Assembling Terminal To Base Patents (Class 29/842)
  • Patent number: 10499509
    Abstract: Various methods and systems are provided for forming a flexible circuit. In one example, a method includes forming a flexible circuit comprising a plurality of contact pads arranged into a plurality of rows, each contact pad of a given row electrically coupled to one another via electrical traces and each contact pad including a via, electroplating the flexible circuit, including electroplating each via, with at least a first material, and upon confirming connectivity of each via, cutting at least some of the electrical traces at least partially.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 3, 2019
    Assignee: General Electric Company
    Inventors: Kevin Matthew Durocher, David Joseph Andrews, Mark Stephen Maggio, Min Yuan
  • Patent number: 9954319
    Abstract: An electrical connector assembly includes: a plug connector including an insulative housing, plural conductive terminals arranged in two rows and affixed to the insulative housing, and a metal shell enclosing the insulative housing, the insulative housing comprising a top wall having plural first grooves, and each conductive terminal comprising a fixed portion affixed to a corresponding first groove and exposed to the metal shell; and a receptacle connector including an insulative body, plural mating terminals affixed to the insulative body, and a shielding shell enclosing the insulative body, the shielding shell having a tuber extending inwardly; wherein the tuber resists against a surface of the metal shell when the plug connector is mated with the receptacle connector.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: April 24, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Jun Zhao
  • Patent number: 9923295
    Abstract: A connector includes a connector housing (10) with a cavity (15B), into which a terminal fitting (40) is to be inserted. The connector housing (10) is connectable to a mating connector. A retainer insertion opening (30) opens in a side surface of the connector housing (10) and in a direction intersecting an inserting direction of the terminal fitting (40). A retainer (50) can be inserted into the retainer insertion opening to lock the terminal fitting (40). The retainer (50) includes a thin plate (61) extending in an inserting direction of the retainer (50), a convex portion (70) on a lower surface of the thin plate (61) and a groove (71) in the convex portion (70). A projection (25) is provided on a rear part of a locking lance (20) in the cavity (15B) of the connector housing (10) and fits to the groove (71).
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: March 20, 2018
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Mizuho Fujimura
  • Patent number: 9887469
    Abstract: A wire connector for connecting and maintaining a branch wire connected to a main uncut wire during handling of the wire connector and without cutting the main wire by laterally inserting the main uncut wire into a laterally open wire port in a piston sleeve and extending a cut end of a branch wire through an offset wire guide on the exterior of the wire connector and then reversing the branch wire direction to form a slack loop in the branch wire before inserting the end of the branch wire into a further wire port in the piston sleeve.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 6, 2018
    Assignee: THE PATENT STORE LLC
    Inventors: L. Herbert King, Jr., James Keeven, William Hiner
  • Patent number: 9841632
    Abstract: Provided are a liquid crystal display panel, a composite substrate, and a method for fabricating the composite substrate. The composite substrate includes: a substrate, a carbon nanotube layer, a polarizing material and a photoalignment matrix material. The carbon nanotube layer is adhered to a surface of the substrate with the photoalignment matrix material; the carbon nanotube layer includes multiple carbon nanotubes extending in a same direction; the polarizing material is mixed into the photoalignment matrix material, and a molecule arrangement direction of the polarizing material is the same as the extending direction of the carbon nanotube. Multiple grooves arranged in parallel may be formed between carbon nanotubes since the extending direction of the carbon nanotube is the same, and the groove may be used for an initial alignment of liquid crystal molecules.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: December 12, 2017
    Assignees: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD., TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventor: Sifan Wei
  • Patent number: 9684621
    Abstract: A termination connector for use in a heavy machine environment operable to terminate an electronic signal of a communication network. The termination connector has a connector housing which can be mated with a separate receptacle to connect to the communication network. The termination connector has a plurality of pin receptacles within the connector housing which connect to a termination circuit. The termination circuit has at least two resistors in electric series with one another connected to a first pin receptacle of the plurality of pin receptacles and connected to a second pin receptacle of the plurality of pin receptacles. A capacitor is connected between the at least two resistors in electric series at a front capacitor end and the back capacitor end is connected to a third pin receptacle of the plurality of pin receptacles within the connector housing.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: June 20, 2017
    Assignee: Electro-Motive Diesel, Inc.
    Inventor: Tadeusz A. Gajda
  • Patent number: 9622355
    Abstract: An environmentally sealed electrical housing assembly with an integrated connector and a method for manufacturing same is presented. The assembly includes a non-accessible electrical component, such an electromechanical relay, and a plurality of terminals connected to a circuit board. A dielectric housing encases the non-accessible electrical component. The housing is in intimate contact with the non-accessible electrical component, thereby sealing it from the environment. The housing defines an integral perimeter wall that surrounds the terminals, forming a connector shroud. Removable electrical components, such as fuse assemblies, may be attached to the terminals inside the shroud. When a sealed mating connector is attached to the housing, the removable components are also sealed from the environment. The assembly allows distribution of power switching functions and circuit protection to be distributed to a location near the electrical load instead of a central location, such as a bussed electrical center.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: April 11, 2017
    Assignee: Delphi Technologies, Inc.
    Inventors: Eric J. Stern, William J. Mosby
  • Patent number: 9490589
    Abstract: A differential signal connector includes a plurality of pairs of signal contacts, a plurality of ground contacts, and an insulating housing holding the signal contacts and the ground contacts. On a first connection side for connection to a connection partner, the ground contacts are arranged on both sides of each pair of signal contacts so that a contact array of a fixed pitch is formed. On a second connection side for connection to a board, the ground contacts are arranged spaced apart from each other in a first row, while the pairs of signal contacts, which are adjacently arranged on both sides of the ground contact on the first connection side, are arranged so as to be allocated in a second row and a third row located on both sides of the first row so that the pairs of signal contacts are arranged zigzag on the second connection side.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: November 8, 2016
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Masayuki Shiratori, Shuichi Aihara, Masayuki Katayanagi, Osamu Hashiguchi
  • Patent number: 9472863
    Abstract: A holder has a flat cable insertion chamber for a flat cable to be inserted and a cutting blade penetration hole penetrating the flat cable insertion chamber. A jig has a cutting blade penetrating the cutting blade penetration hole of the holder with the flat cable inserted into the flat cable insertion chamber and forming a slit in a cover between a plurality of conductors of the flat cable.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 18, 2016
    Assignee: YAZAKI CORPORATION
    Inventor: Masahito Ozaki
  • Patent number: 9442151
    Abstract: A method for detecting electrical disconnections of a chip during testing under environmental conditions includes providing n monitor connections on a chip from which a voltage or current can be sensed during testing of the chip under environmental conditions, where n is an integer of at least one. M sensing connections are provided on the chip, where m>n. An electrical circuit for electrically connects the n monitor connections with the m sensing connections. The electrical circuit has a characteristic that changes when one or more of the m sensing connections is disconnected from its corresponding contact on the printed circuit board or chip socket. The electrical circuit is monitored via the n monitor connections during the testing. It is determined based on changes in the characteristic, whether one or more of the m sensing connections is disconnected from the printed circuit board or chip socket.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: September 13, 2016
    Assignee: SanDisk Technologies LLC
    Inventors: Shai Tubul, Evgeni Bassin, Victor Romanov
  • Patent number: 9442135
    Abstract: A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: September 13, 2016
    Assignee: MPI CORPORATION
    Inventors: Kuan-Chun Chou, Huo-Kang Hsu, Hui-Pin Yang, Chien-Kuei Wang
  • Patent number: 9362679
    Abstract: The invention relates to an insulation body of a plug-in connector, which comprises connection elements (21) that can be electrically connected to conductor tracks of a circuit board and/or to individual wires of a multi-wired cable to be connected, wherein the connection elements (21) can be produced using MID technology.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: June 7, 2016
    Assignee: HARTING ELECTRONICS GMBH
    Inventors: Stephan Schreier, Melanie Genau
  • Patent number: 9343835
    Abstract: The invention provides a terminal including a base, a first arm, a second arm, a first contact portion and a second contact portion. The base is of a plate-like shape. The first arm is of a plate-like shape and extends from the base in a first direction. The second arm is of a plate-like shape, extends from the base in the first direction, is spaced apart from the first arm in a second direction crossing the first direction, and has a larger dimension in the first direction than that of the first arm. The first contact portion is of a plate-like shape and extends from the first arm to one side of the second direction. The second contact portion is of a plate-like shape and extends from the second arm to the one side of the second direction so as to be located on one side of the first direction of the first contact portion.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: May 17, 2016
    Assignee: HOSIDEN CORPORATION
    Inventors: Daisuke Sasaki, Takayuki Nagata, Yasuo Nakai
  • Patent number: 9293865
    Abstract: A multiple connector socket is able to interface to a low bandwidth connector and a high bandwidth connector. The low bandwidth connector facilitates a low bandwidth interface, such as USB 2.0, using a miniaturized connector having low bandwidth blade contacts, such as a micro USB 2.0 connector. The high bandwidth connector interposes high bandwidth blade contacts between the low bandwidth blade contacts for facilitating a high bandwidth interface, such as components of a DisplayPort interface. The high bandwidth blade contacts incorporate apertures to reduce electromagnetic coupling with the low bandwidth blade contacts. In one implementation, apertures are not required on the low bandwidth blade contacts.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: March 22, 2016
    Assignee: BlackBerry Limited
    Inventor: Sheldon Terry Schwandt
  • Patent number: 9281268
    Abstract: A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: March 8, 2016
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Eugene M. Chow, John E. Cunningham, James G. Mitchell, Ivan Shubin
  • Patent number: 9269686
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: February 23, 2016
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana T. Adryushchenko, Guanghai Xu
  • Patent number: 9265155
    Abstract: A rework device in form of a flexible circuit is provided in order to repair a printed circuit assembly. The printed circuit assembly includes one or more through vias and interconnections. The flexible circuit includes a lead in portion and a tail portion. The flexible circuit also includes a first distended head portion proximal to the lead in portion and a second distended head portion proximal to the tail portion. Further, the second distended head portion is connected to the first distended head portion through a coverlay portion. The flexible circuit provided is adapted to be threaded through a through via to repair the printed circuit assembly.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 16, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gerald K Bartley, David J Braun, John R Dangler, Matthew S Doyle, Thomas D Kidd
  • Patent number: 9169567
    Abstract: A components comprising a plurality of tab members formed thereon are provided. The plurality of tab members include at least one dissimilar metallic layer applied to the component. The plurality of tab members are configured to extend away from or retract toward a surface of the component in response to a temperature change.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: October 27, 2015
    Assignee: General Electric Company
    Inventors: Rebecca Evelyn Hefner, Paul Stephen Dimascio
  • Patent number: 9112325
    Abstract: A contact configuration for producing an electrical connection between a plug and a socket, preferably for connecting an electrode to an electronic implantable device (such as a pacemaker), has a contact section on the plug and/or the socket. The contact section includes metallic conductive fibers which project between the plug and socket when the socket receives the plug. The contact configuration has a high degree of redundancy in providing electrical communication between the socket and plug, and high contact stability under mechanical load. In addition, friction corrosion is avoided.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: August 18, 2015
    Assignee: BIOTRONIK CRM PATENT AG
    Inventor: Ronald Rebentisch
  • Publication number: 20150147910
    Abstract: An electrical connector include a movable hold down member that is configured to receive a fastener so as to secure the electrical connector to an underlying substrate to which the electrical connector is mounted.
    Type: Application
    Filed: November 19, 2014
    Publication date: May 28, 2015
    Inventors: Douglas M. Johnescu, Gregory A. Hull
  • Publication number: 20150147911
    Abstract: A panel mount connector and method involve a connector shell assembly that is configured to be received in an opening that is defined by a panel with the connector shell defining a through passage. A flexible circuit board is supported within the through passage and defines a first external connection interface at one end for external electrical access from one side of the panel when the connector shell assembly is installed in the panel and at least the first external connection interface is supported for independent movement relative to the connector shell.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Inventors: Ronald T. Logan, JR., Sean Zargari, Mehrdad Ghara, Huan Do
  • Publication number: 20150137849
    Abstract: A probe card includes a first insulation layer, a contact terminal arranged on the first insulation layer, and a wiring pattern arranged on an upper surface of the first insulation layer. The wiring pattern includes a rewire connected to the contact terminal and a first pad connected to the rewire. The probe card further includes a wiring substrate. The wiring substrate includes an interlayer insulation layer, a wiring layer, and a cavity defined in central portions of the interlayer insulation layer and the wiring layer. The wiring substrate is spaced apart from the first insulation layer arranged in the cavity. The cavity is filled with a second insulation layer. A conductive wire is arranged in the second insulation layer to electrically connect the first contact terminal and the wiring layer. The second insulation layer has a lower elasticity than the interlayer insulation layer.
    Type: Application
    Filed: October 16, 2014
    Publication date: May 21, 2015
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake
  • Publication number: 20150137848
    Abstract: A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 21, 2015
    Inventors: David Walter Lewinnek, Roger Allen Sinsheimer, Luis Antonio Valiente, Craig Anthony DiPalo
  • Patent number: 9032614
    Abstract: One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The electrical bushing includes a holding element to hold the electrical bushing in or on the housing. The conducting element is set-up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The holding element is made, to at least 80% by weight with respect to the holding element, from a material selected from the group consisting of a metal from any of the subgroups IV, V, VI, VIII, IX, and X of the periodic system.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 19, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventor: Heiko Specht
  • Publication number: 20150126074
    Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.
    Type: Application
    Filed: January 12, 2015
    Publication date: May 7, 2015
    Inventors: Shadi Alex AbuGhazaleh, Joseph Edgar Dupuis, Christopher Wayne Gribble, Naved Shah Khan, Douglas Paul O'Connor
  • Patent number: 9021690
    Abstract: A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: May 5, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Myung Sam Kang
  • Patent number: 9011178
    Abstract: A connector which permits the resistance against the deformation of a shield to be increased and a method of manufacturing the connector. The shield is made up of an inner shield member disposed on the inner surface side of the shield and anouter shield member disposed on the outer surface side and, therefore, the strength of the shield can be increased by the double structure of the shield members. As a result of this, the shield is not deformed easily even in the case where an excessive external force is applied to the shield in the vertical direction or in the horizontal direction, for example, in inserting and extracting a mating connector into and out of the shield.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: April 21, 2015
    Assignee: Iriso Electronics Co., Ltd
    Inventors: Kiichi Hori, Yoshihito Ohkuma
  • Patent number: 9003650
    Abstract: A conductive sleeved fastener assembly includes an electrically-conductive fastener having a fastener head and a fastener shank extending from the fastener head and an electrically-conductive fastener sleeve receiving the fastener shank of the fastener and a fastener sleeve flange provided on the fastener sleeve and disposed in direct contact with the fastener head of the fastener. A method of preparing a conductive sleeved fastener for use is also disclosed.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: April 14, 2015
    Assignee: The Boeing Company
    Inventors: Thu A Nguyen, Michael G Parent, Russell Joe Heeter, Jeffrey A Wilkerson
  • Publication number: 20150098193
    Abstract: A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.
    Type: Application
    Filed: February 1, 2013
    Publication date: April 9, 2015
    Inventors: Josef Loibl, Herbert Wallner, Roland Friedl
  • Publication number: 20150099398
    Abstract: A female connector for electrical connection to an edge connector, the edge connector being of predetermined width, the female connector comprising: two parallel outer segments, at least one of the outer segments comprising electrical connections for the edge connector located on an inwardly facing surface thereof; and a spacer spacing the outer segments apart by approximately the edge connector width, the outer segments extending forward of the spacer to fit over corresponding electrical connections on either side of the edge connector to provide electrical connection.
    Type: Application
    Filed: October 7, 2013
    Publication date: April 9, 2015
    Inventor: Eli BENOLIEL
  • Patent number: 8997320
    Abstract: Provided is a method for manufacturing an acoustic wave device that has an excellent temperature coefficient of frequency (TCF) and high accuracy of IDT pattern forming and is capable of resisting high temperature processing of 200 degrees or more. The method for manufacturing an acoustic wave device according to the present invention includes forming an IDT (2) on a principal surface (1a) of a piezoelectric substrate (1), and forming a film by thermal spraying a material (3) having a smaller linear thermal expansion coefficient than the piezoelectric substrate onto an opposite principal surface (1b) of the piezoelectric substrate (1) where the IDT (2) is formed.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: April 7, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Fuyutsume, Taro Nishino, Hisashi Yamazaki, Noboru Tamura, Nakaba Ichikawa, Masaki Aruga
  • Publication number: 20150094974
    Abstract: A capacitive sensor (20) includes a capacitive sensor field (2), the capacitive sensor field (2) having a plurality of discrete electrodes (4) which are coupled to discrete leads (8). The leads (8) of a first electrode (41) are guided such that they are capacitively coupled with at least one second electrode (42). A first signal (Cm1) is detected at a first lead (8) which is coupled with the first electrode (41), and a second signal (Cm2) is detected at a second lead (8) which is coupled with a second electrode (42). The capacity (Cf1, Cf2) of the first electrode (41) or of the second electrode (42) is determined using a predetermined calculation formula which takes the first signal (Cm1), the second signal (Cm2) and the capacitive coupling between the second electrode (4) and the first lead (8) coupled with the first electrode (41) into account.
    Type: Application
    Filed: April 2, 2013
    Publication date: April 2, 2015
    Inventor: Ulrich Backes
  • Publication number: 20150090588
    Abstract: Method for interfacing an integrated circuit with a biological ion channel, the integrated circuit being at least partially disposed within an electrolytic solution and including an amplifier and one or more electrodes on a surface thereof, includes forming one or more microwells proximate the one or more electrodes, applying a lipid membrane over the integrated circuit proximate the microwells, and placing a further electrode in the electrolytic solution proximate the lipid membrane on a side opposite the integrated circuit. A biological ion channel interface is also provided.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 2, 2015
    Applicant: The Trustees of Columbia University in the City of New York
    Inventors: Kenneth L. Shepard, Jacob Rosenstein, Siddharth Ramakrishnan, Jared Roseman
  • Publication number: 20150077650
    Abstract: A touch screen includes a plurality of first transparent electrodes extending in a first direction and a plurality of second transparent electrodes extending in a second direction intersecting the first direction disposed on the substrate; first conductive layers located on at least one side of the first transparent electrodes and connected in parallel with the first transparent electrodes; and/or second conductive layers located on at least one side of the second transparent electrodes and connected in parallel with the second transparent electrodes; the first conductive layers and the second conductive layers are metal layers or alloy layers. A manufacturing method of the touch screen and a display device having the touch screen are further disclosed.
    Type: Application
    Filed: December 9, 2013
    Publication date: March 19, 2015
    Inventors: Weiyun Huang, Young Yik Ko, Yingying Nan, Minghua Xuan
  • Publication number: 20150079832
    Abstract: An LGA socket suitable for electro-optical modules, such as transceivers having channels operable at 25 Gbit/s, or greater. A socket may include a socket body having a bottom side to face a printed circuit board (PCB) and a backstop on a top side to receive a leading edge of a module substrate. The backstop has an overhang to contact a first side of the module substrate when seated into the socket body. The socket further includes a first and a second row of electrical contacts, the first row being more proximate to the backstop than is the second row. Contacts extend through the socket body between the top and bottom sides and are positioned relative to the overhang to be compressed against contact pads on a second side of the module substrate by a torque applied to the module substrate about a fulcrum within the socket body.
    Type: Application
    Filed: September 13, 2013
    Publication date: March 19, 2015
    Inventor: Glen Gordon
  • Publication number: 20150077946
    Abstract: A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 19, 2015
    Inventors: CHANG-CHIN WU, TEN-HSING JAW, CHIN-YANG WU
  • Publication number: 20150072565
    Abstract: A dual orientation connector having a connector tab with first and second major opposing surfaces and a plurality of electrical contacts carried by the connector tab. A retainer is positioned at an entrance end of the tab and is overmolded on a portion of a carrier. The carrier has a first portion positioned within the tab, a second portion extending through the retainer and a third portion extending out of the retainer at an angle with respect to the longitudinal plane of the tab. The carrier has a plurality of conductors formed thereon and extending from the first portion to the third portion.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 12, 2015
    Applicant: APPLE INC.
    Inventors: Albert J. Golko, Warren Z. Jones, Ibuki Kamei
  • Patent number: 8973260
    Abstract: A method of forming nanotube contact structures may include forming an interconnect layer over a portion of a layer of a microelectronics device and forming a nanotube layer over a portion of the interconnect layer. The nanotube layer may define openings through the nanotube layer. The method also may include forming self-aligned electrodes in the openings of the nanotube layer such that the self-aligned electrodes are formed only in openings in the nanotube layer that substantially reside over metal filled vias of the microelectronics device. In some examples, the self-aligned electrodes may be formed on the metal in the vias, and the self-aligned electrodes may not be formed in openings that do not reside over the metal filled vias.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: March 10, 2015
    Assignee: Honeywell International Inc.
    Inventor: Thomas Keyser
  • Patent number: 8973228
    Abstract: A vibration layer is formed by the AD method on a cavity plate before forming pressure chambers, a common electrode is formed on the vibration layer, and a piezoelectric layer is formed on the common electrode by the AD method. Subsequently, the pressure chambers are formed in the cavity plate by the etching. After that, individual electrodes are formed on the piezoelectric layer. Subsequently, the stack of the cavity plate, the vibration layer, the common electrode, the piezoelectric layer, and the individual electrodes is heated at about 850° C. to simultaneously perform the annealing of the piezoelectric layer and the sintering of the individual electrodes and the common electrode. Accordingly, the atoms of the cavity plate are suppressed from being diffused into the driving portions of the piezoelectric layer.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: March 10, 2015
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Hiroto Sugahara
  • Patent number: 8966730
    Abstract: A method of manufacturing a sensor network is described which includes stretching a silicon substrate over a desired area, and generating a plurality of nodes fabricated on the stretchable silicon substrate. The nodes include at least one of an energy harvesting and storage element, a communication device, a sensing device, and a processor. The nodes are interconnected via interconnecting conductors formed in the substrate.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: March 3, 2015
    Assignee: The Boeing Company
    Inventors: Michael Alexander Carralero, John Lyle Vian
  • Patent number: 8970242
    Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: March 3, 2015
    Assignee: Rohm Co, Ltd.
    Inventors: Goro Nakatani, Masahiro Sakuragi, Koichi Niino
  • Publication number: 20150056833
    Abstract: In accordance with one embodiment, an electrical connector can be mounted to a first printed circuit board to obtain a first current capacity, and the electrical connector can be mounted to a second printed circuit board to obtain a second current capacity that is lower than the first current capacity.
    Type: Application
    Filed: August 5, 2014
    Publication date: February 26, 2015
    Inventors: Thomas Brungard, Michael Percherke, Christopher J. Kolivoski, Christopher S. Gieski, Nazareth Eppley, Charles Copper, Thierry Goossens
  • Publication number: 20150056854
    Abstract: An electrical connector lock can include a mounting member configured to attach to a substrate. The electrical connector lock can also include force cancellation member that cancels forces generated on an electrical component by a mated component.
    Type: Application
    Filed: August 18, 2014
    Publication date: February 26, 2015
    Inventor: Michael Scholeno
  • Patent number: 8959734
    Abstract: An interactive card or the like employs a piezoelectric charge generator (piezo-strip) for temporarily driving an indicator. The piezo-strip may be displaced (bent) in order to generate charge to drive the indicator. Printed electronic processes are utilized to produce the indicator and/or the piezoelectric charge generator. An indicator is formed on a substrate by way of a printed electronics process. A displaceable region of piezoelectric material associated with the said substrate is formed by way of a printed electronics process. Electrical interconnections are formed on said substrate by way of a printed electronics process. The electrical interconnections connecting said indicator and said first region of piezoelectric material such that displacement of said first region of piezoelectric material generates a voltage therein that is provided to said indicator in order to actuate said indicator and thereby indicate the displacement of said first region of piezoelectric material.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: February 24, 2015
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Jurgen H. Daniel, Tse Nga Ng
  • Patent number: 8955219
    Abstract: The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective layer. The protective layer covers at least one surface zone of the metallic surface in which the metallic surface is to be electrically conductive bonded to a contact conductor. To fabricate the bond, a portion of a provided contact conductor above the surface zone is pressed on to the protective layer and the body so that the protective layer is destroyed above the surface zone in achieving an electrically conductive bond between the metallic surface and the contact conductor.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: February 17, 2015
    Assignee: Infineon Technologies AG
    Inventors: Roman Roth, Dirk Siepe
  • Patent number: 8955218
    Abstract: A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core layer. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded pads are located on an upper surface of the insulating layer.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 17, 2015
    Assignee: Unimicron Technology Corp.
    Inventors: Tsung-Yuan Chen, Shih-Lian Cheng
  • Publication number: 20150043190
    Abstract: Microelectronic assemblies and methods of making the same are disclosed.
    Type: Application
    Filed: August 7, 2013
    Publication date: February 12, 2015
    Applicant: INVENSAS CORPORATION
    Inventors: Ilyas Mohammed, Belgacem Haba
  • Patent number: 8950068
    Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: February 10, 2015
    Assignee: Google Inc.
    Inventor: James Etzkorn
  • Publication number: 20150033556
    Abstract: A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection.
    Type: Application
    Filed: October 22, 2014
    Publication date: February 5, 2015
    Inventor: Benjamin V. Fasano
  • Publication number: 20150028196
    Abstract: Ion filter for FAIMS fabricated using the LIGA technique. The ion filter is manufactured using a metal layer to form the ion channels and an insulating support layer to hold the structure rigidly together after separation of the metal layer into two electrodes.
    Type: Application
    Filed: January 3, 2013
    Publication date: January 29, 2015
    Inventors: Danielle Toutoungi, Matthew Hart, John Somerville, Jon Pearson, Max Allsworth, Richard Orrell, Antoni Negri, Jeremy Spinks, Martin Holden, Andrew H. Koehl, Alistair Taylor