Abstract: Apparatuses and methods for preventing disengagement of electrical connectors in the assembly of computers. In one embodiment, a computer system includes a chassis, an electrical component contained within the chassis, an electrical connector engaged with a receptacle on the electrical component, and a retainer to prevent disengagement of the electrical connector from the receptacle. The retainer has a mounting portion that can attach to at least one of the electrical component or the computer chassis, and a connector interface adjacent to the electrical connector to prevent the connector from disengaging from the receptacle on the electrical component. In one aspect of this embodiment, the retainer is a one-piece retainer with a mounting portion that attaches to only one surface of the electrical component. In other embodiments, the retainer can be a two-piece retainer having a bracket and a movable retainer portion.

Abstract: A waterproof connector is mounted on a circuit board fixed within an enclosure. The waterproof connector is connectable with a mating connector through a connector passageway formed in the enclosure. The waterproof connector includes a contact electrically connectable with the mating connector, an insulating housing holding the contact, a first seal disposed on a circumference of the housing, and a faceplate into which the insulating housing is inserted. The having a cylindrical section and a brim section. The cylindrical section includes a first and second open end with the brim section formed at the first open end and spreading outwards. A second seal is interposed between the first open end and the insulating housing.

Abstract: A jacket sleeve with grippable tabs provides protection to exposed portions of cable that are connected to an electrical connection. The jacket sleeve can be made as part of the electrical connector or may be connected subsequent to its creation through the use of glues or other adhesives. The jacket sleeve can be made of a material that is more pliable than the electrical connector, making it easier for a lineperson to place the sleeve over an exposed portion of cable. The jacket sleeve can include holes or slots either in the sleeve or in tabs that are attached to the sleeve. A lineperson can place one or more fingers into each hole or slot in order to get a better grip on the sleeve and pull the sleeve over the exposed portion of cable with less slippage and effort on the part of the lineperson.

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract: A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffusible second electron transfer agent. The sensor and/or the methods used produce a sensor signal in response to the analyte that can be distinguished from a background signal caused by the mediator. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is typically provided as a second electron transfer agent.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: An electrical contact between a terminal pin and a terminal wire is produced by the pin having an edge against which the wire, inclusive of the insulating jacket on the wire, is radially pressed. The radial contact force is generated via a contact part which encompasses the terminal pin.

Abstract: A cable assembly (1000) includes a plurality of wires (1), each wire (1) including an inner conductor (10), an insulative layer (12) enclosing the inner conductor, a metallic braiding member (14) shielding the insulative layer, and an jacket (16) enclosing the metallic braiding member; a partial of the jacket of the each wire removed away to expose a partial of the corresponding metallic braiding member outside; and a conductive grounding bar (2) molded over the partial of the corresponding metallic braiding member of the each wire such that the wires and the grounding bar are electrically and mechanically linked together.

Abstract: A method of producing a biomaterial measuring device is disclosed. The method includes forming a plurality of reactions elements, to which an assay reagent is applied, on a first substrate, cutting the resulting first substrate in a unit of individual reaction element, and attaching a first substrate piece, which is formed by cutting the resulting first substrate in the unit of individual reaction element, to a predetermined portion of a second substrate. In the biomaterial measuring device, since a material cost in minimized and it is easy to automate production, it is possible to reduce a production, it is possible to reduce a production cost.

Abstract: A coaxial cable splitter including an integral body with a first cable connection, a second cable connection and a third cable connection, each defining an axis. The second cable connection is a crimp sleeve, the first cable connection is a coaxial connector, and the axes are generally parallel to each other. The third cable connection is a coaxial cable connector and the axis is at an angle to the axes of the first and second cable connections. The first and third cable connections each include a center conductor which are electrically linked. The first and third cable connections each include an outer shell positioned about the center conductor which are electrically linked. A method of assembling a coaxial cable splitter with an integral body.

Abstract: An electrical distribution harness assembly configured for coupling with a modular wall panel includes at least one electrical connector including a body and an elastic clip bracket configured for snap-fitting to the modular wall panel, the body forming an overmolded connection with the elastic clip bracket.

Abstract: A header assembly for connecting an implantable medical device to at least one conductor lead terminating within a patient intended to be assisted by the medical device is provided. The implantable medical device is comprised of numerous feedthrough wires in a dense, non-linear, scattered format extending from the control circuitry and through a wall of the housing. The header assembly is comprised of an insulative body that is mountable on the housing of the medical device. The insulative body supports at least one conductor subassembly comprising a terminal that is directly connectable to the conductor lead, an intermediate conductor wire comprising a distal end connected to the terminal and a proximal end connected to a connector sleeve. Methods for making the header assembly and for connecting the header assembly to the implantable medical device are also disclosed.

Abstract: The disclosure describes an axial lead connector assembly for an implantable medical device (IMD). The lead connector assembly facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.

Abstract: A method of fabricating a MEMS switch that is fully integratable in a semiconductor fabrication line. The method consists of forming two posts, each end thereof terminating in a cap; a rigid movable conductive plate having a surface terminating in a ring in each of two opposing edges, the rings being loosely connected to guiding posts; forming upper and lower electrode pairs and upper and lower interconnect wiring lines connected and disconnected by the rigid movable conductive plate. The conductive plate moves up, shorting two upper interconnect wirings lines. Conversely, the conductive plate moves down when the voltage is applied to the lower electrode pair, while the upper electrode pair is grounded, shorting the two lower interconnect wiring lines and opening the upper wiring lines.

Abstract: For providing a shield wire, in which efficiency of processing terminal treatment of braid can be improved, and an apparatus for processing terminal treatment of braid, an apparatus for processing terminal treatment of braid of a shield wire includes a first hold unit holding a top of the braid covering the electric wire, a second hold unit holding a far-side of the braid, a push unit pushing the top toward the far-side so as to fold a part of braid from the top to form an overlap portion, and a forming unit forming the overlap portion into a cone shape, in which the top is located. The formed overlap portion is clamped by a set of inner and outer ring brackets.

Abstract: A connector jack with reduced host PCB footprint and an assembly of the same are provided. The provided connector jack is constructed based on a housing defining at least a front face with a plug receiving cavity on the surface thereof and with a plurality of electrical contacts positioned within the cavity, and a bottom face having a recess area on the surface thereof and adapted for mounting on a circuit board. In the present invention, at least a portion of the housing is made of a transparent or translucent material so that the status indicators located within the recess will be visible through the transparent portion of the front face of the jack housing, and the recess area occupies a substantial portion of the bottom face and allows to place additional components on the circuit board at least partially within the recess area.

Abstract: Apparatus, systems, and methods for assembling a plug with a low profile for use with an electronic device are provided. In some embodiments, a 4-pin plug may include a diameter similar to the diameter of a 3-pin plug. In some embodiments, the fourth pin may be coupled to the plug such that a portion of the fourth pin may be coupled to any suitable device on an internal surface of the plug. In some embodiments, the fourth pin may dive into the plug at the same depth as one of the other three pins of the plug. The pins within the plug may be coupled (e.g., soldered) at the ends that may emerge underneath an overmold to any other suitable device to form electrical connections. The plug may be used to transmit audio or transfer data to a user of the electronic device.

Abstract: A line spring jack and an assembling method are disclosed. The line spring jack comprises a jack body, a jack cap, a line spring wire and a positioning plug. Said jack body further comprises a plug hole; said line spring wire is located in said plug hole; said jack cap is connected to one end of said jack body; said jack cap further comprises a through hole connected to said plug hole; one end of line spring wire is clipped in a space formed between said jack cap and said jack body; wherein said plug hole further comprises a groove in the bottom; the caliber of the groove is smaller than the caliber of said plug hole; said positioning plug includes a part in the groove and a part in the plug hole, the part in the groove is tightly matched to said groove.

Abstract: A cable having an electrostatic discharge (ESD) dissipative layer in one embodiment includes a plurality of leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A cable having an electrostatic discharge (ESD) dissipative layer in another embodiment comprises at least 16 leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A method for fabricating a cable in one embodiment comprises coupling an electrostatic discharge (ESD) dissipative layer to a plurality of leads using a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer.

Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

Abstract: Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive or solder either before or after releasing the spring contact from the mandrel.

Abstract: A connection device for cables having an elongated, cylindrical body with first and second ends, a termination interface member attached to each end of the elongated cylindrical body, wherein the elongated, cylindrical body is made of a flexible, cylindrical substrate member extending between the termination interfaces, with a plurality of elongated tension members helically wound about the exterior of the flexible substrate member, the ends of the tension members being attached to respective termination interface members.

Abstract: Cable connection unions are rapidly replaced in a universal seismic data acquisition-module without opening a main electronic circuitry protective chamber. Different connector types required for the many data transmission cable designs needed to service a wide range of survey conditions are more easily accommodated without exposing primary circuitry to the elements.

Abstract: The present invention provides methods of manufacturing a bollard light assembly that provides a choice of light output by being size-adaptable depending on the choice of light output. The methods comprise, in pertinent part, selecting an elongated light and interposing a number of lens rings and light deflectors which correspond to the length of the selected elongated light. Also provided is a lighting bollard assembly manufactured according to the methods of the present invention.

Abstract: Apparatuses and methods for preventing disengagement of electrical connectors in the assembly of computers. In one embodiment, a computer system includes a chassis, an electrical component contained within the chassis, an electrical connector engaged with a receptacle on the electrical component, and a retainer to prevent disengagement of the electrical connector from the receptacle. The retainer has a mounting portion that can attach to at least one of the electrical component or the computer chassis, and a connector interface adjacent to the electrical connector to prevent the connector from disengaging from the receptacle on the electrical component. In one aspect of this embodiment, the retainer is a one-piece retainer with a mounting portion that attaches to only one surface of the electrical component. In other embodiments, the retainer can be a two-piece retainer having a bracket and a movable retainer portion.

Abstract: A diaphragm assembly used for a condenser microphone has a diaphragm made of a resin film including a metallized film on one surface of a supporter ring. The diaphragm is made by a first step of bonding a ring jig of a larger diameter than the supporter ring to the resin film having the metallized film composed of a ductile metallic material on the one surface via an adhesive without exerting tension on the resin film; a second step of heating and contracting the resin film bonded to the ring jig without applying the tension at a temperature over a glass transition point of a film material; and a third step of bonding the supporter ring to the resin film via an adhesive in a state of exerting predetermined tension on the resin film. The diaphragm assembly is cut out of the resin film after the adhesive becomes hardened.

Abstract: An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

Abstract: A method for establishing electrical communication between a control module and a motor/generator in a hybrid electromechanical transmission includes providing a preassembled terminal subassembly including a first plurality of wire terminals sufficiently interconnected for selective, substantially unitary movement with respect to a transmission housing, aligning the preassembled terminal subassembly with a second plurality of wire terminals affixed with respect to at least one electric motor/generator, and establishing electrical communication between each of said first plurality of wire terminals and a respective one of said second plurality of terminals.

Abstract: Disclosed are apparatus and methods for adapting a first receptacle coupled to a vehicle to power a second receptacle coupled to the vehicle without the need for modifying the vehicle's electrical system wiring. A method is provided in which a vehicle plug connected to the vehicle's electrical system is removed from a power inlet of the first receptacle, a first interface of the adaptor is plugged into the same power inlet, the vehicle plug is plugged into a second interface of the adaptor, and a third interface of the adaptor is coupled to the second receptacle. In some embodiments, the adaptor is provided with modules that replicate the interfaces of existing, standardized vehicle receptacles to increase compatibility with pre-installed vehicle receptacles. The adaptor may optionally be provided with an adaptor plug that wires to a second receptacle via terminal blocks or the like and plugs into the adaptor's third interface.

Abstract: The present disclosure relates to electrical connectors and to header systems having such connectors. In one embodiment an electrical connector also known as a header can have two aligning and locating pegs for cooperating with alignment holes of the housing of a control module to accurately and precisely position header in a respective bay of the control module. The pegs of each header can have either unique cross-sectional shapes which can be reflected in respective alignment holes of housing, or can be uniquely positioned on the header which positioning is matched on the holes of the housing to permit each header to be accurately and precisely seated along the x-axis and the y-axis in only one bay and in only a desired front back orientation, or both. In this fashion, the terminals of the header, including its pins, are in position to engage openings in a PCB or other connector.

Abstract: Conductor body comprising a first outer component extending in the longitudinal direction and provided with at least one tooth projecting in the transverse direction from the inner surface, the tooth having an inner recess; at least one middle component having a mating recess and tooth, the same as the outer component; a closing component provided with at least one opening able to engage with the at least one tooth of the middle component, wherein each of the components are packed together in a transverse direction so as to form a multi-layer body.

Abstract: Electrostatic discharge protection, also known as ESD protection, is provided in the form of a discrete array with a voltage variable material (VVM) or a VVM device. The array is fabricated with a common electrode for connection to ground, and one or more electrodes configured for connection to an electrical component. The electrical component is a connector attached to an electrical circuit containing devices subject to damage by ESD events. The array is placed into a pocket or space on the connector and is held in place mechanically by spring force or by soldering to leads or electrodes of the connector. The array may be soldered to a ground connection or held in place by pressure, such as from a spring or from an outer housing or shell. In some embodiments, the array is removable from the component without affecting component circuits other than removal of ESD protection.

Abstract: A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.

Abstract: In a high frequency component, a case made up of metal having a shape of frame for containing a board includes tabs and stoppers. During producing of the high frequency component, the board is inserted from an opening on a side on which the tabs are provided. Each of the tabs has a height in a direction perpendicular to an insertion direction of the board, which becomes lower toward upstream in the insertion direction. Each of the tabs has elasticity so as to return to its original state after being pushed toward an inner side surface of the case by a force applied from upstream side in the insertion direction. By this, the board can be easily inserted and fixed between the tabs and the stoppers in the case. This makes it possible to provide a printed board holding case to which a printed board can be easily inserted and sufficiently fixed.

Abstract: A coaxial connector includes a clamp nut dimensioned to fit over the outer conductor, the clamp nut having threads that mate with corresponding threads on the connector body. A clamp element is positioned between the clamp nut and a leading edge of the outer conductor. The connector body having an annular wedge surface dimensioned to mate with the leading edge of the outer conductor. The threads draw the clamp nut towards the connector body, to clamp the leading edge between the clamp element and the annular wedge surface. A surface-to-surface positive stop between the clamp nut and the connector body limits the compression force to a predetermined maximum by preventing further movement of the clamp nut towards the connector body. A thread lock is engaged as the positive stop is reached; the thread lock inhibiting unthreading of the clamp nut from the connector body.

Abstract: A probe test card assembly for testing a device under test includes interposer probes to connect a printed circuit board to a substrate. The probe test card assembly includes a printed circuit board, a substrate and a substrate holder. A plurality of test probes is connected to the substrate for making electrical contact with the device under test. A plurality of interposer probes is attached to the substrate for providing electrical connections between the substrate and the printed circuit board. The substrate holder holds the substrate in position with respect to the printed circuit board so that the interposer probes contact the printed circuit board. The interposer probes may be arranged in interposer probe groups to facilitate maintenance and replacement of the interposer probes. Hardstop elements may also be used to protect the interposer probes.

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract: A differential probe device is provided that has a scissor-type configuration that allows the inter-tip ground path length to be very short, thereby ensuring that the probe device will have a small ground inductance. Providing the probe device with a small ground inductance ensures that the ground inductance will not cause the bandwidth of the probe device to be unduly limited, even at higher frequencies. The configuration of the probe device also enables the ground areas on the arms to remain in continuous contact over the range of available span widths between the tips, which also helps to ensure that the ground inductance is kept small and generally fixed. Also, the configuration of the probe device enables the proximal ends of the probe arms to be kept small in size to accommodate DUT layouts having small test features and/or test features that are close together.

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract: The present invention relates to a method for arranging a plurality of connecting elements corresponding to a plurality of electronic components which is required to be subject to an electric test for inspecting a fault. The method for arranging a plurality of connecting elements on electronic substrates such that the connecting elements may simultaneously contact with a plurality of electronic components comprises the steps of fabricating each connecting element to have the first extending region at one end extended in a certain direction with a regular width and the second extending region at the other end extended in a certain direction with a regular width; and coupling the first extending region of each connecting element to a fixing post formed in a pre-determined region of the electronic substrate in order to be parallel with the second extending region of each connecting element, wherein each of the second extending region extends at the same length.

Abstract: A method includes forming a signal line on the substrate so as to have a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line; a ground line formed on the substrate between the supporting frame and the signal line; a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward; a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate.

Abstract: A method to fabricate a high density, minimal pitch, thermally matched contactor assembly to maintain electrical contact with contact regions on fully processed semiconductors, preferably while still in wafer form, and throughout a range of temperatures. A guide plate and a contactor assembly for such use, comprising a substrate formed of a material having a coefficient of thermal expansion approximately equal to that of the device; and at least one hole in the guide plate for receiving an electrical contact (probe element) for contacting at least one respective region on said surface, said at least one hole being sized and shaped so as to accept said electrical contact, while allowing said electrical contact (probe element) to move with respect to said hole in said guide plate. The material can be one of silicon, borosilicate glass and cordierite.

Abstract: A method of repetitively accomplishing mechanical action of a tool member by drivingly engaging the tool member with one end of a compression spring, manually applying incrementally increasing force to the other end of the compression spring until the mechanical action of the tool member is completed, and utilizing an electronic measurement of the force level within the compression spring for repetitiveley reproducing the mechanical action.

Abstract: A method for installing a bonding pad as a gasket for an electronic subassembly includes providing a bonding pad comprising an expandable foam; an air-tight bladder covering at least one side of the expandable foam; a layer of conductive material covering the air-tight bladder and comprising at least one contact point; and an open port; removing air from the air-tight bladder, thereby compressing the expandable foam; installing the bonding pad into a gap between two surfaces; allowing the compressed foam to expand under atmospheric pressure; and electrically bonding the two surfaces with the bonding pad.

Abstract: A spindle motor connector (1) is adapted for making electrical connection between a spindle motor and a PC board in HDD, which is mounted below the spindle motor. Said spindle motor connector (1) has a step-like insulated housing (10) with passageways (105) formed thereon, and a plurality of contact terminals (11) are formed to receive in said passageways (105), said spindle motor connector (1) further includes a removable cover (12) with engagement portion to secure the removable cover (12), the contact terminals (11) and the insulated housing (10) together. With this new design, the mold structure and the manufacturing progress can be improved.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: An electrical connector includes a sleeve defining an axis and a contact assembly inserted in the sleeve, the contact assembly including pieces that move axially relative to one another during a fault close operation. An interface between the sleeve and the contact assembly is configured to permit replacement of the contact assembly without replacing the sleeve.

Abstract: An electrical connector includes first and second connector bodies which are arranged to first be positioned together, and then separated once electrical contacts have been inserted in at least one of the first and second connector bodies. During, after, or both during and after the separating of the two connector bodies, portions of the first and second connector bodies are in direct contact with each other. The first connector body has first and second walls extending there from. At least one ramp and at least one stop are arranged on at least one of the first wall, the second wall, and the second connector body. At least one protrusion is arranged on at least one of the first wall, the second wall, and the second connector body. The at least one ramp, the at least one stop, and the at least one protrusion are arranged such that, when the at least one ramp and the at least one stop engage the at least one protrusion, a distance between the first and second connector bodies is fixed.

Abstract: A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points; connecting a passive element to the corresponding metal protruding points; providing a board having a core substrate with organic insulation layer on a core substrate; stacking the conductive foil and the board, wherein the passive component is embedded in the organic insulation layer and patterning on the conductive foil.

Abstract: A method of manufacturing an electronic key with USB connector comprises the making of a key body 10, with a polarizer 14 of the connector M, formed in one piece with the key body. The polarizer extends from the surface s1 of the connector which carries the vignette of contact pads, or extending from of the opposite surface s2. The key body excluding the connector, and the polarizer 14 advantageously exhibits the same thickness d1 greater than the standardized thickness dK of the remainder of the connector. It is formed of at least one guidance element 14a. Advantageously it is formed of two guidance elements 14a, one on each side of the vignette, in the form of a longeron following the direction D of introduction of the connector. An outline of the key body is advantageously made in a card body 11, from which it can be separated.