Abstract: A method of forming a bump on a substrate such as a semiconductor wafer or flip chip. The method includes the act of providing a semiconductor device having a contact pad and having an upper passivation layer and an opening formed in the upper passivation layer exposing a portion of the contact pad. An under bump metallurgy is deposited over the upper passivation layer and the contact pad. An electrically conductive redistribution trace is deposited over the under bump metallurgy. A photoresist layer is deposited, patterned and developed to provide portions selectively protecting the electrically conductive redistribution trace and the under bump metallurgy. Excess portions of the electrically conductive redistribution trace and under bump metallurgy not protected by the photoresist are removed.

Abstract: Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

Abstract: An electric connector and IC tin ball shaping and fixing manufacturing method is used in welding portions of terminals of one of an electric connector, IC and other electronic elements. A tin film is covered on a bottom of the ball grid array seat; wherein the tin film is formed by connecting a plurality of round small tin pieces with respect to the terminals, and a periphery of the small tin pieces being enclosed by slender connecting portions the ball grid array seat is melt so that the small tin pieces of the tin film weld as tin liquid, then the slender connecting portions will break and the small tin pieces are connected as a tin ball; thereby, the liquid tin ball will enclose the welding portion of the terminal. Finally the tin balls is cooled and condensed and then combined to the welding portions of the terminals.

Abstract: A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Abstract: A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal includes forming a contact through-hole in the terminal, and inserting the contact into the contact through-hole. Next, a crushing punch plastically deforms a portion of the upper surface of the terminal adjacent the contact through-hole so that the terminal is connected to the contact.

Abstract: A method of connecting a terminal to a conductor comprises the steps of mating the terminal with the conductor through a thin stud of the terminal projecting from a base of the termina, giving ultrasonic vibration to the base of the terminal and the conductor to join the terminal and the conductor laminate at mating portion. The method further comprises the step of crushing a portion of the stud projecting above the conductor by giving a pressure without the ultrasonic vibration to the portion of the stud, thus to caulk the terminal to the conductor.

Abstract: A manufacturing method of a printed wiring board. On a conductor plate 1, approximately conical conductor bumps 1a, 1a, . . . are formed, the conductor bumps 1a, 1a, . . . being caused to penetrate through a prepreg 5 to project tip ends of the conductor bumps 1a, 1a, . . . from an opposite side of the prepreg 5. The tip ends of the conductor bumps 1a, 1a, . . . and interconnection patterns 7a and 7b on surfaces of core material 17A, before bonding, are exposed to plasma to activate. The activated tip ends of the conductor bump 1a, 1a, . . . and interconnection patterns 7a and 7b on the surface of the core material are stacked to bond both.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades are disclosed. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices. The wafer saw may also be used to simultaneously sever and electrically isolate conductive traces that extend over adjacent semiconductor devices from connective lines therefor.

Abstract: An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.

Abstract: A pin standing resin substrate comprises: a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface; and a pin solder-jointed to the pin-pad, wherein the pin has been subjected to thermal treatment so as to soften the pin, and comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, and at least the enlarged diameter portion is soldered to the pin-pad.

Abstract: A method of manufacturing a winding of a rotary electric machine includes steps of pressing a portion of a conductor segment in a predetermined direction to reduce its dimension in the direction, inserting the conductor segment into a slot of a stator core, bending the conductor segments and joining ends of the conductor segments. In the pressing step, the conductor segment is pressed with a punch in a condition that it is held in a die that has curved inside corner portions to restrict deformation of corners of the pressed portion.

Abstract: A method of manufacturing a flat antenna is composed of the steps of entirely applying Ni plating to the front and back surfaces of a long metal sheet, bonding masking tapes to the front surface of the metal sheet where the Ni plating has been applied except two stripe regions, applying Au plating to the two stripe regions by dipping the metal sheet into an Au plating solution, making a plurality of conductive flat sheets by punching the metal sheet to a plurality of regions along the lengthwise direction thereof after exfoliating the masking tapes, and bending the portions of each conductive flat sheet acting as a power feed terminal and a ground terminal. The metal sheet can be simply masked by bonding a plurality of the masking tapes thereto linearly except the regions where the plating is to be applied, thereby the productivity of the flat antenna can be increased.

Abstract: The present invention relates to a workpiece implementation device that fabricates individual workpieces, positions them at their point of use on a component, and connects the workpieces to the components. The device further comprises an accessory assembly capable of shaping the workpieces, coating the workpieces with a solderable material, burnishing the point of use on the component, and testing the connection between the workpieces and the component. The positioning, attaching, and accessory assemblies of the workpiece implementation device are adapted to selectively perform their individual functions without the necessity of first repositioning the component or the implementation device. Accordingly, the present invention increases overall production efficiency by integrating several separate implementation tools and workstations into a single, adaptable device.

Abstract: A method of connecting a flat cable and a terminal, comprising a sticking step in which cramp pieces (13b˜13d) are stuck through a flat cable (10) to be received in corresponding cavities (15b, 15c) that are provided to allow the cramp pieces to maintain their shapes, and a cramping step in which the cramp pieces that have been stuck through the flat cable are bent and thereby cramped to the flat cable.

Abstract: So as to obtain a pin-form wire having a stable high-quality shape without being affected by the back tension in a bonding wire, a capillary of the bonding apparatus, with the formed pin-form wire inside the capillary, is move along a curved path has a shape of a bent wire to be formed after forming the pin-form wire by a wire bonding apparatus.

Abstract: A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.

Abstract: An electrical connector crimping die comprises a first section for removably connecting the die to an electrical connector compression tool. A second section of the die, which is connected to the first section, is provided for crimping a connector. The second section comprises a generally concave crimp projection of a given height which defines a primary crimp surface and at least one concave shaped secondary pre-crimp surface. The secondary pre-crimp surface is recessed relative to the primary crimp surface by the given height. The primary crimp surface and the secondary pre-crimp surface are arranged relative to the first section so that a major portion of a crimping force applied by the compression tool to the crimping die is applied to the primary crimp surface to crimp a first portion of the connector and so that a minor portion of the crimping force is applied to the secondary pre-crimp surface to pre-crimp a second portion of the connector. A hydraulic crimping tool employs such a crimping die.

Abstract: A method for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing &mgr;BGA·IC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead is disclosed. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. The center line of the inner lead is recognized, the inner lead is pushed to the chip in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

Abstract: A method of mounting a banana-type electrical receptacle on the substrate includes the steps of placing the electrical receptacle over an aperture formed in the substrate with support ribs formed on the outer surface of the receptacle supporting the receptacle over the aperture. A deformable electrical lead extends from a centrally disposed conductive member making an electrical connection with an electrical contact on the substrate. The electrical lead is affixed to the electrical contact on the substrate and the receptacle is inserted into the aperture crushing or shearing the support ribs and the deforming the electrical lead. Alignment ribs formed on the outer surface of the receptacle have shoulders that contact the substrate for positioning the receptacle in the substrate. The mounting method is compatible with automated soldering processes, such as wave flow soldering.

Abstract: Ultra-miniature electrical contacts are provided with the strength and resilience necessary to give stable low resistance connection, to minute areas of a device, such as a thousand or so closely spaced surface pads of an integrated circuit. Each contact is initially formed on a substrate as a thin, narrow elongated flat body comprised of selectively deposited layers of metal. Depending on the final configuration desired for the contact, the metal of one metal layer has a coefficient of thermal expansion such as chromium (Cr), and the metal of another layer has a coefficient of thermal expansion such as copper (Cu). Each contact is permanently formed (by differential expansion of the metal layers when heated) into a three-dimensional structure and is then made “robust” by a covering of a specialized stiffening metal plating which adds substantial strength to the contact.

Abstract: A printed circuit board and a pad apparatus having a solder deposit formed on the pad apparatus by using a mask having a slit are provided. The slit has the same shape as the solder deposit. The solder deposit includes first and second end portions individually shaped and sized to completely cover at an end portion of the pad a predetermined area of an end portion of the pad, the area defined by both the entire width of the pad and a predetermined length from the end of the pad. A connection web extends between the two end portions to integrate the two end portions into a single structure and is a longitudinal part having a width smaller than any one of both the width of the pad and the width of each of the two end portions. First and second trapezoidal portions are respectively formed at junctions between opposite ends of said connection web and one of the two end portions. The mask has a slit formed at a position corresponding to the position of the solder deposit.

Abstract: In order to connect contact surfaces of electric component blanks for layer resistors to at least two elongated, metallic connection leads, elongated, slot-shaped openings are made, e.g., by etching, in a continuous metal sheet to manufacture a connection lead blank. The openings border on later connection leads of the connection blank and cross-struts yet to be removed. In a second step, the connection lead blank is brought into a cassette and seized, whereby one of the cross-struts projects out of the cassette and is separated in a third step, such that the free ends of the parallel-running connection leads project out of the cassette. In a fourth step, the cassette is brought into a bonding or welding device, so that the free ends of the connection leads cover the contact surfaces of a component blank or a multi-component blank and are connected together by a bonding or welding operation. In case a multi-component blank (multi-unit plate) is used, it is then separated into individual components.

Abstract: A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the first side of the circuit board; providing a first coupler having a conductive lead portion and a ductile conductive tube portion extending from the conductive lead portion; engaging the conductive lead portion with the solder dispensed upon the first side of the circuit board; heating the circuit board, the solder and the conductive lead portion so that the solder reflows, thereby securing the first coupler to the first side of the circuit board; inserting an extremity of the first conductor into the ductile conductive tube portion; and crimping the ductile conductive tube portion so as to provide crimped retention of the first conductor therein. Circuit boards, devices and systems also are provided.

Abstract: In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller socket holes and, therefore, denser arrays of socket contacts. In one embodiment, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring; no outer shell is needed for the spring, as the non-conductive sides of the socket hole serve that function. In another embodiment, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. In yet another embodiment, semiconductor fabrication techniques are used to construct a dense array of contacts.

Abstract: A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the conductors. The multiconductor flat cable or electrical component comprises a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site.

Abstract: A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping old or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

Abstract: Index head in a semiconductor device test handler for mounting semiconductor device in a test socket at a test site, wherein a force pressing down a semiconductor device is accurately controlled by means of a force transducer fitted to a head holder, a precise temperature control of the semiconductor device is made by direct heat transfer to a picked up semiconductor device from an electric heater fitted to the head, and a smooth alignment is made by a compliance part even if there is an alignment error between the index head and/or the test socket, thereby permitting a faster operation of the index head.

Abstract: Press contact terminals are held in terminal housing chambers of a housing body. A longitudinally intermediate part of a flat circuit is positioned above a top surface opening of the terminal housing chambers. Each conductor of the flat circuit is press-connected to each press contact terminal with a press contact jig. A cover is closed, thereby to fold the flat circuit in two in the vicinity of the press-connected part so that one part is overlaid on the press-connected part. The folded part is sandwiched between the cover and the housing body to be held in a connector housing.

Abstract: A first connector is accommodated in a connector housing, with a first connection member lying down relative to the first terminal. The first connection member is raised relative to the first terminal. The first connector and a second connector are stacked to be connected each other.

Abstract: A printed circuit board with at least one component part as a measuring resistor, heat resistor or measuring electrode arrangement has at least two contact pads connected with conductor paths for electrical and mechanically fast connection with lead ends of a jacketed connection cable stripped of their insulation, wherein the cable end with its outer jacket is positionable in a mounting element arranged immovably in relation to the printed circuit board at a distance from the contact pad of the conductor path. In a preferred embodiment, the mounting element has channel-shaped recesses for clamp fastening of the lead jacket, which is arranged with its lead exit area adjacent to a respective contact pad of the printed circuit board.

Abstract: A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.

Abstract: A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.

Abstract: A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.

Abstract: A method of connecting a terminal to a conductor comprises the steps of mating the terminal with the conductor through a thin stud of the terminal projecting from a base of the termina, giving ultrasonic vibration to the base of the terminal and the conductor to join the terminal and the conductor laminate at mating portion. The method further comprises the step of crushing a portion of the stud projecting above the conductor by giving a pressure without the ultrasonic vibration to the portion of the stud, thus to caulk the terminal to the conductor.

Abstract: A method and an apparatus 10 for interconnecting automotive electrical circuits and components. In one embodiment, the apparatus 10 includes at least one channel 73 formed by an opposing pair of rails 66, and a backplane 20. The backplane includes an “omega-shaped” cavity 38. The assembly further includes a first flexible circuit 16 disposed within the backplane 20, an elastomeric member 22 residing upon the circuit 16, and a card 14 which is movably disposed within the rails 66 and which supports a second flexible circuit 30. The card 14 is movable between a first position which is remote from the cavity 38 and a second position in which portions of the card 14 and the second flexible circuit 30 penetrate the cavity 38, thereby deforming the elastomeric member 22 and securely and electrically connecting the first flexible circuit 16 to the second flexible circuit 30.

Abstract: In order to connect contact surfaces of electric component blanks for layer resistors to at least two elongated, metallic connection leads, elongated, slot-shaped openings are made, e.g., by etching, in a continuous metal sheet to manufacture a connection lead blank. The openings border on later connection leads of the connection blank and cross-struts yet to be removed. In a second step, the connection lead blank is brought into a cassette and seized, whereby one of the cross-struts projects out of the cassette and is separated in a third step, such that the free ends of the parallel-running connection leads project out of the cassette. In a fourth step, the cassette is brought into a bonding or welding device, so that the free ends of the connection leads cover the contact surfaces of a component blank or a multi-component blank and are connected together by a bonding or welding operation. In case a multi-component blank (multi-unit plate) is used, it is then separated into individual components.

Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

Abstract: An interlayer connection structure in a circuit board characterized in that a local part of a conductive circuit layer disposed at one surface side of an insulative sheet is bent inwardly of the insulative sheet so that an apex of a projectingly bent portion is formed, and the apex of the projectingly bent portion is abutted with another conductive circuit layer disposed at the other surface side of the insulative sheet so that an interlayer connection is established therebetween.

Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

Abstract: This invention relates to a system of components to be hybridized including at least one first component (110) with first pads (114a) and with a first coefficient of expansion, and at least one second component (112) with second pads (114b) and with a second coefficient of expansion. According to the invention, at a hybridization temperature Th the pads are approximately superposable, and at an ambient temperature Ta the pads are mutually offset by a distance compensating for the differential expansion of the first and second components.

Abstract: In an integrated circuit, the conducting paths electrically coupling the electronic components can be fabricated to conform to conflicting physical property requirements. After formation of the conducting paths, conducting material can be added to or removed from selected conducting paths. In this manner, the resistance or the capacitance of selected conducting paths can be enhanced relative to the non-selected conducting paths.

Abstract: Electrical pin (10) for solderless insertion into metallized apertures of circuit boards, comprising an elastically deformable press-fit portion (14) with four contact areas (26), which are located on a first larger diameter (28) as compared with the diameter of the apertures of the circuit boards. A positioning portion (18) is provided ahead of the press-fit portion (14) and a transition portion (16) lies therebetween. The positioning portion (18) also has four contact areas (36), which are located on a second diameter (30) slightly smaller than the diameter of the apertures. Contrary to the press-fit portion (14) the positioning portion (18) is not deformed during the insertion of the electrical pin (10). Due to the positioning portion (18) the electrical pins can be connected to the circuit board in two operation steps, the first one being the positioning step and the second one being the press-in step.

Abstract: A device and method provide an easy and inexpensive electrical connection between circuits on both sides of a printed circuit board. A through-hole is formed in the board with conductive copper pads around the periphery of the hole on both sides of the circuit board. A malleable, conductive plug is inserted through the hole and then deformed. The plug has a length and diameter such that when deformed, it completely fills the hole and makes a solid electrical connection with the copper pads on both sides of the circuit board. Circuits on both sides of the circuit board may be electrically connected to each other through the copper pads and deformed plug.

Abstract: A method is provided for manufacturing an electrical connector which includes a dielectric housing having a plurality of side-by-side channels separated by partition walls at one side of the housing. A plurality of terminals are mounted on the housing, with lead portions of the terminals located in the channels. The method includes the steps of seating the lead portions of the terminals into the channels, and forming first or minor portions from the partition walls onto the lead portions to retain the lead portions in the channels. Second or major portions of the partition walls then are formed onto the first or minor portions which are in contact with the lead portions to securely lock the lead portions in the channels. The seating step and the first forming step may be carried out simultaneously.

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance.

Abstract: There is provided a method for arranging conductive bumps at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet being is in a plastic state or up to a temperature not lower than the grass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough.

Abstract: When a semiconductor chip is mounted on a wiring substrate, an end of a metallic wire fed through a capillary is first fused to form a ball, which is in turn pressed against and bonded to an electrode pad formed on a semiconductor chip. The metallic wire is then cut at a location in the proximity of the ball so that a portion of the metallic wire remains as a protruding contact on the ball. The protruding contact is pressed against a shaping platform coated with a paste-like electrically-conductive adhesive film to thereby cause the protruding contact to have a given height and transfer a portion of the adhesive film to the protruding contact. The protruding contact is eventually bonded to an electrically-conductive film formed on the wiring substrate via the transferred portion of the adhesive film.

Abstract: A subminiature circuit protector includes a substrate carrying a metal fuse element hermetically sealed in a glass sleeve cartridge. The fuse element may comprise a film deposited on the substrate, or, alternatively a metal strip or wire. Leads extend from opposing ends of the sleeve for connection in a circuit, and a gas is sealed in the sleeve to provide a suitable environment to improve operating lifetime and interrupting capability. A method for making a circuit protector includes placing a substrate carrying a fuse element in a glass sleeve and placing leads in contact with the fuse element. The assembly is heated in the presence of a gas below atmospheric pressure to a temperature sufficient to soften the glass. The pressure is then increased to cause the ends of the glass sleeve to form a hermetic seal about the leads.

Abstract: A method of installing a printed circuit cable on an actuator arm in a disc drive system is described wherein the flat printed circuit cable is bonded onto a flat bracket to form a PCC assembly. Thereafter, the assembly is shaped to form a shaped PCC assembly which will hold the PCC firmly to the arm, the PCC bracket being shaped into three sections bent substantially into a "U" shape, so that the cable is held firmly against the side of the arm, by one arm of the "U", while the base of the "U" attaches the cable to the arm, and the opposite side arm of the "U" extends the cable out towards its attachment point. The first arm of the "U" also includes an anti-rotation tab which fits into a slot on the actuator arm.

Abstract: A system is provided for distributing power between connectors in a connector raceway. At least two spaced-apart connectors each include a housing and a plurality of terminals mounted on the housing. A plurality of conductive wires have first ends respectively attached to the terminals and extend from each connector in the connector raceway toward the other connector. A printed circuit board is mounted in the connector raceway between the connectors and includes circuit traces thereon. Second ends of the conductive wires are electrically secured to the circuit traces. Therefore, one connector is electrically coupled to the other connector through the circuit board in the connector raceway.