Abstract: A cable assembly having at least three electric cables which have electric conductors that are electrically and mechanically connected together. Each of the electric conductors is free of an insulation material and is plate-shaped in a contact point. One of the cables is a carrier cable, and the electric conductor of the carrier cable is formed as a support plate at the contact point in order to attach the contact points of the other electric conductors. Multiple contact points of the other electric conductors are secured to a surface of the support plate next to one another.

Abstract: Substrate supports, substrate support assemblies and methods of using the substrate supports are described. The substrate support has a support surface with at least two electrodes and a plurality of purge channels bounded by a seal band. A power supply connected to the electrodes configured as an electrostatic chuck. A capacitance of the substrate is measured while on the substrate support to determine the chucking state of the substrate.

Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of connection portions is larger than a second fillet width of another solder among the solder fillets located in an outside region of one of the pair of connection portions, which is on a side opposite to the inside region across the one of the pair of connection portions.

Abstract: The present invention relates to a current sensor which measures alternating electromagnetic wave and a current breaker using the same, and the current sensor for alternating current is characterized in that it includes a sensor part arranged at a separation distance from the power wire through which alternating current is flowing; and a means of detecting alternating current by measuring the electromagnetic wave generated across the above sensor part by the electromotive force induced by the alternating current flowing through the above power wire, and in that the above means of detecting alternating current includes an amplifier.

Abstract: Printed circuit boards (PCBs) may include embedded lateral connectors. The embedded lateral connectors may be configured to enable components to quickly couple to or plug into a PCB, thus saving time to form connections. The embedded lateral connectors may also reduce weight and/or size by avoiding need for bulky tradition collections with conventional components (e.g., solders, external pin connectors, etc.). The connectors may include male connectors, female connectors, and/or mounting connectors. The connectors may be configured to connect multiple PCBs together, such as using a stacked configuration, which may enable reducing a volume of space needed in a housing for the PCBs.

Abstract: A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

Abstract: An electrical connector includes an insulative housing having a plurality of passageways arranged in matrix, and a plurality of contacts assembled and retained in the corresponding passageways, respectively. Each contact has a main body, a secondary body sidewardly connected to and angled with the main body. A resilient contacting section upwardly extends from an upper portion of the main body and above the top surface of the housing for contacting an electronic package, and a soldering section extends from a lower portion of the secondary body around the bottom surface of the housing for mounting to a printed circuit board. The main body includes an upper linking part originally linked to an upper carrier, and the secondary body includes a lower linking part which is originally linked to a lower carrier. The main body includes retaining structures for retaining the contact within the passageways without moving.

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.

Abstract: An object is to reduce the size of a multi-contact connector having a wiping function. A multi-contact connector includes a front terminal and a rear terminal. The front terminal and the rear terminal are independently housed in one terminal accommodating groove in a housing in such a manner as to separate from each other. Unlike terminals of a multi-contact connector according to the related art, each terminal has no junction where it divides into a front contact and a rear contact. The housing requires no space for accommodating such a junction, and this reduces the size of the multi-contact connector.

Abstract: A power supply board bridge connector includes an insulating cover to cover an insulating base which is formed with at least one receiving groove. A bottom of the insulating base is formed with through holes. At least two pins provided beneath the insulating base are mated with insertion holes of two left and right power supply boards so that the insulating base bridges over the two power supply boards. The metallic elastic plate is placed in the receiving groove. The metallic elastic plate has two left and right elastic contacts passing through the through holes at the bottom of the receiving groove to be electrically connected to the left and right power supply boards. The structure is simple, the connection is convenient, firm and stable, and the connection efficiency is high.

Abstract: A printed circuit board assembly having a printed circuit board with at least one footprint for attaching a plug connector, wherein the footprint has three or more coupling points for coupling electrical contacts of the plug connector, and a plug connector attached on the footprint, the plug connector has exactly two signal conductors for transmitting a differential signal, wherein the first signal conductor has a first electrical contact coupled at a first coupling point and the second signal conductor has a second electrical contact coupled at a second coupling point, wherein the second coupling point is not one of the coupling points which is directly adjacent to the first coupling point of the footprint.

Abstract: Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.

Abstract: A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.

Abstract: A circuit board has a socket with at least one plated through-hole. A connector includes a housing that has first and second connector interfaces with, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and the interior of the housing to the second connector contact at the second connector interface. A resilient seal is located at the first connector interface. The first connector contact extends through the resilient seal and into the plated through-hole. The resilient seal intimately seals around the first connector contact and provides a barrier at the first connector interface into the vapor path.

Abstract: The invention relates to a process for manufacturing a power circuit board in which, on the one hand, a printed circuit board including an insulating substrate and a conductive track on one of the sides of the substrate, and on the other hand, a bus bar element, are provided. The bus bar element is welded to the conductive track using a laser. In order to make it possible to produce the weld by laser welding, even with a relatively thick bus bar, the welding is carried out in a zone that is thinner relative to the maximum thickness of the bus bar. Thus, a printed circuit board is obtained with a bus bar having a thick zone for conducting high currents and a thinner zone in order to allow the bus bar to be welded to the conductive track by laser welding.

Abstract: A lead with segmented electrodes can be made using one or two mold methods. In one method, segmented electrodes are individually disposed on pins on an interior surface within a mold. Each of the segmented electrodes has at least one opening formed in the exterior surface of the segmented electrode. The lead body is then molded between the electrodes. In a two mold method, segmented electrodes are inserted into electrode slots of a first mold and an interior portion of a lead body is formed. The resulting intermediate arrangement is placed into a second mold to form an exterior portion of the lead body. In another two mold method, a sacrificial ring is formed around the segmented electrodes in a first mold and the resulting intermediate structure is inserted in a second mold to form the lead body. The sacrificial ring is then removed.

Abstract: A substrate terminal includes at least one substrate connection portion that is inserted into a hole portion in a substrate from one surface side of the substrate and is soldered together with the hole portion, a terminal connection portion into which an opposite-side terminal is inserted in a direction same as an insertion direction of the substrate connection portion into the hole portion and that is connected to the opposite-side terminal, an intermediate portion that connects the substrate connection portion and the terminal connection portion, and at least one substrate abutting portion that is made to project in a direction orthogonal to the insertion direction and is made to abut against the one surface of the substrate with the substrate connection portion and the hole portion soldered. The substrate abutting portion is formed on a base member by bending processing.

Abstract: A printed circuit board includes a busbar applied to a surface of the printed circuit board. The busbar is configured as a sequence of sheet metal conductor pieces which are connected to each other in an electrically conducting manner. The respective ends of the conductor pieces may have a rounded portion and a corresponding cutout, or a point and a corresponding indentation. An electrical controller, a motor vehicle and a printed circuit board configuration having at least one printed circuit board are also provided.

Abstract: A contact includes a body section, a tail section arranged at a lower portion of the body section, a peg extending from the tail section such that the peg projects from a front surface of the contact, and a fusible member attached to the contact such that the peg protrudes into the fusible member. A lower portion of the fusible member is offset from a main portion of the fusible member.

Abstract: A semiconductor device comprises a semiconductor chip mounted on an island, and a plurality of leads spaced form the island and connected by wires to the semiconductor chip. An insulating film encapsulates the island, the semiconductor chip, the wires and the leads, and the insulating resin has a concave portion that is in contact with the leads. Each lead has a bottom surface exposed from the insulating resin, and the concave portion of the insulating resin exposes side surfaces which surround the bottom surface of each of the leads located under a bottom surface of the insulating resin. When the semiconductor device is soldered to a circuit board, the concave portion prevents contact between the solder and the insulating resin and improves self-alignment of the semiconductor device on the circuit board.

Abstract: A method for manufacturing a card member includes: preparing a substrate having a card edge section with card edge terminals to be connected to an opposing connector; preparing a fist mold and a second mold that have molding spaces for molding a resin molded section having a fitting section to be fitted with the opposing connector formed around the substrate; placing the substrate inside the molding spaces between the first mold and the second mold in such a way that the joining portion of the first mold and the second mold are disposed so as not to be overlapped with the portion where the fitting section is to be formed; injecting a synthetic resin material into the molding space to integrally form the resin molded section around the substrate. The method can provide a card member having an excellent watertightness.

Abstract: A method is provided for producing a printed circuit board. The method includes the step of providing an insulating substrate having a layer of aluminum material applied to the substrate. A portion of the layer of aluminum material is removed for defining a circuit trace. A layer of conductive material is applied to the layer of aluminum material.

Abstract: One aspect of the invention relates to a multi-core cable in which a cable sheath covers plural electronic wires in each of which a central conductor is covered with a covering. In the multi-core cable, the electronic wires are exposed from a longitudinal end of the cable sheath, and distal ends of exposed portions of the plural electronic wires are parallel aligned, and the exposed portions of the plural electronic wires are fixed by a resin in a place within a range from the end of the cable sheath to a parallel aligned place.

Abstract: Semiconductor devices are provided. The semiconductor devices may include a non-planar conductive pattern. The non-planar conductive pattern may be on an insulating layer and may contact a connection terminal at a plurality of different heights. Related methods of forming semiconductor devices are also provided.

Abstract: Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. Various protocols can be employed during processing to avoid cross-contamination between copper-plated and non-copper-plated wafers. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices.

Abstract: A method of producing and testing a chip package is described. The chip package to be produced includes a semiconductor chip containing an integrated circuit and a reinforcing structure attached to the semiconductor chip. Further, the chip package has a lower main face and an upper main face opposite to the lower main face, wherein the lower main face is at least partly formed by an exposed surface of the semiconductor chip and the upper main face is formed by a terminal surface of the reinforcing structure on which external terminal pads of the chip package are arranged. After production, the package is subjected to a package-level burn-in test.

Abstract: A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.

Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

Abstract: A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.

Abstract: The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.

Abstract: An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the substrates. The substrates, lead frames, and electronic devices are sintered together using silver-based sintering paste between each layer. The material and thicknesses of the substrates and lead frames are selected so stress experienced by the electronic devices caused by changes in temperature of the assembly are balanced from the center of the assembly, thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Abstract: A portable electronic device, a peripheral expansion module and methods for assembling a peripheral expansion module onto a portable electronic device are provided herein. The portable electronic device may comprise a main housing unit having a front cover and a back cover which, when coupled together, enclose internal components of the portable electronic device. The peripheral expansion module, comprising one or more peripheral devices coupled within or on a peripheral module housing, may be securely integrated with the portable electronic device. A majority of the peripheral expansion module may be positioned outside of the main housing unit along one side of the portable electronic device. In some embodiments, the peripheral expansion module includes a pair of rails, which extend out from within an interior of the module housing for attachment via one or more mechanical fasteners to an interior surface of the main housing unit of the portable electronic device.

Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.

Abstract: A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core layer. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded pads are located on an upper surface of the insulating layer.

Abstract: A method for securing a signal propagating line to a downhole component includes configuring the downhole component in a final form prior to securing the line thereto; positioning the line at an outside dimension of the component; and fusing the line to the component with a heat based fusion method and apparatus therefore.

Abstract: Ion filter for FAIMS fabricated using the LIGA technique. The ion filter is manufactured using a metal layer to form the ion channels and an insulating support layer to hold the structure rigidly together after separation of the metal layer into two electrodes.

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

Abstract: The invention relates to an electrical connection piece for a video endoscope having a hermetically closed video unit in a shaft of the endoscope, a video endoscope, and a method for producing an electrical connection in a video endoscope. The electrical connection piece according to the invention includes an at least partially flexible printed circuit board having conductive tracks, wherein the printed circuit board has a base surface with openings for contact pins of a hermetic feedthrough, and a flexible first arm and a flexible second arm that branch off in different, in particular opposite, directions from the base surface, wherein the first arm and the second arm each have a flat end surface at the respective ends facing away from the base surface, wherein the conductive tracks extend between the openings on the base surface and electrical contacting surfaces in the end surfaces.

Abstract: A method of making a stimulation lead includes attaching multiple segmented electrodes to a carrier. Each of the segmented electrodes has a curved form extending over an arc in the range of 10 to 345 degrees. The method further includes attaching conductors to the segmented electrodes; forming the carrier into a cylinder with segmented electrodes disposed within the cylinder; molding a lead body around the segmented electrodes disposed on the carrier; and removing at least a portion of the carrier to separate the segmented electrodes.

Abstract: A printed circuit board on which a component having a plurality of terminals is to be mounted by using a reflow soldering process, includes wiring patterns that are arranged in correspondence with the plurality of terminals and have a size which is smaller in wiring patterns for terminals near the central portion of the component than in wiring patterns for terminals near each end portion of the component.

Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board. The method includes the steps of mounting a strip substrate on a fixing member, and separating the strip substrate into unit substrates by performing a singulation process. The method further includes the steps of attaching solder balls onto the unit substrates using a mask disposed on the unit substrates, and fixing the solder balls on the unit substrates by performing a reflow process.

Abstract: An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

Abstract: The invention relates to a contact pin, comprising an angular end section, which is in particular designed for connecting to a wire or plug, wherein the angular end section has an angular cross-section. According to the invention, the contact pin has a round end section that is opposite the angular end section and that is designed for soldering to a circuit board. The round end section has a cross-section that is round at least in some sections of the circumference.

Abstract: A land grid array (LGA) and a method of forming the LGA are disclosed. The method comprises plating a printed circuit board to form a grid array of copper pads, and soldering a discrete pad over each of the plated copper pads in the grid array. The discrete pad is a solid object that can be handled and positioned independent of other discrete pads. Optionally, the method may further comprise measuring variations in flatness of the printed circuit board as a function of location in the grid array, and selecting individual discrete pads that each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

Abstract: A terminal comprises an upper arm having a top surface for a mating area; a lower arm paralleled with the upper arm and having a bottom surface soldering area; and a connecting arm connected with the upper arm and the lower arm.

Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.

Abstract: In order to lower the substantial heating temperature of a thermosetting adhesive and to realize favorable connection reliability during connecting an electrical element to a circuit board by anisotropic conductive connection with using solder particles, a product in which solder particles having a melting temperature Ts are dispersed in an insulating acrylic-based thermosetting resin having a minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive in producing a connection structure by connecting the circuit board and the electrical element to each other by anisotropic conductive connection.

Abstract: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

Abstract: A new method for making and manufacturing the User-Friendly USB Male connectors which is faster, lower cost, more energy efficient, waterproof and reliable, with no expensive tooling and molding required, having better quality and being easily adaptable for automated assembly.

Abstract: Some embodiments of the invention comprise a customizable multichannel microelectrode array with a modular planar microfabricated electrode array attached to a carrier and a high density of recording and/or stimulation electrode sites disposed thereon. Novel methods of making and using same are also disclosed.