning error of the image of the holding-device fiducial mark within an imaging area of the

Abstract: A method and an apparatus for aligning and supplying an electrical component capable of aligning a first electrical component to be mounted on a second electrical component relative to a suction head without using a pre-alignment stage. On supplying an IC chip being the first electrical component to a position at which the IC chip is mounted on a liquid crystal panel being the second electrical component with the suction head sucking the IC chip, after the suction head sucks the IC chip in a recessed portion in a container, the suction head is moved in an X direction and the container is moved in a Y direction to thereby cause the IC chip abut a wall of the recessed portion, and thereafter the movements in the X and Y direction are still carried out to thereby displace the suction position of the IC chip relative to the suction head to achieve the alignment thereof.

Abstract: In processing a head unit in which a head relative height Y is Y′ with a grinding amount &Dgr;GD of &Dgr;GD′, the relationship between distances Bo between a vertex of a curved surface as a front face of a head chip and a head gap before and after grinding the front face of the head chip and a gap depth dimension GD, is predetermined with respect to a head unit in which the head relative height is substantially equal to Y′, through which Bo1 as the value of Bo before grinding corresponding to a target value of the value of Bo after grinding is determined and used as Bo1 of the head unit in which the head relative height Y is Y′. Thus, grinding of the front face of the head chip is conducted after Bo1 corresponding to the target value is determined. Hence, a head unit with the value of Bo after grinding falling within the range of standard values can be manufactured efficiently, and accordingly the yield can be improved.

Abstract: The component suction device includes a suction nozzle (10) for sucking and holding a component (20), a nozzle turning device (25) for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device (26) which is located upward of the nozzle turning device and which is connected to the suction nozzle to serve for moving up and down the suction nozzle along an axial direction of the suction nozzle.

Abstract: A method of electrically connecting an electronic component to the flexible printed wiring board may comprise the steps of: Providing an air permeable platen having a substantially flat front surface and a back surface; placing the flexible printed wiring board on the front surface of the platen; lowering the pressure at the back surface of the platen; and electrically connecting the electronic component to the flexible printed wiring board.

Abstract: The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board. The board has a plurality of areas for receiving a component respectively. Each area is marked in the center thereof with a first marker. Adjacent each area, and indicative of the polarity of the component, a second marker is marked on the board. The presence or absence of a component can be evaluated by inspecting the board after it has been populated and determining whether any of the first markers appear, indicating that a component is missing. Verification of the polarity of a component is done by placing a marker on a portion of a component required to be installed in a predetermined position indicative of polarity. Inspection of the board once it has been populated will determine if the component is in the proper orientation by verifying if the second marker and the marker on the component are in alignment.

Abstract: A universal mounting structure for surface mountable electronic devices is provided having an arrangement of circuit patterns or lands applied to a circuit board or circuit waffer that permits the mounting of surface mount electronic devices of various sizes or mounting footprint requirements and that provides multiple placement location and interconnection options for the components to the circuit designer. The universal mounting structure described above provides a breadboard or prototyping medium for use with surface mount devices.

Abstract: A component feeder including a rotary mechanism 31 which is mounted on a turning mechanism 17 for turning the suction nozzle 3 and causes the suction nozzle 3 to rotate around its axis line A, a detector 7 for detecting an amount of displacement the component 2 in rotating direction around the axis line A of the suction nozzle 3, and a controller 32 which controls the suction nozzle 3 such as to rotate at a necessary angle around its axis line A before picking up the component 2 in accordance with displacement of the component 2 in rotating direction around the axis line A.

Abstract: An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.

Abstract: An apparatus for assisting an operator of an electric-component supply device including component feeders mounted on feeder support and each accommodating electric components, the apparatus including (a) a position indicator operable to indicate the feeder-mounting position at which the component feeder is to be mounted on the feeder support, and/or the feeder-mounting position at which the component feeder has been removed from the feeder support, and/or (b) a feeder indicator operable to indicate at least one of (i) the component feeder which has been mounted on the feeder support, (ii) the component feeder which is to be removed from the feeder support and (iii) the component feeder on which an intermediate operation is required to be performed between moments of the operations to mount and remove the component feeder on and from the feeder support.