Abstract: An implantable electronic device includes a flexible circuit board, one or more circuit components attached to the flexible circuit board and configured to convert electrical energy into electrical pulses, and one or more electrodes attached to the flexible circuit board without cables connecting the electrodes to each other or to the flexible circuit board, the one or more electrodes configured to apply the electrical pulses to a tissue adjacent the implantable electronic device.

Abstract: A method to remove slugs from a circuitry pattern on the fly during the fabrication of a flexible printed circuit, the method includes applying a coverlay reel-to-reel onto one side of the metal foil on the fly and applying a sacrificial liner reel-to-reel onto another side of the metal foil on the fly. Then, after the slugs and circuitry patterns are created from laser ablation, the slug can be removed by applying compressed air to the slugs and/or peeling off the sacrificial liner from the circuitry pattern reel-to-reel.

Abstract: A shield connector includes a braided conductor through which an electric wire is inserted; a shield shell formed in a tubular shape that has conductivity; and a ring formed in a tubular shape in which a pressing surface that faces the shield shell in an axial direction of the shield shell is formed on an inner surface side over an entire periphery. The pressing surface is inclined in a direction intersecting with the axial direction on a section in the axial direction. The ring is fixed to the shield shell while maintaining a state in which the pressing surface presses the braided conductor against the shield shell in the axial direction over the entire periphery.

Abstract: A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).

Abstract: It is aimed to make connectors accommodating wires conductive to each other without using terminals. Connectors each including wires (2) formed with core exposed portions (2B) by removing parts of coatings (2A) and a connector housing (1) for accommodating the wires (2) while exposing the core exposed portions (2B) in an opening (4) are stacked with the openings (4) facing each other. An operation hole (5) is formed on a side opposite to the opening (4) in the both connector housings (1). Electrodes (9) of a welding machine are inserted through the both operation holes (5) and the core exposed portions (2B) corresponding in a stacking direction are welded to each other. In this way, the wires (2) can be directly connected between the both connectors without using terminals.

Abstract: Stacked dies (110) are encapsulated in an interposer's cavity (304) by multiple encapsulant layers (524) formed of moldable material. Conductive paths (520, 623) connect the dies to the cavity's bottom all (304B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole (514) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.

Abstract: A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 ?m to 300 ?m, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.

Abstract: Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.

Abstract: In order to avoid cost for accommodating a shield wire in a housing while bending, and smoothly and readily accommodate within the housing while the shield electric wire is insulated, a conductive housing 1 including a rear wall 4 continuing to an annular wall 3, and a tube wall 5 continuing to down the rear wall 4, a method comprising the steps of: passing through a shield electric wire 2 from a lower opening 5a of the tube wall of the conductive housing to a front opening 3a of the annular wall while bending the shield electric wire; putting a shield terminal 9 movably around the shield electric wire from top of the shield electric wire; exposing a core wire 2b and a braid 2a of the shield electric wire by stripping a tip thereof; connecting an L-shaped terminal 11 to the core wire; mounting an L-shaped insulation inner housing 12 outside the L-shaped terminal; connecting the shield terminal to the braid; and accommodating a vertical part 14 of the inner housing within the conductive housing by pulling in t

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.

Abstract: An apparatus having a connector housing having an interior socket to receive a connector plug. The connector housing including a mounting hole through the interior socket, the mounting hole comprising a top opening in a first side of the interior socket and a bottom opening in a second side of the interior socket, the first side opposite the second side. A central axis of the mounting hole is oriented perpendicular to a central axis of the interior socket and the central axis of the mounting hole intersects the central axis of the interior socket, the mounting hole to allow a mounting element to pass through the interior socket along the central axis of the mounting hole.

Abstract: A method is provided for mounting a plurality of cable connectors onto a panel that defines a plurality of target mounting locations. At least two of the plurality of cable connectors defines at least a pair of cable retaining apertures. The pairs of cable retaining apertures of a first one of the two cable connectors are spaced apart in a first direction, and the pair of cable retaining apertures of a second one of the two cable connectors are spaced apart in a second direction that is different than the first direction.

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

Abstract: A method is provided for assembling a connector assembly to a case. The case includes an inside surface defining an inside of the case, an outside surface defining an outside of the case, and an aperture therethrough providing communication from the inside surface to the outside surface. The connector assembly includes an outer connector having a body with a passage therethrough, an electromagnetic shield, and an inner connector with a terminal therein with a conductor extending from the inner connector in electrical communication with the terminal. The method includes positioning the outer connector on the outside of the case to align the passage of the outer connector with the aperture of the case. The method also includes positioning the inner connector on the inside of the case. The method also includes inserting the inner connector into the passage of the outer connector from the inside of the case.

Abstract: Methods and structures for controlling wafer curvature during fabrication of integrated circuits caused by stressed films. The methods include controlling the conductor density of wiring levels, adding compensating stressed film layers and disturbing the continuity of stress films with the immediately lower layer. The structure includes integrated circuits having compensating stressed film layers.

Abstract: Apparatus for bleeding electrical charge and methods for installing a ground stud in a composite structure. The apparatus includes a ground stud and a composite structure including a hole. In one embodiment the ground stud engages the hole in the composite structure in a transition fit. In another embodiment the ground stud is countersunk within the composite structure. Embodiments of the present methods include drilling a hole in the composite structure; inserting the ground stud into the hole such that the ground stud is in electrical contact with conductive fibers within the composite structure; securing the ground stud to the composite structure; and attaching a connective device to the ground stud such that the connective device is in electrical contact with the ground stud. In some embodiments the ground stud and the composite structure engage one another in a transition fit.

Abstract: An electrical connector electrically for connecting a chip module having a contacting surface to a printed circuit board includes an insulative housing, a number of terminals received therein and a number of shielding plates received in the insulative housing and located around the terminals. The insulative housing is insert molded with the shielding plates and the terminals and includes a plurality of through slots. The terminals are formed by separated from the shielding plates by the through slot.

Abstract: A method of making a stimulation lead includes attaching multiple segmented electrodes to a carrier. Each of the segmented electrodes has a curved form extending over an arc in the range of 10 to 345 degrees. The method further includes attaching conductors to the segmented electrodes; forming the carrier into a cylinder with segmented electrodes disposed within the cylinder; molding a lead body around the segmented electrodes disposed on the carrier; and removing at least a portion of the carrier to separate the segmented electrodes.

Abstract: Electrical resistance between a male part and a female part through a canted spring is disclosed using mathematical modeling. Increase or decrease in resistance can be quickly analyzed by looking at the equivalence resistance and the number of contacts at the input side, the output side, or both. The number of contacts may also be created by forming a dimple having a discontinuity.

Abstract: Methods for generating tracing information for gas cylinders are provided comprising a metal cylinder body manufactured from an unrefined metal piece, wherein such a method comprises the steps of equipping the metal piece with an individual marking, identifying, during at least one transformation or control step of the piece, an identification code of the piece by reading the individual marking and associating one or more process parameters of the transformation step or control results with the identification code, and storing the process parameters and the association with the identification code in a database. Systems for generating tracing information for gas cylinders are also provided.

Abstract: A method for fabricating a compliant membrane probe for communication with an integrated circuit includes installing an array of conductive structures within a flexible membrane, the conductors comprising a beam structure having a first end and a second end, with each one of the conductors further comprising a probe tip extending from the first end, the probe tip having a throat generally surrounded by material of the flexible membrane and a head at an end of the throat such that the head is disposed at an opposite side of the flexible membrane with respect to the beam structure; and configuring the second end of the beam structure so as to be supported by a first end of the beam structure of an adjacent conductor thereto.

Abstract: A method of manufacturing an electronic component, which includes arranging a plurality of first electrode pads on a first substrate, and a plurality of second electrode pads on a second substrate, so that the first and second electrode pads correspond to each other. The method further includes forming a plurality of solder bumps on the second electrode pads and putting the first substrate over the second substrate. The first and second substrates are shifted in parallel to each other, in a horizontal direction, while the solder bumps are melting, so that the solder bumps are stretched in a slant direction to cause the solder bumps to be solidified into hourglass-shapes.

Abstract: A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.

Abstract: A method for hermetically sealing electronic circuitry within a housing of an implantable medical device is provided. The method comprises assembling the housing having an interior cavity, joining a feed-through assembly to the housing, and joining a back-fill member to the feed-through housing. The back fill member has an opening there through communicating with the interior cavity of the housing. The housing is back-filled with an inert gas through the opening in the back-fill member, and the interior cavity is hermetically sealed by closing the opening through the back-fill member with a sealing element. The sealing element and back-fill member are formed of different first and second materials, respectively.

Abstract: The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.

Abstract: A package manufacturing method capable of easily manufacturing a penetration electrode-attached base board having excellent shape accuracy with a high degree of flatness without forming cracks or the like is provided. The package manufacturing method includes an insertion hole forming step of forming insertion holes in one surface of a base board wafer so as not to penetrate through the base board wafer; a core portion insertion step of inserting conductive core portions made of a metal material into the insertion holes; a welding step of heating the base board wafer to a temperature higher than the softening point of the glass material so as to weld the base board wafer to the core portions while holding the one surface side of the base board wafer with a receiving mold and pressing the other surface of the base board wafer with a flat pressurizing mold; a cooling step of cooling the base board wafer; and a polishing step of polishing both surfaces of the base board wafer.

Abstract: The present invention discloses a method for generating nano patterns upon material surfaces. The method for generating nano patterns upon material surfaces comprises the following steps: providing a thin film capable of controlling lattice directions, applying a nanoindentation action to the thin film to generate an indentation at a specific position on the thin film. At least one hillock is then generated in a specific direction to generate a pattern and to be applied to a data storage system.

Abstract: Twist pin z-axis interconnectors are assembled in columns of aligned vias in stacked printed circuit boards of a circuit module in automated assembly cycles. Each assembly cycle involves singulating a single twist pin from a plurality of twist pins, inserting the twist pin into the via column, gripping a leader portion of the twist pin, pulling the gripped leader portion until a connection portion moves into contact with the vias of the column, severing the leader portion from the connection portion, extracting the severed leader portion, and automatically repeating assembly cycles until interconnectors have been assembled into a substantial majority of the via columns of the circuit module.

Abstract: A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 92° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. A plurality of slots are formed in the sidewall of said interposer for the venting of gases and pressure therethrough.

Abstract: Formation of an assemblage of electrically conductive components for a new electrosurgical pencil is disclosed, and assembly of those components in a method for automating the manufacture and combination of current carrying metal circuitry and operable switching components in “electrosurgical pencils” which supply current to an active terminal, for application of high frequency or high power electrical current to a surgical site, and control of such current through coaction of the elements of the switch. In manufacture, the design of the switch components allows start-to-finish automated assembly of the switch, whereby an array of identical multiple metal “frames” may be formed from a reel, then each frame separated and enclosed within molded plastic, and the resulting cabinet joined with a housing to create an inexpensive hand piece, for use with a high quality, reusable cable and plug assembly.

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and mounting at least one interposer on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. At least one sidewall of the interposer is slitted to facilitate the venting of gases and pressure therethrough. The method includes arranging a plurality of electrically-conductive elements about the surface of the at least one hemi-toroidal interposer and extending them radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract: The invention relates to a method for adapting an electronic component with leads that are not suited to surface mounting on an electrical circuit. The method includes a step of bending said leads. The bending step shapes the leads of said component so that they are suitable for mounting on the surface of the electrical circuit. In particular, the invention applies to electronic components such as radio frequency and microwave power transistors, marketed notably in a straight-lead version.

Abstract: The invention provides a process for preparing a heatsink system for a heat generating electronic device, comprising the steps of: (a) providing a heat conducting substrate; (b) applying an insulating layer on the heat conducting substrate; and (c) applying a printed circuit on the isolating layer by means of a hot embossing system. The invention further provides a heatsink system obtainable by said process, comprising a heat conducting substrate, an insulating layer that is applied on the heat conducting substrate, and a printed circuit that is applied on the insulating layer, wherein the thickness of the part of the insulating layer which is arranged between the heat conducting substrate and the printed circuit is between 1 and 100 micron.

Abstract: The invention relates to a method for applying a connection material with a specified shape on at least one surface of at least one workpiece, wherein the connection material and the surface have complementary wetting or wettable properties, and wherein the connection material (3) is deposited on at least one of the surfaces (2) and a shaping device (10, 10?) is arranged at least for the period of a flowable state of the connection material adjacent to the connection material as well as at least partially surrounding this material on the surface (2), wherein this device has a surface (11, 12) that is non-wettable with respect to the wetting properties of the connection material and that is designed for the forced guidance of the flow of the still flowable connection material in the region of the non-wettable surface that thus assumes a specified shape; and the shaped connection material is hardened.

Abstract: A method for manufacturing anti-EMI shields on computer chassis, the method includes the following steps. The anti-EMI plate is glued to the computer chassis. The anti-EMI plate is pressed onto the plate by a pressing machine, and then the plate is quick dried with the anti-EMI plate by a drying machine. The plate is cut into desired dimension with the anti-EMI plate by a cutting machine, and the plate is stamped into desired shape with the anti-EMI plate by a stamping machine.

Abstract: A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.

Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

Abstract: A terminal joining structure includes a terminal having a tubular barrel portion and a flange portion that is integrally formed at the axis-direction end of the barrel portion, a conductor substrate on which is opened a through-hole for inserting the barrel portion, and a ring that fits on the barrel portion on the opposite side of the conductor substrate. On the barrel portion is formed a taper that increases in diameter toward the flange portion. The diameter of the larger-diameter portion of the taper is larger than the inner diameter of the through-hole. The terminal is caulked to cause radially outward expansion of an end part of the barrel portion, which passes through the ring, on the opposite side of the conductor substrate and is fixed to the conductor substrate together with the ring.

Abstract: A short-circuiting member for preventing a commutator from being elongated in the axial direction without increasing the types of different components. Each component includes outer circumference terminals arranged along an outer circumference, inner circumference terminals arranged along an inner circumference, and connection portions connecting corresponding outer and inner circumference terminals that are separated from each other by a predetermined angle in a circumferential direction. The outer and inner circumference terminals are substantially formed along the same plane. The components are laminated in a state in which the connection portions of one of the components are reversed to the connection portions of another one of the components.

Abstract: This is directed to a power adapter plug arm manufactured from a single piece of material. The plug arm can include a plug operative to extend into a wall socket, an elongated plate coupled to an end of the plug such that the plug extends from a first surface of one end of the plate, and a pin coupled to the opposite end of the plate and extending from the opposite surface of the plate. The pin can be operative to engage a circuit board of the power adapter to provide power received from the wall socket to an electronic device coupled to the power adapter. To enhance the strength of the plug arm, the plate can be manufactured by creating a co-axial plug and a stem from a single piece of material, bending the stem, and cold heading the bent portion of the stem to form a plate. Because the cold heading process involves cold working the material, the arm and in particular the bridge member at the interface between the plate and the stem can become stronger as a result of the manufacturing process.

Abstract: Twist pin z-axis interconnectors are assembled in columns of aligned vias in stacked printed circuit boards of a circuit module in automated assembly cycles. Each assembly cycle involves singulating a single twist pin from a plurality of twist pins, inserting the twist pin into the via column, gripping a leader portion of the twist pin, pulling the gripped leader portion until a connection portion moves into contact with the vias of the column, severing the leader portion from the connection portion, extracting the severed leader portion, and automatically repeating assembly cycles until interconnectors have been assembled into a substantial majority of the via columns of the circuit module.

Abstract: A method of producing a land grid array (LGA) interposer structure includes mounting at least one interposer on a first surface of an electrically insulating carrier plane. The interposer selectively having a hemi-toroidal, conical, dome-shaped conic section, generally cylindrical or hemi-spherical configuration in transverse cross-section and being constituted of a dielectric elastomeric material. The method includes positioning a plurality of electrically-conductive elements about the surface of the hemi-toroidal interposer that extend radially inwardly and downwardly from an uppermost end thereof. The method further includes mounting said at least one component comprising at least one hemi-toroidal interposer mounted on said opposite side of said carrier plane.

Abstract: A method of making a self-supporting field director structure for use in heating an article in a microwave oven comprises in any operative order, the steps of folding a first and a second elongated vane blank along a central fold line to form at least two V-shaped vane doublets; inserting each of the vane doublets into a slotted annular support member so that each vane in each vane doublet extends through an adjacent slot in the annular support member; and attaching the vane doublets at their vertices to define a vane array.

Abstract: A contact element for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connected to each other by a separating area, such that a one-piece semi-finished part is embodied.

Abstract: An improved vacuum interrupter is made. The vacuum interrupter includes a ring-shaped structure placed between a contact support structure and an electrical contact associated with the contact support structure. A resistivity of the ring-shaped structure is higher than that of the contact support structure, so that current traversing the ring-shaped structure on its way from the contact support structure to the electrical contact is evenly distributed. The ring-shaped structure may be fit into an end portion of the contact support structure, the end portion having a diameter less than an outer diameter of the support structure, but greater than an inner diameter of the support structure. Alternatively, the end portion may be used without the ring-shaped portion, in which case the electrical contact may be shaped to fit into the end portion.

Abstract: The method for providing the solder connection of the present invention is a method for providing a solder connection, which electrically connects a first electronic component having a solder bump to a second electronic component having a protruded electrode to provide electrical connection between the first solder bump and the protruded electrode, wherein a relation of: A+B>C is satisfied, where a height of the first solder bump from one surface of the first electronic component is presented as A [?m], a height of the protruded electrode before the compressive deformation from one surface of the second electronic component is presented as B [?m], and a thickness of the adhesive agent layer is presented as C [?m], and further comprising: disposing the adhesive agent layer in the first electronic component; and deforming the first solder bump and the protruded electrode and providing a contact of the above-described protruded electrode with the above-described first solder bump, so that the sum of the heigh

Abstract: A sheet metal member has a first through hole formed at such a position as to be in communication with a screw hole formed in a side surface of a panel, and is fixed to the panel by being screwed using the first through hole and the screw hole. The sheet metal member further has hole a bending piece in which a second penetration is formed and on which a bending processing is performed at such an overlapping position that the second through hole overlaps with the first through hole, and is screwed to the panel in either of, according to a type of the panel, an open state in which the bending processing has not yet been performed on the bending piece or a bent state in which the bending processing has been performed on the bending piece at the overlapping position.