Abstract: A method for manufacturing a network jack is provided. The method includes steps of: a) providing a circuit board having a first side, plural first contacting areas along the first side, plural second contacting areas and an upper and a lower surfaces; (b) forming first bendable contacts on the plural first contacting areas by using a first riveting process; (c) forming second bendable contacts on the plural second contacting areas by using a second riveting process; and (d) bending each of the second bendable contacts by assembling an acting portion on the circuit board to make the second bendable contacts have at least two arranged directions, wherein the first bendable contacts and the second bendable contacts contact with an external plug and are fixed to the circuit board of the network jack by the first and the second riveting processes.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. In comparison with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the parasitic capacitive reactance effect caused by two contact ends of the conventional resistors is also avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and mounting at least one interposer on a first surface of the carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. The method includes arranging a plurality of electrically conductive elements about the surface of the at least one hemi-toroidal interposer and extending radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract: A method of fabricating a conducting crossover structure for a power inductor comprises stamping a first lead frame to define a first terminal and a second terminal; stamping a second lead frame to define a first terminal and a second terminal; and locating an insulating material between and in contact with the first and second lead frames to form a laminate.

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: Formation of an assemblage of electrically conductive components for a new electrosurgical pencil is disclosed, and assembly of those components in a method for automating the manufacture and combination of current carrying metal circuitry and operable switching components in “electrosurgical pencils” which supply current to an active terminal, for application of high frequency or high power electrical current to a surgical site, and control of such current through coaction of the elements of the switch. In manufacture, the design of the switch components allows start-to-finish automated assembly of the switch, in an industry which knows only partially automated assembly, and partial assembly by hand, to create an improved tool for surgical cutting, coagulation, and cauterizing.

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: A method of making a relay includes: preparing a relay core member; coupling first, second and third terminals to the relay core member by moving the same horizontally relative to the relay core member such that terminal portions of the first, second and third terminals enter notches formed in the relay core member in a horizontal direction; and enclosing the relay core member, the first terminal, the second terminal, and the third terminal within a housing, and sealing the housing with resin.

Abstract: A method of manufacturing a heater having a heating element, an insulator and a spring is disclosed. The method includes forming a spring from an annealed superalloy material, heat treating the spring after forming, positioning the heating element in contact with the insulator, and biasedly engaging the spring with the insulator to maintain contact between the insulator and the heating element.

Abstract: An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.

Abstract: An implantable lead for a medical device with a coplanar coupling for connecting a conductor to a contact reduces conductor bending moments to improve lead reliability. The implantable lead comprises a lead body having a proximal end and a distal end, at least one conductor, at least one contact carried on the proximal end, at least one contact carried on the distal end, and at least one coupling. The lead body has an exterior surface. The conductor is contained in the lead body and extends from the lead proximal end to the distal end. The conductor is also electrically insulated. The contact carried on the proximal end is electrically connected to the conductor. The coupling has a conductor coupling and a contact coupling. The conductor coupling is placed over the conductor and attached to the conductor. The contact coupling exits the lead body and has a weld to connect the contact coupling to the contact.

Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.

Abstract: A method for fastening two substantially coplanar edges without a weld. The method includes: configuring a dovetail feature on a first edge; configuring a complementary dovetail feature receptacle on a second edge to receive the dovetail feature therein; disposing the dovetail feature within the complementary dovetail receptacle; and swaging an interface defined between the dovetail feature in said first edge and said complementary dovetail feature in the second edge to swage mating edges defining the dovetail feature and the dovetail receptacle at at least six swage contact points.

Abstract: A self-locking wire terminal assembly and a shape memory wire termination system includes an electrical terminal constructed with spring legs which provide two opposing points of contact on a mating electrical conductive pin. The points of contact prevent the pin from being removed. The shape memory termination system is formed by electrically coupling a clip assembly to shape memory wire and to an electrical source. In one embodiment, the shape memory wire causes an actuator to activate when the shape memory wire dissipates electrical power. The terminal assemblies may be manufactured by assembling wire with conduction pads onto a continuous reel. The terminal assemblies may be formed from the reel by trimming wire and linkages between the conduction pads.

Abstract: A method for attaching a fusible member to a flexible circuit board includes providing the flexible circuit board including an electrode and a hole near each other, placing the fusible member in the hole, and deforming the fusible member to fix the fusible member to the flexible circuit board. A flexible circuit board includes an electrode, a hole, and a fusible member fixed to the hole and arranged to establish an electrical connection with the electrode when the fusible member is fused to the electrode.

Abstract: A method for manufacturing an IC-embedded substrate comprises a first step for encapsulating at least an IC chip having a pad electrode in an insulating layer, a second step for forming a metal layer having at least a first aperture in a location directly above the pad electrode of the IC chip and a second aperture in a location above an area other than the area in which the IC chip is mounted, and a third step for selectively removing the insulating layer by a blasting treatment in which the metal layer is used as a mask, whereby forming a first via hole that corresponds to the first aperture and a second via hole that corresponds to the second aperture.

Abstract: A method of manufacturing a segmented electrode assembly. An electrically conducting tube is coupled to an electrically insulating material. The tube is generally cylindrical and hollow and defines one or more gaps at a first axial position. The tube also includes one or more bridges located at a second axial position. The method includes removing at least a portion of the bridge resulting in a segmented electrode assembly having at least one segment. A number embodiments of making a tube are also provided. In another embodiment a method of manufacturing a medical lead using a segmented electrode assembly is provided.

Abstract: An electrode assembly for use in a vacuum interrupter is made by joining a first side of a substantially disk-shaped structure to an end of a substantially cylindrical coil segment, and joining an electrical contact to a second side of the disk-shaped structure. The disk-shaped structure has a higher resistivity than a resistivity of the coil segment.

Abstract: An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape.

Abstract: The invention relates to a method for adapting an electronic component with leads that are not suited to surface mounting on an electrical circuit. The method includes a step of bending said leads. The bending step shapes the leads of said component so that they are suitable for mounting on the surface of the electrical circuit. In particular, the invention applies to electronic components such as radio frequency and microwave power transistors, marketed notably in a straight-lead version.

Abstract: The application discloses processes for fabricating a slider or head for a data storage device. The processes disclosed provide a transducer portion that is separated from a slider body by a gap. In an illustrated embodiment, actuator elements are fabricated in the gap to adjust a position of the transducer portion relative to the slider body.

Abstract: A method and apparatus for aligning components on a module. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located on a sacrificial portion of the flexible circuit to a second alignment structure on the tooling apparatus. The flexible circuit is attached to the module while the flexible circuit is in an aligned position.

Abstract: An apparatus for manufacturing a complete wire harness from a plurality of wire harnesses have a first transferring unit, an inserting unit and a removing unit. The first transferring unit transfers a wire clamping bar, which holds a partial harness having a plurality of electric wires, to a wire-harness fabricating station. The inserting unit inserts terminals disposed at ends of the plurality of electric wires into predetermined terminal accommodating chambers of predetermined connectors set on a connector receiving jig. The removing unit removes the emptied wire clamping bar.

Abstract: There is provided a method of manufacturing a shielded connector which includes: a terminal-attached wire; a housing containing the terminal of the terminal-attached wire; a shielded shell integrated to the housing; a knitted conductor mounted to the wire; and a shield ring interposing the knitted conductor between the shield ring and the shielded shell so that the knitted conductor is electrically connected to the shielded shell. The method includes: inserting, into the shielded shell, a single core having a stepped portion formed in a opposed drawing direction; bringing a contact portion formed at the shielded shell into contact with the core; covering the shield ring on the shielded shell via the knitted conductor; and calking the shield ring, the knitted conductor, and the shielded shell from outer side of the shield ring to form, on the shielded shell, a calk-deformed portion contained into the stepped portion of the core.

Abstract: Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.

Abstract: Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive or solder either before or after releasing the spring contact from the mandrel.

Abstract: An electrical connector contact includes a metal strip, a shear-formed tab extending the strip to a point with a shear-formed rounded edge corners intersecting at the point to form a small double curvature contact tip.

Abstract: Methods of manufacture of interconnection devices that include using a non-forming process to manufacture a plurality of compression contacts, each compression contact including a cantilevered beam portion that is tapered along its length, and disposing each of the plurality of contacts within a respective cavity in a substantially planar carrier housing lying in a plane defined by x and y axes, the housing having an upper surface and a lower surface, each cavity extending between the upper and lower surfaces of the housing substantially along a z axis, each contact being loosely retained within its respective cavity such that an entirety of the contact in a compressed state has at least some freedom of movement along the x and y axes.

Abstract: A method of fabricating a mandrel for electroformation of an orifice plate. An array of mask elements may be created adjacent a substrate. Surface regions of the substrate disposed generally between the mask elements may be removed, to create a base having a base surface and a plurality of pillars extending from the base surface according to the array of mask elements. Each pillar may have a perimeter defined by an orthogonal projection of one of the mask elements onto the substrate. An electrical-conduction enhancer may be deposited adjacent the base surface and terminating at least substantially at the perimeter, to create a conductive layer to support growth of the orifice plate.

Abstract: Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view.

Abstract: A network jack is provided. The network jack includes a circuit board, first contacts, second contacts and an acting portion. The circuit board has a first side, plural first contacting areas arranged along the first side and plural second contacting areas. The plural first contacting areas are between the plural second contacting areas and the first side, and plural distances between the first side and each of the plural second contacting areas are various. The first contacts are mounted on the first contacting areas and the second contacts are mounted on the second contacting areas. The acting portion bends the second contacts.

Abstract: A method of manufacturing a plurality of electrical terminals includes the steps of: providing an electrical terminal manufacturing fixture which includes a main body defining a plurality of stations; loading the fixture with a plurality of metal workpieces each formed as a tube; and moving the workpieces, one after another, sequentially forward through the stations and thereby transforming each workpiece into two of the electrical terminals.

Abstract: A multi-layered piezoelectric device includes a plurality of piezoelectric portions and a plurality of electrodes electrically connected to the piezoelectric portions that are formed in layers on a ceramic substrate. A first piezoelectric portion is made of a piezoelectric ceramic composition containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO), and second and upper piezoelectric portions are made of a piezoelectric ceramic composition of higher Ni content than in the first piezoelectric portion. An electrode is provided at least between the first piezoelectric portion and the second piezoelectric portion.

Abstract: An apparatus (40) for fixing a flexible printed circuit board module (20) to a sliding mechanism (10) of a portable electronic device is provided. The apparatus includes a base (41) and a pressing device (43). The base includes an assembling stage (414) and defines a mounting space (419) therein. The assembling stage is configured for positioning the sliding mechanism and the flexible printed circuit board module thereto. The pressing device is mounted in the mounting space and configured for sliding within the mounting space and pressing the flexible printed circuit board module toward the sliding mechanism.

Abstract: Disclosed are a piezoelectric ceramic structurally crystal-oriented through the crystallizing control of an amorphous material under an electric field and a method of manufacturing the same. The amorphous material is applied with an electric field to produce the crystal-oriented piezoelectric ceramic. The material is amorphous Li2B4O7 consisting of Li2O and B2O3 in a ratio of 1:2, and is employed in information technology, device technology, mechanical technology and so forth.

Abstract: A circuitized substrate assembly comprised of at least two circuitized substrates each including a thin dielectric layer and a conductive layer with a plurality of conductive members as part thereof, the conductive members of each substrate being electrically coupled to the conductive sites of a semiconductor chip. A dielectric layer is positioned between both substrates and the substrates are bonded together, such that the chips are internally located within the assembly and oriented in a stacked orientation. A method of making such an assembly is also provided, as is an electrical assembly utilizing same and an information handling system adapted for having such an electrical assembly as part thereof.

Abstract: A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexible cable sections of a combination of rigid printed circuit boards and therewith interposed flexible cable sections which are adapted to interconnect the rigid printed circuit boards. The apparatus consists of a tool constituted of an elongated cylindrical member having a tapered leading end which narrows into an ultra-thin flat end section of a blade-like configuration, and which is adapted to be pushed between the flexible cables and so as to preform the flexible cable sections and cause them to yield in a predetermined outwardly bowed permanently relationship between the rigid printed circuit boards at the opposite ends thereof to lengthen the fatigue life of the conductors in the flexible cable sections.

Abstract: A method of making a slider includes the steps of laminating the bottom-facing surface of a third layer to the upper-facing surface of a fourth layer, laminating the bottom-facing surface of a second layer to the upper-facing surface of the third layer in a heat-compression mold, heat-pressing the combined second, third and fourth layers in the mold to form a desired shape, and heat pressing a first layer on top of the second layer inside the mold.

Abstract: The objective of the present invention is to offer a method for forming a conductive pattern on a substrate and solder protrusions on the conductive pattern. The pitch of the conductive pattern corresponds to the pitch of electrodes on a semiconductor chip.

Abstract: A method for fabricating an interconnect for testing a semiconductor component includes the steps of providing a substrate, and forming interconnect contacts on the substrate configured to electrically engage component contacts on the component. The interconnect contacts include flexible spring segments defined by grooves in the substrate, shaped openings in the substrate, or shaped portions of the substrate. The spring segments are configured to flex to exert spring forces on the component contacts, and to compensate for variations in the size or planarity of the component contacts. The interconnect can be configured to test wafer sized components, or to test die sized components.

Abstract: A fabricating method of an electrical terminal connector comprises the following steps: (1) providing an angled insulating housing having a first opening, a second opening and a through passage therein, the insulating housing further including a window and a cover; (2) providing a conducting terminal which has a flat-end connecting portion facing the first opening and a crimped portion facing the second opening; (3) providing a deformable crimp ferrule which has a core-connecting end and a crimping end facing the conducting terminal; (4) assembling conducting terminal with the deformable crimp ferrule; (5) placing the assembly of the conducting terminal and the deformable crimp ferrule through the window in the passage of the insulating housing, then fastening the cover with the window.

Abstract: A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such as a composite perovskite compound, having a higher dielectric constant then the piezoelectric material, the dielectric existing in gaps between the piezoelectric particles. When poling to produce a piezoelectric ceramic, the poling is uniformly performed, and nearly all of the electric field is applied to the piezoelectric particles. Thus, the dispersion of the piezoelectric properties can be reduced, and the piezoelectric properties can be enhanced.

Abstract: A temperature sensor temperature sensing tube and its fabrication method comprised of a step that provides for a tubular blank of an appropriate length, a step in which a curvilinear semifinished product of the tube member bottom section aperture is formed, a step in which a semifinished product of the neck base and the neck body is formed, a step in which a semifinished product of the neck base and the neck body is further formed, and a step in which a finished product having an outer conoidal hem and an inner conoidal hem is formed. Executing each step completes the fabrication of the temperature sensing tube.

Abstract: A method for producing an insulated wire having a cross section of a desired shape, in which a conductor having a cross section of a desired shape is coated with an insulating film, which method comprises: supplying a raw conductor while passing through a rolling unit composed of at least one pair of rolling rolls that are capable of freely rotating without a drive mechanism and that have a desired shape, thereby forming a conductor having a cross section of a desired shape; and coating the conductor with an insulating film.

Abstract: A method and apparatus for fastening two substantially coplanar edges without a weld is disclosed. The method includes: configuring a dovetail feature on a first edge; configuring a complementary dovetail feature receptacle on a second edge to receive the dovetail feature therein; disposing the dovetail feature within the complementary dovetail receptacle; and swaging an interface defined between the dovetail feature in said first edge and said complementary dovetail feature in the second edge to swage mating edges defining the dovetail feature and the dovetail receptacle at at least six swage contact points. In one embodiment the swaging is with a hollow circle punch.

Abstract: A method of forming a conductive gasket material by layering at least one conductive web layer having a blended mixture of conductive fibers and low melting point nonconductive fibers onto a foam core, and needlepunching the conductive web layer and the foam core forming a conductive composite gasket material having a plurality of conductive fibers interspersed through the foam core.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: A spark plug is provided, for a provisional bending process for manufacturing the spark plug, as a work in a condition where an earth electrode is straight and substantially in parallel with an axial line of a center electrode. In the provisional bending process, two searchers individually facing the tip of the center electrode with the tip located therebetween are arranged, positions of the searchers in a first direction perpendicular to the axial line being adjusted for every spark plug. Then a bending punch is driven to press a second end-surface of the other end of the earth electrode down to the searchers so that the earth electrode is provisionally bent at a substantially perpendicular angle to the axial line, the second end-surface being opposite to the first end-surface. Preferably, before the provisional bending process, positioning the work and correcting the position and tilt of the work are performed.

Abstract: The ink jet head is provided with a piezo-electric sheet having a plurality of contacts distributed on a surface thereof. A flat connector is fixed so as to cover the surface of the piezo-electric sheet. A plurality of conductive spots and a plurality of conductive lines are formed on a surface of the flat connector. One of each of the conductive lines is connected with one of each of the conductive spots, and the plurality of conductive spots is disposed with the same distributive pattern as the plurality of contacts. The flat connector is provided with a sheet formed of an insulating material, and is provided with a plurality of projections corresponding to the conductive spots. At least a distal end of each of the projections is covered with one of the conductive spots. The flat connector and the piezo-electric sheet are fixed such that the conductive spots make contact with the contacts of the piezo-electric sheet.