Abstract: A plate and frame style heat exchanger is disclosed herein the heat exchanger is formed by a plurality of heat exchange plates and frame members that are alternatingly stacked together to form fluid channel members. The frame members are formed by lengths of material that are formed or bent into the desired configuration for providing a first fluid tight seal around the periphery of the plates and a second fluid tight seal around respective fluid openings formed in the heat exchanger plates in order to achieve the desired flow configuration through the heat exchanger. In some embodiments the frame members are made up of two mating frame portions that join together in a self-aligning and self-fixturing relationship to facilitate assembly.

Abstract: A bracket attaches a heat exchanger to a supporting member. The bracket includes a vibration-proof member, and first and second bracket members. The first member is fixed to the supporting member. The second member is joined to a projection of the heat exchanger through the vibration-proof member. The second member is attached to the first member. The second member includes a joining part and an attaching part. The projection is inserted in the joining part from a projecting direction of the projection so that the joining part is joined to the projection with the vibration-proof member intervening therebetween. The attaching part is inserted in the first member from a direction that intersects with a joining direction in which the joining part is joined to the projection, so that the attaching part is attached to the first member at an arbitrary position of the first member in the joining direction.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Abstract: A plurality of tubes are connected in a bundle that is bent to follow a curved tortuous path. The method includes providing a plurality of individual tubes and then encapsulating the tubes within a molded or extruded encapsulating material so that the tubes are joined and supported together in a tube assembly. Connectors are provided on the ends of the tubes, either before or after the encapsulating of the tubes. The tube assembly is then bent to the desired bent tortuous shape.

Abstract: The present invention is a total heat exchange element in which a spacing member is provided on both sides of a sheet-like partition member to form a flow path and which performs heat exchange between an airflow that flows in a flow path formed on one side of the partition member and an airflow that flows in a flow path formed on another side of the partition member via the partition member, wherein the spacing member is molded integrally with the partition member by using a resin, and the partition member is configured to include a functional layer that has heat conductivity, moisture permeability, and gas shielding property and a heat shrink layer that shrinks at a predetermined temperature or higher.

Abstract: An example includes an apparatus to pump a fluid. The apparatus includes a housing extending along a length defining an elongate interior, an actuator in the housing, conforming to the elongate interior, the actuator including a plurality of lumens, each having a length extending substantially parallel to the elongate interior, each from around 10 to 200 micrometers across and an actuator configured to oscillate the actuator in the actuator housing along the length of the elongate interior with a rate differential between movement in a first direction versus movement in a second direction opposite the first direction to pump the fluid.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.

Abstract: A heat dissipation unit and a manufacturing method thereof and a thermal module thereof. The heat dissipation unit includes a metal main body having a chamber, an oxide coating and a working fluid. The oxide coating is coated on wall surface of the chamber instead of capillary structure. The oxide coating serves to enhance vapor/liquid circulation efficiency of the working fluid in the chamber of the heat dissipation unit so as to increase heat dissipation efficiency.

Abstract: An apparatus. The apparatus comprises a distribution of microstructures on an area of a surface, each of the microstructures having one or more sloping sides. The apparatus comprises a distribution of nanostructures being located on the one or more sloping sides. The distribution of microstructures on the area of the surface is configured to nucleate and grow droplets of liquid from a gas. The distribution of nanostructures forms a superhydrophobic surface for the liquid.

Abstract: The present application provides a heat exchanger assembly. The heat exchanger assembly may include a folded fin core with a ridge end and a trough end, a first end plate positioned about the ridge end of the folded fin core, a second end plate positioned about the trough end of the folded fin core, and with the first end plate and the second end plate including a number of protrusions thereon.

Abstract: Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.

Abstract: The method for manufacturing products having a metal surface by imparting microfeatures onto the metal surface. The method if further described as the steps of: creating a transfer tool from a microstructured intermediate fabricated from a microstructured prototype having microfeatures; and, transferring the microfeatures to said metal surface using the transfer tool.

Abstract: A forced oscillation radial seal is described for regenerative air preheaters which contain rotatable radial plates having upper and lower edges. The forced oscillation seal includes a base with a first portion attached to a lateral face of the plates adjacent the upper and lower edges, and a second free portion, with a pivot system having an axis attached to the second free portion, and a rigid sealing sheet with a first free portion, second portion, and central portion, the sealing sheet attached at its central portion to the pivot system. The forced oscillation seal includes a counterweight attached to the sealing sheet so the sealing sheet reassumes a vertical position after forming a seal with a sealing surface, and a plurality of springs in contact with the sealing sheet and base along the axis of the pivot system, which cooperate with the counterweights to force the seal to oscillate.

Abstract: A heat exchanger comprises a shell comprising a hollow shell body and separate shell end members attached thereto. A number of tubes is disposed within the shell body which is sized to permit both ends of the tubes to project outwardly therefrom to facilitate access for attaching the tubes ends to respective tube header plates, after which time the shell end members are slid over the shell body towards the shell body ends for attachment to respective header plates. The heat exchanger can include an expansion element attached between a shell end member and the shell body, wherein the expansion element is positioned adjacent a slidable joint formed by an overlapping section of the shell body and shell end member. Together, the expansion element accommodates axial movement and the slidable joint carries vibration loads between the shell body and shell end member.

Abstract: Thermally shielding body having at least one temperature-resistant fastening point, comprising a thermally shielding plate made from aluminium, wherein the thermally shielding plate made from aluminium has a cut-out in the region of at least one fastening point, wherein a metal-plate element with greater heat resistance is arranged in the cut-out, which metal-plate element is connected in a material-to-material manner to the thermally shielding plate at the edge of the cut-out or of the metal-plate element, wherein the at least one heat-resistant fastening point in arrange on the metal-plate element with greater heat resistance, and at method for producing the thermally shielding body.

Abstract: An electrical equipment cabinet cooling device includes an electrical equipment cabinet having a cabinet outer frame defining an inner perimeter wall. A planar outer cabinet wall is positioned within the inner perimeter wall. A two-phase thermal device includes spaced and opposed first and second transfer walls. An outer perimeter wall connects the first and second transfer walls and defines an interior sealed cavity between the first and second transfer walls. The outer perimeter wall is sized for slidable receipt within the inner perimeter wall. A liquid/vapor retained in the interior sealed cavity acts as a heat transfer medium between the first and second transfer walls. A convective cooling block has a planar end face in direct contact with the second transfer wall. Heat transfers to atmosphere in a path including the outer cabinet wall, the first transfer wall, the liquid/vapor, the second transfer wall, and the cooling block.

Abstract: A regenerative heat exchanger for transferring heat from the exhaust gas to the intake working fluid of a prime mover. Application includes gas turbines for both motor vehicles and distributed electric generation. The heat exchanger employs a rotating matrix, which circulates through working fluid exhaust and intake channels while absorbing and rejecting heat between the two channels. Features include corrugated tubes for enhanced heat transfer, minimally welded low stress construction, quick-detach assembly of standard components, and purge flow sealing using recovered heat. Effectiveness exceeding 95% increases thermal efficiency of low-pressure ratio gas turbines.

Abstract: A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.

Abstract: A temporary assembly apparatus includes a support member for supporting heat exchange tube blanks having their lengthwise direction positioned laterally, with their widthwise direction positioned vertically. Header supports are arranged respectively at the left and right sides of the support member and movable leftward or rightward. Tube blank correcting members are each in the form of a plate having slits formed in a side edge thereof and arranged from the front rearward at the same spacing as the heat exchange tubes to be produced. Each of the blank correcting members is movable between a correcting position where the corresponding ends of the tube blanks as supported on the support member are fitted into the respective slits and a noncorrecting position where the tube blanks are not fitted into the slits.

Abstract: A regenerator (100), for a thermal cycle engine with external combustion, according to the invention comprises a network of metal fibers wherein a majority of the fibers at least partially encircles the axis of the regenerator. The fibers were part of a fiber bundle which is coiled and sintered thereby obtaining the regenerator.

Abstract: A method for designing the construction of a Heat Exchange Reformer (HER) to minimise metal dusting, and a method for improved thermal control in a Heat Exchange Reformer (HER). By analysis of various parameters related to a Main Reforming Unit (MRU) and a Heat Exchange Reformer (HER), improved thermal control and reduced metal dusting is achieved.

Abstract: Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity.

Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.

Abstract: A method for making a heat column includes a step of preparing a section of a metal object; a step of forging the section of the metal object to be a hollow column which has a flat bottom, a guide surface being formed in the inner periphery of the hollow column, the hollow column having a flat bottom which has a heat-exchange surface; a step of making a neck on one end of the hollow column, and a step of sealing the neck by way of welding when the interior of the hollow column is sucked to be substantial vacuum status, liquid high heat transmission agent being introduced into the interior of the hollow column. The flat bottom is integral formed when the hollow column is formed and the flat bottom is in contact with the heat source.

Abstract: The invention refers to a method of brazing together thin heat exchanging plates of an iron based base material provided with port holes and a pressing pattern of elevations and depressions over the heat exchanging area of the plates and, if present, also over the distribution area to a plate heat exchanger. The plates are coated with brazing material and are arranged such that contact between elevations and depressions in adjacent plates is obtained prior to the brazing together. The plates are then brazed together at the resultant contact points. Only 5-40%, preferably 10-30%, of the heat exchanging area and the distribution area are coated with brazing material prior to the brazing.

Abstract: A vapor chamber structure includes an integrally formed main body defining a chamber and having radiating fins. The radiating fins are outward extended from one side of the main body in a direction opposite to the chamber; the chamber is internally provided with a wick structure and filled with a working fluid. A method of manufacturing a vapor chamber structure is also disclosed, which includes the steps of using an extrusion process to manufacture a main body having a plurality of radiating fins and a chamber; forming at least one wick structure on inner walls of the chamber after the main body has been manufactured; and sealing two ends of the main body, and evacuating the chamber before filling it with a working fluid. With the method, the vapor chamber structure can be manufactured with reduced material and labor costs and shortened manufacturing time.

Abstract: A heat exchanger of a type with a collector plate which has a wall in which are formed rim holes which can receive the ends of tubes of a bundle, wherein the wall of the collector plate is designed such that, for the purpose of a soldered or welded connection to the tubes, it forms collars around the rim holes, and wherein the wall has a front side facing toward the tube bundle and a rear side facing toward the collecting tank. Each collar extends in the direction of the collecting tank from a straight base plane on the rear side of the wall.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.

Abstract: A thermal conductive stress relaxation structure is interposed between a high-temperature substance and a low-temperature substance to conduct heat in a heat-transfer direction from the high-temperature substance to the low-temperature substance. The structure includes an assembly configured such that a thermal conductive material gathers in a non-bonded state having stress relaxation effect. Such an assembly is a rolled-up body configured such that a carbon-based sheet material and a metal-based sheet material are alternately rolled up, for example. This structure has one or more interfaces at which adjacent parts can slide, thereby dividing a deformable region to relax the thermal stress. It has a low rigidity and can thus deform to release the thermal stress. The structure can suppress the thermal stresses and the shape changes that would be generated in the high-temperature substance and the low-temperature substance, and each physical body located there between.

Abstract: A lanced and/or slit seamed housing and method of manufacture having a peripheral rolled and lanced or punched seam between a wrapper and the housing panels. The method of manufacture utilizes similar or dissimilar sheet materials in a variety of material thicknesses and with or without coatings applied prior to formation whereby a housing is formed quickly and safely. The rolling and lancing method manufactures a blower housing with an assured and positive sealed seam between the panels and wrapper of the housing. The lances or slits maintain the integrity of the seam and prevent slippage between the wrapper and panels.

Abstract: A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.

Abstract: A heat shield is disclosed comprising a formed sheet having a thickness, an exterior shielding surface, and an interior shielded surface, wherein the exterior shielding surface comprises a multiplicity of protruding perforations. The protruding perforations comprise protrusions increasing surface area and generating turbulent flow, and small openings through the shield to allow convection air flow to pass through.

Abstract: A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Abstract: A method of manufacturing a vapor chamber includes steps of: attaching a first edge of a first metal cover plate to a second edge of a second metal cover plate; placing the first metal cover plate and the second metal cover plate on a die after attachment; and using a punch head to punch the first edge and the second edge in a direction toward the die so as to seal the first edge and the second edge.

Abstract: A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost.

Abstract: Provided is a method of producing a liquid-cooled jacket wherein deformation of a seal body can be minimized.

Abstract: A heat exchanger with a first manifold and a second manifold. The heat exchanger includes tubes having first and second ends. The tubes connect to the first manifold at the first end and the second manifold at the second end establishing fluid communication between the manifolds. The tubes are arranged parallel and forming gaps between tubes. The heat exchanger includes fin matrices formed from fins that span the gaps and extend from the first end to the second end. At least two adjacent tubes define an expansion gap that accommodates thermal expansion.

Abstract: A method for marking a specific tube in a shell and tube heat exchanger includes inserting a marker into a second tube adjacent to the tube to be marked and directing a directional pointer on the marker toward the tube to be marked.

Abstract: The present invention provides a metal plate for heat exchange which facilitates nucleate boiling and is extremely excellent in heat conductivity. In the metal plate for heat exchange of the present invention, a recess part 2 having a depth of 5 ?m or more and 10% or less of a plate thickness of the metal plate is formed. A crevasse part 7 is formed at least at a bottom corner 6 of the recess part 2. The crevasse part 7 is formed by cutting away the bottom corner 6 of the recess part 2 in the thickness direction. An angle ? formed by one cut-away surface and the other cut-away surface is 90 degrees or less. In addition, the crevasse part 7 is formed by cutting away a crystal grain 9. The recess part 2 is formed on the surface of the metal plate 1 by pressing a working part 14 formed on a surface of a working roll 12 against the surface of the metal plate 1 being carried.

Abstract: A battery pack thermal management assembly draws heat from prismatic batteries having opposed major surfaces and arranged in a stacked configuration inside a housing. The thermal management assembly includes a plurality of thermal transfer sheets made from sheets of a compressed mass of exfoliated graphite particles. Each thermal transfer sheet is positioned to contact the major surface of at least one of the prismatic batteries. A cover plate has a top face and a bottom face and includes a plurality of apertures through which the plurality of thermal transfer sheets extend. The apertures include at least one curved sidewall and the thermal transfer sheets are bent over the curved sidewall. At least a portion of each of the thermal transfer sheets is secured between a heat sink and the top face.

Abstract: A heat exchanger and a method of manufacturing the same are provided. With the heat exchanger and method of manufacturing, a tube may be inserted into a through hole formed in a fin coated with a filler metal, the tube may be expanded using a tube expansion ball, and the tube and the fin may be joined through the filler metal by brazing processing. The tube may be made of aluminum (Al). An interval between an outer circumferential surface of the tube and an inner circumferential surface of the fin collar before expanding the tube may be approximately 0.1 mm or more, and the tube may be expanded so that the interval between the outer circumferential surface of the tube and the inner circumferential surface of the fin collar is approximately 0.1 mm or less. Accordingly, a heat transfer performance of the heat exchanger may be improved.

Abstract: An article and method of assembling the article is disclosed. The method of assembling includes positioning a pre-fabricated thermal interface element between a heat source and a heat-sink. The pre-fabricated thermal interface element includes an indium substrate and a plurality of nanosprings disposed on the indium substrate.

Abstract: A tubing element for a heat exchanger is at least partially a rigid elongated tubing having a first end, a second end, a first side wall and a second side wall. First and second side walls are substantially parallel to each other. The distance between first side wall and second side wall is considerably smaller than the width of first side wall and second side wall, resulting in a substantially overall flat tubing structure with connection walls on both sides. The tubing element has a plurality of fins on at least one of the outer surfaces of the first side wall and/or of the second side wall. Fins define an angle enclosed by the fins and a connection wall. A heat exchanger, use of a tubing element, use of a heat exchanger and method of manufacturing of a tubing element to manufacture at least partially a heat exchanger are included.

Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including: a body comprising an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a metal powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a vaporization surface of the sintered wick where evaporation of the working fluid occurs, wherein a plurality of through holes are formed in the additional layer such that the working fluid changed into a vapor state passes through the additional layer after passing the sintered wick.

Abstract: An air-to-air cooler has a heat exchanger integrated to a housing. A first passage extends through the housing for directing a flow of cooling air through the heat exchanger. A second passage extends through the housing for directing a flow of hot air to be cooled through the heat exchanger. The first passage has a cooling air outlet tube disposed downstream of the heat exchanger. The cooling air outlet tube extends across the second passage between the heat exchanger and a hot air inlet of the second passage. The hot air inlet is disposed to cause incoming hot air to flow over the cooling air outlet tube upstream of the heat exchanger. An ejector drives the flow of cooling air through the first passage of the air-to-air cooler. A portion of the hot air flow may be used to drive the ejector.

Abstract: A heat dissipation device includes a heat dissipation element and a ceramic main body. The heat dissipation element includes a heat transfer section and a heat dissipation section located on one side of the heat transfer section; and the ceramic main body is directly connected to another side of the heat transfer section opposite to the heat dissipation section by way of welding or a direct bonding copper process, so as to overcome the problem of crack at an interface between the heat dissipation device and a heat source due to thermal fatigue. A method of manufacturing the above-described heat dissipation device is also disclosed.

Abstract: A method for a production of a heat exchanger for an inline measuring device includes the steps of: producing first opening provided for the connection of the heat exchanger to a temperature control piping system in a first sheet part serving for the production of one of the heat exchanger sheets; laying the first sheet part on a second sheet part serving likewise for the production of one of the heat exchanger sheets; producing an edge connection seam and inner connection locations by welding of the two superimposed sheet parts; introducing fluid through a first opening into a chamber remaining between the two sheets; superimposing a static pressure on the fluid in the chamber which exceeds a static pressure of a surrounding atmosphere to such a degree that an expansion of the chamber is initiated; and plastically deforming material of the thinner of the two sheet parts by expanding the chamber by means of the fluid with superimposed pressure.

Abstract: A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique.