Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

Abstract: An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.

Abstract: Methods and systems for processing semiconductor workpieces are disclosed herein. In one embodiment, a method for processing a semiconductor workpiece includes releasably attaching a plurality of microelectronic dies to a first side of a releasable film, and at least partially detaching one of the dies from the releasable film by pivoting a contact member with a surface of the contact member pressing against a second side of the releasable film.

Abstract: A method of fabricating a plurality of inkjet nozzles on a substrate, each nozzle comprising a nozzle chamber having a roof spaced apart from said substrate and sidewalls extending from said roof to said substrate, said chamber having an entrance for receiving ink from at least one ink inlet defined in said substrate, said at least one ink inlet having at least one priming feature extending from a respective rim thereof, said method comprising the steps of: (a) providing a substrate having a plurality of trenches corresponding to said ink inlets; (b) depositing sacrificial material on said substrate so as fill said trenches and form a scaffold on said substrate; (c) defining openings in said sacrificial material, said openings being positioned to form said chamber sidewalls and said at least one priming feature when filled with roof material; (d) depositing roof material over said sacrificial material to form simultaneously said nozzle chambers and said at least one priming feature; (e) etching nozzle aper

Abstract: Provided is a maintenance method which makes it possible to collectively and quantitatively detect maintenance timings of parts included in respective devices in a component mounter. A management apparatus determines a position of an equipped device using a RF-tag reader/writer (S1001). Then, from the RF tag, the RF-tag reader/writer obtains maintenance information regarding parts in the device (S1002). Then, the determination unit determines a maintenance timing of each of the parts, by comparing maintenance information recorded in a maintenance reference information storage unit to the maintenance information of each part which has been obtained at S1002 (S1003). Next, if it is not yet the maintenance timing (NO at S1003), then the determination unit (608) ends the determining processing. On the other hand, if it is the maintenance timing (YES at S1003), then the determination unit (608) instructs a warning unit to provide warning (S1004) and stops driving of the component mounter.

Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.

Abstract: According to a method and in a device for placing a component on a substrate, a component is moved in a supply direction until it abuts against a stop. The component is then moved at least in a vertically extending pick-up direction and subsequently positioned on the substrate. The component is pivoted near said stop, about a pivot axis that extends transversely to the supply direction and the pick-up direction.

Abstract: A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

Abstract: A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from ends of the supporting base and face each other in a Y direction. The component mounting apparatus further includes a plurality of Y-axis tables extending between upper ends of the supporting frames, X-axis tables attached to movable portions of the Y-axis tables, and operating heads attached to movable portions of the X-axis tables to perform operations with respect to the substrate on the work conveyor-positioner unit. Each of the plurality of the Y-axis tables includes a movable portion at a lower part. Each of the X-axis tables includes a movable portion at a lower part and the operating heads are attached to a lower part of the movable portion of the X-axis tables.

Abstract: The invention relates to a method of producing an electronic unit of a radio system automatically, an electronic unit of a radio system and an electronic component. The method of producing an electronic unit of a radio system automatically comprises mounting (802) the electronic component automatically in a hole provided for the electronic component in the circuit board using alignment means of the electronic component and alignment means of the circuit board, which align electric connecting means of the electronic component against electric connecting means on the circuit board; soldering (804) the electric connecting means of the electronic component automatically to the electric connecting means of the circuit board; and attaching (806) the electronic component automatically to the mechanical part so that the electronic component is in contact with the mechanical part, in which case the electronic component is cooled via the mechanical part.

Abstract: A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzles, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head sections performs successive suction, recognition, posture adjustment, and mounting of the components.

Abstract: A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved using electrostatic forces which lift the components from the surface of the substrate. The components may then be moved further by providing electrostatic forces between components. Two or more components may engage with one another to provide a three-dimensional structure.

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: Methods for qualifying the accuracy of a circuit board may include providing a printing mask pattern for first and second sides of the circuit board with a first sequence of spaced indicia parallel to a first edge of the printed circuit board, and a second sequence of spaced indicia parallel to a second edge of the printed circuit board opposite the first edge. A layer of visually conspicuous material may be printed on the board using the mask patterns. The board may be separated or cut to a predetermined size thereby removing, at least a portion of the spaced indicia of each sequence. The number of indicia printed on the first and second sides respectively of the circuit board may be determined after the circuit board is cut to the predetermined size. The circuit board may be accepted or rejected based upon the numerical determination against a qualification criteria.

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial are also described.

Abstract: Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup position and a component placement position located on a substrate. In addition, a total distance to be covered by the component placement unit is calculated for the number of components to be placed, wherein the number of components to be placed is determined beforehand. This total distance value is subsequently compared with a reference value. If the total distance value is greater than the reference value, the substrate to be provided with the components is rotated with respect to the component pickup position about an axis that extends perpendicularly to the substrate.

Abstract: A method for manufacturing a printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes loading an insulation substrate in which an align mark is formed, loading an imprinting mold in which a first align hole is perforated in correspondence with the align mark, aligning the insulation substrate and the imprinting mold by perceiving the align mark through the first align hole, and compressing the imprinting mold and the insulation substrate together such that the intaglio pattern is formed in correspondence with the raised pattern, it is possible is to use an existing optical system for an imprinting process in aligning an opaque imprinting mold and an insulation substrate, without installing expensive alignment instruments, and to manufacture several insulation substrates having circuit patterns by sequentially loading and aligning several imprinting molds and insulation substrates and compressing simultaneously.

Abstract: A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the energy management system. An energy management system that includes a shunt coupled to a printed circuit board using the above method is also provided.

Abstract: According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed thereon. Then, a porous layer is formed on the metal layer. A barrier layer of the porous layer at the bottom of the pores is thinned down. Then, a catalyst is deposited at the bottom of the pores. Carbon nanotubes are then grown in the pores. Another layer of metal is then formed over the porous layer and the carbon nanotubes. The semiconductor wafer is then separated into microelectronic dies. The dies are bonded to a semiconductor substrate, a heat spreader is placed on top of the die, and a semiconductor package resulting from such assembly is sealed. A thermal interface is formed on the top of the heat spreader. Then a heat sink is placed on top of the thermal interface.

Abstract: A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one external area of the printed circuit board. The semiconductor memory chips are rectangular in shape and are arranged, in at least two rows with the adjacent chips being oriented perpendicular to one another, such that the area used on the PC board is optimized.

Abstract: A method and apparatus that provides improved loop inductance of decoupling capacitors. Vias are moved close to the pads and close to each other. Instead of placing power and ground vias on opposite sides of the capacitor, these vias are moved around to the same side of the capacitor and are placed as close to each other as manufacturing tolerances will allow. For designs using standard two-terminal surface mount capacitors, two vias per capacitor, and standard manufacturing procedures (no vias inside pads, for example), the lowest possible loop inductance of the capacitor's connections to the printed circuit board planes is provided. This results in the lowest effective capacitor series input inductance.

Abstract: Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.

Abstract: Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a step of identifying absolute positions of the recognition marks by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition device. A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition device, and significantly reduce the alignment time and mounting tact.

Abstract: One embodiment of the present invention provides a system that automatically detects and corrects a misalignment of a semiconductor chip. During operation, the system uses a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip. Next, the system uses an actuation mechanism integrated with the chip to automatically correct the misalignment, thereby improving performance and reliability of the chip.

Abstract: An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not.

Abstract: An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus includes a first depression which cooperates with an alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the first substrate and a second depression which cooperates with a second alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the second substrate. The first and second depression of the alignment apparatus and the alignment spheres cooperate to passively align micro-components disposed on each of the substrates.

Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

Abstract: Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.

Abstract: A method for programming a routing layout design through one via layer includes forming a plurality of metal traces on a first routing layer and a second routing layer, and positioning a plurality of vias within a via layer disposed between the first and second routing layers for connecting the metal traces on the first and second routing layers according to a first current route defined by a predetermined circuit layout design to connect a first node and a second node so as to establish a second current route equivalent to the first current route.

Abstract: A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorbing the electronic components by descending at least one nozzle spindle; rotating at least one rotation housing and rotating nozzle spindles to which the electronic components are absorbed, thereby correcting positions of the electronic components absorbed to the nozzle spindles depending on an inclination angle of specified positions for mounting the electronic components to a printed circuit board; moving the absorbed electronic components over the printed circuit board; and mounting the absorbed electronic components to the specified mounting positions of the printed circuit board.

Abstract: A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.

Abstract: In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10, an image of a supply portion reference mark provided at a mark post 18 of the component supply portion 2 is taken by a second camera 35 moved by a camera moving mechanism, a camera coordinates system is calibrated based on a result of taking the image, thereafter, a position of the chip 6 is recognized by the second camera 35 and the chip 6 is picked up by a mounting head based on a result of the recognition. Thereby, stable pick up accuracy can be ensured by calibrating an aging variation of the coordinates system owing to thermal elongation or contraction of the camera moving mechanism.

Abstract: A keypad assembly including a substrate, a metal layer, a patterned light-shielding layer, a light-transparent material layer and a keypad circuit module is provided. Said substrate has a first surface and a second surface and the metal layer is disposed on the first surface of the substrate. In addition, the patterned light-shielding layer is disposed on the metal layer to define a light-transparent area and a light-shielding area, wherein the patterned light-shielding layer corresponds to the light-transparent area. In the meantime, the light-transparent material layer is disposed on the second surface of the substrate and corresponds to the light-transparent area. Further, the keypad circuit module is disposed on the patterned light-shielding layer.

Abstract: The method of the present invention includes a first step of preparing a substrate in which a plurality of circuit boards are integrally connected to one another, each of the circuit boards having conductive patterns which include pads formed on a surface of the circuit board; a second step of electrically connecting circuit elements to the respective conductive patterns on each of the circuit boards; a third step of positioning ends of leads above the respective pads by superposing a lead frame including the plurality of leads on the substrate, and fixing the leads to the pads; and a fourth step of separating the circuit boards from the substrate in a state where the leads are fixed to the respective pads on each of the circuit boards, and thus separating the leads from the lead frame.

Abstract: A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon at an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.

Abstract: A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate.

Abstract: A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a thickness of approximately greater than 10 ?m to 100 ?m. Then, then the at least one thick film element structure is bonded to a second substrate, and the at least one first substrate is removed from the at least one thick film element structure using a lift-off process employing radiation energy. The lift-off process including emitting, from a radiation source, a radiation beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the first surface of the first substrate. The first substrate being substantially transparent at the wavelength of the radiation beam, permitting the radiation beam to generate sufficient energy at the interface to break the attachment.

Abstract: A system for transferring electrical components. The system may comprise a plurality of electrical components. Each of the components may include leads and a physically asymmetric fiducial marker that structurally alters a physical appearance of the components. The system may also comprise a nest having a nest surface that defines a recess shaped to receive any one of the plurality of components only when the component is oriented such that the component's fiducial marker is received by a corresponding asymmetric portion of the nest surface. In addition, the system may comprise a component feed assembly for feeding the plurality of components to the nest, a component alignment detector, and a pick and place machine having a movable pick head. The movable pick head may have access to the component feed assembly and the recess of the nest.

Abstract: A method and system for maximizing process capability in a progressive forming operation. The method compensates for deviations introduced by unformed components, and uses closed loop feedback to compensate for deviations introduced by forming tools. Fiducial features are detected on an incoming component, and a first compensation value is calculated from displacement of the fiducial features from an ideal forming location on the component. Component position with respect to a theoretical forming position is adjusted according to the first compensation value. Placement of a feature formed on the component at the adjusted position is detected and compared to the ideal forming location to obtain a difference value. A second compensation value is derived from a plurality of difference values. Forming positions for subsequent incoming components are adjusted with respect to the theoretical forming position according to first and second compensation values.

Abstract: A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of a halt condition of each of constituent parts of an electronic component mounting apparatus and shuts off a drive power source to the drive device in the halt condition. Thus, wasteful power consumption is eliminated and production is continued with a necessary minimum power.

Abstract: Provided is a mounting apparatus which enables high levels of both maintenance/improvement of product quality and reduction of product cost by reliably preventing accidental contact of a mounting part with a mounting target part while enhancing the productivity.

Abstract: A method of fabricating electronic parts includes the steps of: mounting electronic elements in regular cavities that are two-dimensionally arranged on a baseboard on which dummy cavities are provided so as to surround the regular cavities, and covering a top of the baseboard with a resin sheet.

Abstract: Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.

Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

Abstract: A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive features are formed in proximity to the vias, as by selectively depositing a metal on the metal layers or selectively etching the metal layers. The top and bottom conductive features are connected to one another by depositing a conductive material into the vias, most preferably without seeding the vias as, for example, by depositing solder in the vias.