Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.
Type:
Application
Filed:
October 16, 2013
Publication date:
February 13, 2014
Applicant:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventors:
Eric A. ECKBERG, David P. GRAYBILL, Madhusudan K. IYENGAR, Howard V. MAHANEY, JR., Roger R. SCHMIDT, Kenneth R. SCHNEEBELI
Abstract: A clamshell heat exchanger for use in a gas-fired direct combustion furnace. The exchanger comprises a first clamshell half and a second clamshell half that when joined with the first clamshell half forms a passageway having an inlet and an outlet. The passageway includes a U-bend located between the inlet and the outlet, wherein the U-bend includes a re-entrant sectional profile.
Type:
Grant
Filed:
July 12, 2010
Date of Patent:
February 11, 2014
Assignee:
Lennox Industries Inc.
Inventors:
Shailesh S Manohar, Glenn W Kowald, Floyd E Cherington, Hans J Paller, John W Whitesitt, Jianmin Zhang
Abstract: In a method for fabricating a heat exchanger, a metal body includes a bore and inlet and outlet connectors fitted to the body at respective inlet and outlet ends of the bore. The connectors each include an inner surface in which annular grooves are formed. A tube is inserted in the bore such that inlet and outlet ends of the tube are respectively located in the inlet and outlet connectors. A mandrel is operated to expand at least a portion of the tube into contact with the body, and to expand the inlet and outlet tube ends into contact with the grooves of the inlet and outlet connectors, respectively. The heat exchanger provides improved thermal exchange efficiency between the tube and the body, and fluid-tight connections between the tube and the inlet and outlet connectors.
Abstract: The heat exchanger includes: a plurality of heat transfer tubes which is arranged and provided with predetermined gaps; and a plurality of second vibration suppression members 14B which is provided in the gaps and is provided on both sides sandwiching each of the heat transfer tubes 5, and one second vibration suppression member 14B and the other second vibration suppression member 14B of a plurality of second vibration suppression members 14B are provided at different positions in an axial direction of the heat transfer tubes 5 sandwiching the heat transfer tubes 5, the one second vibration suppression member 14B is provided pressing the heat transfer tubes 5; and the other second vibration suppression member 14B is provided pressing the heat transfer tubes 5 from an opposite side of the one second vibration suppression member 14B.
Abstract: A method of assembling thermal module includes steps of providing a first heat dissipation member and a second heat dissipation member, and aiming a section of the first heat dissipation member at a section of the second heat dissipation member, which section of the first heat dissipation member is to be assembled with the section of the second heat dissipation member and driving the first heat dissipation member to connect with the second heat dissipation member by means of striking the first heat dissipation member into the second heat dissipation member. By means of the method, the thermal module can be assembled at higher efficiency. Moreover, the manufacturing process of the thermal module is simplified.
Abstract: The disclosure describes trench-confirmable geothermal reservoirs that can snugly abut trench walls (that may be of virgin, compacted earth) for facilitating heat exchange and flow liquid from one lower end to an opposing top end, and vice versa, depending on desired heat exchange. The direction can be reversed for summer and winter heat/cooling configurations. A series of the reservoirs may be used for appropriate heat transfer. The water volume of the reservoirs is relatively large and slow moving for good earth heat conduction.
Abstract: A surface cooler comprises a plate-like layer and a plurality of spaced-apart fins extending substantially perpendicular from an uppermost layer of the plate-like layer. The plurality of fins defining a plurality of air flow paths. The plurality of spaced-apart fins are configured to augment heat transfer of the surface cooler by increasing the turbulence levels of a fluid flowing through the airflow paths by promoting increased mixing with a resulting increase in the heat transfer coefficient of the surface cooler. A method of forming the surface cooler and an engine including the surface cooler.
Type:
Application
Filed:
July 27, 2012
Publication date:
January 30, 2014
Applicant:
GENERAL ELECTRIC COMPANY
Inventors:
William Joseph ANTEL, JR., Carlos Enrique DIAZ, Jorge Carretero BENIGNOS
Abstract: A retrofit heat transfer unit, including: a housing for the retrofit unit, including inlet and outlet ports for water and refrigerant; a water pump, in fluid communication with the water inlet port, the water pump adapted to pump water from a water source; a heat exchanger, in fluid communication with the water pump, the water outlet port, the refrigerant inlet port and the refrigerant outlet port; and a thermostat, configured to measure a temperature of the pumped water and activate the water pump when the water is below a predefined low temperature and cease to pump when water is above a predefined high temperature. The retrofit unit is also adapted to receive heated refrigerant fluid from an air conditioner and direct the refrigerant through the heat exchanger and direct the pumped water into the heat exchanger so that the refrigerant heats the water and the water cools the refrigerant.
Abstract: The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members.
Abstract: A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced.
Abstract: The invention relates to a heat sink and a method of fixing the same. In one embodiment this is accomplished by a method for bonding a heat sink and an electronic device together, wherein the heat sink including a base member and a heat radiating portion the method comprising milling the base member in the midst of the heat sink of a predetermined depth, cleaning the milled surface of the heat sink with an activator, filling the milled surface of the heat sink with an adhesive for bonding with the electronic device and placing the heat sink on the electronic device and applying force for a predetermined amount of time period.
Abstract: This patent discloses and claims a system for providing in-plane stabilization to the tubes of a heat exchanger. The system increases the friction between the tubes and the existing anti-vibration bars by pressing the tube bundle together in the out-of-plane direction. The invention involves a structure that develops forces by reacting either off the inner diameter of the tube bundle wrapper, or off an assembled stressor hoop, which is self-supporting on top of the tube bundle, or involves purposely deforming connecting hoops to bias the anti-vibration bars in a way that the tube U-bend is no longer planar. It imposes a controlled clamping and/or deforming force on the tube bundle, either by direct contact with the outer tubes or indirectly via the existing anti-vibration bar structure.
Abstract: An electrodialysis unit for treating water comprises a membrane cell, a temperature monitoring device for monitoring the temperature of incoming water and a heater for increasing the temperature of the incoming water before it reaches the membrane cell; wherein the heater is arranged to operate to increase the temperature of the incoming water when the original water temperature is below a predetermined level.
Abstract: A temperature control device for a casting die and which includes a connection part having an inlet and an outlet for a temperature control medium, and a heat transfer part having a closed outer body and which is configured for insertion into a corresponding opening in the casting die and by way of which a heat exchange is carried out between the temperature control medium and the casting die.
Abstract: Rotary fluid processing systems and associated methods are disclosed. A purification system in accordance with the particular embodiment includes a rotatable adsorbent-containing heat/mass transfer element that is generally symmetric about a rotation axis, and includes multiple radial flow paths oriented transverse to the rotation axis and multiple axial flow paths oriented transverse to the radial flow paths. The axial flow paths and radial flow paths are in thermal communication with each other, and are generally isolated from fluid communication with each other at the heat transfer element. Particular embodiments can further include a housing arrangement having multiple manifolds with individual manifolds having an entry port and an exit port, and with individual manifolds having different circumferential locations relative to the rotation axis.
Abstract: An embodiment is a method and apparatus to provide thermal management for a memory module with a heat sink. A top element has a first portion with a top area covering a substantial top surface of the memory module and a second portion bent at an angle that is substantially perpendicular to the first portion and having a height that is approximately equal to thickness of the memory module. A bottom element has a third portion with a bottom area covering a substantial bottom surface of a memory module and a fourth portion bent at an angle that is substantially perpendicular to the third portion and having a height that is approximately equal to the thickness of the memory module. The fourth portion is attached to the second portion.
Abstract: An apparatus may include an electrical component body, where the electrical component body is operative to vary power during operation. The apparatus may also include a thermal component in contact with at least a portion of the electrical component body, in which the thermal component comprises a matrix material, and a thermal energy storage material embedded in the matrix material to absorb heat generated by the electrical component body. Other embodiments are disclosed and claimed.
Type:
Application
Filed:
June 28, 2012
Publication date:
January 2, 2014
Applicant:
Intel Corporation
Inventors:
David Pidwerbecki, Alexander B. Uan-Zo-li
Abstract: A method for manufacturing a honeycomb structural body having a honeycomb unit includes obtaining a honeycomb molded body including a compound containing a phosphate group zeolite and an inorganic binder. The honeycomb molded body has a plurality of through holes that are defined by cell walls and arranged in a longitudinal direction of the honeycomb molded body. The honeycomb molded body is dried. The dried honeycomb molded body is fired to obtain the honeycomb unit. At least one of the honeycomb unit and the dried honeycomb molded body is stored so that a difference in moisture content is approximately 5 mass % or less between a moisture content of the cell walls at a center part of a cross section perpendicular to the longitudinal direction and a moisture content of the cell walls at an outer periphery part of the cross section perpendicular to the longitudinal direction.
Abstract: A heat exchanger is described comprising a distributor having an outer housing and including a plurality of substantially parallel plates disposed within the housing and configured to partition an input two-phase flow into a series of primarily single-phase layers. A heat exchanger is described comprising a distributor having an outer housing including a plurality of substantially parallel channels disposed therein, each channel configured to uniformly and independently convey a portion of a homogenous input two-phase flow from an input of the distributor to an output of the distributor.
Type:
Application
Filed:
June 20, 2012
Publication date:
December 26, 2013
Applicant:
HAMILTON SUNDSTRAND CORPORATION
Inventors:
Abbas A. Alahyari, Miad Yazdani, Thomas D. Radcliff
Abstract: A portable assembly for cooling the contents of a fermentation vessel is provided. In one embodiment, the assembly comprises an insulated, cylindrical enclosure having a fixed bottom and a removable lid. A flexible heat exchanger is cylindrically disposed within the enclosure and encircles the fermentation vessel. In one embodiment, the flexible heat exchanger is connected to a vessel containing thermally conductive fluid by flexible tubes that extend outside the enclosure. In one embodiment, a heating element is used to heat the fermentation vessel.
Abstract: Water for data center uses is generated from the ambient air by a water generator that cools air below its dew point, thereby causing the water in such air to precipitate out. The water generator is powered by renewable energy sources that provide a sufficient amount of energy over an extended period of time, despite temporary interruptions. Heated air from the data center is exhausted so as to absorb moisture from the ambient air, with such heated air being capable of holding a greater amount of moisture, and is then directed through the water generator, thereby enabling the water generator to generate a greater amount of water. The level of water available is monitored and the water generator utilizes on-demand power sources to generate a greater amount of water so as to avoid emptying water storage units.
Abstract: A heat sink composed of a fin set and a seat and a method for manufacturing the same are disclosed. One side of the fin set is provided with a plurality of rail rods whose cross sections are of a hook shape. One side of the seat is formed with a plurality of slots corresponding to the rail rods. Thus the fin set and the seat can be assembled by engagement of the rail rods and slots. A press mold is employed to press the rail rods and the slots, thus the rail rods and slots are deformed to make the fin set and seat tightly engage with each other.
Abstract: An exemplary method for manufacturing a heat dissipation device includes the following steps. First, providing fins spaced from each other. Then, providing an electric conductor extending through the fins and being electrically connected to the fins. Next, immersing the combination of the fins and the electric conductor into an electrolyte of an electrolytic cell. After that, connecting an anode of the electrolytic cell with the electric conductor in an electric conductive relationship. Finally, providing the anode with electrical power to form metal oxide films over surfaces of the fins and the electric conductor.
Type:
Application
Filed:
August 21, 2013
Publication date:
December 19, 2013
Applicants:
FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
Abstract: Field-replaceable, modular pumping units are provided, configured to facilitate pumping coolant through a cooling apparatus assisting in removal of heat generated by one or more electronic systems. The cooling apparatus includes one or more heat exchange assemblies, and the modular pumping units are coupled in parallel fluid communication to the cooling apparatus. The modular pumping unit includes a housing, a coolant inlet to the housing, a coolant reservoir tank disposed within the housing, a coolant pump, and a coolant outlet of the housing. The coolant reservoir tank and coolant pump are disposed within the housing in fluid communication, and the coolant pump pumps coolant from the coolant reservoir tank to the coolant outlet of the housing. A modular pumping unit controller is associated with the modular pumping unit, and automatically adjusts operation of the coolant pump based upon one or more sensed parameters.
Type:
Application
Filed:
June 14, 2012
Publication date:
December 19, 2013
Applicant:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventors:
Gary F. GOTH, Francis R. KRUG, JR., Robert K. MULLADY, Allan C. VANDEVENTER, Randy J. ZOODSMA
Abstract: Secondary heat exchanger assembly for a heat exchanger unit comprising a hot header box configured to receive combustion gases from a primary heat exchanger assembly of the heat exchanger unit, a cold header box configured to transfer combustion gases to an induction assembly of a furnace unit the heat exchanger unit is part of and heat transfer zone located between the hot and cold boxes. The zone includes secondary heat conduction tubes coupled to the hot box to receive the combustion gases passing through the hot box, and, coupled to the cold box to deliver the combustion gases to the colder box. Air, when blown from a blower unit of the furnace unit through the zone, has a non-uniform velocity profile across a width of the zone, and, a heat transfer mass of the zone across the width is configured to have a substantially similar-shaped non-uniform heat transfer mass profile.
Abstract: A cell module 10 comprises: a cell stack 20 comprising multiple cells 30 which are electrically connected to each other; a plate-shaped heat dissipating member 70 arranged such that it extends along a direction in which the multiple cells 30 are arranged, and such that it is thermally connected to the multiple cells 30; and an intervening layer 80 arranged between the cell stack 20 and the heat dissipating member 70, and configured to allow heat to propagate from the cell stack 20 to the heat dissipating member 70, and to suppress a relative displacement between the cell stack 20 and the heat dissipating member 70.
Abstract: An example cold plate assembly includes a heat spreader assembly that defines a mounting surface for heat generating devices and provides an improved thermal conduction of heat away from the heat generating devices. The example heat spreader assembly provides a more uniform thermal gradient across the mounting surface of the cold plate assembly and improves thermal conductivity and cooling provided by the cold plate assembly.
Abstract: A heat exchanger plate for a plate heat exchanger includes a plate substrate formed at least on its upper side with a flow duct configuration having a multiplicity of flow ducts. Some or all of the flow ducts have duct webs, over an entire extent thereof or in sections, forming duct walls delimiting a duct groove of a respective flow duct. A plate heat exchanger and a method for manufacturing a heat exchanger plate for a plate heat exchanger are also provided.
Abstract: In one aspect, the present invention relates to a structural assembly including a first frame member hingedly coupled to a second frame member. A support member extends outwardly from the first frame member. At least one glazing panel is disposed above the support member. A thermal clip is coupled to the support member. The thermal clip insulates the support member from a building exterior. The support member extends less than an entire length thereof and reduces loss of thermal energy from a building interior to the building exterior via the support member.
Abstract: In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surfa
Abstract: The invention relates to a method for transferring heat between a first material having a first temperature and a second material having a second temperature, wherein said first temperature is greater than said second temperature, said method comprising providing one or more rotatable elements, disposing said one or more rotatable elements such that a heat transfer portion thereof is thermally contactable with both said first material and said second material on rotation of said one or more rotatable elements, and rotating said one or more rotatable elements, whereby heat is transferred from said first material to said heat transfer portion and from said heat transfer portion to said second material.
Abstract: The invention relates to a method for manufacturing a fin (4) of width l and comprising corrugations (20) for a heat exchanger comprising at least one step of splitting a metal sheet (2) into at least two strips (4) of width l and a step of folding the strips (4) of width l in order to obtain the corrugations (20). The steps of splitting and of folding the metal sheet (2) take place simultaneously. A further subject of the invention is a device for applying such a method and a fin and a heat exchanger obtained by such a method, particularly for use in the motor-vehicle field.
Abstract: A component includes a substrate that has outer and inner surfaces. The inner surface defines at least one hollow, interior space. The outer surface defines pressure and suction sidewalls that are joined together at leading and trailing edges of the component and together form an airfoil portion of the component. The outer substrate surface further defines at least one platform and at least one fillet that extends between and integrally connects the airfoil to the respective platform. The outer surface defines one or more grooves that extend at least partially along a respective fillet. Each groove is in fluid communication with a respective hollow, interior space. The component further includes a coating disposed over at least a portion of the outer substrate surface and including at least a structural coating that extends over the groove(s). The groove(s) and the structural coating together define channel(s) for cooling the respective fillet.
Abstract: The present invention provides a heat dissipating member having excellent heat dissipation properties and suitable for use in an oil environment. The present invention is a heat dissipating member including: a porous base material containing a fluorine resin and a thermally-conductive filler; and an oil contained in pores of the porous base material. The fluorine resin contains polytetrafluoroethylene. The heat dissipating member can be produced, for example, by a method including the steps of: (1) stacking and rolling together a plurality of sheet-shaped formed bodies each containing a polytetrafluoroethylene-containing fluorine resin, a thermally-conductive filler, and a molding aid, so as to obtain a rolled laminated sheet; (2) removing the molding aid from the obtained rolled laminated sheet to obtain a porous base material; and (3) impregnating the obtained porous base material with an oil.
Abstract: A heat absorbing device including a structure including plural individual cells delimited by an envelope made of a material that has good thermal conductivity and includes at least one phase-change material, the cells being stacked on top of one another from an end surface so that the structure extends in a direction of thermal flux, the flux being made up of two notable periodic thermal events, the structure including two different sizes of cells. The sizes of the cells are determined as a function of frequency of the thermal events of the thermal flux and a distribution of a number of cells of each size is determined as a function of amplitudes of each event.
Type:
Application
Filed:
February 9, 2012
Publication date:
November 28, 2013
Applicant:
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
Abstract: The present invention relates to a mechanical draft cooling tower that employs air cooled condenser modules. The aforementioned cooling tower operates by mechanical draft and achieves the exchange of heat between two fluids such as atmospheric air, ordinarily, and another fluid which is usually steam. The aforementioned cooling tower utilizes a modular air cooled condenser concept wherein the air cooled condensers utilize heat exchange deltas that use tube bundles that are manufactured and assembled prior to being shipped to the tower site.
Type:
Application
Filed:
May 23, 2012
Publication date:
November 28, 2013
Applicant:
SPX Cooling Technologies, Inc.
Inventors:
Michel Vouche, Christophe Deleplanque, Fabien Fauconnier
Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.
Abstract: The invention relates to a method for producing an adsorption heat exchanger, which is characterized by the following Steps: producing a heat exchanger structure; forming an adhesive layer (5) on the heat exchanger structure; filling the heat exchanger structure with a sorbent material (6.1); removing from the heat exchanger structure portions of the sorbent material that have bonded only weakly or not at all to the adhesive structure.
Type:
Grant
Filed:
March 2, 2006
Date of Patent:
November 26, 2013
Assignee:
Sortech AG
Inventors:
Walter Mittelbach, Willy Frank, Manfred Arnold
Abstract: The invention relates to a heat exchanger panel (10) preferably for heat exchange utilizing light energy, comprising a board (24) having plates parallel to each other, and partition walls (12) dividing the inner space between the plates into parallel channels (14), said partition walls (12) joining the plates and being of a same material as the plates, passages (18) in the partition walls (12), said passages enabling the flow of a heat exchanger medium between the neighbouring channels (14) and providing a flow path (20) for the medium, sealing units (16) covering openings at the ends of the channels (14) and joints (22) allowing the heat exchanger medium to enter into and exit from the panel (10). According to the invention, the sealing units (16) are made of a sealant which is thermal expansion compatible with the material of the board (24), the sealant being introduced into the ends of the channels (14). The invention also relates to a method for manufacturing the heat exchanger panel (10).
Abstract: The present invention is directed to apparatus and methods for cooling computer servers and/or electrical equipment in a rack device for data centers or telecommunication centers.
Type:
Application
Filed:
December 10, 2012
Publication date:
November 21, 2013
Inventors:
Joerg Burkhard Helbig, Steven Thomas Gizzi
Abstract: A thermal management system for use in a vacuum is provided including a heat generation device and a heat dissipation device. A laser sintered first heat transfer panel is mounted to a surface of the heat generation device and a laser sintered second heat transfer panel is mounted to a surface of the heat dissipation device. The first and second heat transfer panels are positioned between the heat generation device and the heat dissipation device. A portion of the first heat transfer panel and a portion of the second heat transfer panel are interposed.
Type:
Application
Filed:
May 21, 2012
Publication date:
November 21, 2013
Applicant:
HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL
Abstract: The invention relates to improvements of a scraping heat exchanger having an outer cylinder comprising a first wall having a smooth circle-cylindrical inner side, and an inner cylinder positioned concentrically within it. The improvements regard a simple detachable inner cylinder, a heat exchanger with lid including a fluid barrier, a heat exchanger with a tangential output, and a method and heat exchanger adapted for improved evacuation of a product chamber of a heat exchanger.
Type:
Application
Filed:
October 3, 2011
Publication date:
November 21, 2013
Applicant:
STIBBE MANAGEMENT B.V.
Inventors:
Niels Ter Huurne, Ronald Buitenhuis, Gerardus Cornelius Maria Van Der Ven, Franciscus Johannes Cornelis Smeltink, Gerrit Hendrik Van Aartsen
Abstract: According to embodiments of the present invention, there is provided an adjustable heat dissipation assembly and a method for manufacturing and assembling same. The heat dissipation assembly may include: a heat dissipation frame including a base with at least two side walls, the base and the side walls define an internal space suitable for accommodating a device that requires cooling; and an adjustable plate, configured to be placed over the device in between the side walls, and secured to the side walls, the distance of the adjustable plate from the base of the heat dissipation frame when it is not secured to the side walls being adjustable.
Type:
Application
Filed:
May 14, 2012
Publication date:
November 14, 2013
Inventors:
Alexander TIMASHOV, Oxana SAVVATYEYEV, Evgenia GIDVARG
Abstract: An actuator providing linear displacement, includes a plurality of planar-beam support structures disposed along a longitudinal axis; wherein each said plurality of planar-beam support structures are configured with more than one multidirectional, conductive, coplanar-beams disposed therein; such that said plurality of planar-beam support structures are configured to provide a coupling means to adjacent said plurality of planar-beam support structures having said more than one multidirectional, conductive, coplanar-beams in registry therewith; wherein said coupling means is characterized by that: said more than one multidirectional, conductive, coplanar-beams in registry therewith, are configured to provide for the conjoint parabolic disposition of a plurality of non-rigid, shape-memory material elements.
Abstract: A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique.
Abstract: A thermal module and a manufacturing method thereof. The thermal module includes a radiating fin assembly and a base seat. The radiating fin assembly has at least one folded edge on one side. The folded edge has at least one connection section. The base seat has at least one fixing section corresponding to the connection section. The fixing section is latched with the folded edge. A pressure is applied to the fixing section to plastically deform the fixing section and press the fixing section against the folded edge so as to securely connect the radiating fin assembly with the base seat. The thermal module can be assembled without welding so that the working time is shortened and the manufacturing cost is lowered.
Type:
Application
Filed:
May 11, 2012
Publication date:
November 14, 2013
Inventors:
Sheng-Huang Lin, Chi-Ming Lee, Jin-Hsun Liu
Abstract: Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).
Type:
Application
Filed:
November 30, 2011
Publication date:
November 14, 2013
Applicant:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Abstract: A heat sink includes a base and a heat exchange element coupled to the base. The heat exchange element includes a foam structure that is coupled to the base.
Type:
Application
Filed:
July 12, 2013
Publication date:
November 14, 2013
Inventors:
Domhnaill Hernon, Alan Lyons, Shankar Krishnan, Marc Hodes, Alan O'Loughlin