Assembling Terminal To Base Patents (Class 29/842)
  • Patent number: 11644500
    Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: May 9, 2023
    Inventors: Mohammed Ghouse, Shailesh Nayak, Damaruganath Pinjala, Rohit Dev Gupta, Mehmet Onder Cap
  • Patent number: 11601208
    Abstract: Parameter calibration method for calibrating multiple parameters corresponding to multiple electronic components to be calibrated in a circuit, including steps: (A) turning off all of the electronic components to be calibrated and selecting a first electronic component from the electronic components to be calibrated as an electronic component being calibrated; (B) turning on the electronic component being calibrated and performing a calibration procedure on the electronic component being calibrated to determine a setting value of a parameter corresponding to the electronic component being calibrated; and (C) selecting a second electronic component from the electronic components to be calibrated as the electronic component being calibrated and performing step (B).
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: March 7, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yun-Tse Chen, Yan-Guei Chen, Shi-Ming Lu, Liang-Wei Huang
  • Patent number: 11600947
    Abstract: An electrical connector for connection to a complementary mating connector includes a housing having at least one socket and at least one contact assembly which is disposed at least partially within the socket. A fastening element secures the contact assembly within the socket. A secondary retention means is movable between a pre-latched position and a final latched position, and, in the final latched position, prevents the fastening element from releasing securement of the contact assembly in the socket. The housing has a fastening groove extending along the socket at least along a portion of its length for securing the secondary retention means. In the final latched position, the secondary retention means engages by at least one latching element in the fastening groove.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 7, 2023
    Inventors: Thomas Kirschner, Johannes Eben, Matthias Plischke
  • Patent number: 11564316
    Abstract: An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: January 24, 2023
    Inventor: Jesse Michael Zamarron
  • Patent number: 11532426
    Abstract: An inductor includes a body, a coil disposed inside the body, and first and second external electrodes disposed on one surface of the body to respectively be connected to both ends of the coil. A recess portion is disposed in a region between the first and second external electrodes on the one surface of the body.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 20, 2022
    Inventors: Seung Hee Kim, Jong Min Lee
  • Patent number: 11497126
    Abstract: Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: November 8, 2022
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Patent number: 11486923
    Abstract: Disclosed herein are apparatuses and methods for mitigating sticking of units-under-test (UUTs). For example, in some embodiments, a probe card may include a probe landing pad, a guide plate having a hole therein, and a pushing mechanism. The pushing mechanism may include a pusher needle and a pusher needle support, the pusher needle support may be between the probe landing pad and the guide plate, and the pusher needle support may be controllable to cause the pusher needle to extend and retract through the hole in the guide plate.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: November 1, 2022
    Assignee: Intel Corporation
    Inventors: Jagat Shakya, Ethan Caughey, Jeremy Alan Streifer
  • Patent number: 11150268
    Abstract: An electric connection device, includes: a circuit trace-included member (30); a probe (10) including a base that connects to a circuit trace formed in the circuit trace-included member (30) and a tip that comes into contact with an inspection subject (2); a probe head (20) which is provided next to the circuit trace-included member (30) and holds the probe (10); and a fixing component (100) which is located in the probe head (20) with an end protruding from the probe head (20) toward the circuit trace-included member (30), the end being fixed to a fixing surface (301) of the circuit trace-included member (30) that faces the probe head (20) to connect the probe head (20) and the circuit trace-included member (30).
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: October 19, 2021
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventor: Tatsuya Ito
  • Patent number: 11050173
    Abstract: An electrical connector includes an insulative housing forming plural rows of passageways wherein each row of passageways extends along a transverse direction while the plural rows are spaced from one another in a front-to-back direction perpendicular to the transverse direction. Each passageway is dimension to receive a unified contact having three sets of spring arms spaced from one another in the transverse direction. The three sets of spring arms are categorized with two outer sets and one inner set therebetween in the transverse direction. The pitch between the two neighboring sets of spring arms of each unified contact is essentially one half of the distance between one outer set of spring arms of one unified contact and another outer set of spring arms of the neighboring unified contact.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: June 29, 2021
    Inventors: Shan-Yong Cheng, Chih-Hsien Chou, Fang-Jwu Liao
  • Patent number: 10971839
    Abstract: A floating connector and a conductive terminal thereof are provided. The conductive terminal is integrally formed as a one piece structure, and includes a contacting segment, a fixing segment, and a buffering segment having two ends respectively connected to the contacting segment and the fixing segment. A longitudinal direction of the buffering segment and a longitudinal direction of the fixing segment have a first angle there-between less than ninety degrees. The buffering segment includes a first portion connected to the contacting segment, a second portion connected to the fixing segment, and two impedance matching portions defining a buffering hole. Two opposite ends of each of the two impedance matching portions are respectively connected to the first portion and the second portion. The buffering segment is configured to provide for an electrical current to travel there-through so as to generate a capacitance effect at the two impedance matching portions.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: April 6, 2021
    Assignee: Greenconn Corp.
    Inventors: Tsung-Lung Kuo, Kun-Shen Wu
  • Patent number: 10727622
    Abstract: A board-mounted connector (1) includes plural terminals (10) and a housing (40) holding the terminals. The housing has, on its wall surface (40a), a pair of first holding portions (41) each covered with an inner surface of each of a pair of hood portions (41a), and a second holding portion (42) located more distant from a circuit board (2) than the first holding portions. The terminals include a pair of first terminals (20) held by the first holding portions, and a second terminal (30) held by the second holding portion. The second terminal has an intermediate portion (33) between a holding target portion (32) held by the second holding portion and a contact portion (34) to be connected to the circuit board. The intermediate portion is press-fitted in a gap (S) between respective outer surfaces (44) of the hood portions.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: July 28, 2020
    Assignee: Yazaki Corporation
    Inventors: Takashi Matsunaga, Shin Nemoto, Kazuhito Kawabe
  • Patent number: 10534350
    Abstract: A flexible pressing system for accepting and rejecting pressed part into a part may include a pressing apparatus configured to press components into a hole of a part and a controller programmed to receive press data for a press of at least one of the components, the press data including force, distance and time of the press, and determine whether the force is indicative of an inadequate press based on the force and distance at a specific time of the press.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: January 14, 2020
    Assignees: Ford Motor Company, ABB Technology AG
    Inventors: Alexander Marrocco, Hossein Firoozgan, Joosok Jinn, Isaac Zolotarev, Arnold Bell
  • Patent number: 10499509
    Abstract: Various methods and systems are provided for forming a flexible circuit. In one example, a method includes forming a flexible circuit comprising a plurality of contact pads arranged into a plurality of rows, each contact pad of a given row electrically coupled to one another via electrical traces and each contact pad including a via, electroplating the flexible circuit, including electroplating each via, with at least a first material, and upon confirming connectivity of each via, cutting at least some of the electrical traces at least partially.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 3, 2019
    Assignee: General Electric Company
    Inventors: Kevin Matthew Durocher, David Joseph Andrews, Mark Stephen Maggio, Min Yuan
  • Patent number: 9954319
    Abstract: An electrical connector assembly includes: a plug connector including an insulative housing, plural conductive terminals arranged in two rows and affixed to the insulative housing, and a metal shell enclosing the insulative housing, the insulative housing comprising a top wall having plural first grooves, and each conductive terminal comprising a fixed portion affixed to a corresponding first groove and exposed to the metal shell; and a receptacle connector including an insulative body, plural mating terminals affixed to the insulative body, and a shielding shell enclosing the insulative body, the shielding shell having a tuber extending inwardly; wherein the tuber resists against a surface of the metal shell when the plug connector is mated with the receptacle connector.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: April 24, 2018
    Inventor: Jun Zhao
  • Patent number: 9923295
    Abstract: A connector includes a connector housing (10) with a cavity (15B), into which a terminal fitting (40) is to be inserted. The connector housing (10) is connectable to a mating connector. A retainer insertion opening (30) opens in a side surface of the connector housing (10) and in a direction intersecting an inserting direction of the terminal fitting (40). A retainer (50) can be inserted into the retainer insertion opening to lock the terminal fitting (40). The retainer (50) includes a thin plate (61) extending in an inserting direction of the retainer (50), a convex portion (70) on a lower surface of the thin plate (61) and a groove (71) in the convex portion (70). A projection (25) is provided on a rear part of a locking lance (20) in the cavity (15B) of the connector housing (10) and fits to the groove (71).
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: March 20, 2018
    Inventor: Mizuho Fujimura
  • Patent number: 9887469
    Abstract: A wire connector for connecting and maintaining a branch wire connected to a main uncut wire during handling of the wire connector and without cutting the main wire by laterally inserting the main uncut wire into a laterally open wire port in a piston sleeve and extending a cut end of a branch wire through an offset wire guide on the exterior of the wire connector and then reversing the branch wire direction to form a slack loop in the branch wire before inserting the end of the branch wire into a further wire port in the piston sleeve.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 6, 2018
    Inventors: L. Herbert King, Jr., James Keeven, William Hiner
  • Patent number: 9841632
    Abstract: Provided are a liquid crystal display panel, a composite substrate, and a method for fabricating the composite substrate. The composite substrate includes: a substrate, a carbon nanotube layer, a polarizing material and a photoalignment matrix material. The carbon nanotube layer is adhered to a surface of the substrate with the photoalignment matrix material; the carbon nanotube layer includes multiple carbon nanotubes extending in a same direction; the polarizing material is mixed into the photoalignment matrix material, and a molecule arrangement direction of the polarizing material is the same as the extending direction of the carbon nanotube. Multiple grooves arranged in parallel may be formed between carbon nanotubes since the extending direction of the carbon nanotube is the same, and the groove may be used for an initial alignment of liquid crystal molecules.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: December 12, 2017
    Inventor: Sifan Wei
  • Patent number: 9684621
    Abstract: A termination connector for use in a heavy machine environment operable to terminate an electronic signal of a communication network. The termination connector has a connector housing which can be mated with a separate receptacle to connect to the communication network. The termination connector has a plurality of pin receptacles within the connector housing which connect to a termination circuit. The termination circuit has at least two resistors in electric series with one another connected to a first pin receptacle of the plurality of pin receptacles and connected to a second pin receptacle of the plurality of pin receptacles. A capacitor is connected between the at least two resistors in electric series at a front capacitor end and the back capacitor end is connected to a third pin receptacle of the plurality of pin receptacles within the connector housing.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: June 20, 2017
    Assignee: Electro-Motive Diesel, Inc.
    Inventor: Tadeusz A. Gajda
  • Patent number: 9622355
    Abstract: An environmentally sealed electrical housing assembly with an integrated connector and a method for manufacturing same is presented. The assembly includes a non-accessible electrical component, such an electromechanical relay, and a plurality of terminals connected to a circuit board. A dielectric housing encases the non-accessible electrical component. The housing is in intimate contact with the non-accessible electrical component, thereby sealing it from the environment. The housing defines an integral perimeter wall that surrounds the terminals, forming a connector shroud. Removable electrical components, such as fuse assemblies, may be attached to the terminals inside the shroud. When a sealed mating connector is attached to the housing, the removable components are also sealed from the environment. The assembly allows distribution of power switching functions and circuit protection to be distributed to a location near the electrical load instead of a central location, such as a bussed electrical center.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: April 11, 2017
    Assignee: Delphi Technologies, Inc.
    Inventors: Eric J. Stern, William J. Mosby
  • Patent number: 9490589
    Abstract: A differential signal connector includes a plurality of pairs of signal contacts, a plurality of ground contacts, and an insulating housing holding the signal contacts and the ground contacts. On a first connection side for connection to a connection partner, the ground contacts are arranged on both sides of each pair of signal contacts so that a contact array of a fixed pitch is formed. On a second connection side for connection to a board, the ground contacts are arranged spaced apart from each other in a first row, while the pairs of signal contacts, which are adjacently arranged on both sides of the ground contact on the first connection side, are arranged so as to be allocated in a second row and a third row located on both sides of the first row so that the pairs of signal contacts are arranged zigzag on the second connection side.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: November 8, 2016
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Masayuki Shiratori, Shuichi Aihara, Masayuki Katayanagi, Osamu Hashiguchi
  • Patent number: 9472863
    Abstract: A holder has a flat cable insertion chamber for a flat cable to be inserted and a cutting blade penetration hole penetrating the flat cable insertion chamber. A jig has a cutting blade penetrating the cutting blade penetration hole of the holder with the flat cable inserted into the flat cable insertion chamber and forming a slit in a cover between a plurality of conductors of the flat cable.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 18, 2016
    Inventor: Masahito Ozaki
  • Patent number: 9442135
    Abstract: A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: September 13, 2016
    Inventors: Kuan-Chun Chou, Huo-Kang Hsu, Hui-Pin Yang, Chien-Kuei Wang
  • Patent number: 9442151
    Abstract: A method for detecting electrical disconnections of a chip during testing under environmental conditions includes providing n monitor connections on a chip from which a voltage or current can be sensed during testing of the chip under environmental conditions, where n is an integer of at least one. M sensing connections are provided on the chip, where m>n. An electrical circuit for electrically connects the n monitor connections with the m sensing connections. The electrical circuit has a characteristic that changes when one or more of the m sensing connections is disconnected from its corresponding contact on the printed circuit board or chip socket. The electrical circuit is monitored via the n monitor connections during the testing. It is determined based on changes in the characteristic, whether one or more of the m sensing connections is disconnected from the printed circuit board or chip socket.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: September 13, 2016
    Assignee: SanDisk Technologies LLC
    Inventors: Shai Tubul, Evgeni Bassin, Victor Romanov
  • Patent number: 9362679
    Abstract: The invention relates to an insulation body of a plug-in connector, which comprises connection elements (21) that can be electrically connected to conductor tracks of a circuit board and/or to individual wires of a multi-wired cable to be connected, wherein the connection elements (21) can be produced using MID technology.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: June 7, 2016
    Inventors: Stephan Schreier, Melanie Genau
  • Patent number: 9343835
    Abstract: The invention provides a terminal including a base, a first arm, a second arm, a first contact portion and a second contact portion. The base is of a plate-like shape. The first arm is of a plate-like shape and extends from the base in a first direction. The second arm is of a plate-like shape, extends from the base in the first direction, is spaced apart from the first arm in a second direction crossing the first direction, and has a larger dimension in the first direction than that of the first arm. The first contact portion is of a plate-like shape and extends from the first arm to one side of the second direction. The second contact portion is of a plate-like shape and extends from the second arm to the one side of the second direction so as to be located on one side of the first direction of the first contact portion.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: May 17, 2016
    Inventors: Daisuke Sasaki, Takayuki Nagata, Yasuo Nakai
  • Patent number: 9293865
    Abstract: A multiple connector socket is able to interface to a low bandwidth connector and a high bandwidth connector. The low bandwidth connector facilitates a low bandwidth interface, such as USB 2.0, using a miniaturized connector having low bandwidth blade contacts, such as a micro USB 2.0 connector. The high bandwidth connector interposes high bandwidth blade contacts between the low bandwidth blade contacts for facilitating a high bandwidth interface, such as components of a DisplayPort interface. The high bandwidth blade contacts incorporate apertures to reduce electromagnetic coupling with the low bandwidth blade contacts. In one implementation, apertures are not required on the low bandwidth blade contacts.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: March 22, 2016
    Assignee: BlackBerry Limited
    Inventor: Sheldon Terry Schwandt
  • Patent number: 9281268
    Abstract: A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: March 8, 2016
    Inventors: Eugene M. Chow, John E. Cunningham, James G. Mitchell, Ivan Shubin
  • Patent number: 9269686
    Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: February 23, 2016
    Assignee: Intel Corporation
    Inventors: Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan, Tatyana T. Adryushchenko, Guanghai Xu
  • Patent number: 9265155
    Abstract: A rework device in form of a flexible circuit is provided in order to repair a printed circuit assembly. The printed circuit assembly includes one or more through vias and interconnections. The flexible circuit includes a lead in portion and a tail portion. The flexible circuit also includes a first distended head portion proximal to the lead in portion and a second distended head portion proximal to the tail portion. Further, the second distended head portion is connected to the first distended head portion through a coverlay portion. The flexible circuit provided is adapted to be threaded through a through via to repair the printed circuit assembly.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 16, 2016
    Inventors: Gerald K Bartley, David J Braun, John R Dangler, Matthew S Doyle, Thomas D Kidd
  • Patent number: 9169567
    Abstract: A components comprising a plurality of tab members formed thereon are provided. The plurality of tab members include at least one dissimilar metallic layer applied to the component. The plurality of tab members are configured to extend away from or retract toward a surface of the component in response to a temperature change.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: October 27, 2015
    Assignee: General Electric Company
    Inventors: Rebecca Evelyn Hefner, Paul Stephen Dimascio
  • Patent number: 9112325
    Abstract: A contact configuration for producing an electrical connection between a plug and a socket, preferably for connecting an electrode to an electronic implantable device (such as a pacemaker), has a contact section on the plug and/or the socket. The contact section includes metallic conductive fibers which project between the plug and socket when the socket receives the plug. The contact configuration has a high degree of redundancy in providing electrical communication between the socket and plug, and high contact stability under mechanical load. In addition, friction corrosion is avoided.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: August 18, 2015
    Inventor: Ronald Rebentisch
  • Publication number: 20150147911
    Abstract: A panel mount connector and method involve a connector shell assembly that is configured to be received in an opening that is defined by a panel with the connector shell defining a through passage. A flexible circuit board is supported within the through passage and defines a first external connection interface at one end for external electrical access from one side of the panel when the connector shell assembly is installed in the panel and at least the first external connection interface is supported for independent movement relative to the connector shell.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Inventors: Ronald T. Logan, JR., Sean Zargari, Mehrdad Ghara, Huan Do
  • Publication number: 20150147910
    Abstract: An electrical connector include a movable hold down member that is configured to receive a fastener so as to secure the electrical connector to an underlying substrate to which the electrical connector is mounted.
    Type: Application
    Filed: November 19, 2014
    Publication date: May 28, 2015
    Inventors: Douglas M. Johnescu, Gregory A. Hull
  • Publication number: 20150137849
    Abstract: A probe card includes a first insulation layer, a contact terminal arranged on the first insulation layer, and a wiring pattern arranged on an upper surface of the first insulation layer. The wiring pattern includes a rewire connected to the contact terminal and a first pad connected to the rewire. The probe card further includes a wiring substrate. The wiring substrate includes an interlayer insulation layer, a wiring layer, and a cavity defined in central portions of the interlayer insulation layer and the wiring layer. The wiring substrate is spaced apart from the first insulation layer arranged in the cavity. The cavity is filled with a second insulation layer. A conductive wire is arranged in the second insulation layer to electrically connect the first contact terminal and the wiring layer. The second insulation layer has a lower elasticity than the interlayer insulation layer.
    Type: Application
    Filed: October 16, 2014
    Publication date: May 21, 2015
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake
  • Publication number: 20150137848
    Abstract: A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 21, 2015
    Inventors: David Walter Lewinnek, Roger Allen Sinsheimer, Luis Antonio Valiente, Craig Anthony DiPalo
  • Patent number: 9032614
    Abstract: One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The electrical bushing includes a holding element to hold the electrical bushing in or on the housing. The conducting element is set-up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The holding element is made, to at least 80% by weight with respect to the holding element, from a material selected from the group consisting of a metal from any of the subgroups IV, V, VI, VIII, IX, and X of the periodic system.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 19, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventor: Heiko Specht
  • Publication number: 20150126074
    Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.
    Type: Application
    Filed: January 12, 2015
    Publication date: May 7, 2015
    Inventors: Shadi Alex AbuGhazaleh, Joseph Edgar Dupuis, Christopher Wayne Gribble, Naved Shah Khan, Douglas Paul O'Connor
  • Patent number: 9021690
    Abstract: A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: May 5, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Myung Sam Kang
  • Patent number: 9011178
    Abstract: A connector which permits the resistance against the deformation of a shield to be increased and a method of manufacturing the connector. The shield is made up of an inner shield member disposed on the inner surface side of the shield and anouter shield member disposed on the outer surface side and, therefore, the strength of the shield can be increased by the double structure of the shield members. As a result of this, the shield is not deformed easily even in the case where an excessive external force is applied to the shield in the vertical direction or in the horizontal direction, for example, in inserting and extracting a mating connector into and out of the shield.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: April 21, 2015
    Assignee: Iriso Electronics Co., Ltd
    Inventors: Kiichi Hori, Yoshihito Ohkuma
  • Patent number: 9003650
    Abstract: A conductive sleeved fastener assembly includes an electrically-conductive fastener having a fastener head and a fastener shank extending from the fastener head and an electrically-conductive fastener sleeve receiving the fastener shank of the fastener and a fastener sleeve flange provided on the fastener sleeve and disposed in direct contact with the fastener head of the fastener. A method of preparing a conductive sleeved fastener for use is also disclosed.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: April 14, 2015
    Assignee: The Boeing Company
    Inventors: Thu A Nguyen, Michael G Parent, Russell Joe Heeter, Jeffrey A Wilkerson
  • Publication number: 20150099398
    Abstract: A female connector for electrical connection to an edge connector, the edge connector being of predetermined width, the female connector comprising: two parallel outer segments, at least one of the outer segments comprising electrical connections for the edge connector located on an inwardly facing surface thereof; and a spacer spacing the outer segments apart by approximately the edge connector width, the outer segments extending forward of the spacer to fit over corresponding electrical connections on either side of the edge connector to provide electrical connection.
    Type: Application
    Filed: October 7, 2013
    Publication date: April 9, 2015
    Inventor: Eli BENOLIEL
  • Publication number: 20150098193
    Abstract: A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.
    Type: Application
    Filed: February 1, 2013
    Publication date: April 9, 2015
    Inventors: Josef Loibl, Herbert Wallner, Roland Friedl
  • Patent number: 8997320
    Abstract: Provided is a method for manufacturing an acoustic wave device that has an excellent temperature coefficient of frequency (TCF) and high accuracy of IDT pattern forming and is capable of resisting high temperature processing of 200 degrees or more. The method for manufacturing an acoustic wave device according to the present invention includes forming an IDT (2) on a principal surface (1a) of a piezoelectric substrate (1), and forming a film by thermal spraying a material (3) having a smaller linear thermal expansion coefficient than the piezoelectric substrate onto an opposite principal surface (1b) of the piezoelectric substrate (1) where the IDT (2) is formed.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: April 7, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Fuyutsume, Taro Nishino, Hisashi Yamazaki, Noboru Tamura, Nakaba Ichikawa, Masaki Aruga
  • Publication number: 20150094974
    Abstract: A capacitive sensor (20) includes a capacitive sensor field (2), the capacitive sensor field (2) having a plurality of discrete electrodes (4) which are coupled to discrete leads (8). The leads (8) of a first electrode (41) are guided such that they are capacitively coupled with at least one second electrode (42). A first signal (Cm1) is detected at a first lead (8) which is coupled with the first electrode (41), and a second signal (Cm2) is detected at a second lead (8) which is coupled with a second electrode (42). The capacity (Cf1, Cf2) of the first electrode (41) or of the second electrode (42) is determined using a predetermined calculation formula which takes the first signal (Cm1), the second signal (Cm2) and the capacitive coupling between the second electrode (4) and the first lead (8) coupled with the first electrode (41) into account.
    Type: Application
    Filed: April 2, 2013
    Publication date: April 2, 2015
    Inventor: Ulrich Backes
  • Publication number: 20150090588
    Abstract: Method for interfacing an integrated circuit with a biological ion channel, the integrated circuit being at least partially disposed within an electrolytic solution and including an amplifier and one or more electrodes on a surface thereof, includes forming one or more microwells proximate the one or more electrodes, applying a lipid membrane over the integrated circuit proximate the microwells, and placing a further electrode in the electrolytic solution proximate the lipid membrane on a side opposite the integrated circuit. A biological ion channel interface is also provided.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 2, 2015
    Applicant: The Trustees of Columbia University in the City of New York
    Inventors: Kenneth L. Shepard, Jacob Rosenstein, Siddharth Ramakrishnan, Jared Roseman
  • Publication number: 20150079832
    Abstract: An LGA socket suitable for electro-optical modules, such as transceivers having channels operable at 25 Gbit/s, or greater. A socket may include a socket body having a bottom side to face a printed circuit board (PCB) and a backstop on a top side to receive a leading edge of a module substrate. The backstop has an overhang to contact a first side of the module substrate when seated into the socket body. The socket further includes a first and a second row of electrical contacts, the first row being more proximate to the backstop than is the second row. Contacts extend through the socket body between the top and bottom sides and are positioned relative to the overhang to be compressed against contact pads on a second side of the module substrate by a torque applied to the module substrate about a fulcrum within the socket body.
    Type: Application
    Filed: September 13, 2013
    Publication date: March 19, 2015
    Inventor: Glen Gordon
  • Publication number: 20150077650
    Abstract: A touch screen includes a plurality of first transparent electrodes extending in a first direction and a plurality of second transparent electrodes extending in a second direction intersecting the first direction disposed on the substrate; first conductive layers located on at least one side of the first transparent electrodes and connected in parallel with the first transparent electrodes; and/or second conductive layers located on at least one side of the second transparent electrodes and connected in parallel with the second transparent electrodes; the first conductive layers and the second conductive layers are metal layers or alloy layers. A manufacturing method of the touch screen and a display device having the touch screen are further disclosed.
    Type: Application
    Filed: December 9, 2013
    Publication date: March 19, 2015
    Inventors: Weiyun Huang, Young Yik Ko, Yingying Nan, Minghua Xuan
  • Publication number: 20150077946
    Abstract: A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 19, 2015
  • Publication number: 20150072565
    Abstract: A dual orientation connector having a connector tab with first and second major opposing surfaces and a plurality of electrical contacts carried by the connector tab. A retainer is positioned at an entrance end of the tab and is overmolded on a portion of a carrier. The carrier has a first portion positioned within the tab, a second portion extending through the retainer and a third portion extending out of the retainer at an angle with respect to the longitudinal plane of the tab. The carrier has a plurality of conductors formed thereon and extending from the first portion to the third portion.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 12, 2015
    Applicant: APPLE INC.
    Inventors: Albert J. Golko, Warren Z. Jones, Ibuki Kamei
  • Patent number: 8973260
    Abstract: A method of forming nanotube contact structures may include forming an interconnect layer over a portion of a layer of a microelectronics device and forming a nanotube layer over a portion of the interconnect layer. The nanotube layer may define openings through the nanotube layer. The method also may include forming self-aligned electrodes in the openings of the nanotube layer such that the self-aligned electrodes are formed only in openings in the nanotube layer that substantially reside over metal filled vias of the microelectronics device. In some examples, the self-aligned electrodes may be formed on the metal in the vias, and the self-aligned electrodes may not be formed in openings that do not reside over the metal filled vias.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: March 10, 2015
    Assignee: Honeywell International Inc.
    Inventor: Thomas Keyser