Abstract: A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial layer with a resist, depositing a probe material in the recess to form a probe and then removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process, and detaching from the base table the probe held on the base table by the remaining part of the sacrificial layer. In the recess of the resist are formed a main body part corresponding to a flat surface shape of the probe and an auxiliary part continuing into the main body part. The probe is formed by deposition of the material at the main body part, and a holding portion is formed by deposition of the material at the auxiliary part.

Abstract: An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape.

Abstract: A probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.

Abstract: An OCR system for matching wire harnesses and connectors facilitates precise registration of wire number strings, uses geometric modeling for character recognition, and restricts searches by region and character to ensure speed and accuracy. A string location algorithm is used to search for and identify the location of the beginning of a wire number string. The horizontal edges of the wire in the image are located, a diameter of the wire is determined, light intensity is confirmed, and the first character is found. The resulting coordinate is used by the algorithm for character definition. Geometric shapes are used for identification in order to overcome twisted wires, poorly printed markings, ink color variations, and contacting characters.

Abstract: Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.

Abstract: A method manufactures a keyboard with injecting keys and an inmold metal sheet. The bottoms of grooves of the keys are combined with an elastic material layer to form a keyboard. The metal layer is disposed at a surface of said keyboard.

Abstract: Methods of manufacture of interconnection devices that include using a non-forming process to manufacture a plurality of compression contacts, each compression contact including a cantilevered beam portion that is tapered along its length, and disposing each of the plurality of contacts within a respective cavity in a substantially planar carrier housing lying in a plane defined by x and y axes, the housing having an upper surface and a lower surface, each cavity extending between the upper and lower surfaces of the housing substantially along a z axis, each contact being loosely retained within its respective cavity such that an entirety of the contact in a compressed state has at least some freedom of movement along the x and y axes.

Abstract: A clad contact point material 1 is formed into a tape in shape by attaching by pressure a contact point part 3 of silver or silver nickel to a copper base material 2, silver plating 4 is performed on the entire material. A 2 mm clad contact point 6 segmented from the clad contact point material 1 is pushed into a lower hole 8 provided at the end part of a 0.15 mm thick beryllium copper movable plate 7 caulked as shown in FIG. 2D, and mounted as a contact point. Since the caulked part includes more silver plated part at the ratio of 1:1.3, it is antioxidant and anticorrosive under a high temperature condition, thereby increasing a service life of the contact point, and realizing uses under higher temperature and larger current conditions.

Abstract: A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

Abstract: In a probe manufacturing method, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily without damaging the probe. A recess corresponding to a flat surface shape of a probe is formed by a resist mask on a sacrificial layer on a base table, and a probe is formed by depositing a probe material in the recess. Thereafter, the resist mask is removed, and further the sacrificial layer is removed by an etching process with a part of the sacrificial layer remaining. For the purpose of forming an opening for control of the remaining part of the sacrificial layer in the etching process in the probe so as to let the opening pass through the probe in its plate thickness direction, a hole-forming portion for the opening is formed in the resist mask. Etching of the sacrificial layer in the etching process is promoted from an edge of the opening formed in the probe by this hole-forming portion.

Abstract: A method is provided for removing a component from a medium. The method includes applying an adhesive to a portion of a component. An attachment member is inserted into the portion of the component. The attachment member is pulled with a pulling element in a direction opposite a medium in which the component is inserted.

Abstract: A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b) depositing sacrificial material so as fill the trenches and form a scaffold on the substrate; (c) defining openings in the sacrificial material; (d) depositing roof material over the sacrificial material to form nozzle chambers and filter structures simultaneously; (e) etching nozzle apertures through the roof material; and (f) removing the sacrificial material.

Abstract: The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit.

Abstract: To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device. A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.

Abstract: A printed circuit board assembly is formed by a press-fit connector attached to a printed circuit board. The press-fit connector includes a plurality of press-fit terminals and a housing. An overlapping resist part is formed on the printed circuit board. The overlapping resist part closely contacts the housing, and is arranged in a circular shape at an outer circumference of a through hole. By dipping the housing and the overlapping resist part closely contacting each other into a synthetic resin bath, the synthetic resin is filled in an inside of the through hole and a space surrounded by the overlapping resist part, and swarf of the press-fit terminal is fixed in the synthetic resin.

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit.

Abstract: An ink jet head includes a substrate having a flow path construction member constructing a plurality of discharge ports for discharging ink and a plurality of ink flow paths corresponding thereto, and a plurality of energy generating elements corresponding to the plurality of discharge ports. The substrate has an ink supply port for supplying ink to the ink flow paths. The ink supply port includes a first liquid chamber disposed on a plane on which the energy generating elements are formed, and having a grooves with island-shaped columns left, and a second liquid chamber disposed on the opposed plane, and having a plurality of through holes partitioned at positions corresponding to the island-shaped columns. In the ink jet head, the island-shaped columns and a partition wall for the through holes are left as a beam construction section, thereby improving a mechanical strength of a semiconductor substrate.

Abstract: A high speed electrical connector is provided that comprises a substantially planar dielectric, a substantially planar ground plane, and a signal conductor. The ground plane is disposed on one planar surface of the planar dielectric and the signal conductor is disposed on the opposing planar surface of the planar dielectric.

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in an aperture disposed from the first surface to the second surface. To contact the electrical devices, the contact includes a center portion from which extends two diverging, cantilevered spring arms that project beyond either surface of the electrical connector. To shorten the path that current must travel through the contact, one spring arm terminates in a bellows leg that extends proximate to the second spring arm. When placed between the electrical devices, the spring arms are deflected together causing the bellows leg to press against the second spring arm. For retaining the contact within the aperture, the contact also includes retention members extending from the center portion that engage the insulative housing.

Abstract: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

Abstract: A method for production of a semiconductor package which enables uniform conduction processing for all through holes covered by the conduction processing without being limited to any specific structure, is free from surface relief shapes and internal voids, and enables conduction processing simply, in a short time, at a low cost utilizing existing facilities, wherein the conduction processing of the through holes includes a step of press fitting a conductor into the through holes by a ball bonder and a step of flattening the exposed heads of the press-fit conductors by coining.

Abstract: An apparatus for positioning and press-fitting press-fit portions of roughly L-shaped legs of contacts arranged in multiple rows in a connector into a substrate includes a press-fitting head and an alignment plate. The press-fitting head is rotatable between a rest position and a press-fitting position and has vertical grooves for receiving the contacts in the press-fitting position. The alignment plate is arranged proximate the press-fitting head when the press-fitting head is in the press-fitting position and aligns the press-fit portions of the contacts with press-fitting apertures in the substrate. The alignment plate is retracted from the press-fitting head when the press-fitting head press-fits the press-fit portions into the substrate.

Abstract: A method for fabricating a thermal inkjet head equipped with a symmetrical heater and the head fabricated by the method are provided. The method incorporates two thick photoresist deposition processes and a nickel electroplating process. The first thick photoresist deposition process is carried out to form an ink chamber in fluid communication with a funnel-shaped manifold and an injector orifice. The second thick photoresist deposition process forms a mold for forming an injector passageway that leads to the injector orifice. The nickel electroplating process provides an orifice plate on top of the inkjet head through which an injector passageway that leads to the injector orifice is provided for injecting ink droplets.

Abstract: A pin contact for pressing into electrical engagement with a plated section in a hole in a circuit board. The contact includes a deformable portion for engaging the plated section with a feed-through portion and a terminal portion at opposite ends thereof. An end part of the deformable portion adjacent to the feed-through portion is deformed prior to insertion of the deformable portion into the hole. This substantially eliminates deviation of the feed-through portion from a central longitudinal axis or rotational deviation of the contact caused by pressing of the contact into the hole. A method and apparatus for making the contact are also disclosed.

Abstract: There is disclosed a cable modem device capable of reducing unnecessary signals inputted into a circuit substrate which processes signals and signal terminals from the outside and unnecessary radiation generated by the circuit substrate, the device having a hexahedral shield case which shields a circuit substrate, and a plurality of terminals for use in input/output of the signals with respect to the circuit substrate. Each of the terminals has a noise filter function, and is fixed to the shield case.

Abstract: By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.

Abstract: In an electrically shielded connector, conductive material covers an outer surface of said body and is spaced away from a conductive structure included in the connector to create electrical isolation therebetween. A channel in which the connector is situated is either plugged when conductive material is applied to the connector during manufacturing or is counter bored to create the electrical isolation.

Abstract: An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.

Abstract: A press-fitting device in which a terminal of a connector having a staggered arrangement section of the terminal of the connector is press-fitted into an insertion hole is provided. In the press-fitting device, a first terminal restricting member on which a guide section for restricting a vertical displacement of the terminals between the terminals along the lateral direction of the connector housing and a second terminal restricting member on which a guide section for restricting the lateral displacement of the terminals between the terminals along the vertical direction of the connector housing in an upper or lower part of the first terminal restricting member are provided. A guide groove to which terminals on an interior side of the connector housing are introduced is provided at a tip end portion of the guide portion positioned at the staggered arrangement section of the terminals.

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.

Abstract: The present invention is directed to a socket connector to couple electrical plugs to sockets mounted on circuit boards or cable ends. The socket connector includes a socket that receives an electrical plug and a socket silo. The silo may contain a beveled outer surface that receives a beveled face on the plug. The plug is held in the socket by latches disposed on the plug. The latches include pawls that fit within pawl receiving chambers in the socket and couple the plug to the socket. The latch and hinged section may rotate into a recessed section on the plug from an extended to a retracted position. A locking portion on the pawl and the receiving chamber may be angled to develop a desired pullout force.

Abstract: A method of manufacturing a liquid discharge head provided with a liquid flow path communicating with a liquid discharge port on a substrate has a step of forming a first electrically conductive layer on the substrate, a step of forming a molding member into the pattern shape of the flow path on the substrate, a step of forming a second electrically conductive layer on the molding member so as not to contact with the first electrically conductive layer, a step of forming a metal film by a plating process around the molding member by the utilization of the first electrically conductive layer and the second electrically conductive layer, and a step of removing the molding member and forming the flow path.

Abstract: A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.

Abstract: A machine for terminating wire assemblies comprising: a means for holding a wire assembly; a linear movement means for moving said means for holding between a first area and a second area; an insertion head; and, a means for dislodging; wherein, after a wire assembly is loaded into the means for holding a wire assembly, the means for holding a wire assembly is moved by the linear moving means from the first area to the second area for assembly termination by the insertion head; and, following termination, the assembly is at least partially unseated from the means for holding a wire assembly by the means for dislodging.

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: A method for wiring a test fixture comprised of two parallel fixture plates wherein the wires are wired randomly from locations on one plate to locations on a second plate using a system of software algorithms and positioning apparatus to control the motion of one plate relative to the other to allow the wires to be passed directly through the hole locations to be wired together, while previously woven locations are allowed to slide in the hole in the fixture plate to allow reaching subsequent hole pair locations. After the fixture is wired, a termination is added to the wire end emerging from the hole in the fixture plates. The resultant assembly consists of contacts on one outer surface electrically connected to contacts on a second outer surface with all of the wiring sandwiched between the two fixture plates.

Abstract: A method in which a claw portion of a connecting member penetrates a first piercing portion of a flat circuit member in a thickness direction thereof. In the case of connection to the flat circuit member having a thick conductor portion, the claw portion is bent such that a distal end portion of the claw portion pierces the flat circuit member so as to obtain electric contact with the conductor portion of the flat circuit member. In the case of connection to the flat circuit member having a thin conductor portion, the claw portion is bent such that a portion of the flat circuit member is clamped between an outer surface of the claw portion and inner edge portion of a side wall portion of the connecting member, so as to obtain electric contact with the conductor portion of the circuit member.

Abstract: A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

Abstract: Coax and twinax connector assemblies, suitable for low-cost manufacturing and high-frequency performance, include one or more slices of insulating material having a series of through-holes therein. Dimensions of the through-holes are tailored to the dimensions of the coax or twinax that are to be fitted to such connector assemblies. The slices may have dimensions that are uniform to within typical manufacturing tolerances. By combining, or stacking, the slices, the connector height can be customized to a particular application. A variety of slice thicknesses are provided so that a variety of final connector heights may be achieved. Conductive material sheets may be disposed between one or more pairs of connector slices so as to provide a common ground connection for one or more conductors, such as, for example, ground shields, disposed in the through-holes of the stacked connector slices. Additionally, right angle connectors and low-cost twinax cables are disclosed.

Abstract: A housing-remover tool for a press-fit connector. The tool including shoulder part pressers for pressing the shoulder parts of pin-shaped terminals, each shoulder part presser having a hollow part for receiving a pin part of the pin-shaped terminal and a cut-away part at a leading end for engaging with the shoulder part; a first sub-assembly for insertion inside a housing of the connector and provided with through-holes for receiving the shoulder part pressers; and a second sub-assembly having a pair of engagement members having engaging protrusions which can engage with stepped parts of the housing and a lifting portion for lifting the engagement members along the side surfaces of the first sub-assembly.

Abstract: A method for equipping plug housings with fitted-out cables includes an equipping installation downstream of a fitting-out installation and introduces each fitted-out cable end into a first or second plug housing according to an installation sequence. A feeder unit takes a cable loop from a transfer unit moved from the fitting-out installation and transfers the leading cable end to a transfer station and the trailing cable end either to a rotatable store unit or, to the transfer station when it is free. An equipping unit takes over the cable ends in succession at the second transfer station and introduces the cable ends into designed cells of the corresponding plug housings.

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: An housing of a meter unit is inserted from above into a meter unit support hole which is provided in the rear handle cover. Engagement claws of the housing are engaged with claw receiving portions of the rear handle cover, thereby prevent the housing from coming out. Male connector is provided beforehand in the rear handle cover, and inserting the housing of the meter unit into the meter unit support hole causes the female connector of the housing to be automatically connected to the male connector, thus completing the wiring work of the meter unit. The wiring work on the meter unit supported on the rear handle cover of the motorcycle can therefore be performed easily and reliably.

Abstract: An apparatus and method for servicing a telecommunications device that utilizes pin connectors connecting electronic modules to the backplane. A catch basin module is insertable into a slot in the telecommunications device in which at least one of the electronic modules would normally be disposed. The catch basin module includes a rear wall having a window, the window being dimensioned to surround a group of pin connectors disposed on the backplane. The catch basin module also includes a bottom surface disposed below the window which projects out from the catch basin module and abuts the backplane under the pin connectors when the catch basin module is inserted into the slot. When pins in the pin connectors are pushed out of the pin connectors from a rear side of the backplane, the pins fall onto the bottom surface of the catch basin module and do not fall into the chassis of the telecommunications device.

Abstract: A method for manufacturing and packaging an integrated circuit includes following steps: pressure a continuous pin material and a base board area at first; then cut off pin material into several pin units, accommodate each pin units into respective position in a mould, and ejecting plastic into the mould gap to shape a pin unit, then remove waste part of the pin material after removing down the mould parts; put four pin units and a base board into a rectangle mould, then eject plastic again into mould gap, after that cut off waste part of the base board to attain an IC socket; stick an IC chip on top of the base board of the IC socket and wire it. Finally, cover and stick a panel on the IC socket to finish the whole IC packaging procedures.

Abstract: The present invention relates to a copper ball insertion machine, for integrating metal inserts in via holes provided through a printed circuit board (PCB), comprising a motor driven X-Y table (2) with the PCB on top. The X-Y table (2) is adjustable to position a selected via hole in a predetermined location aligned with a closable outlet opening (12) of a movable container (6) for metal inserts. The container is by means of a clamping cylinder (28) displaceable for clamping the part of the PCB adjacent said via hole against the working surface (2) of said X-Y table. By means of a pivoting cylinder (20) the container is rotatable for feeding one metal insert through the outlet opening (12) into said via hole. A stamp (30) is drivable by a hammer cylinder (40) for compressing said metal insert to shape and deform it into a tight fit with the via hole.